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Implementing a simple digital-to-analog converter (DAC) by cascading a single pulse width modulator (PWM) and an analog low-pass filter is nothing new. Nor is applying to a filter the sum of the outputs of a most significant 2N-count PWM and a least significant 2N-count one to get a composite 22N-bit DAC [1][2]. But designing one with simple, adjustment-free topologies and reasonably accurate, repeatable performance characteristics is not trivial. A proposed example is seen in Figure 1. Let’s examine the circuit from the output to the input.

Figure 1 The PWM—driven 16-bit DAC. Capacitors C1, C2, and C3 are NPO/COG ceramic.

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Op amp

The OPA383 is a “rail-to-rail” input and output op amp. Typical of such parts, the output doesn’t quite swing to the rails. A close look at the spec reveals that the V+ and V- supplies should be at least ±155 mV beyond the range of output signals, and their difference should be less than 5.5 V.  Input offset voltage is ±5 µV maximum at 25°C, but unfortunately, we are not given limits over temperature. However, a graph of 5 measured units shows limited susceptibility to temperature. Let’s assume three times 5, or a 15 µV maximum over the temperature range.

The bias current is ±76 pA maximum from -40°C to +85°C. I’d like to keep the design’s various independent error contributions under ½ PWM count (in this case, under 2-17 of full-scale). Considering the under 100 kΩ resistance seen by the op amp input, full-scale DAC voltages over 2.0 V would encounter errors less than ½ count due to bias current and offset voltage.

The op amp’s DC gain is a minimum of 118 dB, and its gain-bandwidth (GBW) product is 2.5 MHz typical. In the absence of other information, I’ll assume and work with a minimum GBW of 1 MHz.

PWM filter

The filter consists of U2, Ra, Rb1, Rb2, R1, R2, R3, C1, C2, and C3. It’s important to keep a handle on the tolerances of these passive components to ensure repeatable results. The capacitances of common ceramic types such as Y5V and X7R are very sensitive to temperature and to DC voltage; they are not recommended for use in filters requiring any significant stability. Film and ceramic COG/NPO types are far less sensitive. NPO/COG capacitors and the resistors of the values and tolerances shown in the schematic are available for well under $0.10 in 1000-piece quantities.

The filter shown is a 3rd-order one (evident from the presence of three capacitors). Generally, 3rd-order filters offer a smaller (better) product of settling time and ripple attenuation factor than 2nd-order filters (two capacitors). Design aids for 3rd-order types are rare, so I’ve used one I developed and published in EDN almost 15 years ago [3]. This filter does not rely on the cancellation of large signals of opposing phases, so there is no need for adjustment pots to deal with the lack of zero-tolerance components that would otherwise be required to achieve maximal nulling.

It’s the job of the filter to suppress the AC “ripple” of PWM signals, which are at their worst when the output is 50% of full scale. Minimization of settling time is also of interest. To assess the effects of variations due to component tolerances, Figure 2 and Figure 3 show 100-run Monte Carlo trials of settling times for a zero to full-scale transition and for ripple attenuation.

Figure 2 100 Monte Carlo runs of a transition from 0 to full scale, 0 to 65535 counts. Settling to better than ½ count occurs in less than 2 milliseconds.

Figure 3 100 Monte Carlo runs of ripple, where full scale is 65535 counts. Ripple is less than ½ PWM count peak and 1 count peak-to-peak. PWM frequency is 78 kHz.

Summing network

There are two 8-bit PWMs. To create a 16-bit signal, the contribution of the most significant PWM signal is weighted by a factor very close to 256 times larger than that of the less significant PWM signal. A summing network of Ra and Rb1 + Rb2 accomplishes this. (Note that the remaining filter components have no DC effect on this network.)

Filter drivers (logic Inverters)

The logic inverters shown driving the summing network have finite output resistances, which effectively add to those of Ra and R1b. Unfortunately, logic inverters are not linear devices and are not characterized as such. The best way to determine maximum output resistance from their data sheets is to first identify the specified supply voltage nearest (but less than or equal) to the one intended for use, and then divide the maximum output voltage drop by the specified load current.

It’s best to do this for the high side, as its resistance is typically higher than that of the low side. For instance, if a 3.3-V supply is intended for a Texas Instruments SN74AC04, use the datasheet’s 2.46-V minimum for a 3-V supply drawing 12 mA to arrive at a maximum resistance of 45 Ω. Paralleling five gates will reduce that resistance to an unknown amount below 9 Ω. The amount is unknown because the individual inverters share common resistances on the wafer and in the wafer-to-package bonding wires. And so up to 9 Ω is added to Ra. The up to 45 Ω added to Rb has a comparably negligible effect.

But here we depart from the goal of limiting an error source to a maximum contribution of ½ count—the maximum differential non-linear error is now just under 1 count. Fortunately, even with this error, an increasing series of counts yields a monotonically rising sequence of output voltages. If the performance improvement is worth the cost, you could stay below a ½ count error by doing the following:

• Replacing the inverter with the low-resistance, dual-channel TS5A22362DRCR analog switch
• Replacing the R1a1% part with a 0.05% part
• Replacing the 30.1 kΩ R1b with a 28.7 kΩ 1% resistor in series with a 5% 510-Ω unit.

Driver power supply

Alas, once again, we must abandon the goal of keeping the errors introduced to less than ½ LSb. The TI REF35 IC’s ±0.05% at 25°C rating equates to 33 LSb’s! And even with the benefit of calibration and added hardware to adjust the inverter/analog switch’s supply voltage, the reference’s 12 ppm/°C temperature variations would leave us in the lurch. Once again, we have to eat some error.

In the spirit of continuing to do our best with the cards dealt, the reference’s DC resistance (60 ppm max of 3.3 V (for instance) / 1 mA) is about only 0.2 Ω. This is negligible when met with the DC resistance seen through the summing network of Ra and Rb. Transients from the inverters are a concern, however.

Adequate decoupling of those devices is a must. Additionally, the AC impedance due to the combination of R1, Ra Rb, and C1 of approximately Zsum = 16.5 kΩ appears at the inverter outputs and so also across their supply terminals. Fortunately, these are at frequencies no lower than the PWM frequency (see next section for this value). The capacitors shown keep the impedance at this frequency well below 0.1% of the almost completely resistive Zsum. For practical considerations, the magnitude of this combination is indistinguishable from that of Zsum.

