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TDK SensEI’s edgeRX Vision system, powered by advanced AI, accurately detects defects in components as small as 1.0×0.5 mm in real time. Operating at speeds up to 2000 parts per minute, it reduces false positives and enhances efficiency in high-throughput manufacturing.

AI-driven vision systems now offer real-time processing, improved label efficiency, and multi-modal interaction through integration with language models. With transformer-based models like DINOv2 and SAM enabling versatile vision tasks without retraining, edge-based solutions are more scalable and cost-effective than ever—making this a timely entry point for edgeRX Vision in high-volume manufacturing.

edgeRX Vision integrates with the company’s edgeRX sensors and industrial machine health monitoring platform. By enhancing existing hardware infrastructure, it helps minimize unnecessary machine stoppages. Together, the system offers manufacturers a smart, integrated approach to demanding production challenges.

Request a demonstration of the edgeRX Vision defect detection system via the product page link below.

edgeRX Vision product page

TDK SenseEI 

The post Real-time AI fuels faster, smarter defect detection appeared first on EDN.

Analog Devices and Antmicro have released AutoML for Embedded, a tool that simplifies AI deployment on edge devices. Part of Antmicro’s hardware-agnostic, open-source Kenning framework, it automates model selection and optimization for resource-constrained systems. The tool helps users deploy models more easily without deep expertise in AI or embedded development.

AutoML for Embedded is a Visual Studio Code plugin designed to integrate seamlessly into existing development workflows. It works with CodeFusion Studio and supports direct deployment to ADI’s MAX78002 AI accelerator MCU and MAX32690 ultra-low power MCU. The tool also enables rapid prototyping and testing through Renode-based simulation and Zephyr RTOS workflows. Its support for general-purpose, open-source tools allows flexible model optimization without locking developers into a specific platform.

With step-by-step tutorials, reproducible pipelines, and example datasets, users can move from raw data to edge AI deployment quickly without needing data science expertise. AutoML for Embedded is available now on the Visual Studio Code Marketplace and GitHub. Additional resources are available on the ADI developer portal.

AutoML for Embedded product page 

Analog Devices

The post Open-source plugin streamlines edge AI deployment appeared first on EDN.

SK keyfoundry, in collaboration with Siemens EDA Korea, has introduced a 130-nm automotive process design kit (PDK) compatible with Calibre PERC software. The process node supports both schematic and layout verification, including interconnect reliability checks. With this PDK, fabless companies in Korea and abroad can optimize automotive power semiconductor designs while performing detailed reliability verification.

According to Siemens, while the 130-nm process has been a reliable choice for analog and power semiconductor designs, growing design complexity has made it harder to meet performance targets. The new PDK from SK keyfoundry enables designers to use Siemens’ Calibre PERC with the foundry’s process technology, supporting layout-level verification that accounts for manufacturing constraints.

SK keyfoundry aims to deepen collaboration with Siemens through optimized design solutions, enhanced manufacturing reliability, and a stronger foundry market position.

To learn more about Siemen’s Calibre PERC reliability verification software, click here.

Siemens Digital Industries Software 

SK keyfoundry 

The post Foundry PDK drives reliable automotive chip design appeared first on EDN.

Nexperia’s 1200-V, 20-A SiC Schottky diodes contribute to high-efficiency power conversion in AI server infrastructure and solar inverters. The PSC20120J comes in a D2PAK Real-2-Pin (TO-263-2) surface-mount package, while the PSC20120L uses a TO-247 Real-2-Pin (TO-247-2) through-hole package. Both thermally stable plastic packages ensure reliable operation up to +175°C.

These Schottky diodes offer temperature-independent capacitive switching and virtually zero reverse recovery, resulting in a low figure of merit (QC×VF). Their switching performance remains consistent across varying current levels and switching speeds.

Built on a merged PiN Schottky (MPS) structure, the diodes also provide strong surge current handling, as shown by their high peak forward current (IFSM). This robustness reduces the need for external protection circuitry, helping engineers simplify designs, improve efficiency, and shrink system size in high-voltage, harsh-environment applications.

Use the product page links below to view datasheets and check availability for the PSC20120J and PSC20120L SiC Schottky diodes.

PSC20120J product page 

PSC20120L product page

Nexperia

The post SiC diodes maintain stable, efficient switching appeared first on EDN.

Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for large-scale AI workloads — has expanded its leadership team with Vivek Khanzodé joining it as VP of engineering. To support its efforts in high-volume manufacturing and CPO adoption, the firm has also opened a new office in Taiwan and doubled the size of its San Jose headquarters, bolstering its aim to transform AI connectivity with optical interconnects...

Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA plans to invest $8m with Stony Brook University to establish a wide-bandgap research center to advance innovation in power semiconductors and foster the next generation of skilled professionals in the field...

Driven by the growth of artificial intelligence (AI) and the electrification of everything demanding higher levels of power efficiency and reliability, Microchip Technology Inc of Chandler, AZ, USA has announced a new partnership agreement for its mSiC products and technology to be used in the designs of global power and energy management firm Delta Electronics Inc. The synergies between the firms aim to accelerate the development of innovative silicon carbide (SiC) solutions, energy-saving products and systems...

AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials — says that Ms Christine Russell, a member of the board of directors, passed away on 11 July...

🤝📚 НАЗК пропонує чотири нові вакансії: антикорполітика, просвіта, дизайн та роз’яснювальна робота kpi пт, 07/18/2025 - 13:35

Nuvoton will emphasize cloud computing applications at OCP APAC 2025. Nuvoton will showcase cloud computing silicon solutions for M-PESTI, eBMC nu.RoT, Multi-nodes controller, and computing/server ASIC/MCU. The OCP APAC Summit 2025 will take place from August 5-6, 2025, in Taipei, Taiwan.

