ELE Times

Quantum computers are expected to become powerful enough within the next decade to compromise many of today’s cryptographic algorithms, putting a wide range of systems at risk. Long-life products such as ePassports, IoT devices and Secure Elements, therefore, demand post-quantum cryptography (PQC)-ready hardware already today. To address this, Infineon Technologies AG is providing the SLC27 security controller with a Common Criteria-certified cryptography library featuring the PQC algorithms ML-KEM and ML-DSA. As part of the TEGRION security controller family and based on the Integrity Guard 32 security architecture, the SLC27 supports standardized PQC implementations across multiple applications, enabling OEMs to integrate quantum-resistant security into their designs.

“At Infineon we know that quantum computing has the power to change the world because we are innovating in this field, too,” says Thomas Rosteck, Division President Connected Secure Systems at Infineon. “As quantum capabilities move from theory to reality, post‑quantum cryptography is an urgent, practical necessity — and Infineon is leading the industry in delivering certified, easy‑to‑adopt quantum‑resilient security that helps accelerating quantum resistance for crucial applications.”

Since post-quantum cryptography represents a fundamentally new class of cryptographic techniques, involving highly diverse and complex operations, it is essential to utilize a robust and security-optimized hardware platform. The SLC27 security controller, built on the Integrity Guard 32 security architecture, provides a resilient foundation for implementing high-performant PQC, excellently protected against side-channel and fault attacks. The controller also supports in-field updates and crypto agility, enabling OEMs to deploy PQC-ready hardware today and adapt to future requirements without replacing devices already in use. With these features, the SLC27 is suitable for applications where long device life and high security requirements demand quantum-resistant protection:

• IoT devices: Industrial sensors, smart meters, and control units often operate for ten to twenty years. The SLC27 allows such devices to remain protected against future quantum attacks throughout their operational lifetime.

• eID and ePassports: Government-issued ePassports and national eID cards with a typical ten-year validity can be future-proofed by integrating the SLC27, maintaining protected identification and border control systems.
• Secure Elements and brand protection: Secure Elements and brand protection solutions for luxury goods, health care devices and consumables benefit from PQC-enabled SLC27 to resist tampering and counterfeiting over the long term.

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Rohde & Schwarz expands its next-generation MXO oscilloscope portfolio with the compact four- and eight-channel MXO 3 series. The MXO 3 delivers fast and precise advanced MXO technology – previously available only in larger, higher-priced models – in an extremely compact form factor at a more affordable price point. This oscilloscope allows engineers to see more of their device under test’s signal than any other instrument in this class.

Fast:

All MXO 3 models come standard with up to 99 % real-time capture, which is up to 50 times better than competitors’ instruments, enabling users to instantly see more signal details and rare events. Like other MXO models, these oscilloscopes leverage cutting-edge MXO-EP processing ASIC technology developed by Rohde & Schwarz to deliver:

• 5 million acquisitions per second– the fastest in the industry, allowing users to instantly detect additional signal detail and infrequent events.
• 600,000 trigger events per second with zone triggering– the fastest and most flexible in the industry, enabling users to isolate events in the time domain, including math and frequency domain signals.
• 50,000 FFTs per second– up to 1,000 times faster than other oscilloscopes, providing faster and more comprehensive analysis for applications such as EMI and harmonic testing.
• 600,000 math operations per second– the best in the industry and up to 100,000 times faster than competitive models, allowing users to accurately analyze signals like power, which require multiplication of voltage and current.

Precise:

All MXO 3 models are engineered with advanced technology to ensure accurate measurement isolation and results users can trust:

• 12-bit vertical resolutionin hardware at all sample rates allows users to observe small signal changes even of larger signals. This provides 16 times more resolution than traditional 8-bit oscilloscopes.
• HD modeenhances signal details that would otherwise be buried in noise. It offers both noise reduction and up to 18 bits of vertical resolution – the highest in the industry. Unlike other oscilloscopes, HD mode operates at full sample rate and is implemented in hardware, ensuring precision without sacrificing speed.
• With the largest offset range in its class, MXO 3 users can take advantage of the most sensitive vertical scale setup to reveal more of their signal while minimizing measurement system noise. MXO 3 oscilloscopes feature a wide ±3V offset at 1 mV/div on both 50 Ω and 1 MΩ input paths – two to three times better than other leading models in this class.

Compact:

Both the four- and eight-channel MXO 3 oscilloscopes are designed with a compact, portable form factor, making them easy to fit anywhere even on crowded benches. Their small footprint allows more space for the creative chaos of engineering workspaces. Combined with an industry-leading low audible noise – quieter than a whisper – the MXO 3 ensures a distraction-free work environment.

• 6” full-HD capacitive touchscreen, combined with intuitive user interface, offering an enhanced user experience to engineers who spend significant time working with the instrument
• Its light weight of only about 4 kg allows moving the MXO 3 easily to a different measurement location.
• 5U of rack height, ensuring efficient use of limited space in labs or testing environments.
• The VESA mountingcompatibility of the MXO 3 allows additional flexibility in engineering environments.

Philip Diegmann, Vice President of Oscilloscopes at Rohde & Schwarz, says: “With the launch of the MXO 3, we are bringing the breakthrough capabilities of our MXO technology to a more accessible, smaller instrument class. This compact oscilloscope delivers the same cutting-edge performance and usability that our customers have come to expect, while opening up new possibilities for engineers at a variety of price points, especially with the addition of an eight-channel model – the only instrument of its kind in this class. At Rohde & Schwarz, we are committed to making advanced test and measurement tools available to more users, and our fast, precise and compact MXO 3 is another step forward in that mission.”

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Texas Instruments (TI) debuted new design resources and power-management chips to help companies meet growing artificial intelligence (AI) computing demands and scale power-management architectures from 12V to 48V to 800 VDC. The new solutions will be on display at Open Compute Summit (OCP) Oct. 13-16 in San Jose, and include:

• “Power delivery trade-offs when preparing for the next wave of AI computing growth”: TI is collaborating with NVIDIA to develop power-management devices to support 800 VDC power architecture, as IT rack power is expected to eclipse 1MW in the next two to three years. This white paper reexamines the power delivery architecture within the IT rack, and addresses design challenges and opportunities for high efficiency and high power-density energy conversion at a system level.
• Reference design: 30kW AI server power-supply unit: To support stringent AI workloads, TI’s dual-stage power-supply reference design features a three-phase, three-level flying capacitor power factor correction converter paired with dual delta-delta three-phase inductor-inductor-capacitor converters. The power supply is configurable as a single 800V output or separate output supplies.
• Dual-phase smart power stage:The highest peak power density power stage on the market, TI’s CSD965203B offers 100A of peak current per phase and combines two power phases in a single 5mm-by-5mm quad flat no-lead package. The device enables designers to increase phase count and power delivery across a small printed circuit board area, improving efficiency and performance.
• Dual-phase smart power module for lateral power delivery: The CSDM65295 module delivers up to 180A of peak output current in a compact 9mm-by-10mm-by-5mm package, helping engineers increase data center power density without compromising thermal management. The module integrates two power stages and two inductors with trans-inductor voltage regulation (TLVR) options, while maintaining high efficiency and reliable operation.
• Gallium-nitride intermediate bus converter: Capable of delivering up to 1.6kW of output power in a quarter-brick (58.4-mm-by-36.8mm) form factor, TI’s LMM104RM0 converter module offers over 97.5% input-to-output power-conversion efficiency and high light-load efficiency to enable active current sharing between multiple modules.

