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To further strengthen its strategic and technological leadership as it advances its semiconductor innovation roadmap, Sweden-based AlixLabs AB (which was spun off from Lund University in 2019) has appointed Arthur van der Poel to its advisory board...

Rohde & Schwarz showcased the support precise measurement technology can provide to the automotive industry’s transformation at CES 2026. The company highlighted an extensive range of solutions engineered to support both market progress and technical excellence, from electric drivetrain optimisation and high-speed in-vehicle connectivity to radar validation, UWB-based safety applications and satellite-enabled communications.

“The automotive industry is undergoing its most significant transformation in a century,” said Juergen Meyer, Vice President Market Segment Automotive at Rohde & Schwarz. “From electric drivetrains to new automotive connectivity like non-terrestrial networks and next-generation sensors enabling higher levels of autonomous driving, every innovation requires precise, reliable testing. At CES 2026, we’re showcasing the solutions that enable automakers and suppliers to bring safer, smarter, and more sustainable vehicles to market faster.”

Electric drivetrain testing
Efficiency remains the cornerstone of electric mobility, and Rohde & Schwarz addresses this challenge with advanced tools for inverter and battery management system characterisation. The solution provides deep insights into switching behaviour, EMI performance and electrical power efficiency. Early detection of signal anomalies, precise impedance measurements and multi-channel visibility help Tier 1s and OEMs optimise EV drivetrains faster and more reliably.

OpenGMSL compliance testing
High-resolution radar, video and sensor data are essential for autonomous driving and vehicle infotainment. Rohde & Schwarz supports the emerging OpenGMSL standard and showcases comprehensive validation using the R&S RTP oscilloscope. Integrated PMA tests, real-time signal integrity tools, jitter analysis and built-in eye masks ensure robust link performance. Complementary vector network analysers enable detailed cable and channel characterisation – crucial as OpenGMSL becomes a foundational technology for camera and display systems or satellite radars.

Accelerated radar sensor development with simulation software
R&S strategic partner fiveD, an innovation leader in hyper-realistic radar simulations, bridges the gap between the real and virtual worlds in radar simulation with its Radar Simulation Suite to generate complete environment models and radar digital twins. This allows radar sensor vendors to simulate the complete radar module performance in its host environment even before a hardware prototype exists, providing awareness of errors at an earlier stage and accelerating the development process.

UWB for in-cabin detection and digital key testing
With UWB gaining momentum in automotive in-cabin detection and access systems, Rohde & Schwarz demonstrates advanced target simulation using the R&S SMW200A signal generator and R&S FSW26 spectrum analyser. The setup enables realistic testing of UWB modules used for child-presence detection, hands-free access and intrusion sensing.

Non-Terrestrial Network (NTN) testing
The automotive industry wishes to ensure a seamless user experience for safety, autonomous driving and infotainment services, wherever the vehicle is located and is exploring the role that non-terrestrial networks (NTNs) can have in providing ubiquitous wireless connectivity. Testing at chipset, TCU, antenna and vehicle level has a critical role in creating the always-connected vehicle, and the CMX500 radio communication tester is the complete solution to ensure correct operation of all implementations of NTN.

eCall testing
Meeting critical RF performance and modern protocol stack requirements is essential for ensuring reliable connectivity in systems such as NG eCall. This capability will be mandatory for all vehicles sold in the European market. In parallel, China is introducing a new automotive GNSS test standard, expected to become mandatory by 2027 for its AECS emergency call system. Rohde & Schwarz supports both regulatory frameworks with a comprehensive test setup combining the CMX500 communication tester and the R&S SMBV100B vector signal generator for precise GNSS simulation.

The post Rohde & Schwarz drives the future of mobility at CES 2026 appeared first on ELE Times.

