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Зустріч у ДПМ з телеведучою Анастасією Красницькою Інформація КП пн, 06/30/2025 - 16:43

In order to test multiple ICs simultaneously with different test voltages and currents, semiconductor automatic test equipment (ATE) uses multiple source measurement units (SMUs). Each SMU requires its own independent floating voltage tracking power supply to ensure clean measurements.

Figure 1 shows the basic structure of the SMU power supply. The voltage tracking power supplies need to supply the power amplifiers with a wide voltage range (±15 V to ±50 V) and a constant power capability.

Figure 1 A simplified power-supply block diagram in an ATE. Source: Texas Instruments

Figure 2 illustrates the maximum steady-state voltage and current that the SMU requires in red and the pulsed maximums in blue.

Figure 2 An example voltage-current profile for a voltage tracking power supply. Source: Texas Instruments

The ICs under test require a low-noise power supply with minimal power loss. In order to manage the power dissipation in a linear power device and deliver constant power under the conditions shown in Figure 2, it is required that the power supply be able to generate a pulsating output with high instantaneous power.

In addition to power dissipation considerations, it is essential that the power supply has a sufficient efficiency and thermal management to accommodate as many test channels as possible.

Four topologies are studied and compared to see which one best meets the voltage tracking power supply requirements. Table 1 lists the electrical and mechanical specifications for the power supply. The four topologies under consideration are: hard-switching full bridge (HSFB), full-bridge inductor-inductor-capacitor (FB-LLC) resonant converter, dual active half bridge (DAHB), and a two-stage approach composed of a four-switch buck-boost (4sw-BB) plus half-bridge LLC resonant converter (HB-LLC).

Parameter	Minimum	Maximum
Vin	15V	45V
Vout	±15V	±45V
Iout	0A	±2.0A
Pout,pulse	N/A	150W
Height	N/A	4mm
Width	N/A	14mm
Length	N/A	45mm
PCB layers	N/A	18

Table 1 Electrical and mechanical SMU requirements. Source: Texas Instruments

Topology comparison

Figure 3 shows the schematic for each of the four power supplies.

Figure 3 The four topologies evaluated to see which one best meets the voltage tracking power supply requirements listed in Table 1. Source: Texas Instruments

Each topology was evaluated on two essential requirements: small size and minimizing the thermal footprint. Efficiency is only important in as far as heat management is concerned.

Table 2 summarizes the potential benefits and challenges of each topology. In addition to size, the maximum height constraint necessitates a printed circuit board (PCB)-based transformer design.

Topology	Benefits	Challenges
HSFB	Single power conversion stage. Simple well-known control.	Hard switching will limit the operating frequency. A wide input and output range will be difficult for a single stage.
FB-LLC	Single power conversion stage. Capable of high switching frequency because of zero voltage switching (ZVS).	A wide input and output range will be difficult for a single stage. Low Lm may result in low efficiency because of high root-mean-square (RMS) currents.
DAHB	Single power conversion stage. Capable of high switching frequency because of ZVS.	A wide input and output range will be difficult for a single stage. Complex control is required to deliver the required power and maintain ZVS.
Two-stage	Optimized preregulator for power delivery over a wide range. Optimizing the LLC for a single operating frequency makes the resonant tank design straightforward. Heat is spread out over a larger area.	Two stages will increase the required space.

Table 2 The benefits and challenges of the four different SMU power supply topologies. Source: Texas Instruments

In order to understand the size implications for the HSFB, it is necessary to start out by examining the structure of the transformer. Equation 1 calculates the turns ratio for the HSFB as:

Using the requirements listed in Table 1 gives a result of . Because a practical design will require a PCB with no more than 18 layers, the maximum required primary turns on a center-tapped design is 2:8:8. With this information, you can use Equation 2 to estimate the center leg core diameter:

Hard switching losses in the FETs will keep the frequency no higher than 500 kHz, resulting in a 12 mm diameter of the center leg. The resulting core will be at least twice this size. The end result is that the HSFB solution is just too large for any serious practical consideration.

The single-stage FB-LLC enables a higher switching frequency by solving the hard-switching concerns found in the HSFB. However, the broad input and output voltage range will require a small magnetizing inductance. The best design identified used a turns ratio of 4:5, Lm = 2 µH, Lr = 1 µH, and fr = 800 kHz. This design addresses the issues with the HSFB by incorporating more primary turns, achieving a high operating frequency for minimal size, and requiring only 14 layers. However, the design suffers from several operating points that result in ZVS loss and an inability to generate the necessary output voltage under pulsed load conditions.