AI data centers require architectures designed with multiple foundational semiconductors for efficient power management, sensing and data conversion. With new design resources and a broad power-management portfolio, TI is working alongside data center designers to implement a comprehensive approach that drives efficient, safe power management – from power generation at the grid to the fundamental logic gates of graphics processing units.

“With the growth of AI, data centers are evolving from simple server rooms to highly sophisticated power infrastructure hubs,” said Chris Suchoski, sector general manager, Data Centers at TI. “Scalable power infrastructure and increased power efficiency are essential to meet these demands and drive future innovation. With devices from TI, designers can build innovative, next-generation solutions that are enabling the transition to 800 VDC.”

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The event brought together institutional and industrial partners, ESA Member State representatives, and leading figures in satellite navigation. The celebration revisited pivotal milestones in Europe’s satellite navigation history and looked ahead to future innovations. A highlight of the evening was the award ceremony led by European Space Agency (ESA) Director of Navigation Javier Benedicto, who, alongside past directors, presented accolades to organizations and partners instrumental in this success story.

Rohde & Schwarz’s recognition underscores their role in advancing European satellite navigation technology. Their contributions have been vital in the development and operational success of Galileo and EGNOS, systems that have revolutionized positioning, navigation, and timing services across Europe and beyond.

The event not only celebrated past achievements but also set the stage for the future of European satellite navigation, with discussions around upcoming initiatives and advancements. For Rohde & Schwarz and other honourees, the evening served as both a celebration of past achievements and a call to continue building a connected, resilient, and sustainable future in space.

Rob Short, Director Business Development at Rohde & Schwarz comments: “Thirty years of satellite navigation is a testament to shared vision, determination to push technology boundaries, and intense, long-term collaboration. We are honoured to have contributed to this remarkable achievement. Congratulations to everyone who made this milestone possible.”

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, joined the board of directors of the FiRa Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.

ST is actively driving the development of the IEEE 802.15.4ab amendment, building upon previous UWB enhancements to further improve system performance and expand UWB’s application scope. The ongoing evolution of UWB standards promises significant improvements, including centimetre-level accuracy, enhanced security, and reduced power consumption. These improvements are critical for enabling a wide range of applications, from automotive access and digital keys to smart home automation and IoT innovations. Integrating IEEE 802.15.4ab into the CCC Digital Key ecosystem would represent a major step forward in addressing implementation challenges and accelerate broader adoption of UWB technology in both consumer and automotive markets.

“STMicroelectronics has long been a valued member of the FiRa Consortium, and we are thrilled to welcome them at the Sponsor level. This upgrade is a reflection of ST’s deepening commitment to the future of Ultra-Wideband technology and to FiRa’s mission. We are especially pleased to have Rias Al-Kadi, General Manager of ST’s Ranging and Connectivity Division, join our Board of Directors. His experience and leadership will be instrumental as we continue to expand UWB’s global impact and shape the future of secure, interoperable solutions,” states SK Yong, FiRa Consortium Board Chairman.

“Joining the FiRa board underlines our commitment to advancing the CCC Digital Key and other UWB-based applications,” said Rias Al-Kadi, General Manager, Ranging and Connectivity Division, STMicroelectronics. “By deeply engaging in standardization and certification across all major UWB groups, we are helping to shape the future of UWB technology to deliver maximum value for consumers and industries alike.”

Rias Al-Kadi’s appointment further strengthens ST’s active participation in key UWB standards bodies and consortia, including the IEEE, Connected Car Consortium (CCC), Connectivity Standards Alliance (CSA), and UWB Alliance. Through strategic participation in these groups, ST supports the continuous evolution of UWB technology aimed at enhancing user experiences and lowering system costs, particularly in consumer and automotive access applications. This aligns with ST’s vision to foster a robust UWB ecosystem that enables seamless, secure, and cost-effective solutions for the growing UWB market.

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The STARLight project is bringing together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.  From now until 2028, STARLight aims to develop application-driven solutions focusing on key industry sectors such as datacentres, AI clusters, telecommunications, and automotive markets.

Led by STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, the STARLight consortium has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative.

“Silicon Photonics technology is critical to put Europe at the crossroads to the AI factory of the future and the STARLight project represents a significant step for the entire value chain in Europe, driving innovation and collaboration among leading technology companies. By focusing on application-based results, the project aims to deliver cutting-edge solutions for datacentres, AI clusters, telecommunications, and automotive markets. With well-recognized pan-European partners, the STARLight consortium is set to lead the next generation of silicon photonics technologies and applications,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics.

Silicon photonics is a preferred technology to support datacentres and AI clusters optical interconnects for scale-out and scale-up growth, as well as for other technologies such as LIDAR, space applications, and AI photonic processors that require better energy-efficiency and power efficient data transfer. It combines the high-yield manufacturing capabilities of CMOS silicon, commonly used in electronic circuits, with the benefits of photonics, which transmits data using light.

Addressing key challenges
The development of advanced Photonic Integrated Circuits (PICs) will tackle several challenges:

• High-speed modulation: creating highly efficient modulators capable of operating at speeds exceeding 200 Gbps per lane is a key focus
• Laser integration: developing efficient and reliable on-chip lasers is critical for integrated systems
• New materials: various advanced materials will be explored with actors like SOITEC, CEA-LETI, imec, UNIVERSITE PARIS-SACLAY, III-V LAB, LUMIPHASE, and integrated on a single innovative silicon photonics platform, such as Silicon-on-Insulator (SOI), Lithium Niobate (LNOI), and Barium Titanate (BTO)
• Packaging and integration: optimizing the packaging and integration of PICs with electronic circuits is essential to optimize signal integrity and minimize power consumption.

Applications-based innovations
Datacentres / Datacom
The STARLight project has an initial focus to build datacom demonstrators for datacentres, based on PIC100 technology, capable of handling up to 200Gb/s with key actors including ST, SICOYA and THALES. It will also develop prototypes for free-space optical transmission systems, designed for both space and terrestrial communication.

Additionally, the project will leverage the multidisciplinary experience of major contributors to shape the research effort towards a 400Gbps per lane optical demonstrator using new materials, targeting the next generation of pluggable optics.

