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High-speed data acquisition is made simple with a 12-bit digitizer that offers up to 10 GSPS sampling rate and 2 Gbyte/s sustained data transfer to a host PC. Teledyne’s ADQ3-series digitizer provides high-performance data acquisition in a compact, standalone USB 3.2 form factor.

Digitizers—crucial in analytical and sensing systems such as automated test equipment (ATE), distributed fiber optic sensing platforms, LiDARs, mass spectrometers, and swept-source optical coherence tomography—are undergoing a transformation amid growing demand for faster data acquisition. It inevitably calls for higher resolution, faster imaging speeds, and more granular real-time analysis.

That’s because new use cases in sensing systems generate gigabytes of data per second, demanding efficient real-time processing and high-speed data transfer. Then there is the issue of preserving signal integrity in compact and noise-sensitive environments, which mandates compact form factors that can be placed close to the detector within the system enclosure.

ADQ3-USB, housed in a robust, fanless enclosure, allows engineers to place the digitizer close to the detector. This also minimizes cable length and reduces signal reflections, a crucial factor for optimizing analog performance in high-speed applications.

ADQ3-USB is compatible with a wide range of digitizer models within the ADQ3 series, including ADQ30, ADQ32, ADQ33, and ADQ35. Source: Teledyne SP Devices

ADQ3-USB features onboard FPGA capabilities for real-time signal processing. That enables it to support continuous data streaming at up to 2 Gbyte/s via USB 3.2. Moreover, even large volumes of raw data up to 20 Gbyte/s can be efficiently reduced and transferred without bottlenecks.

Next, it eliminates the need for PCIe slots, leading to fast and simple integration with mini-PCs and laptops. This also makes it suitable for mobile setups, embedded systems, and OEM applications.

ADQ3-USB’s open FPGA architecture also allows design engineers to implement application-specific algorithms directly on the 1/2 digitizer. That, in turn, reduces the need for post-processing and enables real-time decision-making.

Finally, this digitizer supports multiple firmware packages tailored to specific application needs. That includes FWDAQ for standard data acquisition, FWATD for waveform averaging, FWPD for pulse detection, and DEVDAQ for custom FPGA development.

Related Content

• Analysis of large data acquisitions
• Data acquisition systems and SoCs—A guide
• Trending into data-acquisition: a mini-study in contrasts
• Data Acquisition and Instrumentation: The DAS and Sensors
• Data Acquisition and Instrumentation: Data Processing and Calibration

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submitted by /u/Riverspoke [link] [comments]

Researchers uncover a chain of flaws in a widely used automotive Bluetooth stack, exposing infotainment systems to remote compromise

In July 2025, cybersecurity researchers disclosed PerfektBlue, a set of four vulnerabilities (CVE-2024-45431 to -45434) found in OpenSynergy’s BlueSDK, a Bluetooth stack widely integrated into modern infotainment systems. The flaws affect millions of vehicles across brands including Volkswagen, Mercedes-Benz, and Skoda, enabling attackers to execute malicious code over Bluetooth Classic connections.

Attack Path and Impact

PerfektBlue can only be exploited at close range, requiring the attacker to be within 5-7 meters of a target vehicle and establish Bluetooth pairing. This limits the possibility of large-scale exploitation; however, a successful attack would open the IVI system to the hacker(s), leaking data such as:

• GPS data & Vehicle location
• Listening through in-car microphones
• Contact lists & communication logs

Safety-critical functions like braking and steering remain segmented. Yet, as past incidents (e.g., the 2015 Jeep Cherokee hack) have shown, weak network isolation could allow lateral movement if additional vulnerabilities exist.

Root Causes in Bluetooth Stack Design

PerfektBlue includes one memory corruption flaw and three logic-level vulnerabilities stemming from protocol mismanagement. Combined, they create a pathway to remote code execution once pairing succeeds.

The flaws illustrate ongoing issues in Bluetooth stack security:

• Multi-layer protocols such as L2CAP, RFCOMM, and AVRCP handle vast amounts of untrusted data.
• Implementations in C heighten memory safety risks.
• The wireless and real-time nature of Bluetooth complicates fuzz testing, letting subtle bugs persist across generations.

Delays in Fixing and Deployment

The vulnerabilities were first reported in May 2024, and a patch was issued by September 2024. Yet disclosure did not occur until July 2025, largely because automakers lagged in deploying updates.

Challenges included:

• Complex supply chains with limited visibility on software components.
• No software bills of materials (SBOMs)-thus OEMs were not aware that they even depended on BlueSDK.
• Highly manual service updates rather than OTA.

