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I couldn't for the life of me understand why the multimeter was not reading correctly when using bananas to crocodile cables. Lesson learned: don't cheap out on cables. submitted by /u/love_in_technicolor [link] [comments]

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PONG has always fascinated me. A video game made entirely from logic blocks from the 74xx series. Without a processor, memory or software. After seeing an original PONG console at the Berlin Computer Game Museum, I set myself the goal of recreating one. And now it's finished. I didn't want to use the large arcade cabinet like the original as the ‘housing’, but something smaller that would focus on the circuit board. Because it is the ‘star’ of PONG. Ingeniously designed by Allen Alcorn, who went down in computer gaming history as the designer of PONG. But as I said, it's not a computer. I redesigned the circuit board from photos and templates. Conductor track by conductor track, component by component. The ICs are still relatively easy to obtain (I also recreated an Apple I, which was more difficult, or rather almost impossible nowadays). The control panel also had to be the same as the original, and of course a real coin validator had to be included. submitted by /u/GHelectronic [link] [comments]

This “Mona Lisa” was created as a technical demonstration by a by a Japanese company that provides PCB assembly (PCBA) services. Instead of using PCB traces or silkscreen artwork, this piece is built from about 10,000 1608-metric SMD components. The image is formed through the color variation of resistors, ceramic capacitors and other components, turning electronic parts into a high-resolution mosaic. submitted by /u/NEET_FACT0RY [link] [comments]

This post presents a component-level schematic overview of an ESP32-S3-based vision development board. The shared material focuses strictly on electronic circuit design and interconnection of active components, including the MCU core, power regulation, and peripheral interfaces. Primary active components shown in the schematic: - ESP32-S3-WROOM system-on-chip - DVP camera interface connected directly to the MCU - 6-axis IMU interfaced over I2C - MEMS microphone connected via I2S - SPI-based microSD card interface - Dedicated voltage regulation stages supplying RF, camera, and sensor domains The circuit design integrates vision, motion sensing, and wireless communication on a single ESP32-S3 platform. Power integrity, signal routing density, and pin multiplexing constraints are central factors influencing the schematic structure. The schematic is provided for component-level reference and electronic circuit visibility. Since it's newly created, it doesn't have a GitHub repository yet. submitted by /u/No-Army-950 [link] [comments]

submitted by /u/Vast_Image_4828 [link] [comments]

I love maps, transit, and DIY electronics- here is my recent project combining all three! I had an 8"x10" PCB manufactured with a custom map of Boston silkscreened on the front side. On this map, each station on the Red Line is marked by two LEDs- one for inbound and outbound trains. Data is streamed from the MBTA's API and displayed on the board, showing location, speed, or occupancy information. This version utilizes WS2812B-2020 LEDs and a very simple two-layer PCB. For future projects, I would be interested in using rear-mounted LEDs (such as SK6812-Es) for a more polished look. If you're interested in the project, all of the code, PCB files, and tutorials are open source: https://github.com/tomunderwood99/CharlieBoard submitted by /u/CyclingOctopuses [link] [comments]

Korea Advanced Institute of Science and Technology (KAIST) has demonstrated a high-efficiency, ultra-high-resolution red micro-LED display, paving the way for displays that can deliver visuals even sharper than reality...

MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) has promoted two senior leaders within the organization to the senior vice president level. The promotions further strengthen and expand the management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies...

❤️ БО БФ "КОЛО" і Центр крові ЗСУ у співпраці із КПІ ім. Ігоря Сікорського запрошують на донацію крові kpi пт, 02/06/2026 - 14:36

The ST Foundation, the non-profit corporate arm of STMicroelectronics, hosted a media briefing late January 2026 to outline its strategic expansion in India and celebrate the recent recognition of its flagship “Digital Unify” program. Dedicated to bridging the global digital divide since 2001. The Foundation’s mission has taken on critical urgency in India, where over 400 million people remain excluded from essential digital services.

Addressing the 400 Million Divide

With global data from the 2025 ITU Connectivity Report indicating that 2.2 billion people lack basic digital access, the ST Foundation has positioned India as a central focus for its “Digital Unify” (DU) initiative. The program uses a “train-the-trainer” model and local partnerships to ensure sustainable, community-owned growth.

