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After supplying Peroxidizer highly concentrated hydrogen peroxide gas delivery systems since 2013, industrial gas company Taiyo Nippon Sanso Corp (TNSC) of Tokyo, Japan (part of Nippon Sanso Holdings Group) has added to the BRUTE suite of chemicals by beginning to sell BRUTE Peroxide in Japan...

Modern bomber jets represent the pinnacle of aerospace engineering, combining stealth, speed, payload capacity, and cutting-edge avionics. The evolution of these aircraft has been driven by the need for superior strategic deterrence, precision strikes, and the ability to operate in contested environments. Here’s a look at the top 10 bomber jets in the world as of 2025, ranked based on their technological capabilities, combat effectiveness, and future potential.

1. Northrop Grumman B-21 Raider (USA)

The B-21 Raider is the latest stealth bomber developed for the United States Air Force (USAF). Designed to replace the aging B-1B Lancer and B-2 Spirit, it features next-generation stealth technology, extended range, and AI-assisted avionics. The aircraft is optimized for both nuclear and conventional strikes, with the ability to penetrate sophisticated air defense systems. It is expected to enter service by the late 2020s.

2. Northrop Grumman B-2 Spirit (USA)

The B-2 Spirit remains one of the most advanced stealth bombers ever built. Featuring a flying wing design, it can evade radar detection and deliver nuclear and conventional payloads. Though expensive to maintain, its strategic importance remains unparalleled.

3. Tupolev PAK DA (Russia)

Russia’s PAK DA, currently in development, is envisioned as a long-range stealth bomber capable of carrying hypersonic weapons. It will replace the Tu-160 and Tu-22M3 bombers, leveraging a flying wing design similar to the B-2 Spirit.

4. Tupolev Tu-160M2 (Russia)

The upgraded Tu-160M2 is an improved version of the Cold War-era Tu-160. It boasts advanced avionics, electronic warfare systems, and extended operational range, making it Russia’s premier supersonic strategic bomber.

5. Rockwell B-1B Lancer (USA)

Despite its age, the B-1B Lancer remains a formidable long-range bomber. With a variable-sweep wing design, it can reach supersonic speeds and carry a massive payload, including precision-guided munitions.

6. Xian H-20 (China)

China’s H-20 is expected to be a game-changer in strategic bombing. It is anticipated to feature advanced stealth, extended range, and the ability to deliver nuclear and conventional payloads deep into enemy territory.

7. Tupolev Tu-22M3M (Russia)

The Tu-22M3M is a modernized version of the Tu-22M3, featuring improved avionics, radar systems, and precision-guided missile capabilities. It plays a critical role in Russia’s tactical and strategic bombing operations.

8. Boeing B-52H Stratofortress (USA)

The legendary B-52H, first introduced in the 1950s, continues to serve as a backbone of the USAF’s bomber fleet. Modernized with advanced electronics and weaponry, it remains a highly effective platform for strategic operations.

9. Dassault Rafale F4 (France) – Tactical Bomber Variant

While primarily a multirole fighter, the Rafale F4 variant is equipped with advanced strike capabilities, making it a formidable tactical bomber. It carries nuclear-capable ASMP-A missiles, enhancing France’s strategic deterrence.

10. Su-34 Fullback (Russia)

The Su-34 is a tactical bomber with exceptional maneuverability and survivability. Designed for deep-strike missions, it boasts heavy payload capacity, modern avionics, and electronic warfare capabilities.

Conclusion

The evolution of bomber jets continues to shape global military strategies. While stealth and electronic warfare capabilities dominate future designs, legacy bombers remain critical with modernization programs. The coming decades will see further advancements in hypersonic weapon integration, AI-assisted operations, and next-gen stealth technologies, redefining the role of bombers in modern warfare.

The post Top 10 Bomber Jets in the World appeared first on ELE Times.

NEPCON China is the leading B2B event in the electronics assembly field. It brings
together leading industry brands, innovating new areas of IC packaging, attracting
emerging companies to join, and integrating new resources in key fields.

Its concurrent, highly interactive events include conferences, competitions, award
programs and business matchmaking, providing an incomparable business networking
and learning platform for expanding new businesses in fast-growth industries and
regions.

It helps you to explore future opportunities in new fields, such as AI, humanoid robotics,
and the low-altitude economy by learning about industry trends and gaining insight via
face-to-face exchange.

Coming this April 22-24, 2025 to the Shanghai World Expo Exhibition & Convention
Center, NEPCON China 2025 is expected to exceed 45,000 m 2 of show space, attracting
more than 500 exhibiting enterprises and brands, while hosting more than 20 industry-
relevant and engaging summits and activities. Exhibitor segments of NEPCON China 2025
will showcase SMT, test & measurement equipment, dispensing & spraying equipment, smart factory, semiconductor packaging and testing equipment, electronic components, and more. The show will additionally focus on technologies and solutions for 3C, automotive electronics, wireless communication devices and systems, new energy, and
rail transit technology with leading exhibitors including ASMPT, HANWHA, YAMAHA,
ASYS, BTU, ERSA, Omron, TRI, QUICK, and GKG.