Wider Implications and Next Actions

As long as vehicle safety systems remain isolated, infotainment are not benign to breaches. Attackers could track drivers, eavesdrop on conversations, and steal sensitive data, or in poor circumstances, pivot to other systems if the segmentation is weak.

As a countermeasure, experts advised the automakers to:

• Consider Bluetooth stacks as high-value attack surfaces.
• Standardize the use of SBOMs so that the third-party software can be identified and tracked.
• Give priority to OTA update pipelines to reduce patch deployment delays.
• Integrate protocol fuzzing and binary analysis in the development lifecycles.

PerfektBlue is a reminder that connected vehicles remain vulnerable to wireless exploits. Without stronger defenses and adoption of patches faster, the automotive industry is repeating the same mistakes of past cybersecurity lapses.

(This article has been adapted and modified from content on Keysight Technologies.)

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Devices Offer Y1 Rating of 500 VAC and 1500 VDC, High Capacitance to 4.7 nF, and High Humidity Robustness

Vishay Intertechnology, Inc. introduced a new series of Automotive Grade AC line rated ceramic disc safety capacitors that are the industry’s first with a Y1 rating to be offered in a surface-mount casing. Combining their Y1 rating of 500 VAC and 1500 VDC with high capacitance to 4.7 nF, the Vishay BCcomponents SMDY1 Automotive Series devices are designed to provide EMI / RFI suppression and filtering in harsh, high humidity environments.

AEC-Q200 qualified with PPAP available, the capacitors released, will be used in on-board chargers (OBC), traction inverters, battery management systems (BMS), e-compressors, and AC/DC converters in electric (EV), hybrid electric (HEV), and plug-in hybrid electric (PHEV) vehicles. For these applications, the devices offer high humidity resistance with a Class IIB humidity grade (in accordance with IEC60384-14 annex I) and can withstand the 85 / 85 / 1000 h test.

Allowing for surface-mount assembly with a reflow soldering process, SMDY1 Automotive Series capacitors reduce production costs. Unlike leaded components, the devices offer a low, flat profile on the PCB to enable flat casings or backside PCB mounting without the clearance space required by through-hole capacitors.

RoHS-compliant and halogen-free, the components consist of a copper-plated ceramic disc and feature encapsulation made of flame-resistant epoxy resin in accordance with UL 94 V-0. The devices are available in two case sizes: the C case with a creepage distance of 10 mm and the D case with a creepage distance of 14.5 mm.

The post Vishay Intertechnology Launches Industry’s First Automotive Grade Ceramic Capacitors With Y1 Rating in SMD Casing appeared first on ELE Times.

Learn about "hidden" timing couplings in multicore systems that cause unexpected interference, significantly impacting Worst-Case Execution Time (WCET) even for independent tasks.

Blown thyristors, hopefully that's all it is. Waiting for the modules before attempting any repair. Circuit board looks okay, so does the power supply and some thick gloves just in case. I will be plugging this in outside on an extension lead far away from me when turning on. submitted by /u/JustBe-Chillin [link] [comments]

Hey folks, I’ve been tinkering with an ESP32-based clone of the Motogadget M-Unit Blue and finally decided to throw it out into the wild as open source: 👉 GitHub repo It’s not a polished product (yet) — more like a prototype playground. If you’re into DIY electronics/motorcycles: Try to boot it up, Hack it, improve it, break it, Build a prototype, Let me know how it goes. Think of it as: “Motogadget is $$$, but what if… we open-source it?” 😅 Any feedback, PRs, or pics of your builds are super welcome. Let’s see where the community can take this! 🏍️⚡ submitted by /u/jaksatomovic [link] [comments]

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.

Precision-matched capacitor pairs are commercially available items, but only in a limited range of values, working voltage, and dielectrics.

Plus, sometimes an extra critical application with extra tight tolerances (or an extra tight budget) can dictate a little (or a lot) DIY. For example, see “Inherently DC accurate 16-bit PWM TBH DAC.”

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1’s matchmaker circuit can help make the otherwise odious chore of searching through a batch of parts for accurately matching pairs quicker and a bit less taxing. Best of all, it does precision matchmaking (potentially to the ppm level) with no need for pricey precision reference components.

Here’s how it works.

Figure 1 Flip-flop U2b generates complementary excitation of the A and B capacitors under test.

Complementary (equal but opposite) excitation of the A and B capacitors under test implies that if Ca = Cb, then the charges passed will exactly cancel out, yielding a null at OUTPUT. If they differ, however, then an integrated output signal of 50 mV per % of mismatch will result if C3, C5, C4, and Cab (capacitors randomly selected from the trial batch) are equal in value, e.g., 0.68 µF. This signal is synchronously rectified by U1b, then integrated and buffered by the U1c and A1 feedback loop.