Artificial Intelligence (AI)
The STARLight project aims to develop a cutting-edge photonic processor optimized for tensor operations, such as matrix vector multiplication and multiply-accumulate, with superior characteristics in terms of size, data processing speed, and energy consumption compared to existing technologies. Since neural networks – the core algorithms behind AI – rely heavily on tensor operations, enhancing their efficiency is critical for AI processing performance.

Telecommunication
The STARLight project plans to develop and showcase innovative silicon photonic devices specifically designed for the telecommunications industry. Ericsson will focus on two concepts to improve mobile network efficiency. The first involves the development of an integrated switch to enable optical offload within Radio Access Networks, allowing for more efficient handling of data traffic. The second concept explores Radio over Fiber technology to relocate power-intensive processing ASICs away from antenna units, thus providing enhanced capacity and savings in embodied CO2. Additionally, MBRYONICS will develop a free space to fiber interface at the reception of Free Space Optical (FSO) communication, which is a key element in the design of an optical communication system.

Automotive/ Sensing
The STARLight project will also demonstrate how it performs in sensing applications, and the close relationships of STEERLIGHT, a LiDAR sensors maker, with leading car manufacturers will help make this an industrial reality.

“STEERLIGHT is developing a new generation of 3D vision sensors—non-mechanical FMCW LiDARs—powered by groundbreaking silicon photonics technology that enables the entire system to be integrated onto a microchip. In the coming years, the light-vehicle components market will undergo a significant transformation driven by the rise of advanced driver-assistance systems (ADAS), which require compact, cost-effective, and high-performance LiDAR solutions. Securing sovereign sources of microelectronic components is a strategic priority for STEERLIGHT to enable large-scale production of this next generation of LiDAR systems. This is essential for European players to maintain a leading position in the global value chain and to ensure technological sovereignty in a highly competitive and rapidly evolving sector. The STARLight project will support this goal with ST’s proprietary advanced silicon photonics platform, bringing the capability to industrial maturity.” – François Simoens, CEO and co-founder of SteerLight.

Within the project, THALES will develop sensors that accurately generate, distribute, detect, and process signals with intricate waveforms to demonstrate key functionalities. More broadly, the outcomes of this project are also intended to benefit the wider ecosystem of indoor and outdoor autonomous robot manufacturers.

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KYOCERA AVX released the new KGP Series commercial-grade stacked capacitors for high-frequency applications in the industrial and downhole oil and gas industries.

The new commercial-grade KGP Series stacked multilayer ceramic capacitors (MLCCs) deliver higher capacitance values in the same mounting area as traditional capacitors to support the enduring miniaturization megatrend and are manufactured without lead or cadmium to support the thriving sustainability megatrend and ease standards compliance. They also exhibit low equivalent series resistance (ESR) and inductance (ESL) to minimize noise and optimize performance and feature metal lead frames that reliably suppress both thermal and mechanical stress to ensure stability and durability.

KGP Series stacked MLCCs are currently available in five EIA case sizes (1210, 1812, 1825, 2220, and 2225) with two stack sizes, maximum thicknesses spanning 3.40mm to 6.95mm, and “J” or “L” leads. They are also available in three dielectrics (C0G, X7R, and X7T). The series is rated for operating voltages spanning 50V to 1,500V, capacitance values ranging from 10nF to 47µF ±10% or 20% capacitance tolerance, and operating temperatures extending from -55°C to +125°C.

Ideal applications for the series extend throughout the industrial, alternative energy, and downhole oil and gas industries and include power supplies, DC/DC converters, control circuits, high voltage coupling, and DC blocking.

“The new KGP Series stacked MLCCs further expand our proven portfolio of capacitor solutions optimized for growing markets with challenging performance requirements, including the power supply and downhole drilling markets,” said Zack Kozawa, Director of MLCC Product Marketing at KYOCERA AVX. “They also support the miniaturization and sustainability megatrends affecting these and other market segments.”

KGP Series stacked MLCCs with C0G and X7R dielectrics are available in all five EIA case sizes with the full range of rated voltage values and capacitance values up to 220nF and 47µF, respectively. Those with X7T dielectrics are available in three EIA case sizes (1210, 1812, and 2220) with three rated voltages (250V, 450V, and 630V) and capacitance values up to 4.7μF.

All parts are thoroughly tested for visual characteristics, capacitance values, dissipation factor, temperature coefficient, insulation resistance, dielectric strength, temperature cycling, steady state and load humidity, high temperature load, termination strength, bending, vibration resistance, and soldering heat resistance to ensure peak performance in a wide range of challenging high-frequency applications. They are also RoHS compliant and packaged on tape and reel in quantities of 500–1,500 for automated placement.

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Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth, low latency and advanced security for high-performance compute, cloud computing and hyperscale data centers

As artificial intelligence (AI) workloads and high-performance computing (HPC) applications continue to drive unprecedented demand for faster data movement and lower latency, Microchip Technology has introduced its next generation of Switchtec Gen 6 PCle Switches. The industry’s first PCIe Gen 6 switches manufactured using a 3 nm process, the Switchtec Gen 6 family is designed to deliver lower power consumption and support up to 160 lanes for high-density AI system connectivity. Advanced security features include a hardware root of trust and secure boot, utilizing post-quantum safe cryptography compliant with the Commercial National Security Algorithm Suite (CNSA) 2.0.

Previous PCIe generations created bandwidth bottlenecks as data transferred between CPUs, GPUs, memory and storage, leading to underutilization and wasted compute cycles. PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied. Switchtec Gen 6 PCIe switches enable high-speed connectivity between CPUs, GPUs, SoCs, AI accelerators and storage devices, and are designed to help data center architects scale to the potential of next generation AI and cloud infrastructure.

“Rapid innovation in the AI era is prompting data center architectures to move away from traditional designs and shift to a model where components are organized as a pool of shared resources,” said Brian McCarson, corporate vice president of Microchip’s data center solutions business unit. “By expanding our proven Switchtec product line to PCIe 6.0, we’re enabling this transformation with technology that facilitates direct communication between critical compute resources and delivers the most powerful and energy efficient switch we’ve ever produced.”

By acting as a high-performance interconnect, the switches allow for simpler, more direct interfaces between GPUs in a server rack, which is crucial for reducing signal loss and maintaining the low latency required by AI fabrics. The PCIe 6.0 standard also introduces Flow Control Unit (FLIT) mode, a lightweight Forward Error Correction (FEC) system and dynamic resource allocation. These changes make data transfer more efficient and reliable, especially for small packets which are common in AI workloads. These updates lead to higher overall throughput and lower effective latency.

