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Occam’s Razor and a USB-C to HDMI adapter

The simplest explanation is likely the best, even if its validity isn’t always intuitively obvious in advance.
Speaking of USB-C, and the cables (including splitters) that connect to it to other things…
My long-in-the-tooth Intel-based 2018 Apple Mac mini is still sitting on my desk, humming to my right, even though its M2 Pro Apple Silicon-based successor has been sitting downstairs in storage awaiting its turn in the spotlight for going on three years now. The legacy hardware is no longer a candidate for new Apple operating system releases, but it’s still receiving bug fixes and security patches, until sometime in the second half of next year, if past-history trends remain valid. And as the saying goes, “if it works, don’t touch it” (I’d also be tempted to haul out the “a penny saved is a penny earned” quote, but since I’ve already bought its replacement…).


In conjunction with my transition to it from its 2014-era Mac mini predecessor roughly 2.5 years ago, I upgraded the two-display suite above it to a set of Dell P2415Q 4K LCDs.

The Mac mini leverages the displays’ HDMI inputs; a “Project Volterra” Windows-on-Arm dev kit 2023 stacked above it connects to those same LCDs over their DisplayPort connections, and front panel buttons toggle the displays between the two systems when running concurrently.

Look back at that 2018 Mac mini rear panel “stock” photo a couple of paragraphs ago, however, and you’ll only see one HDMI output, into which I’ve plugged a “straight” HDMI cable running directly to one of the LCDs. How, then, did I connect the system to the other display’s HDMI input? That’s where today’s teardown victim enters the picture.
It’s an Anker A8730 6’ USB-C to HDMI adapter cable; I’d bought and pressed it into immediate service way back in mid-2021. I sourced from Anker’s outlet store on eBay, where it cost $25.90 as a refurb. So, you can say I’ve gotten my money’s worth out of it! Speaking of fiscal topics, there’s a 0.75′′ (19.1 mm) diameter U.S. penny alongside in the second (and non-stock) image that follows, along with subsequent others, for size comparison purposes.


How it works is (at least to me) an interesting story in and of itself. It fundamentally leverages a DisplayPort technology called “Alt Mode”, which repurposes USB 3.x’s “SuperSpeed” data and Configuration Channel (CC) lines to transport dedicated audio and video streams sourced from the graphics and sound subsystems. The CC leverage explains why, among other implementation reasons, it’s only applicable to USB-C, not also to prior-generation USB physical connector standards.
Macs don’t additionally support DisplayPort’s Multi-stream Transport (MST) mode, either in the operating system (generally) or in hardware (for newer Apple Silicon-based systems). If MST support had existed, it would have conceivable enabled me to extended-mode tether both displays to a single USB-C (or Thunderbolt 3, aka TB3, in this case) system connector, in combination with a separate inter-display connection. But again, per the system back panel photo, I had plenty of spare connector candidates available, not even counting those on the separate expansion hubs (the latter added subsequent to the snap of the earlier “stack” picture).



