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Зустріч з представниками турецької технологічної компанії ASPILSAN Enerji kpi пт, 07/04/2025 - 15:31

Two-phase cooling

Thermal management is an ongoing concern for many designs. The process usually begins with a tactic for dissipating or removing heat from the primary sources (mostly but not exclusively “chips”), then progresses to keeping the circuit-board assembly cool, and finally getting the heat out of the box and “away” to where it becomes someone else’s problem. Passive and active approaches are employed, involving some combination of active or passive convection, conduction (in air or liquid), and radiation principles.

The search for an effective cooling and thermal transfer solution has inspired considerable research. One direct approach uses microchannels embedded within the chip itself. This allows coolant, usually water, to flow through, efficiently absorbing and transferring heat away.

The efficiency of this technique is constrained, however, by the sensible heat of water. (“Sensible heat” refers to the amount of heat needed to increase the temperature of a substance without inducing a phase change, such as from liquid to vapor.) In contrast, the latent heat of phase change of water—the thermal energy absorbed during boiling or evaporation—is around seven times greater than its sensible heat.

Two-phase cooling with water can be achieved by using the latent heat transition, resulting in a significant efficiency enhancement in terms of heat dissipation. Maximizing the efficiency of heat transfer depends on a variety of factors. These include the geometry of the microchannels, the two-phase flow regulation, and the flow resistance; adding to the task, there are challenges in managing the flow of vapor bubbles after heating.

Novel water-cooling system

Now, a team at the Institute of Industrial Science at the University of Tokyo has devised a novel water-cooling system comprising three-dimensional microfluidic channel structures, using a capillary structure and a manifold distribution layer. The researchers designed and fabricated various capillary geometries and studied their properties across a range of conditions to enhance thin-film evaporation.

Although this is not the first project to use microchannels, it presents an alternative physical arrangement that appears to offer superior results.

Not surprisingly, they found that both the geometry of the microchannels through which the coolant flows and the manifold channels that control the distribution of coolant influence the thermal and hydraulic performance of the system. Their design centered on using a microchannel heat sink with micropillars as the capillary structure to enhance thin-film evaporation, thus controlling the chaotic two-phase flow to some extent and mitigating local dry-out issues.

This was done in conjunction with three-dimensional manifold fluidic passages for efficient distribution of coolant into the microchannels, Figure 1.

Figure 1 Microfluidic device combining a microchannel layer and a manifold layer. (A) Schematic diagrams of a microfluidic device. Scale bar: 5 mm. (B) Exploded view of microchannel layer and manifold layer. The heater is located on the backside of the substrate with parallel microchannels. Both the microchannel layer and manifold layer are bonded with each other to constitute the flow path. (C) The coolant flows between the manifolds and microchannels to form an N-shaped flow path. The capillary structures separate the vapor flow from the liquid thin film along the sidewall. The inset schematic shows the ordered two-phase flow under ideal conditions. Scale bar: 50 mm. (D) Cross-sectional schematic view of bonded device showing the heat and fluid flow directions. (E) Clamped device is mechanically tightened using bolts and nuts. (F) Images of clamped device showing the isometric, top, and side views. Scale bar, 1 cm. Source: Institute of Industrial Science at the University of Tokyo

Testing this arrangement requires a complicated electrical, thermal, and fluid arrangement, with clamps to put just the right calibrated pressure on the assembly for a consistent thermal impedance, Figure 2. They also had to allow time for start-up thermal transients to reach steady-state and take other test subtleties into account.

Figure 2 The test setup involved a complicated arrangement of electrical, thermal, mechanical, and fluid inputs and sensors, all linked by a LabVIEW application; top: system diagram; bottom: the actual test bench. Source: Institute of Industrial Science at the University of Tokyo

Their test process included varying key physical dimensions of the micropillars, capillary microchannels, and manifolds to determine optimum performance points.

It’s difficult to characterize performance with a single metric, Figure 3.

