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As AI data centers scale to support high-power GPU clusters, the industry is shifting toward 800V DC rack power architectures to improve distribution efficiency, increase power density and support next-generation server designs. To help accelerate this transition, power semiconductor firm Navitas Semiconductor Corp of Torrance, CA, USA and Microchip Technology Inc of Chandler, AZ, USA have collaborated on an 800V DC-to-6V DC reference design for AI data-center rack power applications...

Layer <0,1,0,1,0,0,0> segment(01,01). 10kx10k image, zoom in. submitted by /u/protofield [link] [comments]

A retro-arcade clock on a 128×64 RGB LED matrix driven by an ESP32-S3 brings 1980s video game icons to the workbench. Keralots’ project combines fourteen animated clock styles, weather without an API key, and PC performance monitoring in a single desktop device. Configuration happens from the browser, without recompiling the firmware.

The hardware foundation is two Waveshare P2.5 64×64 HUB75E panels, scan 1/32, chained into a single 128×64 pixel canvas. The FM6126A driver requires initialization that the firmware handles automatically at startup. The control board is an ESP32-S3-WROOM-1 (N16R8) devkit, with 8MB of PSRAM and 16MB of flash: enough space for the firmware, GIFs, and custom animations.

Styles, Cycle All, and custom animations

The clock styles cover arcade classics: Mario, Space Invaders, Pac-Man, Snake, Tetris, Asteroids, Dino Runner, and Matrix Rain, plus Weather variants and others. Cycle All mode alternates styles in sequence, with a configurable duration from 5 to 3600 seconds per style. Ambient screensavers and user-uploaded GIFs can also replace the clock, with hourly scheduling.

Storage for animations on the board is 128KiB, within the 4MB of available flash. An empty tested device holds about 23 animation frames. The input limit for GIFs is 8MiB, while the converted .pca file has a maximum of 1.5MiB and up to 360 frames. The command-line tool tools/gif2pca.py, which requires pillow, converts GIFs into the proprietary format.

Power supply and measured consumption

Power comes from a dedicated 10A 5V supply, with a 2200µF, 25V capacitor on the bus. Estimated consumption in use is about 10W, with measurements under 30W in normal conditions. The power connection goes through a USB-C power breakout and an XT60 panel feed, keeping wiring tidy and safe.

PC monitor mode receives metrics over local UDP on port 4210 from a companion app for Windows or Linux. The app sends up to 20 CPU, GPU, RAM, and network metrics, with a default update interval of 3 seconds. When the PC is offline, the clock automatically returns to displaying the time.

The optional weather feature uses Open-Meteo, which requires no account or API key, with updates every 10 minutes. The built-in web interface configures clock style, per-element colors, brightness with scheduled night dimming, timezone with automatic DST, and OTA updates. All code, firmware, and conversion tools are collected in Keralots’ repository.

For those who want to rebuild the project, the documentation includes the wiring diagram for the HUB75E panels and instructions for flashing the firmware. Keralots’ repository is the starting point for downloading the code and utilities. Keralots’ repository contains the full firmware and the companion app.

The component list for the build is as follows:

• ESP32-S3-WROOM-1 (N16R8) devkit
• Waveshare ESP32-S3-Zero
• 2x Waveshare P2.5 64×64 HUB75E panels
• FM6126A driver
• 2200µF, 25V capacitor
• USB-C power breakout
• XT60 panel feed

Choosing an ESP32-S3 with generous PSRAM and flash keeps the project smooth even with complex animations. The combination of P2.5 panels with a 2.5mm pitch offers good pixel density for a desk clock. The result is a device that changes appearance with a click, from minimalist clock to arcade system monitor.

Source: https://github.com/Keralots/AnimatedPixelClock

The post Retro-Arcade Clock on RGB LED Matrix with ESP32-S3 appeared first on Open Electronics.

On a safety module.l took apart to take a look, i have no intention to put it back in production. submitted by /u/PatrikuSan [link] [comments]

Is there actually any AI in the “AI Box”? Highly doubtful. That said, it’s still reasonably durable, along with being platform-nimble. And the price-attractiveness is indisputable.

Sorry, readers. To quote baseball terminology, when it comes to teardowns of Apple CarPlay and Google Android Auto wireless adapters, I’m “0-for-3”. Not when it comes to fundamentally doing them, mind you; here are the two that EDN has published so far:

• Adapter makes Apple CarPlay connectivity wireless
• Adapter makes Google’s wireless Android Auto a reality

And the “combo” conclusion is appearing today. But none of them match the ones I told you I’d dissect at the end of my initial conceptual coverage in January.