Messe Frankfurt has joined GMTX Co Ltd as co-organiser of Automation Expo, further expanding the company’s portfolio of manufacturing trade events in Southeast Asia. This collaboration extends the company’s presence in Thailand, connecting the region’s manufacturers with the international expertise and resources of Messe Frankfurt’s global network. The next edition will run from 25 – 27 February 2026 at the Nongnooch International Convention and Exhibition Center (NICE) in Pattaya, which sits at the centre of the Eastern Economic Corridor (EEC), the country’s flagship initiative for high-tech industrial development.

 Mr Wolfgang Marzin, President & CEO of Messe Frankfurt Group remarked: “Messe Frankfurt currently organises 11 events and conferences worldwide as part of its Electronics & Automation Technologies portfolio, covering smart and digital automation, intelligent motion and power electronics, alongside energy management solutions. With this new addition, we are reinforcing our commitment to supporting Thailand’s manufacturing sector through the next phase of digital transformation, ensuring that both local SMEs and multinational enterprises benefit from the same high standards and international connections found in our events worldwide.”

 Thailand is a major regional economy where manufacturing accounts for nearly 25% of the national GDP. However, the country is facing a severe demographic shift, with record-low birth rates and a rapidly ageing population, shrinking the workforce. Economists have warned that to maintain regional competitiveness, the industrial sector must urgently shift focus to high-tech industries and automation. Consequently, manufacturers are looking to technology providers to help bridge this labour gap and sustain the sector’s high-value production.

Serving this industrial base, Automation Expo is held in Chonburi province, one of the three provinces that make up the country’s Eastern Economic Corridor (EEC). The EEC initiative aims to advance the region’s role as a major global production hub for the automotive, electronics, and petrochemical industries by focusing investment and policy on twelve designated “S-curve” sectors prioritised for their high growth potential.

Of these, automation and robotics are themselves a priority sector, while also serving as a critical enabler for other targeted industries such as next-generation automotive, intelligent electronics, and aviation and logistics.

To create a favourable ecosystem, the government has implemented investment policies to ease regulatory processes, alongside major infrastructure projects to upgrade the region’s transport and logistics capacity. This combination of policy and infrastructure has strengthened the region’s appeal to international investors. In the first half of 2025, the EEC attracted USD 1.7 billion in foreign capital, representing 56% of Thailand’s total foreign investment, while new company registrations rose by 36% compared to the same period in 2024.

The 2026 edition of Automation Expo will present a comprehensive range of technologies across every stage of the production cycle, from factory floor systems to enterprise-level infrastructure. Industrial automation systems, robotics, smart sensor technology, and digital infrastructure will be featured alongside software for design, simulation, and process control. Professional services for project analysis and financing will also be available, supporting companies at different stages of automation adoption.

Covering 7,500 sqm of exhibition space, the event is expected to bring together around 150 exhibitors and attract a professional audience of company owners, investors, factory managers, system integrators, and engineers, with a focus on the country’s primary industrial verticals, including automotive, iron and sheet metal, food, agriculture, and plastics.

In addition to the exhibition, a comprehensive conference programme will offer technical insights across more than 50 topics. Sessions will focus on practical implementation, covering areas such as hyperautomation, AI for Quality 5.0, factory cybersecurity, and zero downtime strategies, alongside predictive maintenance, IT/OT integration and carbon footprint management.

The event is supported by many prominent organisations and industry associations, including:

• The Federation of Thai Industries (FTI)
• Logistics Division, Department of Industrial Promotion
• Industrial Promotion Center Region 9, Department of Industrial Promotion
• National Science and Technology Development Agency (NSTDA)
• National Electronics and Computer Technology Center (NECTEC)
• Software Park Thailand
• Eastern Economic Corridor of Innovation (EECi)
• EEC Automation Park
• Thailand Productivity Institute (FTPI)
• Thai-German Institute (TGI)
• Sumipol Institute of Manufacturing Technology
• Thai-Nichi Institute of Technology
• Thai Automation and Robotics Association (TARA)
• Thai IoT Association
• Artificial Intelligence Association of Thailand (AIAT)
• Technology Promotion Association (Thailand-Japan)
• Thai PLC Center

Automation Expo is jointly organised by Messe Frankfurt (HK) Ltd and GMTX Company Ltd, joining Messe Frankfurt’s global portfolio of Electronics & Automation Technologies events.