But what’s with all this DisplayPort talk? I thought we were discussing connecting the computer to a display’s HDMI input! We are, and that’s where the bulge surrounding the adapter cable’s HDMI connector end comes in. Conceptually, and I hope to definitively confirm today, inside is likely a DisplayPort to HDMI protocol-converting bidirectional transceiver; a particularly robust one, it seems, since the Anker A8730 touts 4K 60 Hz specs. HDMI once also had an “Alt” mode for USB-C, at least on specification paper, although actual products never made it to market.
Erratic function = dissection rationalizationSince the adapter cable had been operational in my abode since mid-2021 (and, considering it was a refurb, maybe even earlier than that with its original owner), why’d I decide to take it apart? Curiosity was as always one motivation, although I generally hold that particular urge at bay for as long as the gear remains operational. But this one had eventually failed, in another story-in-and-of-itself, through whose telling I aspire to also rationalize the “Occam’s Razor” title reference.
As previously mentioned, the 2018 Mac mini is still receiving periodic patches for its last-supported MacOS 15 “Sequoia” operating system release. A few updates ago, the left-side display of the pair (the one leveraging the Anker adapter) was no longer recognized by the system after the upgrade and subsequent reboot. Online research revealed that mine wasn’t a unique post-update quirk, and swapping the adapter cable to a different TB3 system connector got the display going again.
So, I figured that an obscure “Alt Mode” bug (specifically, since the first TB3 port still worked fine for generic data) introduced along with the upgrade had made it through Apple’s pre-release QA checks. This purported scenario was unsurprising albeit still disappointing, given that Intel-based Macs in general, and this system in particular, were on their “last legs” and likely no longer receiving their fair share of QA attention. Why my surmised bug only affected one TB3 port but not another wasn’t clear, but…
The next time I did an update, however, the exact same thing happened, this time to the second TB3 connector. Swapping the cable adapter back to the first TB3 connector didn’t resurrect the display. And I no longer had any other spare TB3 ports on the system available to try. At this point, I began to fear I had a fundamental system hardware degradation issue on my hands.
But after unplugging the cable adapter from the Mac mini and trying it with the “Project Volterra” system instead, where it also didn’t work, I was reassured by the now-nonfunctional repetition across multiple systems (and O/Ss) that a dead cable adapter was the likely culprit. An “Amazon Basics” cable adapter replacement fired up fine, sealing the Anker A8730’s fate.
What was behind the cable adapter’s initial failure, temporary resurrection, and eventual permanent demise? I hoped the pending teardown might provide visual Achilles’ Heel evidence (hold that thought). But I suspect it has something to do with MacOS’s use of display-supplied Extended Display Identification Data (EDID) information for software interface purposes versus Windows’ leverage of (when available) display-specific drivers.
My guess is that EDID (re-) enumeration in MacOS happens both when a display is first-time plugged into a new system connector and after each sufficiently impactful operating system update. In this particular case, the aforementioned DisplayPort
HDMI bidirectional protocol translator in-between the system and display initially began operating erratically and eventually failed completely. But that’s just my conjecture; reader theories in the comments are as-always also welcomed!
Speaking of tearing down, let’s dispense with further abstract chit-chat and get to dissecting, shall we? Here are a few more real-life device photos as prep. Packaging is long gone at this point, along with any potential originally accompanying literature. The USB-C end, to start.

With a product-code sticker behind it.

Intermediary cable markings next.


And now the bulge-augmented HDMI other end, starting with the seam-less cable-intro side.

The connector side conversely does have a visible seam at its circumference.

But attempts to surmount it with hair dryers and heat guns, along with spungers and such, were for naught. So, I escalated my attack by breaking out the hacksaw with hopeful deft technique.


That’s what I’m talking about!
For anyone following in my footsteps who prefers a less Neanderthal-reminiscent dissection approach, here’s the HDMI connector-surrounding piece I was unsuccessfully trying to extract earlier. Note specifically the locations of the retention tabs.

Finally, what you’re all most interested in, the PCB. As I’ve mentioned before, “top”, “bottom” and other orientation terms are particularly nebulous where HDMI is concerned. So instead, here’s the side corresponding to the wider HDMI connector edge.
Now zooming in for a closer look.
I was admittedly surprised to encounter a preponderance of passives, given that the most common adapter-usage orientation would have put this side on top, with the remaining (and proportionally higher heat-generating) stuff you’ll see next on the other side and below it. Given that heat rises (don’cha know), and that there’s no passive ventilation venting available, that’s a seeming premature failure-inducing decision. But not in my case, since the HDMI connector points downward with this display, not horizontally straight out the back as with many others.