Switchtec Gen 6 PCIe switches feature 20 ports and 10 stacks with each port featuring hot- and surprise-plug controllers. Switchtec also supports NTB (Non-Transparent Bridging) to connect and isolate multiple host domains and multicast for one-to-many data distribution within a single domain. The switches are designed with advanced error containment and comprehensive diagnostics and debug capabilities, a wide breadth of I/O interfaces and an integrated MIPS processor with bifurcation options at x8 and x16. Input and output reference clocks are based on PCIe stacks with four input clocks per stack.

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Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute Platforms

Nuvoton Technology Corporation announced the launch of the Arbel NPCM8mnx System-in-Package (SiP) — a compact, fully integrated BMC subsystem designed to accelerate deployment and simplify system management in next-generation AI servers and datacenter platforms.

As artificial intelligence reshapes the datacenter landscape, the demand for security, high-density, and easily deployable infrastructure is surging. Nuvoton ‘s new SiP solution addresses this need head-on, offering a plug-and-play BMC platform that dramatically reduces design complexity and time-to-market.

Compact Powerhouse for AI and Cloud Infrastructure

The NPCM8mnx-SiP integrates all essential BMC components into a single 23x23mm² BGA package, reducing the subsystem footprint by approximately 70%. This miniaturized form factor is ideal for:

• AI accelerator cards
• Multi-node compute systems
• Remote access modules
• Edge and hyperscale datacenters

Key integrated components include:

• Full-featured Arbel NPCM8mnx BMC
• Embedded DDR4 memory (1 GB to 4 GB)
• eMMC storage (8 GB to 64 GB)
• NOR Flash (16 MB to 128 MB)
• Reference clock oscillator
• Voltage regulators
• Over 120 passive components

This level of integration eliminates the need for high-speed signal simulations, power sequencing, and complex PCB layouts — enabling faster, more reliable product development.

Built for Security and Open Standards

Security is at the heart of the NPCM8mnx-SiP. Built on the latest Arbel A3 architecture, it supports:

• Post-Quantum Cryptography (PQC) LMS algorithms for secure boot
• DICE Unique Secrets generation and customer-specific key provisioning
• Compliance with OCP S.A.F.E. and FIPS 140-3 standards

The SiP is fully compatible with existing Arbel software stacks, including:

• OpenBMC
• OP-TEE / U-Boot / Linux
• pRoT secure firmware stack

This ensures seamless integration into open compute environments and supports industry-wide efforts toward secure and transparent infrastructure.

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STMicroelectronics has announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, has joined the board of directors of the FiRa Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.

ST is actively driving the development the IEEE 802.15.4ab amendment, building upon previous UWB enhancements to further improve system performance and expand UWB’s application scope. The ongoing evolution of UWB standards promises significant improvements, including centimeter-level accuracy, enhanced security, and reduced power consumption. These improvements are critical for enabling a wide range of applications, from automotive access and digital keys to smart home automation and IoT innovations. Integrating IEEE 802.15.4ab into the CCC Digital Key ecosystem would represent a major step forward in addressing implementation challenges and accelerate broader adoption of UWB technology in both consumer and automotive markets.

“STMicroelectronics has long been a valued member of the FiRa Consortium, and we are thrilled to welcome them at the Sponsor level. This upgrade is a reflection of ST’s deepening commitment to the future of Ultra-Wideband technology and to FiRa’s mission. We are especially pleased to have Rias Al-Kadi, General Manager of ST’s Ranging and Connectivity Division, join our Board of Directors. His experience and leadership will be instrumental as we continue to expand UWB’s global impact and shape the future of secure, interoperable solutions,” states SK Yong, FiRa Consortium Board Chairman.

“Joining the FiRa board underlines our commitment to advancing the CCC Digital Key and other UWB-based applications,” said Rias Al-Kadi, General Manager, Ranging and Connectivity Division, STMicroelectronics. “By deeply engaging in standardization and certification across all major UWB groups, we are helping to shape the future of UWB technology to deliver maximum value for consumers and industries alike.”

Rias Al-Kadi’s appointment further strengthens ST’s active participation in key UWB standards bodies and consortia, including the IEEE, Connected Car Consortium (CCC), Connectivity Standards Alliance (CSA), and UWB Alliance. Through strategic participation in these groups, ST supports the continuous evolution of UWB technology aimed at enhancing user experiences and lowering system costs, particularly in consumer and automotive access applications. This aligns with ST’s vision to foster a robust UWB ecosystem that enables seamless, secure, and cost-effective solutions for the growing UWB market.

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NEPCON ASIA 2025, taking place from October 28 to 30 at the Shenzhen World Exhibition & Convention Center, is set to deliver an unparalleled platform for the global electronics manufacturing community. With over 3500 participating companies across more than 140,000 square meters and 80 high-level forums, the show will highlight the latest advancements in smart manufacturing, AI-driven automation, robotics, and semiconductor technologies.

According to Fortune Business Insights, the global Electronics Manufacturing Services (EMS) market reached USD 609.79 billion in 2024 and is projected to grow to USD 648.1 billion in 2025, eventually surpassing USD 1 trillion by 2032, underscoring the tremendous growth potential of the electronics manufacturing industry.

Connecting Global Manufacturers with Cutting-Edge Innovation

NEPCON ASIA 2025 will host over 600 leading suppliers from sectors including PCB assembly, smart factories, semiconductor packaging and testing, automotive electronics, and touch display solutions. The exhibition provides an immersive opportunity for international visitors to explore innovative products, witness advanced electronic manufacturing processes, and identify emerging technology trends. Through hands-on demonstrations, component dissections, and real-world production line showcases, visitors will gain insight into the industry’s next-generation solutions.

Driving Industry Transformation with AI and Smart Manufacturing

The concurrent S-Factory Expo will feature AI-driven smart factory and automation forums, showcasing how integration of AI, robotics, and digitalized production systems dramatically enhancing operational efficiency, product quality, and flexibility. Leading robotics companies such as FANUC, Elite Robot, Flexiv, and Fudan University will provide in-depth analyses of AI applications, offering actionable insights for businesses seeking to accelerate production line upgrades and embrace intelligent manufacturing transformation.

Vision + AI: Empowering Intelligent Manufacturing

The Vision China Shenzhen exhibition will highlight the convergence of machine vision and AI with a dedicated “Showcase for Machine Vision Innovative Products” Area and the Vision + AI High-Quality Development Innovation Conference. This platform will unveil global product launches and present full-industry-chain intelligent vision solutions for electronics, new energy, industrial automation, life sciences, and packaging industries. Attendees will gain critical insights into quality inspection, smart production, and process optimization, saving time while unlocking new business opportunities.