Why? Well, as I mentioned at the time, the original CarPlay one I ordered never ended up getting delivered, so I’ll deflect any personal responsibility for that particular change in plans. And as for the Android Auto one, I realized upon further reflection that the device I was planning on disassembling was already obsolete, so I instead went with something more up-to-date and otherwise interesting; that NFC subsystem, for example.

In this case, as I re-read the initial January coverage, I realized that I’m being a bit overly harsh on myself. I’d actually never published a promise to subsequently tear down one of the combo devices (with both Apple CarPlay and Google Android Auto support) I’d gotten working in my wife’s Land Rover, although that was always my “inner voice” intent. Specifically, I’d been targeting the one from VCARLINKPLAY as my patient.

But it’s admittedly difficult for me to destructively disassemble perfectly good (and already setup and ready-to-go) hardware, as anyone who’s seen my editorial celebrations after successful re-assemblies and subsequent donations already realizes. That said, from past experiences with the CarPlay- and Android Auto-only devices, I doubt I’d have similar back-together success this time. So, when I came across a cool-looking alternative on eBay for only $9.98 plus tax, I couldn’t resist.

AI? Really?

This first photo of the outer packaging for the actual product I was shipped will, I think, explain the AI references in the title and subhead, not to mention in this particular section header.

As I recently wrote, regarding a different device I was in the process of dissecting:

Is there something explicitly artificial intelligence-related to this product (and/or the manufacturer, more generally), or is it just one of those cases nowadays where “anything sounds more important if you tack “AI” onto it”?

I think we all already know the answer to that question, right? Anyway, onward with the remaining few meaningful sides of the outer packaging.

As usual with products like this, there’s an FCC logo suggestive of certification printed on the packaging, but no actual certification ID to be found anywhere. Again, sigh.

And now let’s open ‘er up.

A sliver of literature, and a nicely included USB-A to USB-C adapter.

And now, last but definitely not least, our patient, initially complete with protective plastic on both the glass (presumed) top and USB-A plug.

A vented metal (aluminum, again presumed) chassis.

Once again, no FCC certification ID. But at least we now know the product code: Q1AS. Not that it helps us much. Google it and you’ll find devices in multiple shapes, sizes and colors, and in both CarPlay-only, Android Auto-only and combo flavors, the latter suggestive of common hardware differentiated solely via software.

I’m guessing this is for attachment to a keychain? Or a leash, mebbe?

And, wrapping up the overview, let’s ditch the plastic bits.

Diving inside

I’d previously mentioned that I thought the topside was glass, therefore the “reasonably” qualifier alongside “durable” (referencing the otherwise-metal body) in the subhead. Let’s test that hypothesis.

Where have I seen something like this before? Ah yes. Yep, glass.

And we’re in.

That glue you see on both ends of the PCB doesn’t seemingly do much; popping out the circuit board was easy.

Let’s look more closely at the topside first.

A nifty marking pattern atop the largest IC, presumably the application processor, although the absence of any meaningful accompanying info isn’t helpful. Arm-based, presumably. Albeit not definitively.

The other two ICs, both above it, include XTX Technology’s XT25F128F serial NOR flash memory, presumably storing system firmware along with various data bits, and to its right a smaller chip marked as follows, whose identity escapes me (readers?).

B11
3959
2512

At bottom right is a 24-MHz crystal, presumably feeding oscillation to the application processor. And on the right edge is the multi-function LED, whose illumination heads out the top via an integrated light pipe.

Now for the PCB’s other side.

The largest silicon sliver this time is the AIC8800M40, a dual-band Wi-Fi-plus-Bluetooth controller from Shenzhen TrolinkTek Technology. The PCB-embedded antenna is to its left, although reiterating what I’ve said before, I only see one of them and I therefore don’t know how it’s capable of handling both 2.4 GHz and 5 GHz duties.

Also located on this particular piece of PCB real estate are four odd-lead-count packaged devices, three of them (all five-lead) marked “t50KfP1” and the other three-lead one stamped with “ADAA” on top. I’m guessing they’re transistors (duals in the five-lead cases) but again welcome reader suggestions. And once again we find a user-inaccessible SPST switch, in the diagonally opposite corner from the aforementioned antenna. Freakish.

Thus concludes another editorial series. I hope you’ve found it to be as educational and otherwise enjoyable as I have. Closing reader thoughts are as-always welcome in the comments!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• Adapter makes Google’s wireless Android Auto a reality
• Adapter makes Apple CarPlay connectivity wireless
• Apple CarPlay and Google Android Auto: Usage impressions and manufacturer tensions
• Spotify’s Car Thing: “Why does it exist” is the crux of the questioning
• Amazon’s Echo Auto Assistant: Legacy vehicle retrofit-relevant

The post An Apple-plus-Google adapter that’s AI in name only (sigh) appeared first on EDN.