If Ca > Cb, the “A > B” output polarity will be positive relative to “B > A”. The reverse is also true: If Cb > Ca, the “A > B” output polarity will be negative relative to “B > A”.

Resolution of the match measurement will depend on the voltage resolution of the digital voltmeter (DVM). If that’s 1 mV, then matching to ±1/50th of 1%, or ±0.02%, will be possible. If it’s 100 µV (typical of a standard 3¾ digit multimeter with a 300 mV scale), then matching to ±0.002%, i.e., ±20ppm, is doable. And so on…

Measurement gain is inversely proportional to C4. So, if you need more resolution, simply decrease C4 to gain gain.

Figure 2 The U1aU2a multivibrator waveforms; the green waveform is the R3R4 junction, and the red waveform is U2 pin 6. The frequency is 0.1mHz/C3.

Note that the U1aU2a clock’s frequency precision and stability is somewhat dubious (even if we’re charitable). Happily, the accuracy of the ultimate Ca/Cb match doesn’t depend on a stable clock. Neither does match accuracy depend on the output impedances of D2b’s complementary outputs, not even on their symmetry!

Both insensitivities derive from the fact that it’s the transferred charge that forms the basis of matchmaking precision, and therefore neither current nor voltage matters very much.

However, due to the temperature sensitivity of some dielectrics, it’s probably a good idea to handle tested devices with thermally insulating gloves. This will save time and frustration waiting for them to equilibrate, not to mention possible outright erroneous results. Those are also known to cause frustration!

My thanks go to frequent contributor Christopher Paul for suggesting the utility of capacitor precision matching, and as always, to DI editor Aalyia Shaukat for this marvelously productive DI EE ecosystem we inhabit.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• Matchmaker
• Circuits help get or verify matched resistors
• Inherently DC accurate 16-bit PWM TBH DAC

The post Capacitor matchmaker appeared first on EDN.

During the first five months of FY 2025–26, notwithstanding non-uniform global demand, India’s external trade sector continued to show resilience. Provisional data published by the Ministry of Commerce & Industry state that the cumulative exports both for merchandise and services aggregated to US$ 349.35 billion during April to August 2025, registering a 6.18% year-on-year growth when compared to US$ 329.03 billion during the same period in 2024.

The Ministry, however, went on to say that growth was led by electronics, engineering goods, gems & jewellery, petroleum products, and pharmaceuticals, where services continued to be another key anchor. More importantly, India’s overall trade deficit has narrowed, pointing to a better external balance.

Merchandise exports reached US$ 184.13 billion, a modest 2.52% rise from US$ 179.60 billion last year. Within this, non-petroleum exports showed stronger momentum, climbing to US$ 158.07 billion from US$ 147.25 billion, a 7.35% increase that reflects resilience in India’s core manufacturing and agricultural sectors.

During the same time period, imports were US$ 390.78 billion, up just 2.49% from US$ 381.30 billion the previous year. The country’s trading condition improved as seen by the trade deficit for April–August 2025, which decreased from US$52.27 billion in 2024 to US$41.42 billion.

August 2025:

August proved to be a very successful month for exports, with total shipments totaling US$69.16 billion, up 9.34% from the previous year. In contrast, imports dropped 7% to US$79.04 billion, which significantly decreased the monthly deficit.

• Merchandise exports: US$ 35.10 billion (vs. US$ 32.89 billion in Aug 2024)
• Merchandise imports: US$ 61.59 billion (vs. US$ 68.53 billion)
• Services exports: US$ 34.06 billion (vs. US$ 30.36 billion)
• Services imports: US$ 17.45 billion (vs. US$ 16.46 billion)
• Trade deficit: US$ 9.88 billion, significantly lower than US$ 21.73 billion in August 2024

Sector-Wise Export Drivers (August 2025):

• Electronics: +25.93%, reaching US$ 2.93 billion (vs. US$ 2.32 billion in 2024)
• Engineering goods: +4.91%, totaling US$ 9.90 billion (vs. US$ 9.44 billion)
• Gems & jewellery: +15.57%, valued at US$ 2.31 billion (vs. US$ 2.00 billion)
• Petroleum products: +6.54%, at US$ 4.48 billion (vs. US$ 4.20 billion)
• Pharmaceuticals: +6.94%, climbing to US$ 2.51 billion (vs. US$ 2.35 billion)

India’s export base is diverse, as evidenced by the double-digit rise in cereals, coal & minerals, tea, dairy, poultry, ceramic items, and rice, in addition to these main categories.