Innovative Technology Areas

Specialized Areas at NEPCON ASIA 2025 include:

• Embodied Intelligence Robot & Core Component Dissection Area – Featuring robot controllers, sensors, actuators, and power modules from leading brands such as Qiongche Intelligent, RobStride Dynamics, AISpeech and more, providing a window into the next frontier of robotics.
• AI Smart Glasses Disassembly Area – Showcasing 25 new AI smart glasses launched in 2025 by Huawei, Xiaomi, Meta, Lenovo, and others, integrating advanced optics, chips, sensors, and interactive technologies.
• IGBT & SiC Packaging and Testing Demo Line – Demonstrating over 50 semiconductor packaging and testing processes, supporting industry R&D and process optimization.
• Finished Electronic Product Automated Packaging Demonstration Area – Highlighting flexible manufacturing, automated packaging, and intelligent conveyance solutions from leading suppliers such as Fanuc, Elite, Feixi, and Yongchuang, enabling higher efficiency and quality control for electronic production lines.
• Engaging Global Audiences through Conferences and Forums – NEPCON ASIA 2025 will host 40 high-level forums across automotive electronics, semiconductors, AI, embodied intelligence, and smart glasses, bringing together industry experts, scholars, and practitioners to explore current challenges, future trends, and cross-industry collaboration opportunities. The SMTA International Forum will feature global technical leaders, including Charles E. Bauer Ph.D from SMTA, delivering international perspectives on the evolution of electronics manufacturing technology.

• Unlocking Global Business Opportunities – With a focus on international collaboration, NEPCON ASIA will invite buyers from Thailand, Vietnam, Malaysia, and Indonesia for factory tours, country-specific networking events, and business matchmaking. This ensures meaningful engagement between Chinese manufacturers and global electronics stakeholders, fostering partnerships and uncovering new market opportunities.

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New Simulation & Optimization Platform Enables Custom Coil Designs for Industrial, Robotics and Medical Systems

Renesas Electronics Corporation introduced a new family of magnet-free inductive position sensor (IPS) ICs that can be fully customized for various coil designs compatible with a wide range of industrial applications such as robotics, medical and healthcare, smart buildings, home appliances and motor commutation. Built for high resolution, precision, and robust performance, the new RAA2P3226, RAA2P3200, and RAA2P4200 sensor ICs offer a cost-effective alternative to traditional magnetic and optical encoders, which can be bulky, expensive, and require frequent maintenance. Renesas also launched a web-based design tool that allows customers to easily create custom sensing elements to meet their specific system needs.

Operating on non-contact coil sensor technology, Renesas IPS products use a simple metallic target and dual-coil or single-coil configurations to detect absolute rotary, linear, or arc positions. These sensor ICs are designed to maintain stable operation even in environments with elevated temperatures (-40 to 125°C), particulate matter, moisture, mechanical vibration and electromagnetic interference. Moreover, they are immune to stray magnetic fields and require no maintenance, unlike magnetic- or optical encoder-based sensors. Their durability and low upkeep make them a reliable and cost-effective sensing solution for motor drives, actuators, valves, service robots and infrastructure applications, where reliability and long-term performance are critical.

All three products offer high precision in detecting target positions, with accuracy better than 0.1 percent of the full-scale electrical range. Two of the products, the RAA2P3226 and RAA2P3200 operate at 600K RPM (electrical) with propagation delays under 100ns, which is imperative in high-speed motor applications. The advanced RAA2P3226 supports dual-coil sensing with up to 19-bit resolution and 0.01° absolute accuracy, providing the high-precision performance required for robotic applications. The RAA2P4200 targets low-speed applications such as medical devices and power tools and the RAA2P3200 is optimized for high-speed motor commutation. All three products include automatic calibration and linearization to simplify integration and improve system-level performance.

In addition to these three products, Renesas will also introduce automotive-grade IPS, RAA2P452x and RAA2P4500. The dual-channel RAA2P452x allows customers to achieve ASIL D safety compliance when paired with Renesas MCUs. This automotive-grade solution offers a cost-effective option for low-speed body control and chassis systems without compromising quality.

Designing with inductive position sensors typically involves integrating a PCB, an IC with passive components, and a metal target mounted to the moving part. The most complex part is the external sensing element, such as the transmitter and receiver coils, which must be precisely configured to realize accuracy and customized to the system’s mechanical and environmental requirements. Renesas’ web-based Inductive Position Sensor Coil Optimizer tool tackles this challenge by automating coil layout, simulation, and tuning, significantly reducing the learning curve for developers. With this tool, engineers can also obtain accurate performance estimates and overcome manufacturing constraints by optimizing the coil layout.

“Our new web-based coil design tool is a game changer for inductive position sensing,” said Leopold Beer, Vice President of the Sensors Division at Renesas. “In the past, developers had to rely on chip suppliers for technical expertise when working with inductive position sensors. We completely removed this hurdle. This intuitive tool lets developers fully customize the sensing element and automatically fine-tunes it to achieve maximum accuracy and robustness at the system level. This dramatically lowers the barrier of entry and enables more customers, regardless of their expertise level, to confidently integrate inductive position sensing into their designs.”

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The IEEE International Electron Devices Meeting (IEDM) is considered the premier forum where scientists and engineers come together to disclose, discuss, and debate the best recent R&D work in electron devices, semiconductors, and microelectronic technologies. The 71st annual IEEE IEDM conference will be held December 6-10, 2025, at the Hilton San Francisco Union.

Supporting the theme “100 Years of FETs: Shaping the Future of Device Innovations,” the 2025 IEDM technical program will consist of 295 presentations, plus a host of events.

“This year’s IEDM offers a preview of the next computing paradigm. We are witnessing the convergence of atomic-scale fabrication, 3D integration, and neuromorphic design, moving us beyond yesterday’s technology and even classical computing. From monolithic CFETs that redefine transistor density to in-memory computing that can mitigate the von Neumann bottleneck, more intelligent and more efficient technology is being built here,” said Gaudenzio Meneghesso, IEDM 2025 Publicity Chair, and Head of the Department of Information Engineering at the University of Padova.

“As AI is demanding unprecedented efficiency, the device community is rising to the challenge. IEDM 2025 showcases technologies that can power the next AI decade: from GaN chiplets for power delivery and silicon photonics for data transfer to 3D DRAM and FeFETs for in-memory computing. These device technologies will make the algorithms of tomorrow possible.”

“The pursuit of Moore’s Law has evolved from a simple race to shrink transistors into engineering in multiple dimensions. IEDM 2025 showcases this new era: we are scaling up with 3D stacking like CFETs and 3D DRAM, scaling laterally with atomic-layer-deposited channel materials, and scaling past CPUs with novel architectures like in-memory computing,” said John Paul Strachan, IEDM 2025 Publicity Co-Chair, Director of Peter Grünberg Institute, Forschungszentrum Jülich, and Professor at RWTH Aachen University. “This is the culmination of a century of FET innovation, pushing the boundaries of what is physically possible to compute.”

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OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS image sensor with TheiaCel technology.

This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance systems (ADAS) and autonomous driving (AD). The device will be introduced at AutoSens Europe.