PWM signal source

The PWM signal source is probably a microprocessor. These days, most of them can be clocked at 20 MHz or greater, meaning that they could all source 8-bit PWMs of at least 20 MHz / 256 = 78 kHz. It’s this frequency or higher that the filter was designed for. So why not use microprocessor GPIO PWM outputs as drivers?

First, there’s the usually fairly high GPIO output resistance. Additionally, if you’ve ever looked closely at the voltage of a microprocessor digital output, you might have seen that it’s a few millivolts or even tens of millivolts from ground and the device’s supply. This is because the processor is performing functions in addition to generating a PWM, which draw significant current, producing voltage drops through portions of the IC wafer and its package bonding wires. The SN74AC74 has no such other functions, and any such voltage drops are part of the voltage drop specs discussed earlier.

Modifications

Want lower ripple amplitude? Increase the PWMs’ frequency. Want faster settling time? The resistance looking into Ra and Rb is Rab = 4009 Ω. Reduce R3, R2, and R1—Rab by some factor and/or C1, C2, and C3 by the same or different factor. Increase the PWMs’ frequency by at least the product of the factors. Increase it further to achieve both improvements.

To sum it up

A simple design has been introduced for a PWM-driven 16-bit DAC. Peak ripple is less than ½ LSb and the circuit settles to this level in less than 2 ms. Monte Carlo analyses show that these parameters are met even considering passive component and op amp GBW tolerances. In 1k quantities, the reference is about $1, the op amp is under $0.75, and the filter passives are each under $0.10.

Error sources in various parts of the circuit have been identified and, where possible, limited to no more than ½ LSb. To address other larger errors, suggestions of additional hardware and calibration have been made, but the temperature sensitivity of the voltage reference is a limiting factor.

Christopher Paul has worked in various engineering positions in the communications industry for over 40 years.

Related Content/References

1. Double up on and ease the filtering requirements for PWMs
2. Inherently DC accurate 16-bit PWM TBH DAC
3. Design second- and third-order Sallen-Key filters with one op amp

The post A nice, simple, and reasonably accurate PWM-driven 16-bit DAC appeared first on EDN.

Quantum sensors are devices that can detect motion at the atomic level, as well as in electric and magnetic fields, utilizing principles of quantum mechanics such as superposition, entanglement, and tunneling. These sensors measure physical quantities (time, gravity, acceleration, magnetic fields) by observing quantum phenomena in atoms, ions, or superconducting circuits.

Far more accurate and resilient than traditional sensing tech, quantum sensors are poised to revolutionize defense and aerospace electronics—fields where GPS denial, high-velocity motion, and extreme conditions are common. No longer the stuff of science fiction, quantum sensors represent a near-future inevitability.

Strategic Significance in Defense and Aerospace

Quantum sensors have the potential to significantly outperform current sensing technologies in navigational accuracy, threat detection, and situational awareness. For example, quantum inertial navigation systems (QINS) can be used in submarines, aircraft, and spacecraft to one day operate without GPS systems. This can be a game-changer in electronic warfare scenarios, where jamming the enemy’s GNSS (Global Navigation Satellite System) is a common tactic.

For submarines in particular, quantum magnetometers capable of detecting minute variations in magnetic fields could allow for passive submarine detection or underground mapping—all without active sonar or ground-penetrating radar.

In space, quantum gravimeters could be of great help in providing valuable data or aiding in resource exploration through the mapping of celestial bodies or detecting subterranean anomalies far more precisely than gravimeters of today.

Key Applications Under Development

While not yet deployed for real-world use, several hardware applications are well underway in the development phase and are emerging as front-runners.

• Quantum Clocks

There are already atomic clocks used in satellite navigation that use trapped ions or cold atoms. However, newer designs that aim to miniaturize or ruggedize these systems are also in development. They will be used in mobile platforms like UAVs or autonomous naval systems.

• Quantum Accelerometers and Gyroscopes

Exploiting interferometry to track motion—all without reliance on external signals—these sensors could allow aircraft or missiles traversing through GPS-denied zones to maintain accurate positioning for extended durations.

• Quantum Magnetometers

These tools, employing nitrogen-vacancy (NV) centers in diamond or superconducting quantum interference devices (SQUIDs), have the power to potentially detect magnetic anomalies with unprecedented accuracy. Theoretical applications range from locating stealth submarines to conducting geophysical reconnaissance from orbit.

• Quantum Gravimeters

Able to measure gravity variations at extreme resolutions, they could be used in planetary missions or terrain mapping to reveal subsurface structures or aid in autonomous navigation across unfamiliar environments.

These technologies are at varying stages of maturity. Some, like optical lattice clocks, are now stable and usable in laboratory conditions. Others still face hurdles in miniaturization, environmental shielding, and power efficiency.

However, it may only take a few more years before it begins real-world deployment

Technical and Operational Challenges

While holding great, revolutionary potential, there are still ways to go before quantum sensors become plug-and-play in aircraft, satellites, or even on the battlefield.

One of the main issues hindering real-world deployment is the lack of environmental robustness. Most of the quantum sensors we have now are very sensitive, not only to the parameters they’re designed to measure, but also to thermal fluctuations, electromagnetic interference, and mechanical vibrations.

Many can still only operate under extreme ultracold or vacuum conditions, needing complex laser systems to manipulate quantum states. At best, they currently function only in laboratory settings.

Data integration is also a hindrance. While quantum sensors can produce ultra-precise raw measurements, turning this into actionable data is another conversation. It will require its own technology involving sophisticated signal processing, calibration, and fusion with other sensor modalities. As such, developing AI or edge-processing capabilities tailored for quantum outputs must be developed simultaneously with the sensors themselves.

Finally, quantum tech will introduce new digital vulnerabilities as well, especially given the ultra-precise data these sensors are expected to produce. The need for secure data transmission, therefore, becomes even more critical. New defense-grade encryption and shielding must be developed. And compatibility with simpler apps, such as a VPN app for iPhone, can help ensure access to mission systems in mobile operational contexts.

Ecosystem and Policy Implications

As quantum sensors approach operational readiness, both governments and private companies are investing in the technology. Overall, the US, UK, and EU are reported to have collectively invested $17.7 billion in quantum technologies as of a 2025 OECD report.

For example, DARPA and the U.S. Department of Defense have established dedicated initiatives—like the Quantum Aperture Sensor program—to accelerate prototyping and field trials. As such, we may soon see quantum tech not just in aerospace or defense, but also in civilian and commercial spheres as well.