The services sector remained a bright spot in India’s external trade. Between April and August 2025:

• Services exports were estimated at US$ 165.22 billion, rising from US$ 149.43 billion last year.
• Services imports stood at US$ 84.25 billion.
• This led to an increase in the surplus from US$ 68.25 billion to US$ 80.97 billion.

This surplus illustrates the worldwide competitiveness of Indian IT services, digital solutions, consulting, and financial services and continues to serve as a crucial buffer against India’s merchandise trade deficit.

Exports in August expanded strongly across both traditional and new destinations:

• UAE: +23.42%
• USA: +7.15%
• Netherlands: +17.87%
• Hong Kong: +62.46%
• China: +22.38%

The sharp rise in shipments to Hong Kong from gems & jewellery and electronics and greater growth to China above all signify an emerging trade linkage of India with Asia, while UAE and USA have stood as reliable supporting engines for export demand.

Key Sources of Imports

On the import front, India saw larger inflows from Russia, Saudi Arabia, Ireland, Iraq, and Qatar. While energy imports seemed to remain the largest from Russian and Middle Eastern suppliers, Ireland became an important source for specialized and high-value imports.

Conclusion:

The Ministry of Commerce & Industry emphasized that the narrowing of the trade deficit alongside the strong growth in the merchandise and services sector testifies to India’s ability to evolve with the shifting global trade dynamics. Electronics, pharmaceuticals, and engineering products are expected to continue to be the main pillars, while agricultural exports add further support.

The post India’s Export Growth Hits 6.18% in Early FY 2025–26, Driven by Electronics, Pharma, and Gems appeared first on ELE Times.

An expansion of TI’s comprehensive C2000 portfolio, the new MCUs transform the performance of household appliances and power tools

What’s new

Texas Instruments (TI) introduced its most affordable C2000 real-time microcontrollers (MCU), enabling engineers to design products with industry-leading performance at a lower cost. The F28E120SC and F28E120SB MCUs deliver 30% faster computing power compared to previous C2000 MCUs for single motor and power factor correction systems, helping transform the performance of home appliances, from washing machines and dishwashers to vacuum cleaners and power tools.

Powered by TI’s proprietary InstaSPIN field-oriented control (FOC) software and advanced algorithms, these new MCUs enable smoother, quieter and more efficient motor performance. Their advanced capabilities – including high-speed sensorless FOC, high-torque zero-speed startup and sophisticated vibration compensation – deliver highly precise, responsive motor control for everyday applications.

Why it matters

Today’s consumers demand appliances and power tools that operate as efficiently, smoothly and quietly as possible. Yet, historically, system designers have had to compromise by using MCUs with less computing performance and analog integration to meet cost targets.

The F28E12x series of MCUs helps solve this challenge by delivering the performance needed to enable premium motor-control features at a lower price than competing devices. These MCUs eliminate additional components by integrating TI’s C28x digital signal processor core and industry-leading analog peripherals, including a high-speed analog-to-digital converter and programmable gain amplifier, helping simplify designs and lowering costs.

“Since their introduction in the 1990s, TI C2000 MCUs have allowed designers to control both simple and complex motors with low latency and high reliability,” said Vivek Singhal, vice president and general manager, Application-Specific Microcontrollers at TI. “Adding fully featured, ultra-low-cost MCUs to the C2000 portfolio enables new markets to access the industry-leading real-time performance that TI is known for. Using this technology, appliance and power-tool manufacturers can deliver seamless, quiet motor operation, previously considered a luxury, at an affordable price point.”

Moreover, TI’s F28E12x series facilitates fast execution of the sensorless FOC algorithm, enabling motor speeds over 120,000rpm, or 2kHz electrical frequency. The ability to run a motor at high speeds reduces gear transition noise and improves reliability, enabling engineers to design products with smooth, quiet operation. The MCUs can also run a vibration compensation algorithm to achieve up to 60% speed ripple reduction, counteracting the acoustic noise and vibrations caused by an imbalanced load in applications such as washing machines.

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Given the rapid advances in quantum computing, it is urgent now to urge the application of post-quantum cryptography (PQC). Every industry must armor its computing infrastructure against the increasing risk of quantum-enabled attacks. The lack of a singular all-encompassing standard for PQC creates the demand from the developer community for the proactive design of adaptable, future-proof security solutions.

Emerging Requirements for PQC and the Hardware-Software Co-Design

At a recent Security Seminar, the companies governing the evolving PQC requirements and co-design approach of hardware and software were accentuated to attain strong and flexible post-quantum security.