Figure 4 shows the equation and plots of the maximum gain of the system. Supporting the requirements outlined in Table 1 requires a gain of at least 3. Figure 4 shows that this is only possible by drastically decreasing one or more of Lr, Lm, or fr. Decreasing Lr will result in a loss of ZVS from the rapid change in the inductor current. Reducing fr will drive up the size of the transformer and the required primary turns. Decreasing Lm will significantly increase losses from additional circulating current. Given these factors, the single-stage FB-LLC is also not an option.

Figure 4 Maximum fundamental harmonic approximation (FHA) gain plots. Source: Texas Instruments

DAHB

The DAHB [1] is an interesting option that also attempts to solve the hard-switching concerns. One area of concern is the requirement to have active control of the secondary FETs. This kind of control will require additional circuitry to translate the control across the isolation boundary. Equation 3 predicts the resulting power delivery capability of the DAHB:

Table 3 lists the results for the full requirements outlined in Table 1. Notice that there are several problematic conditions, most notably one condition where the required peak current is 80 A. The FETs used in the design cannot accommodate this current.

Table 3 DAHB operating points with several problematic conditions that cannot be designed. Source: Texas Instruments

The two-stage approach pushes the voltage regulation problem to the 4sw-BB and operates the HB-LLC at a fixed frequency at resonance, which allows the HB-LLC to run at high frequency and more easily achieve ZVS under all conditions. The obvious downside of this approach is that it uses two power stages instead of one. However, the reduced currents in the HB-LLC and its ability to run at higher frequencies enable you to minimize the size of the transformer.

Table 4 summarizes the comparison between the four topologies, highlighting the reasons for selecting the two-stage approach. References [2] and [3] describe some essential control parameters used for the buck-boost and LLC.

Topology	Comparison results
HSFB	Hard switching losses keep the switching frequency low. Large secondary turns and low operating frequency result in a large magnetic core.
FB-LLC	Parasitic capacitance requires a larger resonant inductor. Gain requires a smaller resonant inductor. The design cannot provide the required voltages.
DAHB	Complex multimode control. Active secondary-side FET control. Large RMS currents.
Two stage	Including a preregulator optimizes power delivery over the wide range. The LLC can be optimized for a single operating frequency. Heat is spread out over a larger thermal footprint

 Table 4 Comparison between the four different topologies, highlighting the reasons for selecting the two-stage approach. Source: Texas Instruments

Test results

Based on the comparison results, I built a high-power-density (14 mm by 45 mm) 4sw-BB plus HB-LLC prototype. Figure 5 shows an image of the hardware prototype of the final design that fits in the space outlined by Table 1.

Figure 5 The top-side layout of the high-power density 4sw-BB + HB-LLC test board. Source: Texas Instruments

Figure 6 shows both efficiency and thermal performance of the LLC converter.

Figure 6 The LLC efficiency curve and a thermal scan of the LLC converter. Source: Texas Instruments

Two-stage approach

After considering four topologies to meet ATE SMU requirements, the two-stage approach with the four-switch buck boost and fixed-frequency LLC was the smallest overall solution capable of meeting the system requirements.

Brent McDonald works as a system engineer for the Texas Instruments Power Supply Design Services team, where he creates reference designs for a variety of high-power applications. Brent received a bachelor’s degree in electrical engineering from the University of Wisconsin-Milwaukee, and a master’s degree, also in electrical engineering, from the University of Colorado Boulder.

Related Content

• Power Tips #140: Designing a data center power architecture with supply and processor rail-monitoring solutions
• Power Tips # 141: Tips and tricks for achieving wide operating ranges with LLC resonant converters
• Modular scalable test set comprises source-measure ATE
• ATE system automates power semiconductor tests

References

1. Laturkar, N. Deshmukh and S. Anand. “Dual Active Half Bridge Converter with Integrated Active Power Decoupling for On-Board EV Charger.” 2022 IEEE International Conference on Power Electronics, Smart Grid, and Renewable Energy (PESGRE), Trivandrum, India, 2022, pp. 1-6, doi: 10.1109/PESGRE52268.2022.9715900.
2. McDonald and F. Wang.” LLC performance enhancements with frequency and phase shift modulation control.” 2014 IEEE Applied Power Electronics Conference and Exposition – APEC 2014, Fort Worth, TX, USA, 2014, pp. 2036-2040, doi: 10.1109/APEC.2014.6803586.
3. Sun, B. “Multimode control for a four-switch buck-boost converter.” Texas Instruments Analog Design Journal, literature No. SLYT765, 1Q 2019.