Murata Manufacturing, a Japanese global leader in electronic components and communication modules has begun mass production of the LLD series, the world’s smallest line of three-terminal, low equivalent series inductance (ESL) multilayer ceramic capacitors (MLCC). Measuring just 0201-inch size (0.6 × 0.3 mm), the new products reduce mounting area by approximately 64% compared with Murata’s previous smallest 0402-inch size (1.0 × 0.5 mm), freeing up valuable PCB space in compact devices such as smartphones and wearables.

Today, as the use of powerful ICs is embedded into smartphones and wearables, providing a stable power source is difficult. During high speed operation, the current fluctuates very fast, resulting in fluctuations in voltage to the IC. Reducing this instability to the lowest possible level is critical. Three-terminal capacitors with their four current paths are shorter than two-terminal devices and exhibit a lower ESL than traditional two-terminal components.

At the same time, thinner and smaller electronic devices require efficient use of limited PCB space. However, miniaturizing three-terminal capacitors has been difficult because their internal and external electrode structures are more complex than those of conventional two-terminal types.

Murata overcame this challenge by optimizing the electrode design and advancing its manufacturing processes. The resulting 0201-inch products enable high-density mounting while stabilizing the power supply voltage near ICs, even at high frequencies. This gives designers greater flexibility in component placement and circuit design around ICs, supporting higher performance in space-constrained electronic devices.

Two models are available. LLD033R60G105ME01 has a capacitance of 1 µF, a rated voltage of 4 Vdc, and an operating temperature range of -55 to +85°C. LLD033D80E105ME01 has a capacitance of 1 µF, a rated voltage of 2.5 Vdc, and an operating temperature range of -55 to +105°C.

Murata will continue developing compact, high-performance MLCCs for mobile and wearable devices, contributing to further miniaturization and enhanced performance of electronic equipment.

The post Murata Begins Mass Production of World’s Smallest 0201-Inch Three-Terminal Low-ESL MLCCs appeared first on ELE Times.

​According to General Motors’ official newsroom, General Motors (GM) and LG Energy Solution are collaborating to produce lithium manganese-rich (LMR) battery technology that could reduce the cost of electric vehicles while delivering high energy density. This joint venture is upgrading its Ultium Cells plant in Spring Hill, Tennessee, to produce LMR battery cells for future EV applications.

The manufacturing plant is expected to be completed by 2028 to produce LMR cells that could deliver 33% higher energy density than Lithium Iron Phosphate (LFP) battery cells at a comparable cost. The major components of LMR battery technology contain 35% nickel, 65% manganese, and virtually no cobalt, targeting future GM electric full-size trucks and SUVs. LFP batteries are widely used in electric vehicles because of their low cost and thermal stability, but they require large and heavy battery packs to cover a longer range.

LMR addresses this challenge with higher energy density, allowing manufacturers to build smaller and lighter battery packs while delivering the same amount of power. The chances of adopting this concept are high, as major manufacturers look for alternatives that can balance cost, energy density and performance. The move also highlights the growing focus on developing new technologies at scale using existing manufacturing facilities.

If this concept is successfully commercialized, the rate of adopting this technology for future electric vehicles will depend on several factors such as cycle life, charging performance, thermal management, manufacturing cost, and the amount of production.

The post GM and LG Develop Lithium Manganese-Rich Batteries to Lower EV Costs, Increase Energy Density appeared first on ELE Times.

​Chinese automobile manufacturer Geely launched Geely Smart Charging, an ultra-fast AI-powered charging system on September 23 in Ningbo, China, featuring real-world demonstrations. The new technology introduced by Geely significantly reduces charging time, charging an electric vehicle from 10% to 70% in 4.5 minutes and to 97% in 8 minutes and 40 seconds.

The core components used in building this efficient charging technology include Xingrui PowerMind AI to adjust power dynamically, Fifth-Gen Charging Station (C12) that delivers power up to 2,250 kW (2.25 MW) per connector, Next-Gen Ultra Short Blade Battery that reduces charging heat by 10% and supports ultra-fast charging speed, and Lithium-Ion Pulse Restoration Tech, which uses micro-pulse currents and a 5-point liquid-cooling system to increase battery cycle life by 20%.

The technology combines 2.25 MW of charging power with a high-rate battery designed to store a large amount of electrical power in a very short time interval. The company says this technology is introduced to address a major problem in EV adoption: charging vehicles for long hours compared with traditional refueling.