The post Messe Frankfurt adds Automation Expo to growing event portfolio in Southeast Asia appeared first on ELE Times.

🤝 Запрошуємо пройти онлайн-курс «Впливай. Викривай.» від НАЗК kpi пт, 12/19/2025 - 13:00

Відкритий діалог КПІшників із Надзвичайним і Повноважним Послом Держави Ізраїль в Україні Міхаелем Бродським kpi пт, 12/19/2025 - 12:18

За доброю традицією до КПІ ім. Ігоря Сікорського прибув Вифлеємський вогонь миру kpi пт, 12/19/2025 - 12:14

Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA has signed a collaboration agreement with GlobalFoundries of Malta, NY (GF, the only US-based pure-play foundry with a global manufacturing footprint, including facilities in the USA, Europe and Singapore) to develop and manufacture gallium nitride (GaN) power products using GF’s 200mm eMode GaN-on-silicon process for critical markets, starting with 650V...

As we look ahead to 2026, we see intelligence increasingly being embedded within physical products and everyday interactions. This shift will be powered by rapid adoption of digital identity technologies such as near-field communication (NFC) alongside AI and agentic AI tools that automate workflows, improve efficiency, and accelerate innovation across the product lifecycle.

The sharp rise in NFC adoption—with 92% of brands already using or planning to use it in products in the next year—signals appetite to unlock the true value of the connected world. Enabling intelligence in new places gives brands the opportunity to bridge physical and digital experiences for positive social, commercial, and environmental outcomes.

Regulatory milestones, such as the phased rollout of the EU Digital Product Passport, along with sustainability pressures and the need to ensure transparency to drive trust will be key catalysts for edge and item-level AI.

In the year ahead, companies will unlock significant benefits in customer experience, sustainability, compliance, and supply chain efficiency by embedding intelligence from the edge to individual items and devices.

Let’s dig deeper into the technology trends shaping 2026.

1. Edge AI is the fastest growing frontier in semiconductors

Driven by the shift from pure inference to on-device training and continuous, adaptive learning, 2026 will see strong growth in edge AI demand. Specialized chips such as low-power machine learning accelerators, sensor-integrated chips, and memory-optimized chips will be used in consumer electronics, smart cities, and industrial IoT.

Next, new packaging approaches will become the proving ground for performance, cost efficiency, and miniaturization in intelligent edge devices.

2. Item-level intelligence is accelerating digital transformation

Intelligence will not stop at the device. Over the next 12 months, low-cost sensing, NFC, and edge AI will push computation down to individual items.

The capability to gather real-time data at item level in a move away from batch data, combined with AI, will enable personalized experiences, automation, and predictive analytics across smart packaging, healthcare and wellness products, retail, and logistics. Applications include real-time tracking, AI-driven personalization, automated supply chain optimization, predictive maintenance, and dynamic authentication.

This marks a fundamental shift as every item becomes a data node and source of intelligence.

3. Connected consumer experiences are driving breakthrough NFC adoption

NFC adoption is accelerating alongside the explosion of connected consumer experiences—from wearables and hearables to smart packaging, digital keys and wellness applications. NFC will become a central enabler of trust, personalization, and seamless connectivity.

Figure 1 NFC has become a key enabler in personalization-centric connectivity. Source: Pragmatic Semiconductor

As consumers increasingly expect intelligent product interaction, for example, to track provenance or engage with wellness apps to build a personalized profile and derive usable insights, the opportunity for NFC is clear. Brands will favor ultra-low-cost and thin NFC solutions—where flexible and ultra-thin semiconductors excel—to deliver frictionless, high-quality consumer experiences.