The Road Ahead

Quantum sensors will not replace classical systems overnight. They will first likely augment them through hybrid, transitional platforms that combine quantum and classical sensing. But they will eventually supersede current tech, becoming foundational for the next-generation aircraft, autonomous naval fleets, and deep-space missions.

It cannot be emphasized enough, however, that development must prioritize safety, reliability, supportive firmware systems, and personnel training for this new technology. Only then can we fully realize the transformative benefits of quantum sensing.

The post Quantum Sensors and Their Impact on Defense and Aerospace Electronics appeared first on ELE Times.

Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA says that it is working with NVIDIA of Santa Clara, CA, USA to support the transition to 800V direct current (VDC) power architectures, which is driving significant gains in efficiency, density and sustainability for next-generation AI data centers...

ams OSRAM of Premstaetten, Austria and Munich, Germany has sold its Entertainment and Industry Lamps (ENI) business to Ushio Inc of Tokyo, Japan for €114m (on a cash-and-debt-free basis) as the first divestment under its deleveraging plan. Net deal proceeds will be determined upon final closing accounts at the date of the transaction closing, which is expected by the end of March 2026 (subject to typical closing procedures)...

ams OSRAM of Premstaetten, Austria and Munich, Germany has placed €500m 2029 senior notes to pre-finance OSRAM minority put option exercises and buy back €150m 2027 convertible bonds. The firm has also announces solid preliminary Q2/2025 results...

The Central Processing Unit (CPU) is the heart of any computing device, whether it be a personal laptop, a high-performance gaming rig, or an enterprise-grade server. In the fast-growing digital India, there continues to be growing demand for efficient and powerful CPUs. The right CPU brand is important for gaming, content creation, or commercial use.  Here are the top 10 CPU brands in India that are providing the computer experience in 2025.

1. Intel:

Corporation is based in Santa Clara, California, United States. It is also the most recognizable CPU brand in India and stands for power, stability, and energy efficiency. The Core i3, i5, i7, and i9 series dominate desktops and laptops while the Xeon series powers servers and workstations. Its vast ecosystem of compatible options, integrated graphics, and strong retail presence endear the brand to gamers, students, and professionals alike.AMD (Advanced Micro Devices).

2. AMD:

Headquartered in Santa Clara, California, AMD too is an U.S.-based company. With its Ryzen Series offering better multi-core performance at competitive prices. AMD offers Ryzen 3, 5, 7, and 9 CPUs to suit a wide range of users, from budget conscious individuals to avid gamers and creative professionals. EPYC and Threadripper are excellent for serious work and large enterprises.

3. Apple:

The initiative to enter the CPU market was taken by Apple Inc., based in Cupertino in California, USA, with the designing and manufacturing of custom ARM-based Apple Silicon chips. The concept is very much simple: The processors and chips are exclusive to Apple, thereby allowing the vanquishing of performance barriers on MacBooks, iMacs, and iPads through processors bearing the M1, M2, and M3 names. These processors are not sold as chips to be put into other machines, yet in India, they find usage in the premium productivity and creative segments as they offer unmatched power efficiency and flawless integration with macOS.

4. Qualcomm

An American company headquartered in San Diego, California, Qualcomm is primarily known for mobile chipsets and now has computing in its purview. Snapdragon Compute platforms 8cx and 7c Gen 3 find use in Windows on ARM laptops and provide a very good power-efficient lightweight computing experience for users looking for an always connected kind of computing battery life with good mobile network support.

5. MediaTek

Media Tek is a Taiwanese company headquartered in Hsinchu, in northern Taiwan. Being value for money service providers, they play prominent roles in India’s cheap computing segment. Their Kompanio line powers budget Chromebooks and low-tier laptops, mostly bought by students and some education institutions. MediaTek processors continue to receive appreciation because of their energy.

6. IBM

IBM, with its corporate offices situated in Armonk, New York, USA, rocks the status of a world leader in enterprise computing. Surrounding its Power9 and Power10 processors used in high-end servers and data centers scattered across India, it especially finds great utility within financial institutions and research facilities. Though not seen as a consumer product, IBM CPUs are crucial for backend computing applications and data-intensive applications.

7. VIA Technologies

It is another company based out of Taiwan, and VIA Technologies focuses on embedded and low-power CPU development. The Eden and C7 processors find application in niche industrial settings such as automation, transportation, and edge computing machines. In a more common PC setup, these processors are not used extensively; however, VIA is crucial for India’s developing industrial technology infrastructure.

8. Unisoc

Unisoc is a Chinese semiconductor company, headquartered in Shanghai, China. It provides affordable processors for tablets, cellphones, and educational tools. In India, Unisoc CPUs are often deployed in government-distributed learning devices primarily because of their affordability and consistent performance in basic tasks.

9. Samsung

Samsung, based in Seoul, is the producer for the Exynos family of processors. These processors are mostly used for smartphones, and so are the Exynos 1280 and onwards, which are increasingly being incorporated into ARM-based tablets and hybrid compute devices. Samsung’s push into ARM laptops will bear it in stock for lightweight and budget computing in the Indian market.

10. Rockchip

Rockchip, or Fuzhou Rockchip Electronics Co., Ltd., is the semiconductor company headquartered in Fuzhou, China. The company is mostly into designing low-power ARM-based processors to be used in tablets, smart TVs, and embedded computing solutions. In India, Rockchip processors are found in mass-market Android tablets, OTT boxes, and educational devices simply because of their low cost and fair multimedia capabilities. Examples of smart-classroom-based RK series chips used by the company include RK3328 and RK3566 as well as digital kiosks and lightweight computing environments. Rockchip is yet to lose its presence in the budget digital hardware segment in India.