The company is also incorporating artificial intelligence in this charging solution to monitor battery conditions and dynamically manage parameters such as temperature and charging performance during a charging state. Using artificial intelligence in high power charging solution is aimed at making fast charging more practical while maintaining battery safety.​

The post Geely Launches 4.5-Minute EV Charging Technology With 2.2 MW Power appeared first on ELE Times.

Davisan1001’s project solves a classic problem for anyone working with LED matrices: getting an even, uniform glowing surface, without halos and without seeing the individual pixels. The solution is a 3D printed enclosure for a 64×64 RGB LED matrix, with a mounting point for a Raspberry Pi. The front uses simple materials: a 3D printed grid, baking paper and a sheet of clear plastic.

The grid is the heart of the system. Each cell of the grid lines up with one LED of the matrix and blocks the light that would otherwise spill onto the neighbouring LEDs. This way every light point stays separate from the others and the diffusion happens in a controlled way. The baking paper, placed above the grid, acts as the diffuser: it is thin, easy to handle, flat and even in colour.

3D printing the grid

The grid does not require complex 3D modelling. Davisan1001 exploits the slicer settings: a flat square is printed with a grid infill and zero solid top and bottom layers. The slicer generates the cell structure by itself. The result is a precise grid, with thickness and cell size controlled by the print parameters.

The choice of diffusion materials is not random. Plain white paper blocks too much light, while waxed paper gives poor output and a poor off-axis view. Baking paper, on the other hand, is opaque enough to diffuse the light without blocking it. A sheet of clear plastic completes the assembly, protecting the paper and giving rigidity to the surface.

Materials and assembly

Rebuilding the project takes only a few components. Besides the 64×64 RGB LED matrix and the Raspberry Pi, you need the 3D printed grid, baking paper and a sheet of clear plastic. The printed enclosure includes the mounting point for the Raspberry Pi, so the electronics stay integrated and tidy.

• 64×64 RGB LED matrix
• Raspberry Pi
• 3D printed grid
• Baking paper
• Sheet of clear plastic

The assembly is within anyone’s reach: place the grid over the matrix, then the baking paper and finally the plastic sheet. Everything closes up inside the enclosure. For those who want to dig deeper, the page of Davisan1001’s project collects the files to print and the useful instructions to replicate the diffuser.

The result is an LED panel with a smooth surface and well-defined square pixels. The solution is inexpensive and uses materials that almost everyone has at home. What is more, the technique of the slicer-generated grid can be reused for other LED matrix sizes or for similar projects.

Source: https://www.thingiverse.com/thing:6687509

The post Cheap LED diffuser with a 3D printed grid appeared first on Open Electronics.

India’s Ministry of Defence announced on September 23 that it has entered into a contract with the government-owned enterprise, Bharat Dynamics Limited (BDL), to procure 160 Satellite Smart Anti-Airfield Weapons for the Indian Air Force, worth roughly 811 crores. The contract is a step towards augmenting the Air Force’s precision-strike capabilities and promoting a robust domestic defence production ecosystem. BDL is a state-owned defence company that manufactures guided weapons and other equipment.

BDL Contract Supports Indigenous Air-Launched Weapon Procurement

A satellite-guided weapon uses its positioning information to estimate the location and guide the weapon to programmed points. There are two possibilities depending on the weapon type: some cartridges use inertial navigation combined with satellite information, which means the weapons estimate a displacement between two waypoints based on an internal inertial navigation device. The fusion of the two-navigation mode allows better guidance continuity in a degraded environment. An anti-airfield weapon is designed for an airfield-related target.

Such cartridges need to be suited to the aircraft as well as specific mission planning and release procedures. They must meet preconditions such as accuracy, navigation capabilities, robustness, and compatibility with the launch platform. The statement also mentions that Indian defence manufacturers will be providing the supply of equipment to the armed forces. India has to develop industry and supply chains, along with maintenance skills, with respect to indigenous manufacturing. The timings of manufacturing, milestones, and operationalisation are subject to contractual obligations and the procurement process.

The post India Signs Rs 811 Crore Contract for 160 Satellite Smart Anti-Airfield Weapons appeared first on ELE Times.

​The Indian Coast Guard recently announced the interception of a transnational syndicate linked to a seaborne narcotic haul worth about 3,000 crores, in a Ministry of Defence press release dated September 30, 2026. This seaborne drug haul exemplifies a maritime security agency’s effort to combat illicit trafficking in coastal and wider maritime domains. Maritime traffic’s vast ranges of maritime traffic and the immense extent of the maritime domain’s 24×7 tracking and surveillance challenge maritime security agency interdiction efforts.

