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ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.

ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.

For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.

Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.

Moonsoo Kim,
Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.

“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”

Sumihiro Takashima,
Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.

“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”

The post ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits appeared first on ELE Times.

The increasing connectivity of road vehicles leads to a growing need for cybersecurity. The United Nations Economic Commission for Europe (UNECE) has therefore adopted the R155 and R156 regulations, which define the cybersecurity requirements for OEMs. OEMs who want to sell new vehicles in UNECE-regulated markets must hold a valid type approval certificate and implement cybersecurity practices throughout the supply chain to minimize the risk of attack throughout the vehicle’s lifecycle. The TRAVEO T2G Automotive Microcontroller family for Body and Cluster from Infineon Technologies AG features a Hardware Security Module (HSM) that is capable of executing secured boot and ensuring secured isolation of HSM applications and data. To further enhance this, Infineon plans to retrospectively implement product compliance for the TRAVEO T2G automotive microcontroller family with the latest automotive cybersecurity standard ISO/SAE 21434. All necessary documentation, including the Cybersecurity Manual and Cybersecurity Case Report, will be provided to customers.

“With ISO/SAE 21434 compliant TRAVEO T2G automotive microcontrollers, OEMs’ effort to comply with UNECE R155 and R156 regulations will be significantly reduced. This enables faster time to the regulated markets”, said Ralf Koedel, Vice President Automotive Microcontroller at Infineon. “For existing customers, compliance becomes simpler, faster and more cost-effective while allowing the reuse of existing software and hardware. New customers can also benefit from the ISO/SAE 21434 compliance.”

The TRAVEO T2G microcontrollers are based on the Arm Cortex-M4(Single core)/M7(Single core/Dual core/ Quad core) core and deliver high performance, enhanced human-machine interfaces, high-security and advanced networking protocols tailored for a wide range of automotive applications. They offer state-of-the-art real-time performance, safety and security features. This is reflected, among other things, in the introduction of HSM (Hardware Security Module), dedicated Cortex-M0+ for secured processing, and embedded flash in dual bank mode for FOTA requirements.

With the planned new product compliance, developers can continue to use the TRAVEO T2G MCUs to develop their ISO/SAE 21434 compliant ECUs. As a result, they will benefit from lower product development costs and faster time-to-market for both existing and new platforms.

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