Impact in Asia and India

In Asia alone, the foundation has 96 Digital Unify Labs, serving about 26,000 beneficiaries per year at a cost of less than $10 per student trained.

The Foundation in India was officially registered in 2018, having reached more than 180,000 trainees to date and having established over 56 Digital Unify Labs across the country.

Key Program Impact and Expansions:

• Education for Vulnerable Children: Since 2022, the “Basic Coding” program has reached over 2,500 children aged 9–13 in slum areas, providing many with their first-ever exposure to digital devices.
• Rehabilitation for Incarcerated Individuals: In partnership with the India Vision Foundation, the “Introduction to Computer Basics” (ICB) course has trained over 3,300 incarcerated people across Uttar Pradesh and Delhi (including Central Jail Rohini) to aid in their eventual reintegration into society.
• Empowering the Visually Impaired: A specialised ICB4VI pilot recently trained 17 visually impaired girls in digital skills. The Foundation is now preparing to scale this model nationwide.

Digital Unification and Cyber Concerns

The Foundation has not only been providing underprivileged people with digital literacy but has also helped them with understanding the basic risks of cyber-attacks, briefings on cybersecurity and internet safety.

Award-Winning Impact

The briefing also highlighted the Foundation’s recent accolade as the “CSR Project of the Year” at the 7th Indo-French Chamber of Commerce & Industry (IFCCI) CSR Conclave & Awards. This award recognises the program’s effectiveness in turning the digital access gap into tangible opportunities for education and employment.

By: Shreya Bansal, Sub-Editor

The post ST Foundation Continues Expansion of Digital Literacy Initiatives in India; Honours IFCCI ‘CSR Project of the Year’ Recognition appeared first on ELE Times.

Rohde & Schwarz will exhibit its extensive portfolio of next generation of wireless technologies, under the motto, “Enabling Connections, Empowering Innovations”, at the Mobile World Congress 2026 in Barcelona, Fira Gran Via, hall 5, booth 5A80 from March 2 to 5, 2026.

The path from 5G to 6G

For a seamless evolution from 5G to 6G, Rohde & Schwarz offers future-ready test solutions for mobile devices and networks. Among the many innovative solutions, the CMX500 one-box signalling tester stands out throughout multiple demos, addressing today’s and tomorrow’s testing challenges.

• Paving the way for 6G, Rohde & Schwarz showcases carrier aggregation combining FR1 and FR3 frequency ranges with its CMX500 one-box signalling tester. The demonstration validates end-to-end device behaviour across the aggregated spectrum. FR3 (7.125 to 24.25 GHz) has been identified by industry and research as a “sweet spot” for combining wide-area coverage with high capacity. Equipped with the new, upgradeable RFU18 board for the CMX500, the tester covers up to 18 GHz, giving users enough headroom for FR3 evolution and a future-ready path for testing next-generation networks.
• Another setup addresses virtual signalling testing. Based on the CMX500, Rohde & Schwarz demonstrates a new approach of shift-left testing, allowing R&D engineers to find design flaws early in their mobile radio modem chips before costly silicon fabrication. This early SDR-based validation will significantly cut time-to-market for 6G devices.
• Ray tracing simulates real-world signal propagation environments, making it a valuable technique for AI receiver testing for future 6G devices. Rohde & Schwarz will showcase the CMX500 as it creates a digital twin of signal propagation within its test environment by leveraging the VIAVI ray tracing engine. This enables controlled and reproducible validation of complex scenarios with high measurement precision, facilitating site-specific optimisation of radio links and reducing the need for tedious field tests.
• Rohde & Schwarz also advances 5G and emerging 6G testing with its AI-based toolset AI Workplace for the CMX500, massively enhancing testing productivity. TechAssist uses natural language to control the CMX500, enabling rapid test-scenario setup and status/configuration queries, while an upgraded ScriptAssist with a new interface simplifies and accelerates scripting for R&D protocol and application testing as well as instrument automation. Visitors can experience these AI-powered tools in action within various setups at MWC 2026.
• Mobile XR and personal AI devices like smart glasses and wearables are key for 5G-Advanced and 6G-enabled immersive 3D communications. Delivering compelling, low-latency experiences will require rigorous, realistic testing. Rohde & Schwarz will demonstrate an end-to-end testbed centred around the CMX500, addressing AI on RAN and XR testing challenges with its ability to emulate 4G, 5G and Wi-Fi networks, applying both RF and IP impairments to reproduce real-world conditions such as interference and congestion.
• 6G ISAC (Integrated Sensing and Communication), which leverages mobile networks for object detection, is rapidly gaining traction. Rohde & Schwarz will demonstrate new capabilities of its R&S AREG800A, including the emulation of micro-Doppler signatures – in addition to distance, speed and RCS – to support object classification, such as drones.
• For testing base stations and network infrastructure, Rohde & Schwarz showcases the PVT360. It meets the requirements for testing FR1/FR2, small cells and O-RU in a single box. For the verification of frequency converting antennas used in SATCOM, NTN or 5G and 6G applications, visitors can learn about CATR-based over-the-air test chambers, enabling fast OTA-testing of phased antenna arrays.
• With the first off-the-shelf commercial mobile devices now available for 5G broadcast, Rohde & Schwarz lets visitors explore seamless rich data distribution transmission to mobile devices, innovative applications like venue casting, emergency alerts and advanced solutions for terrestrial positioning, navigation and timing.