Coast Guard Operation Highlights Maritime Surveillance and Interdiction

Maritime interdiction often relies on a series of interrelated capabilities. Information gathered from sensitive surveillance networks, shipborne radar and electro-optical sensors, protected communications and data sharing systems enables authorities to develop a picture of activity at sea. This targeted activity can then draw on the deployment of patrol vessels or other assets authorised to stop and search vessels if required.

This operation will be successful if it is possible to share information, encourage watch locations, maintain security over sensitive areas, and make best use of resources. Using fusion techniques, operators can combine information, but a detection still has to be identified and verified before a vessel can be stopped and identified. The seizure of large quantities of drugs can help break up trafficking networks and reduce the impact of the network’s actions, but this is only part of understanding its size and shape.

The post Indian Coast Guard Reports Major Narcotics Seizure in Anti-Smuggling Operation appeared first on ELE Times.

The Indo-ASEAN joint Exercise, AIME-26, has started in Subic Bay, Philippines, as per the Ministry of Defence (MoD). The statement was uploaded on 30 September 2026 by the official website of the Press Information Bureau (PIB), and the exercises represent one of the most significant elements of India’s interaction with ASEAN in the maritime sphere, as they constitute a forum for maritime cooperation. Such exercises facilitate participating navies to operate in close coordination, practice SOPs and conduct liaison at sea.

AIME-2026 Strengthens Regional Maritime Engagement

Maritime operations might include the planned manoeuvres, the communication exercise, the search-and-rescue drill, and other professional exchanges arranged as part of the exercise schedule. These activities allow participating forces to familiarise themselves with each other’s procedures and build the capacity to work together in actual maritime-security operations. Location matters. Numerous commercial shipping lanes exist throughout the Indo-Pacific, with ships from all nations moving along these commercial routes.

Naval ships are also expected to be prepared to respond to maritime security threats, including piracy, smuggling, accidents at sea, and other navigation hazards. Maritime coordination can be achieved without ships. Secure communications, navigation aids, radar, identification methods, operational information sharing, and similar programs all contribute to the awareness picture at sea; while exercises can help service personnel practice using them with partner forces, it should not be assumed that all countries’ equipment and operating procedures align.

The post ASEAN–India Maritime Exercise 2026 Begins in the Philippines appeared first on ELE Times.

India and France are stepping up their partnership in space technology into the realm of satellite production and defence related monitoring, the Financial Express has reported, quoting a $5 million deal between India’s Dhruva Space and France’s Safran Space on the construction of 275 satellites. The report suggests that while India’s space-based surveillance capacity is growing, this particular partnership falls under the Space-Based Surveillance Phase III programme, which is a larger and more ambitious mission to improve monitoring of India’s land and water territories via an expanded satellite fleet.

Dhruva Space–Safran Partnership Highlights Satellite Manufacturing

Distributed satellite constellations allow monitoring many sites on several continents repeatedly to detect changes to land borders, coastlines, and seascape approaches. The spacecraft can be equipped with an optical payload, a radar, or other sensors. Especially with radar imaging, observation can be more independent of clouds or limited sunlight, and distributed constellations can lower reliance on a small number of large spacecrafts.

However, the operational utility of constellations depends on the constellation and orbital designs, including, for example, the ground infrastructure, the revisit time, the sensor capabilities, and the downlink capabilities. The large share of the private sector in the reported agreement indicates an increased importance of private players in India’s space activities, their manufacturing capabilities, specialised components, and also the potential for cross-border collaboration.

The post India–France Space Cooperation Targets Military Surveillance Capabilities appeared first on ELE Times.

JEDEC Solid State Technology Association (which develops standards for the microelectronics industry) has announced the release of ‘JESD264: Silicon Photonics Qualification and Reliability Requirements’, the first industry-wide standard designed to bring consistent qualification and reliability practices to silicon photonics devices. By establishing a common baseline for testing and manufacturing controls, the standard helps to reduce deployment risk and supports broader adoption of silicon photonics in high-speed data-center, telecoms and AI networks...

The Indian Army is taking further strides in drone security by working through a network of six specialised laboratories to identify flaws in unmanned aerial systems (UAS). As per a report published by Financial Express on October 1, 2026, this network, named AASHVAST (Assessment and Analysis of Electronic Systems Hardware for Vulnerabilities and Security Threats), is expected to test software bugs, firmware flaws, and electronics that might be compromised by a drone, which could, in turn, threaten the platform. One of these facilities has already been commissioned in Delhi.