Components of particular note include a five-lead SOT23-packaged step-down (buck) DC-DC converter at lower left, marked as follows.
JWA5J
91D5T
There’s also a “2R2” (2.2 µH) inductor to its immediate left, and a 27 MHz oscillator to its right. And what does that clock chip likely drive? Let’s flip the PCB over to the other side.
Now that’s more like it (unless you’re into passives, that is). Again, we zoom in for a closer look.
At lower left is Via Labs’ VL100, a (surprise, surprise…not…) DisplayPort USB-C Alt-mode controller. To its right is (surprise, surprise…truly, this time, at least a bit…) another oscillator, 24 MHz this time. Continuing to the right is, I’m guessing (readers?), a serial interface nonvolatile memory for code and data storage purposes, marked as follows.
125S40
BG17K8
P19030
In the lower right corner is another JWA5J DC/DC converter. Above it is (once again, no surprise) Paradise Technologies’ PS176 DisplayPort to HDMI video interface converter. And again for the passives fans among you, there are plenty more examples to see on this side of the PCB, too!
That’s a “wrap” for today, folks. Share your thoughts with me and your fellow readers in the comments, please!
—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.
Related Content
- USB-C’s lingering incompatibilities and other complexities, part 1: Direct-connect complications
- USB-C’s lingering incompatibilities and complexities, part 2: Splitter issues
- The 2025 WWDC: From Intel, Apple’s Nearly Free, and the New Interfaces Are…More Shiny?
- Connecting systems to displays with DVI, HDMI, DisplayPort: What we got here is failure to communicate
- USB: Deciphering the signaling, connector, and power delivery differences
The post Occam’s Razor and a USB-C to HDMI adapter appeared first on EDN.
Synopsys, COEP Tech University and CADFEM Establish Digital Twin and Multiphysics Lab in Pune
Synopsys, COEP Technological University and CADFEM India have setup the “Ansys Digital Twin & Multiphysics Lab” on the COEP campus, Pune to support advanced engineering education, research, and strengthen the industry-academia partnerships. This program holds huge significance in an ecosystem for automotive and electrical vehicle industry which utilizes the technologies for vehicle system’s product development and validation processes.
The laboratory was established as a part of Memorandum of Understanding (MoU) signed during the 2026 Symposium. It will provide students, researchers, and faculty members access to Ansys digital-twin technologies and advanced high-end multiphysics simulation tool that have been acquired by Synopsis. The lab will host industry training and certification, technical seminars and research.
Multiphysics simulation has a potential role in analysis of different physics domains in development process of the vehicle or component within EV industry. Engineers are able to investigate on battery thermals, electric motor efficiencies, power electronics functionality, structural strength, electromagnetic phenomenon and thermal management by simulation work-flows prior build physical prototype. Digital-twin methodology can create bridge between physics-based models and actual data taken from sensors and operation data so to monitor and predict system behaviours.
The post Synopsys, COEP Tech University and CADFEM Establish Digital Twin and Multiphysics Lab in Pune appeared first on ELE Times.
«Драйвова осінь» 2026
⛺️ У сквері "Сосновий" КПІ ім. Ігоря Сікорського відбувся традиційний фестиваль «Драйвова осінь» від туристичного клубу КПІ «Глобус».
India’s EV Component Industry Faces Technology Capability Gap as Imports Rise
India’s rapidly growing EV industry faces a capability gap in developing and producing high-technology components that can meet modern technology demands because about 80% of component manufacturers are small businesses built for traditional mechanical parts rather than advanced electronics and software. The capability gap involves areas such as batteries, power electronics, embedded software, advanced electronics, and system integration.
India is shifting more towards electric vehicles as its automotive supply chain expands. Original Equipment Manufacturer (OEM) sourcing of auto-components is expected to increase by 16% to 6.6 lakh crore by FY26 against components’ exports valued at around 2.1 lakh crore. However, import charges rise at a greater rate, with China covering about 36% of all the auto component imports India uses.
The capability challenge is particularly significant for small and medium-scale enterprises (MSMEs), which constitute almost 80% of Indian auto-parts producers. Though electronics, embedded software, advanced engineering, and system integration are key factors for competitiveness, a lesser than half the small and medium scale enterprises lack the capabilities required to develop and manufacture components as per the modern industry demands. Embedded software capability is estimated to be found in only 10% of domestic suppliers, whereas system integration, and product-development capabilities are around 14%.
The post India’s EV Component Industry Faces Technology Capability Gap as Imports Rise appeared first on ELE Times.
Indian Electronics Makers Turn to Aluminium as Rising Copper Costs Squeeze Margins
There is growing demand from Indian electronics manufacturers for alternatives to expensive copper such as aluminium, and a more widespread adoption of other cheaper materials due to increased cost pressure and lower profit margins as copper prices rocket. Companies are also encouraged to boost domestic procurement and re-engineer product and component designs to reduce dependence on these raw materials.
Copper is widely used across the electronics industry because of its electrical conductivity, robustness, and reliability. Due to recent surge in copper prices has increased manufacturing costs, creating challenges for companies especially those already facing a competitive market that might not be able to fully pass the rising input costs to consumers.
