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Devices and systems – from automotive and industrial to consumer electronics – rely on powerful, efficient, and secured microcontrollers for reliable operation. At embedded world 2025 in Nuremberg, Infineon Technologies AG will showcase how its innovative semiconductor solutions meet these needs and drive further advancements. The company will present high-quality microcontrollers featuring the latest technologies, enhanced security, and high precision – delivering excellent performance with low-power consumption. True to the motto “Driving decarbonization and digitalization. Together.” the Infineon booth in Hall 4A (booth #138) will present highlights from the consumer and IoT, automotive, and industrial sectors that contribute to a more sustainable future. In addition, customers can register for Infineon’s digital platform – the perfect place to dive deeper into the various technologies presented at embedded world during and after the event.

• Leading microcontrollers: The world of connected devices demands the highest reliability, precise calculations, robust security, energy efficiency, and user-friendly building blocks for high-quality designs.

• PSOC microcontroller families
• TriCore-based AURIX family
• AIROC Wi-Fi-connected MCUs
• MOTIX MCUs
• Paving the way for RISC-V in automotive: Committed to establishing RISC-V as the open standard for automotive applications, Infineon is collaborating with key ecosystem partners to accelerate the adoption and maturity of RISC-V-based solutions.
• CRA-ready IoT solutions: Security is a prerequisite for connected devices and can be accomplished through either a secured MCU or a discrete security element. Mandatory regulations like the EU Cyber Resilience Act (CRA) or global initiatives like Matter aim to protect consumers and businesses using digital products and software. To meet these requirements, Infineon provides a range of high-security, CRA-ready solutions with Edge Protect: PSOC microcontrollers deliver robust security features, while OPTIGA discrete security elements integrate seamlessly with each PSOC.
• System Solutions: To help developers fully leverage MCUs, Infineon offers a comprehensive range of software solutions tailored to various industries. DEEPCRAFT Studio, Infineon’s edge AI development platform, and the DEEPCRAFT Ready Models, deliver an easy-to-use, end-to-end machine learning development experience – from data input to model deployment. ModusToolbox, a suite of development tools, libraries, and embedded runtime resources, provides a flexible and powerful development experience.
• Enabling AI: AI is transforming our world, and to unlock its full potential, companies need a partner offering a diverse portfolio of AI hardware and software solutions – from Automotive AI and AIoT to Industrial AI. Infineon provides specialized microcontrollers and highly precise sensors that enable intelligent and adaptive edge AI systems. Infineon’s high-performance, energy-efficient power supply solutions sustainably support the growing demands of AI applications.

Embedded world will take place in Nuremberg, Germany from 11 to 13 March, 2025. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. For press inquiries please contact media.relations@infineon.com. Industry analysts interested in a briefing can email  MarketResearch.Relations@infineon.com. Information about the embedded world show highlights is available at www.infineon.com/embedded-world.

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NXP Semiconductors, an innovator and supplier of Ultra-Wideband (UWB) solutions, and Rohde & Schwarz collaborate to demonstrate a test setup for UWB radar target simulation at the upcoming Mobile World Congress in Barcelona. The demonstration, being the first of its kind, verifies the unique performance of the NXP Trimension NCJ29D6A chipset including the enhanced radar algorithms. It is capable of generating UWB radar targets with a variable target distance down to a few centimeters, enabling maximum control and reproducibility of the simulated scenario.

Ultra-Wideband (UWB) technology is experiencing a steep growth in automotive, mobile and IoT markets, based on its secure and precise ranging capabilities. The Digital Key as defined by the Car Connectivity Consortium (CCC) leverages UWB for secure and convenient handsfree car access without compromises. The current-generation NXP Trimension UWB chipsets enable new UWB-radar use cases, such as Child Presence Detection (CPD), kick-sensing for easy trunk access, intrusion or proximity detection, and much more.

These UWB radar applications benefit from advanced target simulation, able to solve technical challenges, like short distance target simulation and large signal bandwidth, to mention just two. The key components are the R&S SMW200A signal generator, a R&S FSW26 spectrum analyzer and an R&S developed control software. The equipment used is available in UWB engineering laboratories today, hence reducing the initial capital investment. The demonstration is especially interesting for UWB chipset suppliers, module providers, Tier1s and vehicle OEMs.

In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”

An integral part of this demonstration setup is NXP’s Trimension NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”

The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.

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Malaysia is serious about its bid to move up the semiconductor industry ladder by establishing an IC design presence, and Arm’s setting up a design shop there is a testament to this ambition. Malaysia’s Prime Minister Anwar Ibrahim told reporters late last week that he has been on a call with Arm CEO Rene Haas and SoftBank’s head Masayoshi Son regarding this matter.

He added that talks are in the final stage and the agreement will be finalized and signed this month. Ibrahim also said that this demonstrates confidence in Malaysia’s policies and its ambition to become a regional hub for semiconductor design and manufacturing.

Malaysia is keen to penetrate the IC design market to bolster its standing as a regional tech hub. Source: CNA

This initiative is part of Malaysia’s National Semiconductor Strategy (NSS), which calls for $110 billion of direct investment in IC design, advanced packaging, and front-end semiconductor manufacturing processes, which includes wafer fabs and manufacturing equipment.

Details on what kind of design work Arm will carry out in Malaysia are yet to emerge. Ibrahim calls it a major test for the country’s ambition to embrace IC design work. “Can we provide tens of thousands of young professionals?”

“This is a challenge for the youth,” he added. “A professional workforce is essential when we attract significant investments.” That also shows a lot of sense of excitement.

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