AASHVAST Labs to Examine Drone Hardware, Firmware and Software

Indian military drones’ on-board systems include flight controllers, navigation receivers, sensors, communications modules, and embedded computing systems that can all be points of attack if the systems are compromised. Hardware and Firmware Testing can identify rogue components, verify supply-chain traceability and confirm whether the electronics work as they should. These are critical considerations for surveillance, reconnaissance and other security drones that require reliable transmission and precise navigation. In addition to the trial at the laboratory, another programme by Zuppa Geo Navigation Technologies and the Tamil Nadu Unmanned Aerial Vehicles Corporation plans to train over 2,000 people over three years, providing skills in drone operation and maintenance.

The post Indian Army Plans Drone Vulnerability Labs to Strengthen Cybersecurity appeared first on ELE Times.

FREE-WILi 2 is an open-source electronic multitool that fits in your pocket and replaces an entire workbench. It combines a complete electronics lab, a software-defined radio bench, and a video game console. It supports wireless, GPIO, analog, RFID, CAN, retro-gaming, Linux onboard, and AI agents that write firmware. The project is documented on the maker’s website, where you can find schematics, firmware, and instructions.

The board features an unusual and powerful hardware setup. A primary RP2350 handles I/O and scripting, while a second RP2350 drives the display, buttons, audio, and DVI output. The ICE40UP5K FPGA covers functions that the PIO cannot handle, such as SPI-slave emulation or multicore RISC-V I/O. It also manages 8 MB of SRAM that can be dynamically swapped with the main CPU.

Processors, FPGA, and shared memory

The Raspberry Pi CM0 adds full Python scripting and onboard compilers. The ESP32-C5 provides wireless access to Wi-Fi 2.4/5 GHz, Bluetooth LE, and IEEE 802.15.4. Each RP2350 has 8 MB of serial SRAM and 16 MB of flash. The ICE40UP5K FPGA has another 8 MB of SRAM. Computing power is thus distributed across multiple architectures, each with a specific role.

An ultra-low-power microcontroller supervises 17 power domains. Its job is to optimize the battery life of the 3000 mAh cell. The capacitive touch display measures 3.5 inches with a 480×320 resolution. Analog outputs reach about 4.84 V at 25 kHz. The programmable power supply provides from 1 to 5.5 V at 1.5 A, so you can power external sensors and modules directly from the board.

Firmware, scripting, and the OneWili API

The default firmware includes several onboard scripting engines. You will find rThon, WiliBlocks, ZoomIO, and a WASM engine called WiliWasm. The OneWili API unifies access from Python, Rust, C/C++, and rThon, both from a host PC and directly on the board. This API is generated by the firmware itself, so it always stays aligned with the device’s actual functions.

AI agents are supported natively and can write and debug firmware code. The project also integrates Claude Code and LM Studio. For those who want to get started, the board supports CAN FD at 8 Mbit with a SIC transceiver. The ST25R3916B RFID module and the BMI323 and BMM350 sensors complete the package. All of this is enclosed in a device that also works as a retro-gaming console.

• Primary RP2350 for I/O and scripting
• Second RP2350 for display, audio, and DVI output
• ICE40UP5K FPGA for advanced functions
• Raspberry Pi CM0 for full Python
• ESP32-C5 for Wi-Fi 5 GHz, BT LE, and 802.15.4
• STM32WLE5JC for long-range communications
• ST25R3916B for RFID
• BMI323 and BMM350 for motion and magnetic field

A similar project can be partially built with simpler components, but FREE-WILi 2 compacts everything into a single tool. For those who want to approach the world of wireless microcontrollers, a board like the ESP32-C6-Zero kit is a good starting point to learn. Instead, a Raspberry Pi 5 offers more power for software development, but it does not have the same hardware integration as this multitool.

FREE-WILi 2 represents a step forward for makers who want a complete and portable tool. The combination of FPGA, dual RP2350, and Raspberry Pi CM0 offers rare flexibility. Native support for AI agents opens new scenarios: the board can write its own firmware based on your needs. Anyone working on electronics, radio, or gaming projects will find a powerful ally in this device.

Source: https://freewili.com/

Related products

• ESP32-C6-Zero Wi-Fi 6 IoT Development Kit
• Raspberry Pi 5 – 2 GB memory version

The post FREE-WILi 2: The Pocket Electronics Lab with AI appeared first on Open Electronics.

When standard capacitors succumb to parasitic inductance, feed-through capacitors (or feed-thrus) step in to save the day. Here is how these three-terminal devices act as the ultimate shield against high-frequency EMI.