Figure 3 Benchmark of experimentally demonstrated critical heat flux and COP of two-phase cooling in microchannel using water. Zone 1 indicates the results in this work achieving efficient cooling by using a mass flow rate of 2.0 g/min with an exit vapor quality of 0.54. The other designs using manifolds marked by solid symbols in zone 2 consume hundreds of times of water with an exit vapor quality of around 0.1. The results of microstructure-enhanced designs are marked by open symbols in zone 3. Zone 4 shows the performance of typical single-phase cooling techniques. Source: Institute of Industrial Science at the University of Tokyo

One such number, the measured ratio of useful cooling output to the required energy input (the dimensionless coefficient of performance, or COP) reached up to 105, representing a meaningful advance over other water-channel cooling techniques that are cited in the references.

Details including thermal modeling, physics analysis, device fabrication, test arrangement, full data, results, and data discussion are in their paper “Chip cooling with manifold-capillary structures enables 105 COP in two-phase systems” published in Cell Reports Physical Science.

As noted earlier, this is not the first attempt to use microchannels to cool chips; it represents another approach to implementing this tactic. Do you think this will be viable outside of a lab environment in the real world of mass-volume production and liquid interconnections? Or will it be limited to a very small subset, if any, of enhanced chip-cooling solutions?

Bill Schweber is an EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features.

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The post Can microchannels, manifolds, and two-phase cooling keep chips happy? appeared first on EDN.

• Rural Rising initiative has reached more than 350,000 individuals across Bangarpet and Mulabagilu Taluks
• New Taluk-Level Community Library launched to enhance educational access

Applied Materials India Private Limited in partnership with United Way Bengaluru (UWBe) celebrated a decade of transformative impact in the Kolar district through their flagship initiative, The Rural Rising. This milestone celebrates a journey of growth, sustainable development, and community empowerment that has reached more than 350,000 individuals across 288 villages in Bangarpet and Mulabagilu taluks.

To commemorate the occasion, a Taluk-level community library was inaugurated, reinforcing the initiative’s commitment to educational access and lifelong learning. Avi Avula, Country President of Applied Materials India and Vice President, Semiconductor Products Group, Asia, along with Rajesh Krishnan, CEO, United Way Bengaluru attended the event.

“This milestone is not just a celebration of what we’ve achieved, but a reaffirmation of what’s possible when business, community, and purpose come together”, said Avi Avula. “The Rural Rising initiative has shown us the power of sustained engagement in driving meaningful change”, he added.

A Model for Sustainable Rural Development

Launched in 2015, The Rural Rising initiative was conceived by United Way Bengaluru and implemented by Applied Materials India to address the unique needs of rural communities through a four-pillar approach: education, environment, health, and livelihood. Key achievements over the past decade include:

• Education:
  • 2,299 students mentored and supported through scholarships and enriched learning environments
  • Launch of a new community library to promote literacy and digital access
• Environment:
  • 7 lakes rejuvenated
  • 434 solar-powered streetlights installed
  • 203 tonnes of CO₂ emissions reduced annually
• Livelihoods:
  • 1,170 women, people with disabilities, and rural youth empowered with income-generating skills
  • 561 farmers supported through soil and water conservation programs
  • 8+ community water ATMs installed, benefiting over 4,000 residents
  • Improved sanitation and hygiene infrastructure across villages

“Collaboration is at the heart of the Rural Rising flagship program. By partnering with Applied Materials India, local authorities, and the community, we have made sure that local perspectives are taken into the development process, from planning to implementation. This way, we are helping them take charge of their own progress and build lasting, self-sustaining change in Kolar, said Rajesh Krishnan, CEO of United Way Bengaluru.”

Scaling the Vision Beyond Kolar

Inspired by the success in Kolar, Applied Materials India and UWBe have expanded The Rural Rising to Coimbatore (Tamil Nadu), and Khed Taluk (Pune, Maharashtra). These new chapters will build on the proven model, focusing on education, sports infrastructure, and ecological sustainability. With continued investment and collaboration with local governments, the initiative is poised to scale its impact and enable long-term, community-driven transformation across rural India.

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Aimed at AI/ML applications, Renesas’ RA8P1 MCUs leverage an Arm Ethos-U55 neural processing unit (NPU) delivering 256 GOPS at 500 MHz. The 32-bit devices also integrate dual CPU cores—a 1-GHz Arm Cortex-M85 and a 250-MHz Cortex-M33­—that together achieve over 7300 CoreMark points.