A recent report stated that the copper price has risen by around 45%, thereby decreasing manufacturers’ profit. Because of this, some Indian electronics manufacturers are now considering aluminium as an alternative to copper in applications whether it’s electrical, mechanical, and thermal properties are highly required to meet product specifications. Aluminium is being considered as a substitute of copper because it is lighter and cheaper.
The product design needs modification when using aluminium as a substitute to achieve performance comparable to that of copper. Using aluminium as a substitute for copper is not easy to practically implemented across all electronics applications. It is important for manufacturers to consider properties like electrical conductivity, thermal performance, resistance to corrosion, joining techniques, and product lifespan before adopting alternate materials.
The post Indian Electronics Makers Turn to Aluminium as Rising Copper Costs Squeeze Margins appeared first on ELE Times.
Pi-Ener-lite: Compact UPS with Fuel Gauge and RTC for Raspberry Pi Zero
Pi-Ener-lite is a compact UPS power supply designed by ACE design studio for the Raspberry Pi Zero. It connects to the board via 7 spring-loaded pogo pins, which handle both power delivery and data reading. The project integrates an 18650 battery, a CW2015 fuel gauge chip, and a DS1307 RTC chip, offering a complete uninterruptible power supply in a small footprint.
View of the Pi-Ener-lite hardware
Operation is simple and reliable. When external power is lost, the system automatically switches to battery power. It also supports simultaneous charging and discharging, so you can use the Raspberry Pi Zero while the battery recharges. The whole setup is protected against overcharge, over-discharge, overcurrent, and short circuits.
Battery measurement and RTCThe CW2015 fuel gauge chip measures battery voltage and remaining capacity with ±2% accuracy. The DS1307 RTC chip, powered by a CR1220 coin cell, keeps time even when the main battery is removed. This combination makes Pi-Ener-lite a truly complete UPS for applications that require operational continuity.
Fuel gauge and RTC data are read over I2C, so you can access them easily from Python. The project includes Python examples and detailed documentation. An optional open-source 3D-printable case protects the entire system. Total cost is around $35.
Why choose Pi-Ener-litePi-Ener-lite is a compact UPS specifically for the Pi Zero. Unlike other solutions, it leaves the GPIO connector free, so you can attach other modules without issues. It also adds battery measurement and an RTC, two features often missing from DIY UPS builds. The open-source 3D-printable case adds versatility.
The project is designed for those who want a reliable backup power supply without taking up space. The board connects in seconds thanks to the spring-loaded pogo pins. The CW2015 fuel gauge lets you monitor remaining charge precisely, avoiding sudden shutdowns. If you need a professional solution for your Pi Zero, this project fits the bill.
- Connection via 7 spring-loaded pogo pins, no soldering
- 18650 battery with CW2015 fuel gauge for charge monitoring
- DS1307 RTC with CR1220 battery to keep time
- Protection against overcharge, over-discharge, overcurrent, and short circuits
- Open-source 3D-printable case
To build the project, you need an 18650 battery and a CR1220 coin cell. The rest of the components are already mounted on the board. If you want to power the system from a higher voltage, you can use a 12V DC-DC step-up converter to adapt the input. Alternatively, for industrial applications, consider a DC-DC converter with 36-48V input and 24V output.
Getting started with Pi-Ener-liteThe first step is to connect the board to the Raspberry Pi Zero via the pogo pins. Then install the drivers for the CW2015 and DS1307. Finally, write a simple Python script to read voltage and time. The project board includes ready-to-use examples.
If you want a more powerful system, you can pair Pi-Ener-lite with a Raspberry Pi 5. In that case, you must adapt the power supply, because the Pi 5 requires more current. For the Pi Zero, the solution works perfectly as is. The project is designed to be simple, compact, and reliable.
In conclusion, Pi-Ener-lite is a well-designed UPS with quality components and clear documentation. The ability to print a 3D case makes it even more versatile. If you’re looking for a backup power supply for your Raspberry Pi Zero, this project deserves attention.
The post Pi-Ener-lite: Compact UPS with Fuel Gauge and RTC for Raspberry Pi Zero appeared first on Open Electronics.
Pi-Ener-lite: Compact UPS with Fuel Gauge and RTC for Raspberry Pi Zero
Pi-Ener-lite is a compact UPS power supply designed by ACE design studio for the Raspberry Pi Zero. It connects to the board via 7 spring-loaded pogo pins, which handle both power delivery and data reading. The project integrates an 18650 battery, a CW2015 fuel gauge chip, and a DS1307 RTC chip, offering a complete uninterruptible power supply in a small footprint.
View of the Pi-Ener-lite hardware
Operation is simple and reliable. When external power is lost, the system automatically switches to battery power. It also supports simultaneous charging and discharging, so you can use the Raspberry Pi Zero while the battery recharges. The whole setup is protected against overcharge, over-discharge, overcurrent, and short circuits.
Battery measurement and RTCThe CW2015 fuel gauge chip measures battery voltage and remaining capacity with ±2% accuracy. The DS1307 RTC chip, powered by a CR1220 coin cell, keeps time even when the main battery is removed. This combination makes Pi-Ener-lite a truly complete UPS for applications that require operational continuity.