4. Heterogeneous integration will unlock design innovation

Heterogeneous integration through chiplets, interposers, and die stacking will become the preferred approach for achieving higher density and improved yields. This is a key enabler for miniaturization and differentiated form factors in facilitating customization for edge AI.

At the same time, the rise of agentic AI-driven EDA tools will lower design barriers and fuel cost-effective innovation through natural language tools. This will ignite startup growth and increase demand for agile, cost-effective foundry design services.

5. Compliance shifts from cost to competitive advantage

New regulatory frameworks such as Digital Product Passports, circularity, and Extended Producer Responsibility (EPR) will require authentication, traceability, and lifecycle visibility. Rather than a burden, this presents a strategic opportunity for competitive advantage and market expansion.

Embedded digital IDs with NFC capability allow businesses to secure product authentication, meet compliance and governance expectations, and unlock new value in consumer engagement. As compliance moves from paper systems to embedded intelligence, the opportunity will expand across consumer goods, industrial components, and supply chains.

6. Energy constraints are driving efficiencies in semiconductor manufacturing

As semiconductor manufacturing scales to serve AI demand, growing energy consumption in data centers is forcing industry to focus on power-efficient architectures. This is accelerating a shift away from centralized compute toward fully distributed sensing and intelligence at the edge. Edge AI architectures are designed to process data locally rather than transmit it upstream and will be essential to sustaining AI growth without compounding energy constraints.

Figure 2 Semiconductor manufacturing will increasingly adopt circular design principles such as reuse, recycling, and recoverability. Source: Pragmatic Semiconductor

The capability to establish and scale domestic manufacturing will also play a critical role in cutting embedded emissions and enabling more sustainable and efficient supply chains. Semiconductor manufacturing facilities, known as foundries, will be evaluated on their energy and material efficiency, supported by circular design principles such as reuse, recycling, and recoverability.

Companies that can demonstrate strong environmental commitments will gain long-term competitive advantage, attracting customers, partners, and skilled talent.

Intelligence right to the edge

These trends point toward a definitive shift as intelligence moves dynamically into the physical world. Compute will become increasingly distributed and identity embedded, unlocking efficiencies and delivering real-time insights into the fabric of products, infrastructure, and supply chains.

Semiconductor manufacturing will sit at the heart of the next phase of digital transformation. Flexible and ultra-thin chip technologies will enable new classes of innovations, from emerging form factors such as wearables and hearables to higher functional density in constrained spaces, alongside more carbon-efficient manufacturing models.

The implications for businesses are clear. Companies can accelerate innovation, deepen consumer engagement, and turn compliance into a source of competitive advantage. Those that embed connected technologies into their 2026 strategy will be those that are best positioned to take advantage of the digital transformation opportunities ahead.

Richard Price is co-founder and chief technology officer of Pragmatic Semiconductor.

 

 

Related Content

• AI at the edge: It’s just getting started
• The AI Future is Now All About the Edge
• Edge AI: Bringing Intelligence Closer to the Source
• Powering E-Paper Displays with NFC Energy Harvesting
• Edge AI powers the next wave of industrial intelligence

The post Semiconductor technology trends and predictions for 2026 appeared first on EDN.

submitted by /u/SpaceRuthie [link] [comments]

WIP screenshots for some RP2040 based cyberpunk sunglasses I've been working on this year. Hopefully someone will one day create a kicad or easyeda extension that allows me to route at 30° / 60° angles, so I can make hexagonal traces submitted by /u/babel_infoc [link] [comments]

submitted by /u/aarontodd82 [link] [comments]

Third image is the first version. First and second images are improved based on feedback from my dad that has a lot more experience with electronics than me XD This was possibly the most fun school project I have worked on, even if it was slightly more programming than wiring it all up submitted by /u/__NORB__ [link] [comments]

submitted by /u/Green-Pie4963 [link] [comments]

After an unprecedented investment wave between 2019 and 2024, the power silicon carbide (SiC) industry is now entering a correction cycle, according to Yole Group’s report ‘Power SiC 2025 – Front-End Manufacturing Equipment’...