PQC Evolution

The emerging quantum landscape has necessitated guidelines for multiple aspects of PQC. One of the most cited guidelines is the U.S.-based Commercial National Security Algorithm Suite 2.0 (CNSA 2.0), recommending advanced PQC algorithms such as Kyber, Dilithium, LMS, and XMSS.

CNSA 2.0, while good enough as a baseline, is not exhaustive. Here lie its limitations:

Algorithmic diversity gaps: Popular algorithms such as Falcon or Hamming Quasi-Cyclic (HQC) encryption are not completely integrated. The use of multiple algorithms can reduce single points of failure when used strategically.

Regional divergence: PQC regulations are under development in different regions. The Cyber Resilience Act (CRA) of the European Union, China’s proprietary research, and NIST-led standards all produce different compliance requirements. In their PQC strategies, multinational organizations need to consider these differences. Designing Agile PQC Infrastructure With PQC standards still changing, developers face the challenge of designing actual security without locking into obsolete algorithms. A PQC system that is future-ready must, therefore, provide for:

Crypto-Agility

Crypto-agility is a mechanism for developers to switch between cryptographic algorithms seamlessly with capable protocols in updating in the field. Supporting all algorithm types and hybrid models ensure that security systems flex as quantum threats and standards evolve.

Upgradability at Scale

This implies upgrading the infrastructure at scale. Dynamic hardware that can handle new software ensures systems remain secure and performant as algorithms and regulatory requirements change.

High-Quality Entropy

Reliable and unpredictable entropy is essential for the generation of encryption keys and random numbers. International standards are joining the chorus in requiring checks for high-quality entropy to guard against predictable key generation that a quantum computer might favor.

Hardware-Software Co-Design for PQC

Effective PQC cannot talk alone classically. A co-design approach agilely pairs hardware with flexible software towards future-proof systems. QRNGs use the behavior of subatomic particles to generate sequences that are truly unpredictable, so secure, and verifiable entropy at scale.

FPGA enhances the PQC infrastructure as Coprocessors performing complex algorithms efficiently. In their field-upgradable nature, they enable organizations to implement crypto-agility with regional or hybrid algorithmic models without compromising performance and trust.

Staying Prepared for Quantum Threats

PQC is no longer a future concern-it is here. Developers must now create crypto-agile, entropy-assured, and regionally adaptable systems. Leveraging QRNGs and FPGAs enables secure, upgradable cryptographic engines, ensuring resilience against the evolving quantum threat landscape.

(This article has been adapted and modified from content on Lattice Semiconductor.)

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Industries worldwide are urged to decarbonize but unable to do so at the cost of reliability, efficiency, or scale. While renewables may solve the problem in part, a number of sectors require more than just intermittent electricity-they require constant, high-temperature energy for critical processes. That’s where SMRs enter as the really disruptive solution.

Small Modular Reactors are small in size, built in a factory, and vectoral. They bring nuclear power closer to the point of use. Other than producing, carbon-free electricity their thermal energy may be used in hydrogen production, desalination, district heating, and high-temperature industrial processes. To realize all of this, however, they must be integrated with industrial systems in a very smooth manner, and that can be done only through advanced Automation.

Why Automation is the Missing Link in SMR Adoption

Whereas traditional reactors were designed to serve the national grids, SMRs are customized for local industrial deployment. This paradigm shift presents a fresh challenge to synchronize nuclear performance with the idiosyncratic, cake-and-eat-it demand profiles of industrial facilities.

Automation systems serve as the critical bridge delivering real-time monitoring, dynamic control, cybersecurity safeguards, and compliance with nuclear regulations. They ensure SMRs adapt to specific operational environments, whether it’s a refinery that needs constant thermal output or a manufacturing facility that requires flexible load-following capabilities.

Without robust automation, even the most advanced SMR designs risk deployment delays, higher costs, and integration hurdles.

What SMR Developers Should Demand from Automation Partners

To ensure swift adoption of the system for the maximization of ROI considerations, SMR developers need to consider those automation partners that are conversant with nuclear compliance and industrial operations. To name a few:

1. Scalable Control Architecture–From systems introduced into the modular skid systems all through to plant-wide DCS and SCADA integration, Rockwell’s scalable platforms grow with the industrial needs rather than become the cumbersome older platform.
2. Cybersecurity & Compliance–Rockwell systems were developed with cybersecurity requirements for nuclear control systems, such as those from NEI 08-09 and NRC, to reduce risk and audit time by minimizing the number of disjointed platforms requiring evaluation.
3. Workforce Familiarity–Many industries are already running on Rockwell automation systems. This potential transfer of knowledge can greatly reduce commissioning time and, in the contrast, training cost plus maintenance in the long term.
4. Quick Deployment and Costs–An SMR project is capital intensive, and each delay will cost. Streamlining this process through one platform of Rockwell eliminates extra work and cuts down costs of engineering and troubleshooting.
5. Ecosystem of Trusted Partners-With an integrated ecosystem covering instrumentation, analytics, digital twins, and prediction, Rockwell Inc. ensures long-term operational success for SMR facilities.