From ground to orbit with NTN

As terrestrial and satellite-based networks converge, it becomes increasingly complex to simulate real-world conditions while meeting 3GPP requirements, for instance, when it comes to handovers within orbits, between orbits or from space to ground. As NTN technology matures alongside 5G and towards 6G, overcoming significant technical hurdles is key to realising NTN’s potential.

• Rohde & Schwarz has upgraded its CMX500 one-box signalling tester, supporting NR-NTN, NB-NTN and Direct-to-Cell (D2C/DTC) technologies in a single platform. The tester creates a digital twin of the sky, simulating orbits, bands and impairments like Doppler shifts and fading. Combined with smart features like the Constellation Insights Tool, it allows engineers to visualise satellite constellations, analyse coverage gaps and observe trajectories.
• Rohde & Schwarz also supports NTN conformance and carrier acceptance testing, offering the highest number of validated test cases for NR-NTN according to 3GPP Rel.17. In cooperation with Samsung, validations were conducted across all three test domains: RF, RRM and PCT. At MWC 2026, visitors will not only be able to experience these test cases but also see a demonstration of Viasat’s test plan for NB-NTN, covering protocol, performance and RF test scenarios.

Industry collaborations to accelerate AI-RAN

AI is becoming an integral part of the RAN, enabling performance optimisation, improved energy efficiency and more autonomous operations. As a member of the AI-RAN Alliance, Rohde & Schwarz continues industry collaboration and provides reliable test equipment for navigating interoperability in this evolving landscape.

• Rohde & Schwarz and Nokia Bell Labs have collaborated on an AI/ML-based 6G base station radio receiver employing Digital Post Distortion (DPoD) to recover distorted uplink signals. DPoD improves link budget, preserves coverage and reduces the need for dense site deployments, lowering costs. DPoD also reduces mobile device complexity and power consumption. The testbed at the Rohde & Schwarz booth, comprising the R&S SMW200A vector signal generator and the newly launched FSWX signal and spectrum analyzer will showcase the improved performance of Nokia’s AI receiver for uplink signals with different distortion levels.
• In collaboration with NVIDIA, Rohde & Schwarz will exhibit its latest proof-of-concept, also leveraging digital twin technology and high-fidelity ray tracing. This approach creates a robust framework for testing AI-enhanced base stations for both 5G-Advanced and 6G under realistic propagation conditions. This integration aims to bridge the gap between AI-driven wireless simulations and real-world deployment, facilitating more efficient and accurate testing of next-generation receiver architectures.