The complexity of vehicle hardware and software is rising at an unprecedented rate, so traditional development methodologies are no longer sufficient to manage system-level interdependencies among advanced driver assistance systems (ADAS), autonomous driving (AD), and in-vehicle infotainment (IVI) functions.

That calls for a new approach, the one that enables automotive OEMs and tier 1s to speed the development of software-defined vehicles (SDVs) with early full-system, virtual integration that mirrors real-world vehicle hardware. That will accelerate both application and low-level software development for ADAS, AD, and IVI and remove the need for design engineers to build their own digital twins before testing software.

It will also reduce time-to-market for critical applications from months to days. Siemens EDA has unveiled what it calls a virtual blueprint for digital twin development. PAVE360 Automotive, a digital twin software, is pre-integrated as an off-the-shelf offering to address the escalating complexity of automotive hardware and software integration.

While system-level digital twins for SDVs using existing technologies can be complex and time-consuming to create and validate, PAVE360 Automotive aims to deliver a fully integrated, system-level digital twin that can be deployed on day one. That reduces the time, effort, and cost required to build such environments from scratch.

Figure 1 PAVE360 Automotive is a cloud-based digital twin that accelerates system-level development for ADAS, autonomous driving, and infotainment. Source: Siemens EDA

“The automotive industry is at the forefront of the software-defined everything revolution, and Siemens is delivering the digital twin technologies needed to move beyond incremental innovation and embrace a holistic, software-defined approach to product development,” said Tony Hemmelgarn, president and CEO, Siemens Digital Industries Software.

Siemens EDA’s digital twin—a cloud-based off-the-shelf offering—allows design engineers to jumpstart vehicle systems development from the earliest phases with customizable virtual reference designs for ADAS, autonomous driving, and infotainment. Moreover, the cloud-based collaboration unifies development with a single digital twin for all design teams.

The Arm connection

Earlier, Siemens EDA joined hands with Arm to accelerate virtual environments for Arm Cortex-A720AE in 2024 and Arm Zena Compute Subsystems (CSS) in 2025. Now Siemens EDA is integrating Arm Zena CSS with PAVE360 Automotive to enable design engineers to start building on Arm-based designs faster and more seamlessly.

Figure 2 Here is how PAVE360’s digital twin works alongside the Arm Zena CSS platform for AI-defined vehicles. Source: Siemens EDA

On the other hand, access to Arm Zena CSS in a digital twin environment such as PAVE360 Automotive can accelerate software development by up to two years. “With Arm Zena CSS available inside Siemens’ pre-integrated PAVE360 Automotive environment, partners can not only customize their solutions leveraging the unique flexibility of the Arm architecture but also validate and iterate much earlier in the development cycle,” said Suraj Gajendra, VP of products and solutions for Physical AI Business Unit at Arm.

PAVE360 Automotive, now made available to key customers, is planned for general availability in February 2026. It will be demonstrated live at CES 2026 in the Auto Hall on 6–9 January 2026.

Related Content

• Why the Cloud Is Essential for SDV Development
• Unveiling the Transformation of Software-Defined Vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Architectural opportunities propel software-defined vehicles forward
• Digital Twins Power Rapid Software Deployment in Autonomous Vehicles

The post An off-the-shelf digital twin for software-defined vehicles appeared first on EDN.

In this Design Idea (DI), the classic Schmitt-trigger-based RC oscillator is “hacked” and analyzed using the simulation software QSPICE. You might reasonably ask why one would do this, given that countless such circuits reliably and unobtrusively clock away all over the world, even in space.

Well, problems arise when you want the RC oscillator to be tunable, i.e., replacing the resistor with a potentiometer. Unfortunately, the frequency is inversely proportional to the RC time constant, resulting in a hyperbolic response curve.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Another drawback is the limited tuning range. For high frequencies, R can become so small that the Schmitt trigger’s output voltage sags unacceptably.