“OMNIVISION’s OX08D10 image sensor with TheiaCel technology was launched at AutoSens Brussels in 2023 and has been a highly successful product for automotive OEMs seeking a single device that integrates all of the most important image sensor features, including best-in-class low-light performance, LED flicker mitigation, compact size, superior image quality at high temperatures, and low power,” said Dr. Paul Wu, director of automotive product marketing, OMNIVISION. “Our mission is to partner with our customers to solve their toughest challenges. That’s why our latest-generation devices are designed with innovative features our customers need.”

The OX08D20 features all of the benefits of the OX08D10, as well as:

• An innovative capture scheme developed in collaboration with Mobileye that significantly reduces the motion blur of nearby objects (while driving) and improves low-light performance
• An upgrade to 60 frames per second (fps) to enable dual-use cameras
• Updated cybersecurity to match the latest industry standard, MIPI CSE 2.0

In addition to industry-leading low-light performance, the device has low power consumption and comes in an a-CSP package that is 50% smaller than other exterior sensors in its class.

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OMNIVISION launched the latest addition to its popular Nyxel near-infrared (NIR) technology family: the new OX05C—the automotive industry’s first and only 5-megapixel (MP) back-side illuminated (BSI) global shutter (GS) high dynamic range (HDR) sensor for in-cabin driver and occupant monitoring systems (DMS and OMS). The OX05C’s exceptional capabilities will be demonstrated at AutoSens Europe.

The OX05C GS HDR sensor delivers extremely clear images of the entire cabin, enabling improved algorithm accuracy even in challenging high-brightness lighting conditions. It features a pixel size of just 2.2µm and OMNIVISION’s revolutionary Nyxel NIR technology, which achieves the world’s class-leading quantum efficiency (QE) at the 940nm NIR wavelength to further improve DMS and OMS capabilities in low-light conditions. The OX05C has on-chip RGB-IR separation, relieving the burden of a dedicated image signal processor (ISP) and backend processing, thus freeing extra bandwidth for other tasks.

At just 6.61mm x 5.34mm, the OX05C1S package is 30% smaller than its predecessor, the OX05B (7.94mm x 6.34mm), providing automotive OEMs with greater design flexibility to place the camera in various locations within the cabin. Moreover, OEMs can use the same camera lens when upgrading from the OX05B to the newer OX05C, providing a design and cost advantage.

“We have applied OMNIVISION’s unparalleled HDR technology and top-notch RGB-IR processing algorithm for security cameras to the automotive market. This is a significant step forward in the advancement of DMS and OMS cameras,” said Dr. Paul Wu, Director of automotive product marketing at OMNIVISION. “Our OX05C sensor has industry-leading perception performance. Even in bright light conditions, the driver’s face is not washed out, and the camera can detect distractions or drowsiness.” Added Wu, “DMS cameras are a critical safety component for ADAS (advanced driver assistance systems), which is why OMNIVISION strives to continually improve them.”

“Global shutter combined with HDR and Nyxel NIR sensitivity makes the OX05C a real step forward for in-cabin imaging,” said Detlef Wilke, Vice President Innovations & Strategic Partnerships at Smart Eye. “It gives our algorithms the consistency they need to track driver attention and occupant status in everything from bright sunlight to near darkness, while the smaller form factor offers OEMs more flexibility in camera placement.”

Compared to rolling-shutter HDR sensors, the GS HDR OX05C avoids interference from other IR light sources in the cabin, greatly improving the RGB image quality and providing flexibility to enable more capture scheme and functions in real applications. The OX05C features integrated cybersecurity and supports simultaneous driver and occupant monitoring with a single camera, reducing complexity, cost and space. In addition, OMNIVISION developed the sensor with strong ecosystem partner support to provide a complete, seamless solution for automotive OEMs.

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Vishay Intertechnology, Inc. announced that it has successfully delivered on the ambitious expansion of its inductor and frequency control device (FCD) product lines announced in September 2024, significantly increasing the breadth and availability of components now in the field. The company has released more than 2000 new SKUs across nearly 100 series across inductors and frequency control devices, with continued rollouts underway in 2025.

The expanded offering simplifies sourcing for Vishay customers and supports more applications through broader inductance and voltage ranges, improved noise suppression, and additional size variations to fit even the smallest PCB footprints. Recent launches include new wireless charging inductors, common-mode chokes, high current ferrite impedance beads, and TLVR inductors, as well as nearly 15 new FCD products.

“This expansion was designed to deliver on our commitment to give customers maximum design flexibility, and the market response has confirmed that we’ve hit the mark,” said Mike Husman, Senior Vice President, Inductor Division, at Vishay. “We’re now seeing the impact of this expansion in the field — thousands of new SKUs, strong uptake through distribution, and a clear signal from our customers that they value the depth and readiness of our offering.”

To support this growth, Vishay continues to invest in global production capacity, including expansions in Asia, Mexico and the Dominican Republic. In response to the industry’s increasing demand for diversified manufacturing locations — and part of Vishay’s strategy of vertically integrated, resilient manufacturing — flagship Vishay-produced IHLP power inductors are now shipping from the company’s La Laguna plant in Gómez Palacio, Durango.

The momentum continues in 2025, with more product series set to launch in the coming months. In total, the company expects to exceed 3000 new SKUs across inductors and frequency control devices from its overall expansion effort, supporting increased design-in activity across industrial, telecom, and consumer applications.

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Keysight Technologies will demonstrate 20 advanced AI-enabled 6G and wireless solutions designed to accelerate 6G and wireless innovation at India Mobile Congress 2025. The solutions on display include network digital twins, AI-driven channel modeling, and high-fidelity emulation, which enable rapid validation of beamforming, interference mitigation, and ultra-low latency, advancing next-generation 6G and wireless communication systems. In addition, Prasad Petkar, Keysight India Wireless SEO Manager, will present a paper entitled, “Engineering the 6G Future: Accelerating Wireless Innovation from Lab to Live Networks.”

Keysight Technologies will showcase its cutting-edge AI-enabled 6G and wireless solutions from October 8–11, 2025, at Booth No. C10 in Yashobhoomi, New Delhi.