MCU TF5103Y: M-PESTI target MCU based on DC-MHS

The TF5103Y is a Cortex-Arm M0 32-bit microcontroller that can run the M-PESTI target solution. The small package QFN32 4x4mm is easy to design in the limited layout space of a sideband card, especially in M-SDNO or 1U module systems for rack systems. The M-PESTI target solution on TF5103Y passed the Intel server lab and is already in mass production. And this solution can be compatible with Altera and Lattice systems.

eBMC NCT6694B: nu.RoT builds a security core for your system

ASRock, in collaboration with Nuvoton, has unveiled the world’s first lightweight server motherboard powered by the Nuvoton eBMC (NCT6694B) chip, designed to build a secure and trusted system core. The board includes many functions, such as enabling remote management, system monitoring, and BIOS updates. Tailored for cloud and edge applications, it delivers a high-efficiency and stable security framework. With the u.RoT architecture reinforces a robust trust chain from system boot to runtime, making security the default.

Multi-nodes: Powerful management framework based on BMC-SMC Integration

Considering that the server system architecture is becoming increasingly complex, we now face some problems that require discussion for Multi-Node Scalability to resolve them. For example, the number of cores in Host CPUs is growing, which means platforms are moving from dual/quad sockets (shared memory) to multi-node solutions. Furthermore, OCP partners are looking forward to the Multi-node management on following DC-SCM3.0.

With Nuvoton’s BMC and SMC solution, the USB tunnels over MCTP are ready for UART/SOL, MMBI/ VW, Telemetry, etc.

MCU M2354: RoT on Microcontroller

NuMicro M2354 is a 32-bit Arm Cortex-M23 microcontroller featuring TrustZone technology. Supporting compact WLCSP49 package, it is ideal for resource-constrained devices that cannot accommodate a full TPM. M2354 integrates Secure Boot with DICE architecture in Mask ROM and is in mass production, delivering a lightweight, deployable Root of Trust for modular server and IoT systems.

The post Nuvoton Technology Presents M-PESTI target MCU based on OCP DC-MHS, eBMC nu.RoT, RoT on Microcontroller, and Multi-nodes based on BNC-SCM applications appeared first on ELE Times.

Multidrug-resistant organisms (MDROs) are a major challenge in everyday medical practice, as they often cannot be treated with antibiotics. According to the Robert Koch Institute, there are 400,000–600,000 hospital-acquired infections in Germany annually, and 10,000–20,000 people die from them. Alternative treatments are therefore needed...

Multidrug-resistant organisms (MDROs) are a major challenge in everyday medical practice, as they often cannot be treated with antibiotics. According to the Robert Koch Institute, there are 400,000–600,000 hospital-acquired infections in Germany annually, and 10,000–20,000 people die from them. Alternative treatments are therefore needed...

Quinas Technology Ltd (which was spun off from Lancaster University in early 2023) has been named by the World Intellectual Property Organization (WIPO) as winner in the ICT Start-Up category of the 2025 WIPO Global Awards. Quinas is one of just ten companies worldwide to receive this honour and the first ever winner from the UK...

Fraunhofer Institute for Solar Energy Systems ISE in Freiburg, Germany has developed solar cells based on III-V semiconductors that can achieve an efficiency of over 40% indoors (Kliitzke et al, Applied Physics Letters 127, 023301)...

КПІ ім. Ігоря Сікорського співпрацюватиме з FANUC Ukraine LLC kpi чт, 07/17/2025 - 16:20

As presented at the International Conference on Nitride Semiconductors (ICNS-15) in Malmö, Sweden (6–11 July) in a paper by Kouei Kubota et al, Japan’s Sumitomo Electric Industries Ltd — through joint research with the research group led by assistant professor Takuya Maeda of the University of Tokyo’s School of Engineering — has discovered the scattering mechanism of a two-dimensional electron gas (2DEG) in a heterojunction formed from scandium aluminium nitride (ScAlN) and gallium nitride (GaN). ScAlN/GaN is a strong candidate to be the barrier layer in next-generation high-frequency GaN high-electron-mobility transistors (GaN HEMTs)...

As presented at the International Conference on Nitride Semiconductors (ICNS-15) in Malmö, Sweden (6–11 July) in a paper by Kouei Kubota et al, Japan’s Sumitomo Electric Industries Ltd — through joint research with the research group led by assistant professor Takuya Maeda of the University of Tokyo’s School of Engineering — has discovered the scattering mechanism of a two-dimensional electron gas (2DEG) in a heterojunction formed from scandium aluminium nitride (ScAlN) and gallium nitride (GaN). ScAlN/GaN is a strong candidate to be the barrier layer in next-generation high-frequency GaN high-electron-mobility transistors (GaN HEMTs)...

The Vermont Gallium Nitride (V-GaN) Tech Hub — a consortium founded in 2023 with over 60 member and partners and led by the University of Vermont (UVM) and including GlobalFoundries and the State of Vermont — has secured $3.4m of funding from the Northeast Microelectronics Coalition (NEMC) for a microelectronics testing laboratory to bolster innovation and economic development in the Green Mountain State and the Northeast...

The Vermont Gallium Nitride (V-GaN) Tech Hub — a consortium founded in 2023 with over 60 member and partners and led by the University of Vermont (UVM) and including GlobalFoundries and the State of Vermont — has secured $3.4m of funding from the Northeast Microelectronics Coalition (NEMC) for a microelectronics testing laboratory to bolster innovation and economic development in the Green Mountain State and the Northeast...