Comparison:

Brand	Popular Series / Chips	System Design & Number of Cores	Key Technologies & Strengths	Best For
Intel	Core i3–i9, Xeon	x86, up to 24 cores (i9), Hyper-Threading	Intel UHD / Iris Xe Graphics, AI Boost, Thread Director, PCIe 5.0 support	Gamers, professionals, general users
AMD	Ryzen 3–9, Threadripper	x86, up to 96 cores (Threadripper)	Zen 4 architecture, Smart Access Memory, Radeon Graphics, Overclocking	Gamers, creators, multitaskers
Apple	M2, M2 Pro, M3	ARM-based, up to 12 cores	Unified Memory Architecture, Neural Engine, superior power efficiency	Designers, video editors, Mac users
Qualcomm	Snapdragon 8cx Gen 3	ARM, up to 8 cores	5G/4G modem integration, Adreno GPU, NPU, Always-On Connectivity	Lightweight users, mobile computing
MediaTek	Kompanio 1300T, 1380	ARM, 8-core CPUs	Integrated Mali GPU, AI Processing Unit, low power draw	Chromebook users
VIA	Eden X4, C7	x86, dual or quad-core (low power)	Fanless design, long lifecycle, embedded optimization	Industrial PCs, automation systems
Unisoc	T610, T700	ARM, 8-core CPUs	LTE modem, basic GPU, low thermal footprint	Entry-level tablets, digital classrooms
IBM	Power9, Power10	RISC, up to 120 threads	SMT4/8, massive memory bandwidth, enterprise-grade RAS features	Servers, banking, research infrastructure
Samsung	Exynos 1280, 1380	ARM, up to 8 cores	AI Engine, Image Signal Processor, power-efficient fabrication	Tablets, ARM laptops, multimedia systems
Rockchip	RK3328, RK3566	ARM Cortex-A53/A55, quad-core	4K video decoding, GPU for media, affordable SoC design for edge/IoT	Budget tablets, OTT devices

Conclusion:

From mainstream gaming to heavy industrial automation, CPU needs are changing quite dramatically in India, with changes being wrought in innovation and specialization for the market. In terms of performance and brand, Intel and AMD always come to mind first, but new players and niche players like MediaTek, VIA, are steadily making room for themselves.

The post Top 10 CPU Brands in India appeared first on ELE Times.

submitted by /u/rakesh-kumar-phd [link] [comments]

Hi all, what is resister R54 rated to? I know that sounds silly, but I’m colourblind and I can’t see what colours are there! Any help would be greatly appreciated :) submitted by /u/Andrew6748942 [link] [comments]

Solid-state transformers (SSTs) that use power electronics and high-frequency components to convert and control electricity are extremely useful for integrating renewable energy sources and energy storage systems into the grid, as well as managing surges and disturbances, reducing the likelihood of blackouts. In April, a major blackout occurred across Spain and Portugal, disrupting power for more than 10 hours and causing economic losses of an estimated $1.6bn...

Toward the end of my late-April teardown of Walmart’s first-generation Google TV-based onn. 4K Streaming Box, which EDN quickly augmented by publishing my dissection of its “stick” sibling, the onn. Full HD Streaming Device, two weeks later, I wrote:

I’ve also got an onn. Google TV 4K Pro Streaming Device sitting here which I’ll be swapping into service in place of its Google Chromecast with Google TV (4K) predecessor. Near-term, stand by for an in-use review; eventually, I’m sure I’ll be tearing it down, too.

With apologies (although I know of at least one reader that won’t be disappointed), I’m going to alter that planned content-publication cadence. Thanks to a gently used onn. Google TV 4K Pro Streaming Device that I subsequently found at notable discount to MSRP on eBay, you’re going to get that teardown today. And although I hope that TheDanMan (and the rest of you) get something(s) useful out of this project, I already did. More on that after the break(down).

The onn. 4K Pro Streaming Device teardown

Let’s start with some overview shots of our patient, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes. I’d incorrectly mentioned back in the late April teardown that this device has dimensions of 7.71” x 4.92” x 2.71”…those are actually the package dimensions (in my slight defense, every other review I’ve found parrots the exact same info from Walmart’s website). It’s ~4.25” on each side (a rounded square in form factor) and 1.5” tall (rounded top, too), per my tape measure. And my kitchen scale says it weighs ~9.9 oz:

Around the front is a button that, when pressed, causes the remote control (assuming it’s in Bluetooth broadcast range) to emit a tone so you can find it buried between the sofa cushions (or wherever else you might have absentmindedly put it). Given its first-time inclusion and placement prominence, such scenarios are apparently quite common! Unseen behind the mesh on both sides of the button are microphones in an ambient noise-squelching array arrangement for the device’s also-first-time integrated Google Assistant (now Gemini, I guess) voice interface.

The left-side switch controls the mics’ muted-or-not status. Unmuted in its current state, it exposes a red background when slid to the right. You’ll see later what else turns red:

Around the rear are (left to right) the reset switch, a (first-time once again) optional wired Ethernet connector, the HDMI output, a USB-A 3.0 connector (useful for, among other things, tethering to local mass storage for media playback purposes), and the “barrel” power input:

Speaking of which, now’s as good a time as any to show you the “wall wart” power supply:

Back to our patient. The right side is comparatively bland:

And last, but not least, here’s the bottom:

with a closeup of the label, revealing (among other things) the 2AYYS-ORPK4VTG FCC ID.

If you were thinking that the rubber “foot” (specifically, screw heads underneath it) was a likely pathway inside…well, you’d be right:

And here we go (in what follows, I admittedly followed in the footsteps of this video)…

Hopefully, you’ll read this next bit before you go ahead and rip the top half off. Don’t. Two wiring harnesses require detachment first, one more fragile (and difficult to disconnect) than the other:

I’ll ruin the surprise at this point (sorry). The red-and-black wire combo in the lower left quadrant goes to the speaker. The flex PCB one in the upper right ends up at the dual-microphone array. Stay tuned for more revealing pictures to come.

The former was straightforward to detach:

The latter, a bit trickier:

requiring that I first lift up retaining clips on both sides of the connector soldered to the PCB.

Let’s focus on the top half of the chassis first:

The large metal piece is, likely already unsurprising to you, given the piece of grey thermal transfer tape attached to the middle of it, a big ol’ heatsink for the PCB-housed circuitry normally located directly below it (along with adding heft to the overall assemblage’s weight):

With the heatsink out of the way, the speaker underneath it (and at the very top of the device when fully assembled) is obvious:

Below the speaker are four side-by-side square light guides that route PCB-located LEDs’ illuminations to the outer topside of the device; you’ll see them in action shortly.

And below them is a mini-PCB containing the MEMS microphones:

The mini-PCB is held in place by two brackets, themselves held in place by two screws:

With them removed, there’s still a minor matter of some adhesive to deal with:

Voila:

After retracing my steps to put the mic mini-PCB back in place, I tackled the output transducer next. First, I removed the transparent housing around its backside, which both transforms this portion of the design into a closed-box (i.e., “sealed”) speaker enclosure and suppresses the sound it generates from “leaking” into the microphones’ inputs:

Once again, with aspirations of returning the device to a fully functional state post-teardown, I reversed course and put everything back together again, then switched my attention to the lower half of the chassis. You can already tell, even from the overview image, where the thermal tape on the heatsink had originally attached:

Before going any further, here’s a look at both sides of the rectangular Wi-Fi 6 (802.11ax) antennae on both sides of the device, lower left (inside view first, then outside):

and upper right (ditto).

