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In its 2025 predictions for gallium nitride (GaN) power semiconductors, Infineon Technologies AG of Munich, Germany highlights that GaN will be a game-changing material for energy efficiency and decarbonization across the consumer, mobility, residential solar, telecoms, and AI data-center sectors, as GaN enables efficient performance, smaller size, lighter weight, and lower overall cost. While USB-C chargers and adapters have been the forerunners, GaN is now on its way to reaching tipping points in its adoption in further industry sectors, driving the market for GaN-based power semiconductors...

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine...

A lightweight runtime security code embedded into a system-on-chip (SoC) for Internet of Things (IoT) applications. That’s the outcome of a collaboration between MediaTek and Italy-based embedded IoT security firm Exein. EE Times’ Editor-in-Chief Nitin Dahad spoke to Gianni Cuozzo, founder and CEO of Exein, to know more about this collaboration that ensures security is an integral part of the development process rather than an afterthought.

Cuozzo, who founded the company in 2018 to address the emerging mandatory cybersecurity regulations, claims it’s the world’s first integration between a chip manufacturer and runtime security software. He also claims it’s the lightest runtime agent available, whether running at the edge or the cloud.

Read the full story on EDN’s sister publication, EE Times.

 

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The post Runtime security code embedded into IoT chip appeared first on EDN.

Micro-LED technology firm VueReal Inc of Waterloo, ON, Canada has secured access to US$40.5m in a Series C funding round was led by Export Development Canada (EDC) joined by existing VueReal investors including Cycle Capital, BDC Capital’s Cleantech Practice, and TDK Ventures. The investment will enable VueReal to scale its production capabilities and enhance its ecosystem to support partners in achieving their goals of integrating micro-LEDs in commercial production....

Axus Technology of Chandler, AZ, USA – a provider of chemical-mechanical planarization (CMP), wafer thinning and surface-processing solutions – has announced that its flagship Capstone CS200 platform tools offer what is claimed to be the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide (SiC) wafers. Compared to its closest competitor, Axus’s small-footprint Capstone delivers twice the throughput at less than half the total cost per wafer...

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has announced the general availability and production release of what is claimed to be the industry’s first 100G ZR QSFP28 digital coherent optics (DCO) transceiver...

MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) is showcasing its latest connectivity products at Stand C83 at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23-25 September)...

TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) — which makes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes — and its customer Optomind Inc of Suwon, South Korea, which provides optical interconnect solutions for data centers including artificial intelligence (AI) and high-performance computing (HPC) networks, are showcasing 100Gbps VCSEL performance at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23–25 September). TRUMPF Photonic Componentsis exhibiting in booth C81 and Optomind in booth E33...

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) is showcasing its latest photonic solutions on Stand #A24 at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23–25 September). Highlights are as follows...

As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

In cooperation with Dr Hermann Oppermann of the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Dr Norwin von Malm (senior director New Technologies) and Stefan Groetsch (who leads the corresponding team within System Solution Engineering) at ams OSRAM GmbH in Premstätten, Austria and Munich, Germany comprise one of three teams nominated as a finalist for the Deutscher Zukunftspreis 2024 (German Future Award), the Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), China-based Chengdu InSiGa Semiconductor Technologies Co Ltd and POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — have developed and are showcasing in a live demonstration the combination of POET’s 200Gx4 transmit optical engine using InSiGa’s 200G/lane EML driver ISG-D9616 for 800G and 1.6T modules...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — has announced a reorganization of its engineering team to streamline design, component engineering and new product introduction (NPI) activities globally, in response to active customer demand for 800G-and-higher products directed at the AI systems and hyperscale data-center markets...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — is showcasing live demonstrations of the following optical products designed for the rapidly accelerating AI systems and hyperscale data-center markets...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — says that its transmit and receive optical engines have been selected by Mentech Technology of Shenzhen, China(which supplies datacom and telecom components, including 200-800G optical modules for data-center networking infrastructure) for use in the development of 800G pluggable transceivers. The sample purchase orders are for initial builds and engineering development...

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has partnered with distributor Flip Electronics of Alpharetta, Georgia, which will maintain inventories of its wafers for military applications, ensuring a consistent and reliable supply of critical components...

The JEDEC Solid State Technology Association (which develops standards for the microelectronics industry) has published ‘JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices’. Developed jointly by the JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees of JEDEC’s JC-70 Wide Bandgap Power Conversion Semiconductor Committee (which was formed in October 2017 with 23 member companies, rising to over 80 now), JEP200 is available for free download from the JEDEC website...

Infineon Technologies AG of Munich, Germany is one of three teams nominated by the jury for the Deutscher Zukunftspreis 2024, the German Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...