The Road Ahead: SMRs and Automation Shaping Industrial Energy

This next generation nuclear energy will be distributed, flexible, and designed by industry. SMRs can provide manufacturers, refineries, data centers, and water plants with dependable carbon-free power but require being coupled with advanced automation.

Their integration of automation at the earliest stage of SMR deployment will result in industrial companies becoming resilient, adaptable, and ready for compliance. Those who set out on the road won’t just meet the current demand for energy; they will set the benchmark for industrial decarbonization over the coming years.

(This article has been adapted and modified from content on Rockwell Automation.)

The post How Advanced Automation Drives Industrial Adoption of Small Modular Reactors appeared first on ELE Times.

• Unveils a Made-in-India, industry-first innovation, turning the smartwatch into a true mobility companion and empowering riders with smarter, safer, and more connected rides.
• Delivers real-time ride statistics: battery, tyre pressure, range, and safety alerts, in a simple, glanceable format.
• Built on secure APIs and user permissions, ensuring privacy while unlocking the future of intelligent, connected mobility in India.
• The smartwatch will be exclusively available on the TVS iQube official website.

Noise, India’s leading connected lifestyle brand, and TVS Motor Company (TVSM), a global leader in the two and three-wheeler segments, introduced a Made-in-India, industry-first innovation, India’s first EV-Smartwatch integration, redefining the way riders connect with their vehicles. This integration connects the TVS iQube electric scooter with a special edition TVS iQube Noise Smartwatch, customized to provide real-time access to critical updates including vehicle status, battery insights, tyre pressure, and safety alerts along with a plethora of native watch features.

Noise has been leading the smartwatch market in India for four consecutive years, while TVS iQube has surpassed the 6,50,000 unit sales milestone in the domestic market, reaffirming its position as India’s No.1 EV scooter brand. This partnership with TVS  further enhances customer choice, turning the smartwatch into a true mobility companion that provides seamless access to vehicle features. As smartwatches evolve beyond lifestyle accessories, they are becoming command centers of productivity and mobility, making everyday rides smarter, safer, and more convenient. Together, TVS iQube and Noise are setting a new benchmark in connected technology and customer experience.

Commenting on the launch, Amit Khatri, Co-Founder, Noise, said, “At Noise, our vision has always been to build technology that empowers people to live, move, and stay connected with ease. This partnership with TVS Motor Company is a powerful step in that direction, bringing meaningful innovation to the wrist by turning the smartwatch into a mobility companion. As consumers look for smarter, more integrated ways to move through their day, this first-of-its-kind experience reflects our commitment to pushing boundaries, delivering purposeful technology, and shaping the future of connected living in India.”

Speaking on the industry-first innovation, Aniruddha Haldar, Senior Vice President — Head Commuter & EV Business and Head Corporate Brand & Media, TVS Motor Company said, “We are committed to reimagining the future of mobility by seamlessly blending technology, sustainability and customer-centric innovation. Our partnership with Noise is a testament to this vision, transforming the smartwatch from a lifestyle device into a smart riding assistant. By integrating the TVS iQube with a connected smartwatch, we are empowering our riders with smarter, safer and more intuitive journeys while shaping the future of mobility in India.”

THE EV-SMARTWATCH INTEGRATION DELIVERS:

Features	Description
Vehicle Status Monitoring	Locked, Unlocked, On Ride, Charging, or Charging Complete displayed clearly on the smartwatch.
State of Charge (SoC)	Battery percentage with visual cues for charging progress and low battery alerts (below 20%).
Distance to Empty (DTE)	Shows estimated range across ride modes to help plan commutes and charging stops more efficiently
Tyre Pressure Monitoring (TPMS)	Live pressure values for both tyres with recommended pressure benchmarks and alerts on select models.
Charging Progress	Real-time charging updates, including time-to-full and “Charging Complete” notification.
Tow/Theft Alert	Haptics and visual prompts triggered when motion is detected, followed by a mobile app notification.
Crash/Fall Detection	On-wrist alert followed by a notification in the app in case of a crash or fall.
Geofence Notifications	Alerts when the vehicle crosses a predefined geofence boundary, synced from the mobile app.
Low/Full Charge Alerts	Notifications to connect or unplug the charger based on battery level.
Safety Visual Cues	Color-coded tiles (Green = optimal, Red = attention needed) to minimize decision time and distractions.