Keysight will feature the following demonstrations:

• mMIMO Design from FR1 to FR3 / New 6G Frequency – Sub THz and FR3: Keysight will show how it’s enabling the leap to 6G with advanced mMIMO design across FR1 to FR3, including new sub-THz bands. These next-generation test solutions unlock faster speeds, wider bandwidths, and reliable performance, helping accelerate future wireless technologies from concept to real-world deployment.
• 5G Interference Mitigation: The demo includes advanced spectrum monitoring, signal analysis, and emulation workflows to detect and isolate interfering signals across licensed and unlicensed bands. Leveraging real-time visibility and AI-driven analytics, the solution accelerates root-cause identification, optimizes spectrum usage, and validates network robustness under diverse interference scenarios critical for 5G evolution.
• NTN Design Optimization: This demo showcases advanced modeling and test workflows for satellite-to-terrestrial integration, addressing propagation delays, Doppler effects, and dynamic channel conditions. By combining link-level validation, system simulation, and real-world emulation, the solution enables engineers to optimize performance, spectrum efficiency, and interoperability for emerging 5G-advanced and 6G NTN deployments.
• RF Environment Emulation: The demo recreates real-world wireless conditions in the lab and highlights how innovators can test devices, networks, and use cases under complex RF scenarios including mobility, interference, and multi-path. This ensures reliable performance, faster validation, and reduced field testing costs for 5G and 6G.
• Device Security Defense: The demo integrates protocol fuzzing, penetration testing, and threat emulation to expose vulnerabilities across wireless, application, and cloud layers. Using automation and real-world attack libraries, the solution validates device resilience against cyberattacks, enabling engineers to harden designs, ensure standards compliance, and accelerate secure product deployment.
• Digital Twins Emulation: This demo enables accurate, scalable modeling of devices and networks under real-world conditions. By combining system simulation, AI-driven analytics, and RF environment emulation, the solution provides end-to-end validation of designs and architectures, helping engineers optimize performance and reliability across 5G-advanced and 6G.

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As part of a big push towards the development of India’s semiconductor industry, Electronics and IT Minister Ashwini Vaishnaw has sanctioned the setup of the ‘NaMo Semiconductor Laboratory’ at IIT Bhubaneswar. The ₹4.95 crore estimated facility will enhance India’s strength in chip design, fabrication, and research.

The new laboratory, as per an announcement by the Ministry of Electronics and Information Technology (MeitY), will be a state-of-the-art facility with the machinery and software required for training in semiconductors, design, and fabrication. The center is hoped to be instrumental in developing a rich talent pool of engineers and researchers equipped with industry-standard skills for India’s emerging semiconductor industry.

The ministry underscored that the initiative is consistent with the government’s overall vision of transforming India into a global center for semiconductor manufacturing and innovation. The lab will also aid in the creation of qualified professionals for future chip manufacturing and packaging facilities in the country.

The officials said that the setup of the NaMo Semiconductor Laboratory would act as a catalyst for India’s rapidly growing semiconductor ecosystem, reiterating flagship programs like ‘Make in India’ and ‘Design in India’.

As the global semiconductor industry is experiencing explosive growth, the step is likely to enhance India’s role in the international value chain and spur the country’s march toward technological independence.

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“AI is redefining the role of designers by automating design engineering, improving verification accuracy, and shortening development cycles,” says Satoshi Shibatani, vice president of EDA Technology and Design Services Division at Renesas, in an exclusive conversation with ELE Times. As various professions worldwide undergo a profound shift in their thought processes and operations, largely driven by the emergence of AI, ELE Times takes the hot seat with Satoshi Shibatani of Renesas, the second most prominent company in the automotive microcontroller market in 2024, to discuss the dynamics of the changing role specifically in the landscape of product design and development. 

He remarks, “The role of an engineer is evolving from ‘manual designer’ to ‘AI-collaborative design strategist,’ underlining the impact AI has made on the role of an engineer in the landscape of product development. Through this, he also reflects on the expectations that the companies have of the prospective engineers, which is to become more and more AI-friendly and intelligence-collaborative.

How’s the transformation playing out? 

“At Renesas, we have been advancing design efficiency using AI through the company-wide ‘Design by AI Project’ since 2021, and it has already shown results across many development processes,” says Satoshi, reflecting on the prevalent use of AI at Renesas specifically for product design and development. This captures the early adoption approach that Renesas pursued with the AI technology to enable growth and transformation in the product development cycle. 

Which part is most AI-based now? 

Since design is one of the most important and complex stages of product development, it is vital to know which part has been most affected by AI. Among the various processes involved in the design cycle of a product, verification is one aspect that has been widely affected owing to the emergence of AI. “In verification, generative AI is used for RTL (Register Transfer Level) reviews and spec analysis, which is expected to enable early bug detection and a significant reduction in verification processes,” says Satoshi. 

With this illustration, he simply shows how AI has influenced decision-making at the level of product design through venturing into such intricate processes as bug detection.

How exactly is Renesas using AI? 

At Renesas, AI is being integrated into design through what the company describes as a “collaborative design style.” Rather than relying on AI solely for automation, designers interact with its outputs, assess the results, and propose improvements. “In this model, AI serves not merely as an automation tool but as a collaborative partner that enhances human thinking. Innovation is driven by human creativity, and rapid trial-and-error cycles help us reach our potential and foster continuous breakthroughs,” Satoshi remarks.

How’s the role of engineers changing then? 

As AI takes a more central role in design, the role of engineers at Renesas is also transforming. Shibatani explains that the shift is from being a “manual designer” to becoming an “AI-collaborative design strategist.” This means engineers are now expected to go beyond traditional design skills and embrace new capabilities such as data literacy, prompt engineering, AI model interpretation, and the use of collaborative AI tools. 

“We provide training programs covering AI tool usage, interactive design support with generative AI, model building, and output evaluation and improvement,” he adds, noting that Renesas is actively shaping an environment to support this talent development and ensure engineers are equipped for the future.

What’s the real efficiency metric? 

While aims and efforts do count, metrics make the final case for business. “For design optimization, AI has improved design efficiency by up to 30% in some cases,” says Satoshi as he underlines the real metric conveying the impact of AI usage in the product design and development cycle at Renesas. He states that the company has been consistently enhancing design efficiency since 2021. As a result, apart from the improved productivity through automation, AI usage has contributed to better PPA (Performance, Power, Area) metrics at Renesas. 

Why is it not all good yet?

In the conversation, he further touches upon the various challenges that accompany AI prevalence in the development cycle. It includes “data quality, vendor collaboration, security, and tool integration,” says Satoshi, underlining the fact that no system is devoid of challenges for the engineers. He further states that to address the very issue of data quality, Renesas has built a system that quantitatively measures AI data quality by combining existing EDA tools and technologies. 

As with any system, the AI-powered processes are going through a transition phase wherein various modes and operations are yet to be witnessed. At this stage, AI is significantly improving analysis speed and accuracy by parsing large design datasets and specifications to auto-generate verification plans and test benches. However, it continues to operate under human supervision and is not fully autonomous. Sensitive customer data remains excluded from training and is discarded after use, while strict traceability measures are in place to ensure reliability and prevent hallucinations.

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India is on the verge of an electric revolution. With the government aiming at 30% EV penetration by 2030 and vehicle electrification being a key element of the country’s decarbonization roadmap, power electronics has emerged to be among the very crucial and lucrative sectors in this transformation.

Power electronics, including inverters, onboard chargers, DC-DC converters, and battery management systems (BMS), are all essential to harness energy efficiently and maximize performance from EVs. Two-wheelers to electric buses, the whole spectrum of EVs depends on these systems to efficiently execute the conversion, controlling, and distribution of electrical energy.