Fuel gauge and RTC data are read over I2C, so you can access them easily from Python. The project includes Python examples and detailed documentation. An optional open-source 3D-printable case protects the entire system. Total cost is around $35.
Why choose Pi-Ener-litePi-Ener-lite is a compact UPS specifically for the Pi Zero. Unlike other solutions, it leaves the GPIO connector free, so you can attach other modules without issues. It also adds battery measurement and an RTC, two features often missing from DIY UPS builds. The open-source 3D-printable case adds versatility.
The project is designed for those who want a reliable backup power supply without taking up space. The board connects in seconds thanks to the spring-loaded pogo pins. The CW2015 fuel gauge lets you monitor remaining charge precisely, avoiding sudden shutdowns. If you need a professional solution for your Pi Zero, this project fits the bill.
- Connection via 7 spring-loaded pogo pins, no soldering
- 18650 battery with CW2015 fuel gauge for charge monitoring
- DS1307 RTC with CR1220 battery to keep time
- Protection against overcharge, over-discharge, overcurrent, and short circuits
- Open-source 3D-printable case
To build the project, you need an 18650 battery and a CR1220 coin cell. The rest of the components are already mounted on the board. If you want to power the system from a higher voltage, you can use a 12V DC-DC step-up converter to adapt the input. Alternatively, for industrial applications, consider a DC-DC converter with 36-48V input and 24V output.
Getting started with Pi-Ener-liteThe first step is to connect the board to the Raspberry Pi Zero via the pogo pins. Then install the drivers for the CW2015 and DS1307. Finally, write a simple Python script to read voltage and time. The project board includes ready-to-use examples.
If you want a more powerful system, you can pair Pi-Ener-lite with a Raspberry Pi 5. In that case, you must adapt the power supply, because the Pi 5 requires more current. For the Pi Zero, the solution works perfectly as is. The project is designed to be simple, compact, and reliable.
In conclusion, Pi-Ener-lite is a well-designed UPS with quality components and clear documentation. The ability to print a 3D case makes it even more versatile. If you’re looking for a backup power supply for your Raspberry Pi Zero, this project deserves attention.
The post Pi-Ener-lite: Compact UPS with Fuel Gauge and RTC for Raspberry Pi Zero appeared first on Open Electronics.
Pi-Ener-lite: Compact UPS with Fuel Gauge and RTC for Raspberry Pi Zero
Automotive Electronics Could Account for 50–55% of Car Cost by 2030, Enhancing Localisation Opportunities
Electronics will make up 50% to 55% of a car’s total manufacturing cost by 2030, growing significantly from 30% to 35% in 2020, creating a growth opportunity for Indian automotive component manufacturers in high-value electronic systems, according to a recent report by the Boston Consulting Group (BCG) and the Automotive Component Manufacturers Association of India (ACMA).
As per the report, increasing adoption of ADAS, infotainment, connected vehicle technologies, sensors, and ECUs in both ICE and EV vehicles are driving higher content of electronics.
However, India’s electrical and electronics segment was expected to be around 12% of domestic component supply in FY2025, highlighting significant scope for localization. Indian suppliers could capture a share of this emerging value pool, while also developing new capabilities in automotive electronics and other associated technologies.
Some technologies such as sensors, Electronic Control Units (ECUs), power electronics, connectivity systems, and Battery Management Systems (BMS) are gaining more consumer attraction as cars evolve into software-defined and highly connected products.
To capture this localisation opportunity, Indian component manufacturers need to move beyond traditional mechanical and manufacturing capabilities. They need to invest more in engineering, research and development, electronics design, software, testing, and technology development to compete in advanced technology that can be easily adopted by consumer mature automotive supply chains.
The post Automotive Electronics Could Account for 50–55% of Car Cost by 2030, Enhancing Localisation Opportunities appeared first on ELE Times.
India Approves Industry Production of DRDO-Developed Missile Systems
The defence minister, Rajnath Singh, has authorized the transfer of technologies, including conventional missile systems developed by DRDO, to eligible Indian defence manufacturers to set up indigenous production. In this process, mature and proven missile technologies are being moved from development to industrial-level mass production. The manufacturers will need to have applicable technical qualifications, certification levels, and regulatory requirements in place.
The scope for wider participation in the missile production chain would occur to some extent also due to technology transfer, where state-owned manufacturers, private firms, MSMEs & specialized manufacturers could develop expertise and participate in components and sub-components, electronics, propellants, guidance systems and associated mechanisms, launch systems and integration with greater depth.
There is scope for increased industrial involvement, which could bring about a higher level of domestic production and value addition, thereby lowering defence imports reliance. Increased industrial involvement could enable DRDO labs to focus more on research in newer and advanced technologies, while existing and developed systems may be produced industrially. A drastic policy shift, as it marks a change in treating private Indian companies as long-term technology and production partners in defence manufacturing. Its success hinges on technological absorption capability, quality testing procedures, test facilities, and orders.