 

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Infineon Technologies AG has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

The IM72D128V is distinguished by its top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), making it particularly suited for applications requiring precise low-noise audio pick-up. It operates at ultra-low power consumption, with 430 µA in high-performance mode and
160 µA in low-power mode, which makes it ideal for energy-efficient, battery-powered devices such as high-end headphones. With a footprint of 4 x 3 x 1.2 mm³, it is still small enough to fit most space constraint consumer devices.

The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm³, which makes it ideal for space-constrained devices. It achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, operating at 450 µA in high-performance mode and 170 µA in low-power mode, contributing to extended battery life in portable devices ensuring extended battery life. Its small size makes it particularly suited for multi-microphone designs in compact systems. The devices can be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras.

The IM72D128V and IM69D129F are part of Infineon’s XENSIV MEMS microphone family, offering exceptional audio quality, low power consumption, and high durability. They also support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. Furthermore, both microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems.

In addition, the IM72D128V and IM69D129F are equipped with a low-noise preamplifier and a sigma-delta ADC, providing digital PDM output for seamless integration into modern audio systems. Their shared features include an 11 Hz flat frequency response for precise sound reproduction and a ±1 dB sensitivity tolerance, making them ideal for multi-microphone arrays. Whether used for far-field audio pick-up or portable devices, these microphones enable high-quality audio capturing in challenging environments while enhancing energy efficiency and reliability. Both microphones comply with IEC (60747, 60749) and JEDEC (47/20/22) standards, ensuring reliability and robustness for consumer and industrial applications.

The post Infineon expands XENSIV MEMS microphone lineup delivering best-in-class audio and power performance appeared first on ELE Times.

Microchip launches six variants targeting high-growth motor drive, data center and sustainability applications

The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power density and simplify system design. Microchip Technology announced a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300–900A. The new DP3 power modules are designed to address the growing demand for compact, cost-effective and simplified power converter solutions.

These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15–20% compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. DP3 modules enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability and ease of use in industrial drives, renewables, traction, energy storage and agricultural vehicles.

Available in a phase-leg configuration, the DP3 power modules in a compact footprint of approximately 152 mm × 62 mm × 20 mm, enable a frame size jump for increased power output. This type of advanced power packaging eliminates the need for paralleling multiple modules and helps reduce system complexity and Bill of Materials (BOM) costs. Additionally, DP3 modules provide a second-source option to industry-standard EconoDUAL packages for greater flexibility and supply chain security for customers.

“Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit. “To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”

The DualPack 3 power modules are well-suited for general-purpose motor drive applications and address common challenges such as dv/dt, complexity in driving, higher conduction losses and no overload capability.

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Explore TI’s comprehensive portfolio of analog and embedded processing semiconductors for energy infrastructure, automotive and connected appliances

Texas Instruments (TI) is demonstrating its leading semiconductor innovations for energy infrastructure, automotive and connected appliances at electronica India, September 17-19, in Bengaluru, India. TI’s exhibit in Hall 3, booth D11 at the Bangalore International Exhibition Centre showcases the latest advancements in applications such as HVAC fans, vacuum cleaners and electric 2-wheelers.

“At electronica India 2025, TI is showcasing how our latest semiconductor innovations are enabling energy-efficient, smart and secure solutions that are essential for building a more sustainable future,” said Santhosh Kumar, president and managing director, TI India. “TI’s comprehensive portfolio of analog and embedded semiconductors, combined with our industry-leading technologies and system-level expertise, enables customers to design intelligent systems that are accelerating energy savings at scale across industries.”

New ultra-low-cost, real-time MCUs

At the tradeshow, TI is debuting the most affordable devices in its C2000 real-time microcontroller portfolio (MCU), which enable engineers to design products with industry-leading performance at a lower cost. The F28E120SC and F28E120SB MCUs deliver smoother, quieter and more efficient motor performance in a wide range of home appliances and power tools.

The new F28E120SC MCU is featured in two on-site demonstrations, including:

• Noise reduction in appliance fans: See how the F28E120SC MCU can control a high-voltage three-phase motor and run a total harmonic distortion reduction algorithm, enabling engineers to reduce noise and improve efficiency in a fan for heating, ventilation and air-conditioning system.
• High-speed sensorless motor control in vacuum cleaners: Explore how the F28E120SC MCU can use sensorless FOC software to control a low-voltage vacuum motor, enabling high efficiency, smooth and stable startup, and reduced peak currents. Booth visitors will be able to quickly and easily spin the motor up to 150,000rpm.