Next-generation Wi-Fi experience

Wi-Fi 8 sets new expectations for consistent, ultra-high-reliability and quality connectivity. Designed to handle a growing number of connected devices and demanding applications like XR or industrial IoT, IEEE 802.11bn employs ever more complex MIMO (Multiple-Input, Multiple-Output) scenarios. Rohde & Schwarz enables manufacturers with its solution portfolio, from R&D to production.

• The CMX500 one-box signalling tester is now equipped with comprehensive Wi-Fi 8 capabilities. The tester’s flexibility and embedded IP test capabilities make it a versatile solution for a broad range of Wi-Fi 8-specific tests, such as dRu (distributed resource unit), introducing distributed resource allocation, and UEQM (unequal modulation) where different MIMO layers use different modulation schemes, as well as 320 MHz channel bandwidth.
• To navigate the technical complexities of Wi-Fi 8 throughout the entire device lifecycle – from development to production – Rohde & Schwarz will exhibit the CMP180 radio communication tester, designed for testing in non-signalling mode with advanced capabilities and broad bandwidth support. The CMP180 combines two analysers and generators for efficient testing of 2×2 MIMO Wi-Fi 8 devices.
• For high-end MIMO signal generation and analysis tasks in R&D, Rohde & Schwarz will display the R&S SMW200A vector signal generator and the newly launched FSWX signal and spectrum analyser. With its outstanding standard EVM performance and in combination with its cross-correlation feature, the FSWX discovers details of Wi-Fi 8 signals that have been hidden up to now and offers new margins for optimisation. Its multichannel architecture makes the FSWX well-suited for analysing complex scenarios like multi-user MIMO (MU-MIMO).

Automotive connectivity testing 

Vehicle manufacturers are integrating increasing levels of wireless connectivity to enable new user experiences, safety features and higher levels of autonomous driving. Rohde & Schwarz offers precise test solutions that cover all wireless technologies used in the automotive industry, from 5G and ultra-wideband to C-V2X and GNSS.

• With NG eCall becoming mandatory for vehicles sold in Europe starting in 2026, Rohde & Schwarz will demonstrate compliance testing capabilities using the CMX500 one-box signalling tester and R&S SMBV100B vector signal generator. The test solution also supports the upcoming Chinese automotive GNSS test standard, GB/T 45086.1 2024, expected to be mandatory for the Automotive Emergency Call System in 2027, with automated testing.
• Non-terrestrial networks have the potential to provide ubiquitous automotive connectivity and require enhancements to key components such as the chipsets, TCU and antennas. Trade show visitors can discover at MWC 2026 how the company’s comprehensive NTN test solutions can help the automotive industry create the always-connected vehicle.

Solutions for mission-critical communications and spectrum monitoring

Mission-critical communications (MCX) support public safety, first responders and emergency services by providing extremely reliable, low-latency and secure communications even in adverse conditions. Rohde & Schwarz will showcase its integrated solutions for testing devices and mobile networks, facilitating the ongoing migration to 3GPP-compliant broadband mission-critical services.

• The QualiPoc platform will be demonstrated with new capabilities for MCX testing. This smartphone-based solution allows detailed performance assessment of MCX private and group calls, including measurement of 3GPP-defined MCX KPIs. New features include direct MCX app control and the ability to measure quality of service (QoS) and quality of experience (QoE) for public safety communications. The R&S LCM, an autonomous monitoring probe, and the R&S TSMS8, the fastest network scanner, will also be on display, further expanding capabilities for both business and mission-critical networks.
• Rohde & Schwarz will also exhibit a protocol conformance test solution to verify that MCX devices and client software implementations adhere to 3GPP specifications.
• Expanding its spectrum monitoring portfolio, Rohde & Schwarz will launch two new products at MWC Barcelona 2026: These solutions will enable regulatory authorities, network operators and public services in over 100 countries to actively protect the electromagnetic spectrum and address evolving monitoring challenges. The new devices will enhance capabilities in interference hunting and regulatory compliance.

Endpoint security, network visibility and secure network solutions

Robust security solutions deliver seamless and reliable communications experiences. Rohde & Schwarz subsidiaries will also present their innovative solutions supporting the wireless ecosystem.