The oscillator’s current consumption also increases as the potentiometer resistance decreases. In practice, an additional resistor ≥1 kΩ must always be placed in series with the potentiometer.

The potentiometer’s maximum value determines the minimum frequency. For values >100 kΩ, jitter problems can occur due to hum interference when operating the potentiometer, unless a shielded enclosure is used.

RC oscillator

Figure 1 shows an RC oscillator modeled with QSPICE’s built-in behavioral Schmitt trigger. It is parameterized as a TLC555 (CMOS 555) regarding switching thresholds and load behavior.

Figure 1: An RC oscillator modeled with QSPICE’s built-in behavioral Schmitt trigger, it is a TLC555 (CMOS 555).

Figure 2 displays the typical triangle wave input and the square wave output. At R1=1 kΩ, the output voltage sag is already noticeable, and the average power dissipation of R1 is around 6 mW, roughly an order of magnitude higher than the dissipation of a low-power CMOS 555.

Figure 2 The typical triangle wave input and the square wave output, where the average power dissipation of R1 is around 6 mW.

Frequency response wrt potentiometer resistance

Next, we examine the oscillator’s frequency response as a function of the potentiometer resistance. R1 is simulated in 100 steps from 1 kΩ to 100 kΩ using the .step param command.

The simulation time must be long enough to capture at least one full period even at the lowest frequency; otherwise, the period duration cannot be measured with the .meas command.

However, with a 3-decade tuning range, far too many periods would be simulated at high frequencies, making the simulation run for a very long time.

Fortunately, QSPICE has a new feature that allows a running simulation to be aborted, after which the new simulation for the next parameter step is executed. The abort criterion is a behavioral voltage source called AbortSim(). It’s not the most elegant or intuitive feature, but it works.

Schmitt trigger oscillator

Figure 3 shows our Schmitt trigger oscillator, but this time with the parameter stepping of R1, the .meas commands for period and frequency measurement, and an auxiliary circuit that triggers AbortSim(). My idea was to build a counter clocked by the oscillator. After a small number of clock pulses—enough for one period measurement—the simulation is aborted.

Figure 3 Schmitt trigger oscillator, this time, with the parameter stepping of R1, the .meas commands for period and frequency measurement, and an auxiliary circuit that triggers AbortSim().

I first tried a 3-stage ripple counter with behavioral D-flops. This worked but wasn’t optimal in terms of computation time.

The step voltage generator in the box in Figure 2 is faster and easier to adjust. A 10-ns monostable is triggered by V(out) of the oscillator and sends short current pulses via the voltage-controlled current source to capacitor C3. The voltage across C3 triggers AbortSim() at >= 0.5V.

The constant current and C3 are selected so that the 0.5 V threshold is reached after 3 clock cycles of the oscillator, thus starting the next measurement.

Note that the simulation time in the .tran command is set to 5 s, which is never reached due to AbortSim().

The entire QSPICE simulation of the frequency response takes the author’s PC a spectacular 1.5 s, whereas previously with LTSPICE (without the abort criterion) it took many minutes.

Figure 4 shows the frequency (FREQ) versus potentiometer resistance (RPOT) curve in a log plot, interpolated over 100 measurement points.

Figure 4 Frequency versus potentiometer resistance curve in a log plot, interpolated over 100 measurement points.

Final circuit hack

Now that we have the simulation tools for fast frequency measurement, we finally get to the circuit hack in Figure 5. We expand the circuit in Figure 1 with a resistor R2=RPOT in series with C1.

Figure 5 Hacked Schmitt trigger oscillator with an expanded Figure 1 circuit that includes R2=RPOT in series with C1.