The post Power Tips #142: A comparison study on a floating voltage tracking power supply for ATE appeared first on EDN.

GlobalFoundries of Malta, NY, (GF, the only US-based pure-play foundry with a global manufacturing footprint including facilities in the USA, Europe and Singapore) plans to invest another $3bn in its expansion of semiconductor manufacturing and advanced packaging capabilities across its facilities in New York and Vermont...

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submitted by /u/CheapWelder4303 [link] [comments]

Researchers at the University of Illinois Urbana-Champaign (UIUC) in the USA have fabricated blue light-emitting diodes (LEDs) down to an unprecedented 250nm in size, a critical step for next-generation technologies like ultra-high-resolution displays and advanced optical communication. However, their study reveals a significant challenge: a sharp ‘efficiency cliff’ when these LEDs are scaled to submicron dimensions...

Automakers have always raced to get the latest models to market. The shift to software-defined vehicles (SDVs) has turned that race into a sprint. It’s not a simple shift, however.

Building cars that can evolve constantly demands an overhaul of development practices, tools, and even team culture. From globally distributed engineering teams and cloud-based workflows to virtual testing and continuous integration pipelines, automakers are adopting new approaches to shrink development timelines without compromising safety or quality. These shifts are enabling the industry to move faster.

In older vehicles, after a car leaves the factory, code is rarely changed over its lifetime. In contrast, SDVs are designed for continuous improvement. Manufacturers can push over the-air (OTA) updates to add features, fix bugs, or enhance performance throughout a car’s life.

However, delivering continuous upgrades requires development cycles to speed up dramatically. Instead of a process measured in years for the next model refresh, software updates often need to be developed, tested, and rolled out in a matter of months—sometimes less. The cadence of innovation in automotive is shifting, and time-to-market for each new enhancement has become paramount.

Figure 1 Software-defined vehicles (SDVs) are designed for continuous improvement. Source: NXP

This new pace is a profound change for automakers, and calls for a far more agile, software-centric mindset. Companies that successfully shrink their cycle times can deliver constant improvements; those that cannot risk their vehicles quickly becoming outdated.

Distributed teams, unified development

Managing the massive, distributed development teams behind SDVs is another challenge when it comes to speeding up software delivery. Where a car’s software was previously handled by small in-house teams, today it takes hundreds or thousands of engineers spread around the globe.

This international talent pool enables 24-hour development, but it also introduces fragmentation. Different groups may use different tools or processes, and not everyone can access the same test hardware. Without a coordinated approach, a large, distributed team can prove a bottleneck rather than a benefit.

Automotive manufacturers are tackling the issue by uniting teams in cloud-based development environments. Instead of each engineer working in isolation, everyone accesses a standardized virtual workspace in the cloud pre-configured with every necessary tool. This ensures code runs the same for each developer, eliminating the “works on my machine” syndrome.

It also means updates to the toolchain or libraries can be rolled out to all engineers at once. Onboarding new team members becomes much faster as well—rather than spending days installing software, a new hire can start coding within hours by logging into the cloud environment. With a shared codebase and common infrastructure, a dispersed team can collaborate as one, keeping productivity high and projects on schedule.

Virtual testing: From months to minutes

Rethinking how and when software testing happens is critical to the acceleration of SDV development. In the past, software testing depended heavily on physical prototypes—electronic control units (ECUs) or test vehicles that developers needed to use in person, often creating idle time and long delays that are unacceptable in a fast-moving SDV project. The solution is to virtualize as much of the testing as possible.

Virtual prototypes of automotive hardware enable software development to begin long before physical parts are available. If new hardware won’t arrive until next year, engineers can work with a digital twin today. By the time actual prototypes come in, much of the software will already be validated in simulation, potentially accelerating time to market by months.

Figure 2 Virtual prototypes can be developed in parallel to hardware development. Source: NXP

Even when real hardware testing is required, remote access is speeding things up. Many companies now host “hardware-in-the-cloud” labs—racks of ECUs and other devices accessible online. Instead of waiting their turn or traveling to a test site, developers anywhere can deploy code to these remote rigs and see the results in real time. This approach compresses the validation cycle, catching issues earlier and proving out new features in weeks rather than months.