• The Rohde & Schwarz Networks & Cybersecurity division, comprising the subsidiaries Rohde & Schwarz Cybersecurity and LANCOM Systems, provides endpoint security, secure networks and high-quality cryptography. With products “Engineered in Germany”, they ensure trustworthy, reliable and secure data transfer, specialising in the public, critical infrastructures, defence, health, retail and SME verticals. At MWC 2026, Rohde & Schwarz Cybersecurity will showcase the Layer 2 encryptor R&S SITLine ETH NG and the R&S ComSec solution enabling secure mobile working with sensitive data on iPhones and iPads. LANCOM Systems will present an overview of its Wi-Fi 7 access point portfolio, the latest 5G router models and firewalls.
• As networks become more distributed, encrypted and dynamic, network visibility becomes indispensable. At the Rohde & Schwarz booth, visitors will experience how the ready-to-deploy, DPI-powered R&S Probe Observer delivers deep network visibility, precise real-time traffic analytics and actionable intelligence. Developed by ipoque, a Rohde & Schwarz company, this deep packet inspection (DPI) software probe analyses network traffic at the application level, enabling operators to understand, optimise, and control their networks while supporting faster detection, diagnosis and resolution of network and service issues.

Rohde & Schwarz will showcase its comprehensive portfolio of test and measurement and industry solutions at Mobile World Congress 2026 at Fira Gran Via in Barcelona, in hall 5, booth 5A80. Trade magazine editors and press representatives visiting the event are invited to schedule briefings with their press contact at Rohde & Schwarz.

The post R&S drives connections and innovations at MWC Barcelona 2026 appeared first on ELE Times.

Speaking at the Auto EV Tech Vision Summit 2025, Mohammadsaeed Mombasawala laid bare a reality the EV industry often skirts around—electric vehicles are evolving fast, but the ecosystem supporting them is dangerously lagging.

Opening his address with a provocative question—“Is EV done and dusted?”—Mombasawala was quick to answer it himself:  far from it. Innovation in EVs is accelerating, but the real battleground is no longer the vehicle alone. It is charging infrastructure, grid readiness, and software-defined architectures that will decide the success or failure of the transition.

 Charging Anxiety Will Not Be Solved with AC

According to Mombasawala, EV charging anxiety cannot be addressed with slow, AC charging solutions. The industry is inevitably moving towards high-power DC fast charging, with capacities of  50 kW and above becoming the new norm.

But charging speed alone is not enough. He highlighted the emergence of plug-and-play charging, where vehicles authenticate themselves automatically through preloaded scripts and cloud connectivity—eliminating the need for RFID cards or manual authentication. In this model, the vehicle communicates with the charger via the cloud, pre-authorises itself, and begins charging seamlessly, reflecting the deeper convergence between EVs and software-defined vehicles (SDVs).

Vehicle-to-Grid: Opportunity Born from Crisis

One of the most critical trends Mombasawala pointed to was  Vehicle-to-Grid (V2G) —using EVs not just as consumers of electricity, but as mobile energy sources capable of feeding power back into the grid.

This, he explained, is not just a technological curiosity, but a necessity born from a looming crisis. “I have done the calculation myself,” he noted. If all vehicles in Delhi were replaced with EVs and charged using 50 kW fast chargers, the grid would require 7,000 MW of additional power just to charge vehicles within 5–8 minutes. No grid today is prepared for that kind of load”.

The implication is stark: while EV adoption is racing ahead, grid infrastructure is nowhere close to ready.     

The Grid Is the Real Bottleneck

Mombasawala warned that without serious innovation and investment in electrical infrastructure, a rapid EV transition could destabilise the power system itself.

“If we transition the whole country by 2030 at this pace, the grid will collapse,” he cautioned. The issue is no longer just EV range anxiety—it is national power security. Without infrastructure upgrades, consumers may find themselves unable to charge vehicles and facing power shortages at home.

Electrical engineers, he stressed, have a monumental role ahead—not just in vehicles, but in re-architecting the grid to handle electrified mobility at scale.