Figure 6 illustrates what happens: for R2=0 (blue trace), we see the familiar triangle wave. When R2 is increased (magenta trace), a voltage divider:

V(out)/V(R2) = (R1+R2)/R1

is created if we momentarily ignore V(C1). V(R2) is thus a scaled-down V(out) square wave signal, to which the V(C1) triangle wave voltage is now added.

Figure 6 The typical triangle wave input with the output now reaching very high frequencies without excessively loading V(OUT).

Because the upper and lower switching thresholds of the Schmitt trigger are constant, V(C1) reaches these thresholds faster as V(R2) increases. The more V(R2) approaches the Schmitt trigger hysteresis VHYST, the smaller the V(C1) triangle wave becomes, and the frequency increases.

At V(R2)=VHYST, the frequency would theoretically become infinite. This condition in the original circuit in Figure 1 would mean R1=0, leading to infinitely high I(out). The circuit hack thus allows very high frequencies without excessively loading V(OUT)!

The problem of the steep frequency rise towards infinity at the “end” of the potentiometer still remains. To fix this, we would need a potentiometer that changes its value significantly at the beginning of its range and only slightly at the end. This is easily achieved by wiring a much smaller resistor in parallel with the potentiometer.

Fixing steep frequency rise

In Figure 7, we see a second hack: R1 has been given a very large value.

Figure 7 Giving R1 a large value keeps the circuit’s current consumption low, allowing RPOT to be dimensioned independently of R1.

This keeps the circuit’s current consumption low, especially at high frequencies. The square wave voltage at RPOT is now taken directly from V(OUT) via a separate voltage divider. This allows RPOT to be dimensioned independently of R1.

In the example, I used a common 100 kΩ potentiometer. The remaining resistors are effectively in parallel with the potentiometer regarding AC signals and set the desired characteristic curve.

Despite all measures, the frequency increase is still quite steep at the end of the range, so a 1 kΩ trimmer is recommended for practical application to conveniently set the maximum frequency.

Figure 8 shows the frequency curve of the final circuit. Compared to the curve of the original circuit in Figure 4, a significantly flatter curve profile is evident, along with a larger tuning range.

Figure 8 Frequency versus potentiometer resistance curve in a log plot, interpolated over 100 measurement points, showing a flatter curve profile and larger tuning range.

Uwe Schüler is a retired electronics engineer. When he’s not busy with his grandchildren, he enjoys experimenting with DIY music electronics.

 Related Content

• Exponentially-controlled vactrols
• Schmitt trigger adapts its own thresholds
• Schmitt trigger provides alternative to 555 timer
• Schmitt trigger uses two transistors
• RC oscillator generates linear triangle wave

The post Wide-range tunable RC Schmitt trigger oscillator appeared first on EDN.

“We are more interested in driving the power electronics ecosystem in the Indian market,” says Hitesh Bhardwaj, GM, Semiconductor & Devices Department, Mitsubishi Electric India, in an exclusive conversation with the ELE Times. As India doubles down on its electronics sector through various schemes, including ECMS, PLI, and DLI, the private sector, along with the government, also seems equally aspirational and positive about the Indian prospects in the electronics landscape.

In the conversation, he, along with Dr. Koichiro Noguchi, General Manager, Product Strategy Dept. Mitsubishi Electric Corporation Power Device Works touched upon some innovations that Mitsubishi Electric is launching in India, including Unifull (SBD embedded MOSFETs). In addition to the innovations, the conversation also touched upon other issues like overall material trends in the power electronics line-up and supporting the local talent.

New Dual Inline Package Intelligent Power Modules (DIPIPM)

“The key feature of compact DIPIPM is that it is 53% smaller than the Slim DIP, which is a previous generation device that we were selling in the Indian market,” says Hitesh Bharadwaj. Mitsubishi’s all-new DIPIPM platform is all set to make the design engineers in India target next-level and more compact designs, owing to its unique construction consisting of an RC-IGBT that makes it more resilient towards thermal challenges and, consequently, improves its overall performance.