The post India Approves Industry Production of DRDO-Developed Missile Systems appeared first on ELE Times.
Indian Navy Commissions Indigenous Diving Support Vessel INS Nipun
The Indian Navy commissioned INS NIPUN, the second ‘Nistar’ class Diving Support Vessel (DSV), at the Naval Dockyard. Mumbai on 31st August 2026. This is considered a great boon to our Navy’s underwater diving, underwater intervention, and submarine rescue capabilities. The first-ever indigenously developed and built vessel designed and built at Hindustan Shipyard Ltd. Visakhapatnam has sophisticated underwater-diving facilities for personnel, capable of submergence in adverse environments and pressures of the high seas. It can perform tasks such as inspection, maintenance, salvage, among others while it stays at sea, far away from shore for long periods.
It will provide increased capabilities in support of submarine-rescue operations- a vital skill that will protect crews and response personnel in submerged situations. Vessels like this are used to embark divers, remote systems and specialist rescue gear to operate as afloat platforms.
Induction of INS Nipun showcases the growing Indian capacity in indigenous design and manufacture of complex naval platforms, and it further bolsters the overall defence-shipbuilding industry in India through the contribution of Indian shipyards, equipment providers & supporting industries. She makes inroads into the Navy at a time when underwater surveillance, operation of submarines, and security of sea-based infrastructure are assuming prime importance.
The post Indian Navy Commissions Indigenous Diving Support Vessel INS Nipun appeared first on ELE Times.
GRSE Expands Digital Shipbuilding Through New International Partnerships
Garden Reach Shipbuilders & Engineers has recently signed two international contracts to boost its digital shipbuilding and marine-engineering activities. Both contracts were signed on September 2, 2026, at SMM, the maritime trade fair that was held in Hamburg, Germany. The signing was completed when the Indian defence shipbuilder and the Norway-based classification and assurance organization DNV signed their first Memorandum of Understanding. The partnership is said to seek digital shipbuilding and development in areas of green technologies, training, and leading technical marine engineering.
GRSE further signed its second accord with the Netherlands-based Damen Technical Cooperation to provide technical and commercial cooperation for the design and construction of high-end dredges in India, reinforcing an existing relationship and boosting India’s capability to manufacture specific vessel types in the future. Digital shipbuilding encompasses the use of an interconnected design platform, data-centric engineering, and 3-D models for developing, constructing, and maintaining a vessel throughout its life cycle.
This process helps identify design challenges early in development and allows predicting maintenance needs on vessel parts. These joint ventures may facilitate GRSE in upgrading its shipyard, attaining foreign technology, and thereby increasing opportunities to participate in overseas tenders, along with augmenting India’s indigenous capabilities for construction of advanced warships and commercial ships.
The post GRSE Expands Digital Shipbuilding Through New International Partnerships appeared first on ELE Times.
Aero India 2027 Announced for February 8–12 in Bengaluru
The 16th edition of Aero India, the aerospace and defence manufacturing exhibition, is being organized by the Ministry of Defence from 8-12 February, 2027 at the Air Force Station Yelahanka in Bengaluru. Military officials, defence policy planners and policy formers, defence technology experts, as well as foreign investors are said to visit the show; the exhibition will aim to exhibit combat aircraft, helicopters, unmanned aerial systems, avionics, propulsion systems, electronic warfare and air defence technologies. The defence show of Aero India is managed by the Department of Defence Production. A flying display along with a technology exhibition will also be organized.
The event will also offer a platform for Indian defence manufacturing companies, start-ups, and MSMEs for forming manufacturing alliances and becoming an integral part of the global supply chains. The business meetings are anticipated to deliberate on technology transfer, co-development, co-production and defence exports. The announcement assumes significance at a time when India aims to give impetus to aerospace manufacturing indigenization and cut reliance on imports for its defence equipment needs. Aero India 2027 will hence not merely be an Air Show but a catalyst in enabling India’s Make in India, Make for the World defence manufacturing story.
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The 66th SIAM Annual Convention: PM Modi Wants Auto Industry to Augment ‘Viksit Bharat’
The 66th Annual Convention of The Society of Indian Automobile Manufacturers (SIAM) was recently held in New Delhi. Addressing the event, Indian PM Narendra Modi shared a special message at the convention. He stated, “India’s automobile industry is well placed to further expand its global presence as the country’s mobility ecosystem undergoes a fundamental transformation. Continued innovation, pursuit of excellence and a bold pathway towards Viksit Bharat will unlock transformative opportunities for the sector and accelerate the journey towards a faster, greener and self-reliant future.”
Chief Guest Nitin Gadkari, Hon’ble Union Minister of Road Transport & Highways, Government of India, mentioned, “With quality, innovation, research and competitive pricing, India has the potential to become the largest automobile industry in the world, with the sector playing a key role in Viksit Bharat. We should also encourage the expansion of driver training centres, vehicle fitness centres and vehicle scrapping centres, which can contribute to the economy as well.”