Reimagine safe and efficient electric two- and three-wheelers

TI is also showcasing how its comprehensive product portfolio and reference designs enable innovation across the electric vehicle ecosystem. This includes LED drivers for lighting systems, processors for displays and entertainment, battery management technologies, motor control solutions and more.

Notable demonstrations include:

• 750W light electric vehicle charger: See a 750W light electric vehicle charger powered by the UCC25661-Q1 LLC controller optimal for e-bikes, scooters, and other light electric vehicles. This charger features TI’s patented input power proportional control (IPPC) technology, which provides consistent, stable charging even when batteries are nearly empty.
• Efficient electric vehicle charging with F29x C2000 MCUs: Explore how a single F29xC2000 MCU can power a highly compact 11kW electric vehicle charging system. This design combines both high and low voltage power conversion in one stage, achieving remarkable efficiency (97.6%) while taking up minimal space. The system delivers 5.5 kilowatts of power per liter of volume, helping make electric vehicles more practical with faster charging in smaller, more affordable charging units.
• High-voltage battery management system: Learn about smarter battery management with TI’s high-voltage battery management system (BMS) technology that enhances safety and reliability for large battery packs. This complete solution includes both hardware components and software tools that help manufacturers build better battery systems more quickly.
• CC35xxE wake word detection: Explore Edge AI audio capabilities with 3rd Party Sensory’s TrueHandsfree library on TI’s CC3551 Wi-Fi 6 and Bluetooth LE 5.4 wireless MCU. This can be activated using voice command wake word, which helps to control the Edge IoT device.
• High power density adapters with integrated GaN: See a tiny yet powerful 65W charger with two USB ports using TI’s integrated GaN technology. These chargers pack more power into less space (2.3W per cubic inch), making them significantly smaller than traditional chargers while delivering the same performance. This means more convenient, portable charging solutions for laptops, phones, and other devices.

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Changing geophysical systems are observed from frost in forests to shifting ice packs by satellites equipped with advanced semiconductors. For centuries, human beings have been trying to figure out how to connect environmental occurrences. Suppose a frost attack happens far away in the forest, only to be followed by a heavy storm that causes silt deposits in a harbor far away; then, such cause-effect patterns are nearly impossible to observe on the ground. Modern earth-observation satellites make these connections clearer than ever due to state-of-the-art imaging techniques and ruggedized semiconductor components built to reside in space.

There goes the big picture with imaging methods.

Optical, radar, and infrared imaging combine to provide a multidimensional view of Earth.

• Optical imagery may see changes in the visible spectrum weather, ash clouds, and landscape.
• Radar imaging penetrates clouds to get details of the ground, with synthetic aperture radar being a higher resolution system thanks to the usage of orbital motion to synthesize enormous antennas.
• Infrared and hyperspectral imaging convey the composition of the soil, atmosphere, and temperature variation.

Put together, these imaging methods track environmental change over time: predicting ice sheets shrinking, sea levels rising, or shifts in the ecosystem.

Making satellites that last

While the imaging isn’t new, the instrumentation has to be created so that components can withstand radiation, extreme temperatures, and years without maintenance. Here semiconductor classifications and packaging play a big role.

• QML Class V devices coated with hermetic ceramic are suitable for high-radiation environments with long-term operational reliability.
• QML Class P devices, on the other hand, use specialized plastic packaging, thus creating a balancing act between durability and small size, leading to more compact and capable satellites.
• Radiation-tolerant components satisfy low Earth orbit purposes with cost sensitivity, implementing proven resilience for their relatively reduced lifespans.

These classifications enable designers of satellites to take into consideration whether the mission requires long-term monitoring from geosynchronous orbit or urgently supplying large constellations in low Earth solutions.

Preparing for challenges to come

Satellites can constantly monitor Earth for years because to dependable, radiation-hardened semiconductors, giving scientists and decision-makers vital data. Researchers are better equipped to foresee potential hazards and make wise judgments when they can see how environmental interactions, such as temperature changes and soil chemistry, change over time.
The Earth is billions of years old, and we have only been measuring it for the smallest fraction of time, according to Jason Clark, systems manager for Space and Avionics at Texas Instruments. We are assisting scientists in preparing for the future by collaborating with them today.

(This article has been adapted and modified from content on Texas Instruments.)

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TE, Harwin, and Hirose have released their new next-generation connector families for data centers, industrial systems, and consumer electronics, offering better speed, reliability, and space savings.