The Wi-Fi subsystem is dual-band (2.4 GHz and 5 GHz), so I’m guessing there’s one antenna dedicated to each band. The cables initiating at each antenna terminate at RP-SMA connectors on the lower right corner of the PCB. Also shown here is the Fn-Link Technology 6252B-SRB wireless communications module that manages both Wi-Fi 6 and Bluetooth, and the Bluetooth antenna itself. Also, in the lower left of the photo is one of the four PCB-resident LEDs, each surrounded by grey rubber, into which the square light guides seen earlier can be inserted:

Here’s another perspective on the Bluetooth antenna:

Above the wireless communications subsystem is a piece of grey tape which, when lifted out of place, reveals what I believe is the (presumably class D) audio amplifier for the speaker output, judging by its proximity to the speaker cable harness connector:

At lower left, again, identity-assumed per its connector proximity (this time for the microphone array flex PCB) is the corresponding (both amplification and digitization?) subsystem for the microphone inputs. To their right are the other three LEDs:

In the upper left is, I believe, the device’s power generation, regulation, and management subsystem (proximity-assessed once again; note the input barrel connector above it):

Underneath the piece of foam bridging between the USB-A 3.0 and HDMI connectors is what I originally thought might be something substantive, semiconductor-wise:

Alas, it ended up being just a few more passives:

And of course there’s the sizeable Faraday cage dominating the PCB landscape. But, putting whatever’s underneath it (although I already have ideas) aside for a moment, let’s first get the lay of the land overview of the PCB underside:

Whaddya know…there’s another thermal tape-augmented heatsink here:

And another foam square-augmented Faraday cage:

Prior to popping it off, I first need to fully free the PCB…which necessitated disconnecting those previously glimpsed Wi-Fi antennae connectors:

That’s better:

Note once again the antennae on either side of the underside chassis’ insides, and the heatsink in the middle. Above the left-side antenna is the microphone mute switch:

which, when assembled, mates with the PCB-mounted switch assembly at far right on this shot:

About that Faraday cage…as previously mentioned (and as always), I’m striving to return this device to full functionality post-teardown, so I need to be careful when popping the top off:

Success! Not much to see here, but a bunch of passives, likely associated with ICs on the other side of the PCB. The thermal tape similarly likely assists in removing heat generated by those other-side ICs. Even though heat generally goes up, some of it will also radiate through the PCB, ultimately destined for dissipation by the previously seen heatsink on the bottom of the device:

Speaking of which, let’s return to the larger Faraday cage on the PCB topside.

Careful…careful…

I’m two for two. And as expected, the “meat” of the semiconductor content is here:

In the upper left is the 3 GByte DRAM, likely multi-die stacked in construction (as I’ve discussed in detail recently), and marked thusly:

Rayson
RS768M32LX4
D4BNR63BT
2402CNPFV

The results of a web search on “RS768M32LX4” suggest that it’s LPDDR4 in technology and 3733 Mbps in peak data transfer rate.

To its right is the Amlogic S905X4 application processor ,whose presence I already tipped off to you in late April. And below them both is the 32 GByte e.MMC flash memory storage module:

FORESEE (from Longsys, strictly speaking)
FEMDNN032G-A3A55
H23092453972340
001

Here are some side views of the PCB, after putting the Faraday cage covers back in place:

And after carefully reconnecting the Wi-Fi antennas:

and the microphone and speaker cable harnesses:

squeezing the two halves of the enclosure back together and reinstalling the screws and rubber “foot”, I connected the wall wart, plugged it in, and crossed my fingers:

Huzzah! The four red lights you see in this photo indicate that the mic array is currently muted:

And lest you doubt, the HDMI output is fully functional, too:

About that on-screen remote-control notation…I earlier mentioned that the gently used device I tore down today delivered ancillary benefits for me. Had I not been an honest fellow, the benefits might have been even more bountiful. When it initially arrived, I powered it up and noticed that it still had the previous owner’s Google account info configured in it, including access to purchased content (and potentially, the ability to both buy and rent even more of it if I so desired). I immediately factory-reset it and then messaged the seller with a heads-up to be more thorough about wiping devices before shipping them to their new homes in the future!

The remote control 

But about that remote control…as alluded to earlier, this is actually the second onn. 4K Pro in my possession. I bought the first one from Walmart last August, right after they were released:

which you can chronologically tell, among other reasons, because Walmart has subsequently transitioned the packaging’s color scheme and broader contents:

The other means of indicating when I’d bought it is that, although Walmart advertises it as including a remote control that not only supports the aforementioned “Find Remote” functionality and embeds a Google Assistant-supportive microphone in addition to the mics in the device itself, but also offers backlit keys and a “Free TV” button:

at least some (including mine) initial onn. 4K Pro shipments came for unknown reasons bundled with a prior-revision remote control absent those latter two features. Here’s the one that was in the box alongside my original device:

And, to my ancillary-benefits comments, here’s the full-featured newer-version one that came with the device I more recently acquired off eBay:

Here are both remotes alongside my original device and other in-box goodies that came with it:

mimicking another one of Walmart’s “stock” images.

Here’s a PDF copy of the Quick Start guide that’s also in the box. And speaking of which, here are the results of my packing everything back into the box, simulating (in reverse, albeit also including both remotes; I now have a spare in case “Find Remote” ever fails!) what the insides looked like when I unpacked the original device late last summer:

With that, having passed through 2,000 words a few paragraphs ago, I’ll wrap up and await your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Perusing Walmart’s onn. 4K Pro Streaming Device with Google TV: Storage aplenty appeared first on EDN.

Two channel I2C level-shifting interface with a lot of safety components (our products got a lotta ATEX conditions to meet) for the firmware engineers to wield. Not pretty, but it needed doing QUICK. submitted by /u/Rodifex [link] [comments]

Rushed it so all but the hologram part of my features don't work. Doesn't matter since THE HOLOGRAM PART WORKS. Based largely on the andotrope invented by mike ando which is based largerly on the zoetrope. However I made a couple of my own modifications to achieve a see through display. I did open source it: https://github.com/very-high-priest/Andotrope submitted by /u/vvdb_industries [link] [comments]

Under the new Electronics Component Manufacturing Scheme (ECMS) recently commenced in India, it is alleged that investment proposals worth ₹16,000 crore have come in so far. The scheme was implemented on the first of May, 2025, with the view to foster manufacture of essential electronic components within the country and thus curtail the import.