As the global automotive industry accelerates toward electrification, power electronics have emerged as the driving force behind innovation in electric vehicle. These intelligent systems regulate energy flow, drive efficiency, fast charging, and ensure consistent performance across vehicle segments.

In 2024, the global market for power electronics in electric vehicles surged to USD 28.5 billion, and it’s poised for a meteoric rise projected to exceed USD 70 billion by 2030, driven by a robust CAGR of over 17%. In India, the automotive power electronics market was valued at USD 11.98 billion in 2024 and is projected to grow to USD 22.7 billion by 2034, with a CAGR of 6.6%.

As the Indian EV market grows further, power electronics is seeing extreme localization, investment flows, and technological upgrades-in a clear push towards high-value manufacturing and strategic partnerships.

India’s Five-Year Data Snapshot of the EV Power Electronics Market (2019-2024):

Between 2019 and 2024, India’s EV power electronics market evolved significantly. In 2019, the market size was ₹1,050 crore, driven by early adoption in fleet EVs and pilot policy programs. In 2020, it grew to ₹1,350 crore, supported by the FAME-II extension and state-level EV policies. By 2021, the market reached ₹1,870 crore, fueled by a surge in electric two-wheeler sales and increased component imports. In 2022, local development of BMS and inverters gained momentum, pushing the market to ₹2,720 crore. In 2023, investments in silicon carbide (SiC) production and EMS facilities elevated the market to ₹3,590 crore. The estimated value for 2024 is ₹4,450 crore, driven by the Make in India initiative and rising demand from electric light commercial vehicles (e-LCVs) and electric buses.

Current Market Conditions and Trends:

1. Increasing Demand in the 2W and 3W

Electric two-wheelers and three-wheelers, but most of all in last-mile logistics, food delivery, and shared riding, make up over 80% of the EV sales in India. These require:

• Compact motor controllers, low-voltage
• DC-DC converters integrated
• BMS that is basic but efficient

Startups such as Ola Electric, Ather Energy, Yulu, and Euler Motors are engaged in localizing power electronics with design, testing and fabrication facilities within India.

2. Localization Drive by the Government

The Indian government’s localization drive has prioritized power electronics under the Production Linked Incentive (PLI) schemes for Advanced Chemistry Cell (ACC) battery storage and auto components, designating them as verticals of strategic importance. These incentives aim to bolster domestic manufacturing of inverters and EV chargers, foster the development of EMS (Electronics Manufacturing Services) clusters, and establish robust testing and standardization infrastructure through institutions like ARAI and ICAT. States such as Tamil Nadu, Karnataka, Uttar Pradesh, and Telangana are rapidly emerging as key hubs for EV component production, reinforcing India’s ambition to become a global manufacturing powerhouse in electric mobility.

3. SiC/GaN Technology

SiC and GaN technologies in India are still in their early stages, with manufacturers largely dependent on imports, through companies like Tata Elxsi, Servotech and Exicom are advancing local SiC packaging and vertical integration while some institutions are actively engaged in R&D for high-voltage inverter systems.

Segmentation:

• For two- and three-wheeler EVs, the market demands low-cost inverters, compact BMS, and DC-DC converters. This segment includes over 25 OEMs and a growing retrofitting market.
• Passenger EVs require 400V inverters, onboard chargers, and smart BMS, with companies like Tata and Mahindra driving demand.
• Commercial EVs, such as electric buses and e-LCVs, need rugged, high-voltage inverters and chargers.
• EV chargers require AC-DC converters and controller boards, with over 6,000 charging stations planned by FY 2026.
• Fleet and utility EVs—used by logistics firms, warehouses, and airport fleets—benefit from remote diagnostics and telematics-integrated BMS.

Key Indian Players:

• Tata Elxsi is working on inverters, BMS, and simulation software, with active development in SiC technology.
• Servotech Power focuses on EV chargers, onboard chargers, and DC-DC converters, and plans to manufacture SiC modules in India.
• Exicom specializes in battery packs, BMS, and electronics for light commercial vehicles, and is scaling up production for commercial EVs.
• Ola Electric is developing integrated powertrain systems, with in-house controller and BMS design underway.
• Delta India supplies power conversion systems to Tata Motors and public charging infrastructure.

Growth Drivers and Future Outlook:

Government initiatives and the flourishing private sector work together to provide electronics in India aesthetic power. Supporting localism, the drivers include PLI implementation schemes, import duties granted on the concept of localization, and, on the other hand, electrification of public transport under the PM e-Bus Sewa Yojana. Compliance by fleet operators has been instrumental in accelerating demand; some of them are leading corporate examples, such as Tata, Amazon, and Flipkart. Progressive state EV policies have been sowing the fertile grounds of land, subsidies, and demand-side incentives for manufacturing and innovation.

Opportunities (2025–2030):

The next five years open immense commercial opportunities. India shall become a regional export hub for EV inverters, especially to Southeast Asian and MENA markets. The indigenous development of GaN-based OBCs and DC-DC converters grows ever more attractive, backed by scalable EMS units crafted for startups and MSMEs. Also, modular powertrain kits for retrofitting ICE vehicles offer a good retrofit market in the Tier-2 and Tier-3 cities.

Challenges:

Despite building momentum, some barriers remain in place. As of now, India does not have any domestic entities manufacturing SiC wafers and the high import duties on the GaN components and control ICs continue to eat into margins. There is also an acute shortage of skills in automotive-grade electronics design, and the industry grapples with issues relating to standards and thermal management-a big concern for operating under tropical climates that India presents.

Commercial forecast: By 2030 & onward:

The Mutually Enforced Power Electronics Market in India is slated to exponentially shoot past ₹20,000 crore by around 2030, with over 10 million EVs present on roads of India. Demand would come through the mid-range inverter platforms for domestic as well as for export purposes, with the scaling up of Tier-2 and Tier-3 supplier networks alongside deeper MSME integrations into the EV value chain.

Conclusion:

Power electronics are taking center stage in India’s fast charging electric vehicle landscape, which will support everything from 750V electric buses on major expressways to low-cost e scooters in Tier-2 cities. As vehicle electrification scales up, power electronics will determine not only the operational efficiency and reliability of EVs but also the worldwide competitiveness of India’s EV manufacturing ecosystem.

With supportive government policies in place, a large domestic demand base, growing R&D capabilities, along with increased attention from domestic and global investors, India stands on the cusp of becoming a global hub for EV power electronics manufacturing and innovation.

For OEMs, component makers, and tech entrepreneurs, the window of opportunity is now. Investment in localized, scalable, and intelligent power electronics solutions will reduce import dependency and costs while paving the way to assure dominance in one of the fastest-growing clean tech markets globally.

The future of India’s EV growth, and development, is not just about batteries and motors. It’s about the invisible engine that makes it all possible i.e power electronics.

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