In a video message, Guest of Honour H. D. Kumaraswamy, Union Minister of Heavy Industries and Steel, Government of India, said, “The Indian automobile industry is strengthening its domestic capabilities and advancing vehicle technologies, creating a strong foundation to transform the local market into a global hub. The sector will continue to grow as a cleaner, more inclusive and globally competitive industry, contributing meaningfully to the Viksit Bharat 2047 goal.”
Riding on Indigenous Innovation at the SIAM Annual ConventionSharing his views, Shailesh Chandra, President, SIAM and Managing Director & CEO, Tata Motors Passenger Vehicle Ltd. added, “The Indian Automobile Industry continues to play a defining role in shaping India’s Amrit Kaal, contributing significantly to realising the vision of a Viksit Bharat by 2047. Alongside this progress, India has made significant strides in aligning with global and national priorities of sustainability, decarbonisation, and safety.”

Addressing the automobile fraternity, Shenu Agarwal, Vice President, SIAM and Managing Director & CEO, Ashok Leyland Ltd., highlighted, “The Indian automobile industry has demonstrated remarkable resilience, and India can simultaneously become a large mobility market, a global manufacturing hub and a technology leader. But the next phase of this journey will require looking beyond growth alone, with sustainability and resilience going hand in hand.”
The SIAM Annual Convention session concluded with a shared commitment to building resilience in sustainable mobility, harnessing technology to strengthen global competitiveness and advancing India’s journey towards Viksit Bharat.
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