Software-Defined Vehicles: Complexity Beneath the Surface

While SDVs are often discussed as sleek, updatable platforms, Mombasawala highlighted the hidden complexity beneath the headlines. Today’s vehicles contain hundreds of ECUs communicating through multiple discrete protocols. The industry urgently needs standardisation, moving towards  Ethernet-based architectures to manage growing data and control demands.

He also pointed to emerging semiconductor trends such as chiplets, where optics and semiconductors are packaged together in a single die—underscoring how vehicle electronics are becoming more sophisticated and tightly integrated.

Why the Cloud Is Non-Negotiable

A recurring theme in his address was the absolute necessity of cloud backends for SDVs. With millions of vehicles requiring continuous updates, feature upgrades, and service enhancements, localised solutions are no longer viable. “There is no red reset button,” he reminded the audience. Without cloud-based services, upgrading and managing vehicle software at scale becomes impossible.

AI, Data Centres and the Limits of In-Vehicle Intelligence

One of the most sobering insights came from Mombasawala’s discussion on  AI in SDVs. Advanced vehicle functions—braking behaviour, acceleration profiles, comfort tuning—will increasingly rely on AI models trained on massive datasets. But these models cannot be trained inside vehicles.

To put scale into perspective, he cited how companies like Meta use around  600,000 GPUs, while Elon Musk’s Grok reportedly uses 800,000 GPUs in a single data centre. Even with such resources, training models can take weeks. Training safety-critical vehicle systems like braking could require  6–8 weeks per iteration, and continuous retraining as new data arrives.

This underscores a key reality: SDVs are as much a data-centre problem as they are an automotive one.

Beyond the Hype

Mombasawala concluded by grounding expectations around SDVs. While the stories sound exciting, real-world vehicle control systems only stabilise through negative feedback loops, making their design and validation far more complex than popular narratives suggest. The EV transition, he implied, will not be won by flashy announcements alone. It will require deep engineering, infrastructure investment, and a sober understanding of system-level constraints.

As the industry pushes ahead, his message was clear: the future of EVs depends not just on better vehicles, but on grids, software, clouds, and engineers rising together.

The post EVs, Software and the Grid: Why the Real EV Challenge Is Infrastructure, Not Vehicles appeared first on ELE Times.

Diodes’ PI2MEQX2505Q MIPI D-PHY ReDriver supports data rates up to 2.5 Gbps, making it well suited for ADAS and automotive camera monitoring systems. It provides one clock lane and four differential data lanes. Each data lane features programmable receiver equalization, output swing, and pre-emphasis, configurable via I²C or pin-strap. This helps optimize performance and reduce intersymbol interference across different physical media.

Compliant with MIPI D-PHY 1.2, the device regenerates D-PHY signals for CSI-2 and DSI interfaces over PCB traces, connectors, and cables. This extends trace lengths while minimizing power consumption and maintaining low latency. Activity-detection circuitry allows the redriver to enter a lower-power mode during Ultra-Low Power State (ULPS) and low-power (LP) states.

The PI2MEQX2505Q is AEC-Q100, Grade 2 qualified and operates from a 1.8 V supply over a temperature range of –40 °C to +105 °C. It comes in a compact 3.5 × 5.5 mm W-QFN3555-28/SWP package, supporting high-density channel routing.

Available now, the PI2MEQX2505Q is priced at $0.88 each in lots of 3500 units.

PI2MEQX2505Q product page 

Diodes

The post Redriver boosts automotive camera link reliability appeared first on EDN.

R&S has launched the 44-GHz FPL1044 spectrum analyzer along with a 40-MHz real-time spectrum analysis (RTSA) option for the entire FPL family. With the RTSA option, the FPL1044 can perform real-time measurements across its full frequency range from 10 Hz to 44 GHz. According to R&S, the FPL1044 is the first mid-range spectrum analyzer capable of reaching 44 GHz, making high-frequency testing more accessible.

The FPL1044 is the only model in the FPL family to offer a DC coupling option, enabling analysis of very low-frequency signals starting at 10 Hz. This capability extends measurement coverage from near-DC through the Ka-band. Compact and lightweight, the analyzer occupies minimal bench space, while an optional battery pack allows for portable operation.