The NPU supports most commonly used neural networks, including DS-CNN, ResNet, Mobilenet, and TinyYolo. Depending on the neural network used, the Ethos-U55 provides up to 35× more inferences per second than the Cortex-M85 processor on its own.

RA8P1 microcontrollers provide up to 2 MB of SRAM and 1 MB of MRAM, which offers faster write speeds and higher endurance than flash memory. System-in-package options include 4 MB or 8 MB of external flash memory for more demanding AI tasks.

Dedicated peripherals and advanced security features support voice and vision AI, as well as real-time analytics. For vision AI, a 16-bit camera engine (CEU) handles image sensors up to 5 megapixels, while a separate two-lane MIPI CSI-2 interface provides a low pin-count connection at up to 720 Mbps per lane. Audio interfaces including I²S and PDM enable microphone input for voice AI. To protect edge AI and IoT systems, the devices integrate cryptographic IP, enforce immutable storage, and monitor for physical tampering.

The RA8P1 MCUs are available now in 224-pin and 289-pin BGA packages.

RA8P1 product page

Renesas Electronics 

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ST’s VIPER11B voltage converter integrates an 800-V avalanche-rugged MOSFET with PWM current-mode control to power smart home and lighting applications up to 8 W. On-chip high-voltage startup circuitry, a senseFET, error amplifier, and frequency-jittered oscillator help minimize external components. The MOSFET requires only minimal snubbing, while the senseFET enables nearly lossless current sensing without external resistors.

As an off-line converter operating from 230 VAC, the VIPER11B consumes less than 10 mW at no load and under 400 mW with a 250-mW load. Under light-load conditions, it operates in pulse frequency modulation (PFM) mode with pulse skipping to enhance efficiency and support energy savings. The controller runs from an internal VDD supply ranging from 4.5 V to 30 V.

Housed in a compact 10-pin SSOP package, the converter conserves space—especially in designs with strict form factors like LED lighting drivers and smart bulbs. It’s also well suited for home appliances, low-power adapters, and smart meters. The device includes output overload and overvoltage protection with automatic restart, along with VCC clamping, thermal shutdown, and soft-start features.

In production now, VIPER11B voltage converters are priced from $0.56 each in lots of 1000 units.

VIPER11B product page

STMicroelectronics

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Designed for automotive use, Murata’s 50-V multilayer ceramic capacitor (MLCC) delivers higher capacitance in a compact 0805-size (2.0×1.25-mm) SMD package. With a rated capacitance value of 10 µF, the GCM21BE71H106KE02 ranks among the smallest in its class.

The capacitor operates on 12-V automotive power lines while conserving PCB space and reducing the overall capacitor count. It delivers approximately 2.1 times the capacitance of Murata’s earlier 4.7-µF/50-V model in the same 0805 footprint. Compared to the previous 10-µF/50-V MLCC in the larger 1206 size (3.2×1.6 mm), it occupies about 53% less board area, offering significant space savings for automotive designs.

The GCM21BE71H106KE02 10-µF/50-V capacitor in the 0805 package is now in production. Use the product page link below to request samples, get a quote, or check availability.

GCM21BE71H106KE02 product page

Murata Manufacturing 

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Rohm has introduced the BM6GD11BFJ-LB, an isolated gate driver optimized for 600-V-class GaN HEMTs in industrial equipment such as motors and server power supplies. When paired with GaN transistors, the single-channel driver maintains stable operation under high-frequency, high-speed switching conditions.

The device ensures safe signal transmission by galvanically isolating the control circuitry during switching events with fast voltage rise and fall times. Its 4.5-V to 6.0-V gate drive range and 2500-Vrms isolation rating support a broad selection of high-voltage GaN devices, including Rohm’s 650-V EcoGaN HEMT. Low output-side current consumption—0.5 mA maximum—helps reduce standby power and improve overall system efficiency.