Undoubtedly, the scheme has attracted a great deal of attention from industry players, including large companies such as Tata Electronics, Dixon Technologies, and Foxconn, who are now eager to tap into the growing electronics eco-system in India and entice government incentives for building a self-sustainable supply chain.

ECMSs are part of the bigger strategy that the Indian government has implemented to invigorate electronics manufacturing in India, which is anticipated to reach USD 500 billion by the year of 2030. However, the major identified challenge is developing the demand for components projected to reach USD 248 billion. Currently, most are imported, especially from China, which exposes the Indian electronics sector to uncertainties in the global supply chain.

The scheme operates with a budget of ₹22,805 crore, covering four major categories:

Category A: Sub-assemblies such as camera and display modules.

Category B: Bare components and enclosures for mobile/IT hardware.

Category C: Flexible PCBs and SMD passive components.

Category D: Capital goods and parts required to make A–C category components.

An amount of ₹21,093 crore is allotted under Category A, partly owing to the government’s inclination toward assemblies that are of high value and high demand. The remaining ₹1712 crore is for the other categories. While applications were invited for Categories A, B, and C for three months starting May, Category D will be open for two years, giving a long-term incentive for infrastructure investment.

Strategic partnerships are at work here as well. Of importance is the fact that Dixon Technologies has concluded an agreement with Chinese firms Chongqing Yuhai and Kunshan Q Technology for the manufacture of certain key components in India, all signaling the shift in localization of supply chains.

Shortlisting of proposals is in process and the final approvals are likely by September 2025. The scheme is designed to be in tandem with other ongoing schemes like SPECS and Semicon India Programme, thereby all working towards a-robust semiconductor and electronics manufacturing base within India.

Conclusion:

The ₹16,000 crore investment interest under ECMS reflects growing confidence in India’s aspirations to manufacture electronics. When implemented, the plan could reduce dependency on imports and make India a major global supplier of electronic components, fostering innovation, increasing economic stability, and creating thousands of highly skilled jobs over the coming years.

The post Govt secures ₹16,000 cr investment proposals under electronics component drive appeared first on ELE Times.

When it comes to surveillance technology, the USA boasts a variety of CCTV brands providing state of the art security solutions. Ranging from high-resolution IP cameras to AI-based analytics, these brands serve businesses, homes, and public places, providing safety and efficiency. Top manufacturers concentrate on innovation, reliability, and easy to use designs to fulfill the increasing need for smart security. Here is the list of the top 10 CCTV camera brand in USA.

1. Bosch

A German-based division of Bosch Group, Bosch Security provides quality surveillance solutions, AI cameras, and smart access control system. Bosch is a topnotch supplier of high-quality CCTV systems, Bosch combines video analysis, infrared technologies, and night time vision to build surveillance capabilities.

Features:

Flexidome Panramic Cameras: Delivers 360 or 180degree, blind spot free coverage to enable maximum situational awareness.

Dinion Bullet Cameras: Ideal for both indoor and outdoor use with zoom lenses and infrared lighting.

Bosch further develops video security through the addition of artificial intelligence analytics, improved night time vision, infrared sensors, Real-time video processing, data privacy security aspects for securing and adhering to data laws and regulations.

2. HIK VISION

Hikvision is a world leader in AIoT security solutions, providing innovative surveillance technology for industrial, commercial and public security applications.

Features:

DeepinView AI Cameras: Fitted with sophisticated AI algorithms, the cameras feature face recognition, behavioural analysis and perimeter protection in high- security locations.

Thermal Imaging Cameras: Allow high-sensitivity thermal detection, enhancing visibility in poor lighting conditions.

Hikvision’s dedication to AI based security solutions make it the preferred choice among businesses and governments globally.

3. Honeywell

Honeywell offers enterprise-grade security products, such as IP cameras and AI-powered surveillance. A subsidiary of Honeywell International, located in Charlotte, North Carolina, USA. It offers AI-powered video analytics, infrared, and advanced imaging to extend security functionality.

Features:

PTZ Cameras: Enable remote zoom control and direction, for effective surveillance of vast areas.

Multi-Sensor Cameras: With their separate imagers, multi-sensors cameras offer panoramic images from multiple perspectives.

Honeywell is the world’s top supplier of AI security solutions for usage by businesses and the government.

4. Panasonic

Panasonic is a world leader in state-of-the art security systems, supplying AI-based surveillance technology for industrial, commercial, and public security usage. Panasonic fuses AI-enabled video analytics, infrared technology, and high-resolution imaging to heighten security abilities.

Features:

High Zoom Bullet Cameras: Boasting 10x and 30x zoom capabilities, in 2MP, 5MP, and 4K resolutions, with long-range IR LED features for best-in -class low light performance.

Multi-sensor Cameras: With multiple independent cameras, wide- angle images are captured from multiple perspectives.

Panasonic continues to lead the evolution of security technology with Edge computing, Cloud-based video management for remote access and monitoring.

5. Lorex

Lorex is a market leader in delivering advanced security systems, providing AI- based surveillance technology, combines AI-enabled video analytics, infrared technology, and high-resolution imaging to boost security features.

Features:

4k Ultra HD Security Cameras: Offer crystal-clear resolution for guaranteed detailed video footage for greater security.

Multi-Sensor Cameras: Have several independent imagers, taking wide views from various angles.

6. Dahua Technology

Dahua Technology is a global leader in video-centric AIoT solutions, providing innovative technology for industrial, commercial, and public security use. Dahua combines AI-enabled video analytics, infrared technology, and high-definition imaging to upgrade security capabilities.

Features:

WizSense Series: Budget-performance balance-oriented cameras featuring AI-enabled motin detection and smart alerts.

Multi-Sensor Cameras: Offer independent multiple imagers, viewing wide angles from a variety of perspectives.

7. Hanwa Techwin

Hanwha Techwin, now Hanwha Vision, is a world leader in cutting-edge security systems providing AI-based surveillance technology and high-resolution imaging to augment security capability.

Features:

Wisenet AI Cameras: Fitted with sophisticated AI algorithms, the cameras provide facial recognition, behavior analysis, and perimeter defense for high-security levels.