The 26.5-GHz to 44-GHz frequency range is particularly important for aerospace and defense applications, including satellite communications, radar, and radio navigation. In these environments, the FPL1044 supports system verification, production quality control, and on-site repair and maintenance of high-frequency components such as filters, amplifiers, and traveling-wave tubes.

Configure and request a quote for any FPL spectrum analyzer, including the FPL1044, using the product page link below.

FPL series product page

Rohde & Schwarz 

The post R&S expands mid-range spectrum analysis to 44 GHz appeared first on EDN.

EPC’s first Gen 7 eGaN power transistor, the 40-V EPC2366, delivers up to 3× better performance than equivalent silicon MOSFETs. Now entering mass production, the device features a typical RDS(ON) of 0.84 mΩ and an optimized RDS(ON) × QG figure of merit of 12.6 mΩ·nC. This enables the EPC2366 to reduce conduction and switching losses while improving thermal performance.

Designed for high-efficiency, high-density power systems, the EPC2366 is suitable for synchronous rectifiers, DC/DC converters, AI server power supplies, and motor drives. It is rated for a drain-to-source voltage (VDS) up to 40 V, transient voltages up to 48 V, and a continuous drain current (ID) of 88 A, with pulsed currents reaching 360 A.

To assist design-in and evaluation, the EPC90167 half-bridge development board integrates two EPC2366 transistors in a low-parasitic layout, with PWM drive signals and flexible input modes.

The EPC2366 comes in a compact 3.3×2.6-mm PQFN package and is priced at $1.56 each in quantities of 3000 units. The EPC90167 development board is available for $211.65 each.

EPC2366 product page 

Efficient Power Conversion 

The post GaN transistor cuts losses and heat appeared first on EDN.

Enabling higher power delivery within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device and can be stacked to 200 A. The module integrates a 16-VIN buck converter with programmable PMBus and I²C control, making it well suited for powering PCIe switches and high-compute MPU applications used in AI deployments.

With dimensions of approximately 6.8×7.65×3.82 mm, the MCPF1525’s vertical construction maximizes board space, providing up to a 40% reduction in board area compared to alternative solutions. For improved reliability, the device incorporates multiple diagnostic functions reported over PMBus, including overtemperature, overcurrent, and overvoltage protection to help prevent undetected faults.

Housed in a thermally enhanced package, the MCPF1525 supports a junction temperature range from −40°C to +125°C. An embedded EEPROM enables users to program the default power-up configuration.

The MCPF1525 is available now, priced at $12 each in 1000-unit quantities.

MCPF1525 product page 

Microchip Technology 

The post High-density power module fits compact AI servers appeared first on EDN.

Four power inductors in 0806 and 1210 case sizes from Vishay offer improved performance for commercial and automotive applications. Compared to competing inductors with similar performance, the devices use considerably less board space—up to 64% smaller in 0806 and 11% smaller in 1210 packages. They also support higher operating temperatures, a wider range of inductance values, and lower DC resistance to enhance efficiency.

The commercial IHLL-0806AZ-1Z and IHLL-1210AB-1Z have terminals plated only on the bottom, enabling smaller land patterns for more compact board spacing. The automotive-grade IHLP-0806AB-5A and IHLP-1210ABEZ-5A feature terminals plated on the bottom and sides, allowing a solder fillet that strengthens the mount against mechanical shock and simplifies joint inspection. These automotive devices are AEC-Q200 qualified for high reliability and elevated operating temperatures.

Samples and production quantities of the IHLL-0806AZ-1Z, IHLL-1210AB-1Z, IHLP-0806AB-5A, and IHLP-1210ABEZ-5A inductors are available now, with lead times of 10 weeks.

Vishay Intertechnology 

The post Vishay shrinks inductors, keeps full performance appeared first on EDN.

NUBURU Inc of Centennial, CO, USA — a developer of high-performance blue-laser technology and an emerging integrated defense & security platform provider — has provided a corporate update highlighting continued execution of its strategic transformation, including balance-sheet optimization initiatives, expansion of defense-focused industrial cooperation, and advancement across multiple technology verticals...