The BM6GD11BFJ-LB uses proprietary on-chip isolation to reduce parasitic capacitance, enabling high-frequency operation up to 2 MHz and reducing external component count. Enhanced CMTI of 150 V/ns—reportedly 1.5× higher than conventional products—prevents malfunctions during fast GaN switching. A reduced minimum pulse width of 65 ns improves duty cycle control, allowing stable, efficient operation at higher frequencies.

The BM6GD11BFJ-LB isolated gate driver is now available through online distributors including DigiKey and Mouser. Samples are priced at $4 each.

BM6GD11BFJ-LB product page

Rohm Semiconductor 

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Primemas, a fabless company specializing in SoC Hublets (hub chiplets), is now sampling its Compute Express Link (CXL) 3.0 memory controller. The company is collaborating with Micron through its CXL ASIC Validation Lab (AVL) program to accelerate the commercialization of next-generation CXL controllers compatible with Micron’s advanced DRAM modules.

Hublets are SoC modules in a pluggable chiplet format, offering a range of IP infrastructure, including CPU, network-on-chip bus, memory controllers, and resource schedulers, along with high-bandwidth, low-latency die-to-die interfaces.

Unlike conventional CXL memory expansion controllers constrained by fixed form factors and limited DRAM capacity, Primemas says its chiplet technology offers greater scalability and modularity. Working with Micron, the company aims to deliver a reliable CXL 3.0 controller paired with Micron’s high-capacity 128-GB RDIMM modules.

The semiconductor startup has delivered engineering samples and development boards to strategic customers and partners, who have helped validate the performance and capabilities of its Hublet versus alternative CXL controllers. Building on this early success, Primemas is now ready to ship Hublet product samples to memory vendors, customers, and ecosystem partners.

Learn more about Primemas Hublets here.

Primemas

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Договір між КПІ та ТОВ "Н-ІКС Делівері" відкриває нові можливості kpi чт, 07/03/2025 - 22:58

In cooperation with Erlangen-based Fraunhofer IISB (Institute for Integrated Systems and Device Technology) and Neuss-based bimanu Cloud Solutions GmbH in Germany, Herzogenrath-based deposition equipment maker Aixtron SE is leading a joint project ‘Increasing Energy Efficiency in SiC Epitaxy’...

Stephen Woodward’s DI, “Flip ON Flop OFF” does a wonderful job for DC voltages. I thought of extending this idea to much-needed AC voltages, as all our gadgets work with AC voltages.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 shows the compact circuitry using a simple counter IC. This circuit utilizes a single push-button (PB) to switch between ON and OFF states for AC voltages. When you push PB once, the output terminal J2 gets 230V/110V AC. For the next push, output at J2 becomes zero. This action continues for subsequent pushes. Accordingly, the gadget connected to J2 will be ON or OFF.

Figure 1 Pushbutton circuit that switches on ON and OFF for AC voltages using electromechanical relay (RL1).

In Figure 1’s circuit, when PB is momentarily pushed once, U1’s(counter 4024) Q1 goes HIGH, counting one input pulse, which makes the Darlington pair Q1 and Q2 conduct. Relay RL1 gets energized. Its NO contact closes and passes 230V/110V AC connected to J1 to J2. The gadget connected to J2 turns ON.

When you push PB again, the second pulse is generated and counted by U1. It’s Q1 (LSB of counter) becomes LOW, making Q1 and Q2 OFF. The relay gets de-energized, and the AC voltage to J2 gets disconnected, making the gadget turn off. R2 and C2 are for the power-on reset of U1.

If you prefer not to use an electromechanical relay, a solid-state relay can be used, as shown in Figure 2. In this circuit, when you push PB once, the Q1, Q2 pair starts conducting, current flows through the LED of U3, an optically coupled TRIAC, causing it to conduct. Due to this, U4 TRIAC conducts, passing 230V/110V to J2. When you push PB again, the Q1, Q2 pair opens, stopping current flow through the LED of U3. The TRIACs of U3 and U4 stop conducting, disconnecting power to J2.

Figure 2 Circuit switches AC power on and off for output-connected gadgets using a solid-state relay formed by U3 and U4.