Q Series AI Cameras: Engineered with cost-performance balance, the cameras come with AI-based, the cameras come with AI-based motion detection and smart alerting.

8. FLIR System

Founded in Wilsonville, Oregon, USA, FLIR is well-known for thermal imaging, infrared cameras, and night vision applications across security, the military and industry. FLIR Systems, now a part of Teledyne Technologies, is a world leader in thermal imaging, night vision, and infrared camera systems.

Features:

FLIR Quarsor: Provide 5MP HD and 4kUHD resolution to ensure excellent surveillance.

FLIR A500f/A700f Smart Sensor Cameras: Suitable for condition monitoring and early fire detection.

FLIR Systems continues to advance the art of imaging technology with AI-driven analytics for motion, risk assessment, and automated notification.

9. Vivotek

Vivotek is a pioneer in delivering state of the art security systems with AI-powered surveillance technology used for industrial, commercial and public security use. Vivotek CCTV systems combines AI-driven video analytics, infrared technology and high-definition imaging to further improve security functions.

Features:

IB9383-HV AI Bullet Camera: Includes 5MP resolution, Smart Motion Detection, and Trend Micro IoT Security for added cyber protection.

MA9311-EHTV Panoromic AI Camera: Includes two-way panoramic coverage Smart VCA powered by AI and integrated IR illuminators for optimal low-light performance.

Vivotek keeps challenging the frontiers of security technology with AI driven analytics, data security and privacy compliance.

10. Avigilon

Based in Vancouver, Canada, Avigilon is a high-definition video surveillance, AI driven analytics, and enterprise security solutions company. Avigilon, a subsidiary of Motorola Solutions, boasts a solid reputation for innovation through the integration of AI-enabled video analytics, infrared technology, and high-resolution imaging to advance security capabilities.

Features:

Aviailon AI-Powered IP Cameras: With sophisticated AI algorithms, these cameras enable facial recognition, behavior analysis, and perimeter protection for high-security areas.

Specialty Security Cameras: For specialized applications, such as thermal imaging and high-impact environments.

 

Technology & Model Comparison:

Brand	Key Technologies	Example Model
Bosch	Intelligent Video Analytics, Starlight Imaging, Edge Recording, NDAA-compliant	FLEXIDOME IP panoramic 7000
Hikvision	AcuSense AI Detection, ColorVu Night Vision, Deep Learning NVRs	DS-2CD2387G2-LU ColorVu
Honeywell	Smart Motion Detection, NDAA Compliance, Secure Encryption	H4W4PER2, Honeywell 4MP IR Dome
Panasonic	i-PRO AI Analytics, H.265 Compression, Edge Recording, Face Recognition	WV-S2536L Dome AI Camera
Lorex	4K UHD, Smart Deterrence, Color Night Vision, Cloud & Local Storage	Lorex 4K Smart Deterrence IP Cam
Dahua	WizSense AI, Smart H.265+, Starlight Night Vision, Perimeter Protection	IPC-HDW3849HP-AS-PV
Hanwha	Wisenet AI, Audio Analytics, Cybersecurity Compliance	Wisenet XNO-C7083R AI Bullet
FLIR	Thermal Imaging, Radar, Long-Range Detection, Multi-Sensor Fusion	FLIR Quasar 4K UHD Dome
Vivotek	Smart Stream III, Deep Learning, Trend Micro IoT Security	IB9383-HV AI Bullet
Avigilon	H5A AI Cameras, Appearance Search, Adaptive IR, 30MP Resolution	Avigilon H5A 8MP Dome Camera

 

Conclusion:

The United States CCTV camera industry is witnessing constant growth due to rising security threats and evolving surveillance technology.

Use of AI analytics, IoT connectivity, and cloud- based monitoring is adding strength to surveillance solutions. Demand for intelligent surveillance solutions is increasing steadily, top brands are pushing boundaries to offer smart, responsive, and future-proof security systems across home, commercial, and government sectors.

The post Top 10 CCTV Camera Brands in USA appeared first on ELE Times.

https://x.com/theapache64/status/1949763814351843547 submitted by /u/theapache64 [link] [comments]

If you have on old and/or faulty dehumidifier, rip the fan out of it. They are quite small and have quite a powerful airflow. Just add a filter to it and you have a perfect little fune extractor. It’s a bit loud though. submitted by /u/A55H0L3_WindowsXP [link] [comments]

The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics, and the need for faster processing across all industries fuel this surge.

Application-specific integrated circuits (ASICs), typically implemented as system-on-chip (SoC) devices, are central to today’s AI and HPC solutions. However, traditional implementation technologies can no longer meet the escalating requirements for computation and data movement in next-generation systems.

From chips to chiplets

Traditionally, SoCs have been implemented as a single, large monolithic silicon die presented in an individual package. However, multiple issues manifest as designers push existing technologies to their limits. As a result, system houses are increasingly adopting chiplet-based solutions. This approach implements the design as a collection of smaller silicon dies, known as chiplets, which are connected and integrated into a single package to form a multi-die system.

For example, Nvidia’s GPU Technology Conference (GTC) has grown into one of the world’s most influential events for AI and accelerated computing. Held annually, GTC brings together a global audience to explore breakthroughs in AI, robotics, data science, healthcare, autonomous vehicles, and the metaverse.

During his GTC 2025 keynote, Nvidia president, co-founder, and CEO Jensen Huang emphasized the need for advanced chiplet designs, stating: “The amount of computation we need as a result of agentic AI, as a result of reasoning, is easily 100 times more than we thought we needed this time last year.”

Despite a wide range of analyst expectations, explosive growth is undisputed; chiplets are becoming the default way to build large AI/HPC dies (Figure 1).

Figure 1 Chiplet market forecast illustrates its explosive growth. Source: Nomura and MarketUS

Figure 1 above represents the center of gravity of several published forecasts. Tools, technologies, and ecosystems are coming together with a 2026-27 inflection point to facilitate designers’ goal of being able to purchase complex chiplet IP on the open market.

These chiplets will adhere to standard die-to-die (D2D) interfaces, allowing them to operate plug-and-play or mix-and-match. This is expected to generate explosive growth in the chiplet market, reaching at least USD 100 billion by 2035, with some forecasts more than doubling this forecast.

Why chiplets?

One increasingly popular approach is to take an existing monolithic die design and disaggregate it into multiple chiplets. A simplistic representation of this is depicted in Figure 2.