Added show floor highlights include the Japan Electronics and Automation Zone,
Electronic Materials Zone, and the Semiconductor Packaging and Testing Live DEMO,
among other specialty zones.

NEPCON China 2025 will showcase the latest in innovative products and technologies.
NEPCON ∞ SPACE is set to unveil a dedicated smart car disassembly zone, strategically
designed to engage buyers from the smart car manufacturing supply chain. The
showcase will feature a comprehensive demonstration line for packaging and testing
processes, including the aspects of integrated circuits, optical modules, and power
modules. In addition, the event will host Country Days, factory tours, and exclusive
matchmaking sessions for overseas buyers from Vietnam, Malaysia, Indonesia, and other specialty regions, ensuring an impressive and engaging experience for all attendees.

The post New Business, New Opportunities in Shanghai at NEPCON China 2025 appeared first on ELE Times.

Electromagnetic interference (EMI) and radiofrequency interference (RFI) refer to electromagnetically generated noise that can interfere with products’ performance and reliability. RFI is a subset of EMI that refers to radiated emissions such as those from power or communication lines.

Design engineers must strategically reduce EMI and RFI at every opportunity, especially since some sources are naturally occurring and impossible to remove from the environment.

Engineering professionals should begin by using design choices that mitigate these unwanted effects. For example, trace placement can reduce undesirable interference since a PCB’s traces carry current from drivers and receivers.

One widely established tip is to keep the distance between traces at least several times the width of individual traces. Similarly, designers should separate signal-related traces from others, including those associated with audio or video transmission.

The design-centered tools can help all parties test different possibilities to find the ones most likely to work in the real world. One such tool allows designers to ease the transition from design to manufacture by creating a digital twin of the production environment. This format-agnostic platform also enables real-time collaboration, shortening the time required for clients to approve designs.

Select appropriate internal filters and shields

Besides following design-related best practices, professionals building electronics while reducing EMI and RFI must identify opportunities to suppress and deflect them without adding too much weight to the devices. That is especially important in cases where people build electronics for aerospace and automotive applications.

The general process is identifying trouble spots after making all appropriate design-related improvements. Engineers should then proceed by applying filtering circuits on the inputs and outputs. Next, they can apply shields. These products surround at-risk components, creating a protective barrier.

The shields are typically metal or polyester, and engineers use industrial machines to form them into the desired shapes. While filters allow harmless frequencies to pass through them, shields block and redistribute EMI to mitigate their potentially dangerous effects.

A particular point is that filters only block EMI moving through physical connections such as cables. EMI transmission occurs through the air and needs no entry point. Additionally, designers will get the best results by scrutinizing how the electronic device functions and acting accordingly. One possibility is to install filters at heat sinks to control the EMI that would otherwise come through the holes that promote thermal management.

Consider electrospray technologies

An emerging EMI protection is to deposit electrospray materials onto surfaces or components. In addition to its cost-effectiveness, this solution offers customizable results because engineers can add as much as their applications require.

Although many of these efforts are in the early stages, design engineers should monitor their progress and consider how to incorporate them into their future products. One example comes from a mechanical engineering doctoral student exploring how to apply protective layers to electronics by dispensing aerosols or liquids onto them with electricity. This approach could be especially valuable to manufacturers that create increasingly small products for which traditional shielding techniques are less suitable.

The student argues that electrospray technologies for shielding can open opportunities for protecting miniaturized devices. Her technique deposits a silver layer onto the surface, minimizing the space and costs required to protect devices.

This strategy and similar efforts could also be ideal for engineers who want to safeguard delicate electronics without adding weight. Many consumers perceive lightweight, tiny devices as more innovative than heavier, larger ones. Electrospray caters to these devices while meeting modern manufacturing requirements.

Take project-specific approaches

In addition to following these tips, electronics designers must always engage with their clients throughout their work. Such engagements allow engineering professionals to understand specific needs and identify the most effective ways to achieve successful outcomes.

What worked well in one case may be less suitable for others that seem similar. However, client feedback ensures everyone is on the same page.

Ellie Gabel is a freelance writer as well as associate editor at Revolutionized.

 

 

Related Content

• PCB design for EMI in three easy steps
• RFI: keeping noise out of your designs
• EMI, RFI, EMC and radiated susceptibility
• How EVs, EMI/RFI are influencing AM radio’s future
• The Importance of EMI & RFI Shielding in Medical Equipment

The post How shielding protects electronic designs from EMI/RFI disruptions appeared first on EDN.

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