Step into the EMI compliance chamber—a place every engineer both dreads and respects. You’ve built a shielding enclosure that looks like a fortress: milled aluminum walls, tight seams, and the confidence that nothing inside will leak out. But reality intrudes the moment you need to power the circuit or route a few low‑frequency signals.

Figure 1 An aluminum RF enclosure employs a feed-thru capacitor option to supply power to the unit. Source: Gquipment

A copper wire piercing that flawless wall becomes the perfect antenna. It happily scoops up the high‑frequency clock noise buzzing inside and radiates it outward, undoing all your careful shielding. What seemed like a sealed stronghold is suddenly riddled with invisible leaks, and the compliance test chamber makes sure you see every one of them.

The ESL trap: When your capacitor retires at 100 MHz

Engineers love to talk parasitics, and few are as sneaky as equivalent series inductance (ESL). Every multilayer ceramic capacitor (MLCC) you drop onto a board comes with hidden baggage: the inductance of its leads, pads, and traces. At low frequencies, the capacitor behaves exactly as you expect—shunting noise to ground. But as frequency climbs, that inductance dominates (the math is simple: XL=2πfL).

At 100 MHz, even a modest 5 nH of lead and trace inductance yields an inductive reactance of about 3 Ω. Suddenly, your “decoupling” capacitor is no longer a capacitor at all; it’s acting like a tiny inductor. Instead of shorting high‑frequency noise, it lets clock harmonics sail right through.

This is why the compliance chamber laughs at your fortress enclosure: the copper feed‑through wire plus its “fake” capacitor combines into a broadcast antenna. The lesson is clear—standard MLCCs retire early in the RF game, and parasitics write the rules.

As frequency climbs into the hundreds of megahertz or even the gigahertz range, that “tiny” parasitic inductance becomes a brick wall. The impedance shoots upward, and your capacitor stops behaving like a capacitor at all. This is where the concept of self‑resonant frequency (SRF) comes in. Every real capacitor has a frequency at which its capacitive reactance and inductive reactance cancel.

Below SRF, the device does its job—shunting noise to ground. But once you cross that threshold, the capacitor has secretly retired. It flips roles and behaves like a pure inductor, blocking the very high‑frequency currents you wanted to suppress. The punchline is brutal: your expensive decoupling capacitor, chosen with care, is now actively preventing noise from finding ground.

Instead of helping your shielded enclosure pass compliance, it’s amplifying the problem. That’s why engineers who live in the RF world treat SRF as the “expiration date” of a capacitor. Past that point, you’re not buying capacitance—you’re buying inductance.

Figure 2 Drawing highlights the performance advantages of an SMT feed-thru capacitor over a discrete capacitor. The key difference between the two filtering methods is that the feed-thru offers significantly lower parasitic inductance between the signal line and ground. Source: Kyocera AVX

Thinking coaxially: Demolishing lead inductance

The feed‑thru capacitor earns its reputation not by adding more layers, but by changing geometry entirely. Instead of two parallel leads soldered onto a board, it’s built as three‑terminal device. The signal or DC power line passes straight through the center of a cylindrical dielectric, like a wire threaded through a bead. Around that dielectric, the outer electrode wraps a full 360°, forming a coaxial sleeve that mounts directly into the metal shield wall.

This construction cheats parasitic inductance in a brilliant way. Because the ground electrode is omnidirectional and bonded directly to the chassis, the effective shunt lead length is zero. There are no long traces or dangling wires to add nanohenries of inductance. The result is a capacitor that maintains its low‑impedance shunting behavior well into the gigahertz spectrum.

Where a conventional MLCC would have “retired” at its self‑resonant frequency, the feed‑thru capacitor keeps working, shorting high‑frequency noise to ground and preserving the illusion of a perfect shield.

From wall to board: Form factors and practical applications

While chassis-mounted cylindrical feed-throughs guard outer metal enclosure walls, 3-terminal SMD capacitors bring this same low-ESL geometry directly onto PCB layer boundaries. They are the unsung heroes of electromagnetic compatibility (EMC), serving as critical boundary filters across demanding applications in RF shielding, aerospace avionics, medical equipment, and high-frequency power supplies.

In practice, these devices are available in several mechanical packages tailored to different structural needs. Solder-in and bolt-in bushings are ideal for direct installation through bulkhead walls or shielded enclosures, providing high mechanical stability and maximum chassis grounding contact.

For automated PCB assembly, compact SMD chip packages offer localized decoupling right at layer boundaries or internal compartment shields. Additionally, filtered connectors integrate feed-through filtering directly into multi-pin interconnect housings to protect entire cable bundles at once.