Jayapal Ramalingam has over three decades of experience in designing electronics systems for power & process industries and is presently a freelance automation consultant.

Related Content

• Flip ON Flop OFF
• To press ON or hold OFF? This does both for AC voltages
• Elaborations of yet another Flip-On Flop-Off circuit
• Flip ON flop OFF without a flip/flop

The post Push ON, Push OFF for AC voltages appeared first on EDN.

Участь КПІ ім. Ігоря Сікорського у HR Wisdom Summit 2025 KPI4U-2 чт, 07/03/2025 - 16:21

When gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA announced a strategic partnership for Taiwanese foundry Powerchip Semiconductor Manufacturing Corp (PSMC) to start production of 100V GaN products on 200mm silicon wafers in first-half 2026, this includes Navitas’ 650V devices transitioning from its existiing sole GaN-on-Si wafer foundry supplier Taiwan Semiconductor Manufacturing Company Ltd (TSMC) to Powerchip over the next 12–24 months...

📰 Газета "Київський політехнік" № 27-28 за 2025 (.pdf) Інформація КП чт, 07/03/2025 - 15:00

Mouser Electronics Inc (a Berkshire Hathaway company) has announced a global distribution agreement with Ampleon B.V. of Nijmegen, The Netherlands, which manufactures radio frequency power devices based on gallium nitride (GaN) and LDMOS technologies. Ampleon says that its portfolio offers flexibility in scaling design and production for any volume and addresses a wide range of applications, including 5G infrastructure, industrial, scientific & medical (ISM), navigation, broadcast communications, and safety radio...

Антикорупційний квест 2.0 — “Вибір за вами” kpi чт, 07/03/2025 - 11:43

Murata company pSemi Corp of San Diego, CA, USA – a fabless provider of radio-frequency (RF), analog and mixed-signal solutions – has announced leadership changes and organizational restructuring to support its evolving business strategy and future growth...

Less than a month after Qualcomm announced its acquisition of Alphawave Semi, another chiplet deal is in play. Artificial intelligence (AI) chip developer Tenstorrent has snapped up Blue Cheetah Analog Design after licensing its die-to-die (D2D) interconnect IP for AI and RISC-V chiplet solutions.

Blue Cheetah was founded in 2018 with an initial investment from Marvell co-founders Sehat Sutardja and Weili Dai and their pioneering vision for chiplets. Its BlueLynx D2D interconnect subsystem IP provides physical (PHY) and link layer chiplet interfaces compatible with both Open Compute Project (OCP) Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) standards.

Blue Cheetah also brings a wealth of analog mixed-signal expertise in developing D2D, DDR, SerDes, and other technologies critical in chiplet design. It’s co-founder and CEO Elad Alon is an expert in analog and mixed-signal design. He is also the technical lead of the Bunch of Wires PHY standard.

In addition to chiplet designers, Blue Cheetah offers chiplet interconnect IP solutions to various foundries and process nodes. Earlier this year, it announced the successful tape-out of its BlueLynx D2D PHY on Samsung Foundry’s 4-nm SF4X process node.

The latest version of BlueLynx PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps. As a result, the BlueLynx subsystem IP enables chip architects to meet the bandwidth density and environmental robustness necessary to ensure successful production deployment.

Qualcomm’s acquisition of Alphawave Semi and Tenstorrent buying Blue Cheetah mark an important step in the consolidation of the chiplet ecosystem. With the acquisition of Blue Cheetah, Tenstorrent will gain in-house capabilities for advanced interconnects and other analog and mixed-signal components.

Will 2025 be the year of chiplets? Are there more chiplet acquisitions in the works? There are several chiplet upstarts, such as Baya Systems and Chipuller, and likely, larger semiconductor outfits are currently eyeing them to acquire chiplet design capabilities.

Related Content

• Tony Pialis: A SerDes technology design veteran
• Chiplets advancing one design breakthrough at a time
• Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
• Tenstorrent Shows Off Single-User LLM Speed For Workstation
• Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
• Qualcomm’s Alphawave Acquisition Targets Data Centers and AI, But What’s Next?

The post Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree appeared first on EDN.