Embracing CI/CD for rapid releases

Accelerating time-to-market also requires the software release process itself to be reengineered. Modern development teams are increasingly adopting continuous integration and continuous delivery (CI/CD) pipelines to keep code flowing smoothly from development to deployment. In a CI/CD approach, contributions from all developers are merged and tested continuously rather than in big infrequent batches.

Automated build and test systems catch integration bugs or regressions a lot sooner in the development process, making fixes a lot easier to handle. This reduces last-minute scrambles that often plagued traditional, slower development cycles. With a robust CI/CD pipeline, software is always in a deployable state.

Of course, moving at such speed in a safety-critical industry requires care. CI/CD’s built-in rigor ensures each change passes all quality and safety checks before it ever reaches a car.

Driving into the future, faster

The push to accelerate vehicle software development is reshaping automotive engineering. Building cars that are defined by software forces automakers to adopt the tools, practices, and culture of software companies. Investments in cloud-based development environments, virtual testing frameworks, and CI/CD pipelines are quickly becoming the norm for any automaker that wants to stay competitive.

Ultimately, as cars increasingly resemble computers on wheels, time-to-market for software-driven features has become a make-or-break factor. The race is on for automakers to deliver new capabilities faster than ever, without hitting the brakes on safety or quality.

Those who successfully integrate distributed teams with cloud-first workflows, leverage virtual testing, and adopt continuous delivery practices will be perfectly placed to win over automakers with vehicles that keep improving over time.

Curt Hillier is technical director for automotive solutions at NXP Semiconductors.

Razvan Ionescu is automotive software and tools architect at NXP Semiconductors.

Related Content

• SDVs: Big Picture and Challenges
• Why the Cloud Is Essential for SDV Development
• Unveiling the Transformation of Software-Defined Vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Architectural opportunities propel software-defined vehicles forward

The post Accelerating time-to-market as cars become software defined appeared first on EDN.

Вихованка PhD-програми КПІ Оксана Григор'єва – радниця з гендерних питань командування ЗСУ kpi пн, 06/30/2025 - 02:03

Added a "slightly" bigger capacitor (the red thing) because the old one was ripped of The radio works now again submitted by /u/Darcy_Wu_NR1 [link] [comments]

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You can’t hear it, but it sounds beautiful 😍 AI had helped with some issues. Learned A LOT. Gemini told me to add a 1000uf cap to the Bluetooth module bc it kept on disconnecting at high power, and it worked, and I feel like it sounds better now. I’m gonna 3d print a housing and mount them under my desk as conduction speakers. Total project cost was 9 dollars. 1$ Bluetooth board, 2$ amp, and 6$ for 2 3 watt 4 ohm speaker drivers repurposed from a random speaker off eBay. submitted by /u/Fit_Antelope_1045 [link] [comments]

Powered by a $0.10 RISC V MCU we can do surprisingly accurate whistle detection! Using a timer to make sure whistle sequences are done within a time frame we can do simple whistle pattern recognition for a switch! Great quick project! submitted by /u/Separate-Choice [link] [comments]

I designed a simple board that lets you transmit audio directly from your computer onto the commercial FM band. no code, no drivers, just plug and play. This was a fun personal project and not meant to be an actual product (you can find similar boards on AliExpress for around $5). It’s also my first ever SMD assembly, and it was pretty fun working with SMD components (SSOP was a bit difficult). The board uses a TI PCM2704 chip to stream audio over USB from the host device. That audio is then passed to a KT0803 FM transmitter chip, which broadcasts it over FM radio. I added I²C breakout pins, which can be used reprogram the KT0803's settings like transmitting frequency, mode, and calibration parameters. Github page for the project (Includes the demo with sound) - https://github.com/Outdatedcandy92/FM-Transmitter submitted by /u/FirefighterDull7183 [link] [comments]

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I think I salvaged it from an old VCD player. Pretty cool. submitted by /u/BobBolzac [link] [comments]

Some background here https://antiqueradios.com/forums/viewtopic.php?t=306396 "Prior to the introduction of integrated op amps, it was extremely difficult to build stable DC amplifiers. By passing the signal through a chopper, the DC voltage can be passed through a feedback stabilized AC amplifier and then converted back to DC afterward. Chopper stabilized DC amplifiers--using electromechanical devices--have been around since the late 1940s at least." "HP's photoconductive choppers eliminated the inevitable problems with contact adjustment and wear in the electromechanical ones, but they required higher input voltages to overcome the "on" resistance of the photocells." Enjoy! submitted by /u/99posse [link] [comments]

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