Because the system’s DC current flows directly through the central pin, selecting the right device requires looking beyond capacitance alone. You must rigorously evaluate maximum continuous DC current, peak voltage limits, and mechanical mounting requirements to ensure high-frequency attenuation doesn’t come at the cost of thermal or electrical failure.

Figure 3 Feed-thru capacitors leverage specialized geometries—from miniature threaded bushings and SMD chip packages to high-current stud mounts—to eliminate parasitic shunt inductance and extend EMI suppression into GHz frequencies. Source: Author

AC, DC, and EMI variants: Choosing the right flavor

Feed‑thru capacitors aren’t one‑size‑fits‑all. Manufacturers tailor them for different environments: DC feed‑thrus handle steady current rails and must be rated carefully for amperage; signal‑line feed‑thrus are optimized for AC or communication paths where impedance matching matters; and EMI/RFI feed‑thrus are designed specifically to crush broadband interference across wide frequency ranges. In practice, DC versions dominate power‑supply filtering, signal‑line types appear in communication links, and EMI‑rated parts guard shield walls in aerospace, medical, and defense systems.

Beyond capacitance and current ratings, the real measure of a feed‑thru capacitor’s effectiveness is its insertion loss curve. Datasheets plot attenuation in decibels versus frequency, showing how much noise is suppressed across the spectrum. Two parts that look identical mechanically may differ dramatically in their high‑frequency roll‑off. Reviewing these curves ensures you select a feed‑thru that matches the specific EMI threat in your design.

C, L, and Pi: Tailoring your insertion loss

Once you’ve mastered the geometry, the next step is topology. Feed‑thru capacitors don’t live alone—they pair with inductors to sculpt insertion loss curves that dictate how much noise gets crushed, measured in decibels.

• Pure C‑filters: A single feed‑thru capacitor to ground works beautifully in clean, high‑impedance circuits.
• L‑filters: Adding a series inductor creates an asymmetric filter, ideal when source and load impedances vary.
• The heavy‑hitting Pi (π) filter: Two feed‑thru capacitors with a central inductor form a steep attenuation wall that obliterates harmonics from switching regulators.

Figure 4 C, LC, and Pi feed-thru topologies attenuate unwanted high-frequency noise by shunting interference to ground while passing direct current and low-frequency signals unimpeded. Source: Author

Bench realities

For completeness, T‑filters (Inductor–Capacitor–Inductor) deserve a mention alongside L and π topologies, since they are the preferred choice when both source and load impedances are very low. Equally important is clarifying the inductance story: while the feed‑thru’s 360° ground contact drives the shunt path inductance virtually to zero, the central pin itself still carries a small amount of series inductance along the pass‑through path. Recognizing this distinction prevents the misconception that the signal path is entirely inductance‑free and helps engineers make more accurate high‑frequency design decisions.

Feed‑thru capacitors look bulletproof on paper, but the bench has a way of exposing their weak spots. The first trap is current. Unlike a board‑mounted MLCC, the system’s DC current flows directly through the central pin. Push a 5-A rail through a feed‑thru rated for 1 A and you’ve built a very expensive fuse—complete with smoke and a failed prototype. Always check current ratings before routing power lines.

The second trap is thermal shock. Ceramic feed‑thrus, especially solder‑in types, are notorious for cracking if hit with uneven heating. A cold solder iron or sloppy thermal profile can fracture the dielectric; the soldering process should be controlled such that the component does not experience any thermal shocks which may induce thermal cracks in the ceramic dielectric.

The failure may not show up immediately; instead, it lurks as an intermittent short that appears only after the unit leaves the lab. Treat feed‑thrus with respect—they’re mechanical as much as electrical, and ignoring their limits can turn a compliance win into a manufacturing nightmare.

Fundamental truths

In high‑frequency design, geometry matters as much as capacitance. A shield only works if its inputs are guarded, and feed‑thru capacitors are the ultimate checkpoint. They don’t just block noise; they enforce discipline at the boundary.

Every compliance battle begins at the shield wall, and feed‑thru capacitors are the guards that decide who gets in. If you want your next design to survive the chamber, treat geometry as seriously as capacitance. Audit your inputs, choose the right filter topology, and make feed‑thrus part of your default toolkit.

Don’t wait for the test lab to expose the leaks—engineer your defenses now.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• Trends in capacitors
• Capacitor matchmaker
• Care and feeding of capacitors
• The Many Benefits of FeedThru Capacitors
• Power Tips #51: Be aware of capacitor parasitics

The post Demystifying feed-through capacitors: How to stop EMI in its tracks appeared first on EDN.

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