The rapid advancement of electrification has revolutionized the energy and mobility sectors and provides decisive impulses for industry and society. Power electronics is the indispensable driver of this transformation. With the acquisition of ZES ZIMMER Electronic Systems GmbH, Rohde & Schwarz complements its broad T&M portfolio.

In the constantly changing market environment of the past few decades, ZES ZIMMER Electronic Systems GmbH has managed to achieve continuous growth through innovative solutions and products. The ZES ZIMMER Electronic Systems GmbH portfolio will contribute to expanding the market position of Rohde & Schwarz in the field of power electronics. The family owned company in Hesse with around sixty employees will be fully integrated into the Rohde & Schwarz group. The location will be retained and will continue to be used for power measurement equipment.

For Christina Geßner, Executive Vice President Test & Measurement Division, the acquisition is an important next step that contributes to the sustainable growth strategy of the global technology group: “Both Rohde & Schwarz and ZES ZIMMER Electronic Systems GmbH are privately owned companies with a long tradition. A passion for technology and innovation has always been in the DNA of both our companies. The acquisition will further strengthen our position as a relevant and reliable technology partner for our customers in the field of power measurements, create synergies and generate further growth.”

ZES ZIMMER Electronic Systems GmbH has been an established name in the power measurement market for more than 40 years and not only has a broad customer base but also a strong sales network. The privately-owned company’s exceptionally strong product portfolio supports a wide range of industry-leading use cases and applications, particularly in the electromobility, industrial electronics and renewable energy sectors. The future consolidation and bundling of expertise and portfolios represent a significant expansion of the Test & Measurement Division’s existing offering in the field of power electronics.

Dr. Conrad Zimmer, Managing Partner of ZES ZIMMER Electronics Systems GmbH, says: “Decarbonisation and electrification of various industries will have a major impact on the demand for power electronics and power measurements in the coming decades. A merger with Rohde & Schwarz will allow ZES ZIMMER to make the best use of these growth opportunities. Georg Zimmer founded the company in 1980, and over the last four decades, the employees have built a company with a passion for technology and engineering, whose products are known and appreciated worldwide. I thank our customers for their trust in the company and its products, and all our employees for their dedication and loyalty, and I believe that as a privately-owned company that thinks long term, Rohde & Schwarz will continue the success story of ZES ZIMMER.”

The complete takeover of ZES ZIMMER Electronic Systems GmbH into the Rohde & Schwarz group is an important building block in the long-term growth strategy. At the same time, Rohde & Schwarz is expanding its development capacity with the acquisition and strengthening Germany as an industrial and technological powerhouse.

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Designed for Permanent Contact With Variety of Liquids, AEC-Q200 Qualified Device Eliminates the Need for Costly Wire to Wire Connectors

Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified NTC immersion thermistor. Featuring a miniature design with a compact sensor tip and thin insulated wire, the Vishay BCcomponents NTCAIMM66H is ideal for the small spaces of liquid-cooled automotive systems, where it provides a fast 1.5 s response time to temperature changes.

The rugged device released consists of a miniature NTC thermistor mounted in a stainless steel 316L housing with lead (Pb)-free brass, and 0.35 mm² AWG#22 insulated lead wires with a FLR2X construction that enables a traction force higher than 30 N. These wires allow for direct crimping with automotive connectors eliminating the need for costly wire to wire connectors while the stainless-steel housing enables permanent contact with water or other liquids.

The NTCAIMM66H will be used for temperature measurement, sensing, and control in liquid-cooled automotive systems such as HEV/EV on-board chargers (OBC) and charging plugs and sockets, in addition to solar heating systems, energy storage systems, industrial drives and tools, and servers. The device can be customized with different cable and stripping lengths, gauges, and conductor plating to meet the need of specific applications, enabling Vishay customers to integrate the thermistor into their complete sensor solutions for HEV / EV thermal management systems (TMS).

The immersion sensor offers resistance at +25 °C (R25) of 10 kΩ, with tolerance of ± 2 %, and beta (B25/85) of 3984 K, with tolerance of ± 0.5 %. The device features maximum power dissipation of 100 mW and an operating temperature range of -40 °C to +125 °C.

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