Figure 2 Monolithic die (left) is shown vs. multi-die system (right). Source: Arteris

In monolithic implementations, reticle limits impact scalability, and yields fall as the die size increases. It’s also harder to reuse or modify IP blocks quickly, and implementing all the IPs at the same process technology node can be inefficient.

Chiplet-based multi-die systems offer multiple advantages. When the design is disaggregated into various smaller chiplets, yields improve, and it’s easier to scale designs, currently up to 12x of today’s reticle limit. Also, each IP can be implemented at the most appropriate technology node. For example, high-speed logic chiplets may use the 3-nm node, SRAM memory chiplets the 7-nm node, and high-voltage input/output (I/O) interfaces the 28-nm node.

Observe the red bands shown in Figure 2. These represent a network-on-chip (NoC) interface IP. In a multi-die system, each chiplet can have its own NoC. The chiplet-to-chiplet interfaces, known as die-to-die connections, are typically implemented using bridges based on standard interconnect protocols and physical layers such as BoW, PCIe, XSR, and UCIe.

Aggregation, disaggregation, and re-aggregation

As chiplet-based designs gain traction, it’s essential to understand how today’s SoCs are typically assembled. Currently, the predominant method is to gather a collection of soft IPs, represented at the register transfer level (RTL) of abstraction, and aggregate them into a single, monolithic design. Most of these IPs are sourced from trusted third-party vendors, with the SoC design team creating one or two IPs that will differentiate the device from competitive offerings.

To successfully integrate these IPs into a cohesive design, two other aspects are essential beyond the internal logic that accounts for most of an IP block’s transistors. The first is connectivity information, including port definitions, data widths, operating frequencies, and supported interface protocols. The second is the configuration and status registers (CSRs) set, which must be placed appropriately within the overall SoC memory map to ensure correct system behavior.

Because of this complexity, performing this aggregation by hand is no longer possible. IP-XACT is an IEEE standard (IEEE 1685) that defines an XML-based format for describing and packaging IPs. To facilitate automated aggregation, each IP has an associated IP-XACT model.

As SoC complexity continues to rise, it is becoming increasingly common to take an existing monolithic die design and disaggregate it into multiple chiplets. To support this chiplet-based design, the tools must be able to disaggregate an SoC design into multiple chiplets, each of which may contain many original soft IPs. In addition to partitioning the logic, the tools must generate IP-XACT representations for each chiplet, including connectivity and registers.

Technology Is here now

AI and HPC workloads are advancing quickly, driving a fundamental shift toward chiplet-based architectures. These designs provide a practical solution to meet the increasing demands for scalability and efficient data movement. They require new methodologies and supporting technology to manage multi-die systems’ design, assembly, and integration.

Take, for instance, Arteris’ multi-die solution, which automates key aspects of multi-die design. Magillem Connectivity and Magillem Registers support the assembly and configuration of systems built from IP blocks or chiplets. These tools manage both disaggregation of monolithic designs and re-aggregation into multi-die systems across the design flow.

On the interconnect side, Arteris supplies both coherent and non-coherent NoC IP. Ncore enables cache-coherent communication across chiplets, presenting a unified memory system to software. FlexNoC and FlexGen provide non-coherent options that are compatible with monolithic and multi-die implementations.

Andy Nightingale, VP of product management and marketing at Arteris, has over 37 years of experience in the high-tech industry, including 23 years in various engineering and product management positions at Arm

 

Register for the virtual event The Future of Chiplets 2025 held on 30-31 July.

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The post Chiplet design basics for engineers appeared first on EDN.

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...

India seems to be adjusting its stance toward Chinese investment within the electronics manufacturing space. Government actions indicate a willingness to adopt a flexible and pragmatic posture, weighing both geopolitical and economic concerns.

Change in Engagement Strategy:

China continues to dominate the electronics supply chain globally, engaging in nearly 60% of worldwide electronics manufacturing activities. Under this recognition of interdependence on each other, India seems to be reconsidering its previous hardline approach to allow for strategic collaboration in industries of key importance.

Recent events, namely the restoration of tourist visas for the two countries and diplomatic engagement, have pointed toward a potential gradual thawing of bilateral relations. And this softening of relations on the diplomatic front seems to be reflected now on the industrial policy side, especially for electronics, where global collaboration matters.

The Dixon-Longcheer Deal:

The government turned its gaze onto this matter after it approved the joint venture between Dixon Technologies, a major domestic manufacturer, and Longcheer Intelligence, a Chinese ODM. The agreement states that Longcheer will own 26 percent of the business and Dixon will maintain controlling control. This framework reflects India’s intention to engage with Chinese companies through closely monitored minority-stake agreements.

Following this approval, it is understood that several other Indian electronics companies have developed a keen interest in forming similar joint ventures with Chinese technology partners.

Focus on Value Addition and Technology Transfer

According to the Indian government, Chinese investments will be allowed only if there is significant technology transfer involved and not mere low-level assembly operations. The Ministry of Electronics and IT (MeitY) stated that such collaborations should factor in the improvement of domestic capabilities and local value addition.

Proposal of Policy Reforms

In an attempt to ease out the process and bring down red tape, the NITI Aayog, India’s think tank, has recommended allowing up to 24% foreign direct investment (FDI) by Chinese firms in Indian electronics companies without requiring stringent multi-agency approvals. As these recommendations are being examined, MeitY officials have stated their support for them, citing their importance in attracting high-tech investments without endangering national security.

India is enjoying a window of opportunity with global dynamics undergoing shifts. With U.S. trade policy being uncertain and a reorientation on global supply chains, India seeks to be an important destination for electronics manufacturing. Strategic engagement with select Chinese firms would hasten the process of technology absorption at the component stage and create employment.

Indian leadership, meanwhile, continues to stress that such flexibility will be limited in scope, transparent, and oriented around the national interest. Any lifting of restrictions will be closely scrutinized with country-level mechanisms put in place to ensure that the long-term technological sovereignty and security of the country will not be jeopardized.

Conclusion:

Changing economic realities and investment in China in electronics by India show it as having an evolving approach toward becoming a true manufacturing center. This new stage of pragmatic economic engagement is characterized by an investment model that is more technology-focused and selective.

The post India Eases Curbs on Chinese Investment in Electronics with Strategic Conditions appeared first on ELE Times.

Deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany says that the UK’s University of Cambridge has purchased a Close Coupled Showerhead system for 2D materials for its photonics and optoelectronics R&D...