The new DIPIPM comes in two ratings: 30 amp 600 volt and 50 amp 600 volt, which make it suitable for consumer appliances, industrial equipment, and small-capacity inverters.

Unifull- New SiC high Voltage Product

“It is a unique solution in the segment of the SiC high voltage product where we architect a Schottky barrier diode and MOSFET into a single chip,” says Koichiro Noguchi as he explains the USP of the Unifull. It improves the switching and DC performance highly. He adds that this innovation in the 3.3 Kilowatt & 200-600 Amp range is the industry’s first.

Also, Mitsubishi Electric is confident of its Unifull technology, also evidenced by Koichiro Noguchi’s words when he says, “We are ready for the new business” with the all-new Unifull.

Material Trends in Power Electronics

On material trends, Hitesh Bhardwaj points out that while innovation is advancing, the industry must first capitalise on the already available WBG devices such as SiC and GaN, along with emerging 2D materials like graphene (which today sees limited use in specialised areas). Looking ahead, he notes that the next decade may open the door to ultra-wide bandgap materials, with several oxide- and nitride-based devices showing promising results in the research and development phase.

“We should give at least 10 to 12 years for WBG devices, just the way silicon was given decades to mature,” he says, underlining the natural progression of material technologies. He also mentions ongoing experiments on materials like gallium oxide and recalls Mitsubishi Electric’s earlier work with gallium arsenide for low-power, space-grade applications.

Power Electronic Ecosystem in India

Moving further, Hitesh Bhardwaj also talks about the India Power Electronics System, wherein he says, “Our priority is to develop the power electronics ecosystem in India.” He further goes on to underline the ongoing contributions of Mitsubishi Electric, specifically in regard to the training and upskilling of the local talent. He further adds that Mitsubishi Electric is currently focusing on developing the capabilities and sharing their best global practices with the local engineers, with the local design centers, and consequently making them drive benefits out of it.

Hence, enabling a self-sufficient and skilled power electronics ecosystem in India. It is currently in collaboration with universities and institutions, including IITs, NITs, so that they can contribute on their own, by using Mitsubishi’s devices.

The post “Being 53% smaller than the previous model, the new Compact DIPIPM helps engineers push PCB miniaturisation and efficiency to the next level,” says Mitsubishi Electric’s Hitesh Bharadwaj appeared first on ELE Times.

The Central Government expects the modified Electronics Manufacturing Clusters (EMC 2.0) scheme to generate approximately 1.80 lakh jobs. The approved projects cover 10 Indian states and are expected to have a total investment of Rs. 1.46 lakh crore, which will make the country’s electronics manufacturing system robust and efficient.

According to an old government notification, the scheme aims to provide world-class infrastructure support to specific clusters with shared facilities. These facilities will be provided with a ready-to-start setup to prevent wasting time by starting from scratch.

As of now, the government has approved 11 electronics manufacturing clusters along with 2 common facility centres. These projects cover nearly 4,400 acres of land, with a total cost of Rs. 5.226.49 crores, out of which the Central Government is providing financial assistance worth Rs. 2,492.74 crores.

The Ministry of Electronics and IT reports that 123 manufacturers are committed to investing a total of Rs. 1,13,000 crore in the approved areas for the projects.

An independent study by the National Institute for Micro, Small and Medium Enterprises recently assessed the impact of the scheme. The study found that the clusters help develop better supply chains and lower the cost of moving goods. The assessment also noted that the program improves skill development and creates many direct and indirect jobs within the local ecosystem.

“The assessment highlights accelerated development of electronics manufacturing infrastructure, improved supply-chain responsiveness, availability of RBF/Plug-and-Play facilities, cost-efficient logistics, and significant direct and indirect employment generation, along with enhanced skill development within the cluster ecosystem,” the release said.

The post India’s EMC 2.0 Proves to be Efficient for Supply Chains & Skill Development appeared first on ELE Times.

Диджиталізація промислових МСП — Hack & Match kpi чт, 12/18/2025 - 12:22