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Bluetest and Rohde & Schwarz extend their long-established collaboration and have integrated the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test systems (RTS) to perform MIMO stress testing of IEEE 802.11be stations as well as access points under realistic conditions.

Bluetest specializes in reverberation chambers, such as the RTS65, which are designed for efficient over-the-air performance evaluation of wireless devices. In contrast to anechoic test chambers, reverberation chambers extensively reflect an RF signal inside the chamber, creating a Rayleigh faded multipath RF environment. This environment closely mirrors real-world indoor and city conditions, making it ideal for evaluating the antenna and radio performance of modern multi-antenna (MIMO) and multi-carrier devices as used in WLAN, 4G, and 5G.

The setup is operated using the Bluetest Flow control software, an integrated test environment for complex wireless solutions. By integrating the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow software, WLAN developers utilizing the R&S CMX500 can now leverage Bluetest’s reverberation chamber technology in the development of their advanced WLAN stations and access points.

Wi-Fi 7 (IEEE 802.11be) is engineered for extremely high data throughput and capable of handling tens of gigabits of data per second with low latency. It caters to the increasing demand for ultra-high-definition video streaming, virtual reality, and augmented reality applications. The key components facilitating higher throughput include an increased channel bandwidth of 320 MHz, up to 16 spatial streams, 4096 QAM modulation, and multi-link operation (MLO).

During the development of WLAN devices, measurements of the antennas as well as RF transmitter and receiver characteristics must be conducted under real-world conditions in signaling mode. With MLO being a key feature in Wi-Fi 7, a test environment that provides multiple RF chains is crucial. The R&S CMX500 one-box tester from Rohde & Schwarz, featuring integrated Wi-Fi 7 test functionality, is a multi-technology multi-channel signaling tester. Its flexibility, support for multiple radio technologies, and embedded IP test capabilities make it a versatile solution for a broad range of Wi-Fi 7-specific tests.

Christoph Pointner, Senior Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “Our collaboration with Bluetest has resulted in a unique synergy between our CMX500 one-box tester and their RTS technology. This long-established partnership has enabled us to push the boundaries of WLAN testing, providing a real-world environment that is integral to the development of cutting-edge wireless solutions.”

Kjell Olovsson, Bluetest CEO, said: “Teaming up with Rohde & Schwarz and integrating their CMX500 one-box tester into our Flow software broadens our WLAN testing capabilities. Now we are able to offer an unprecedented testing environment for the latest Wi-Fi 7 devices, reflecting our commitment to supporting the evolution of wireless communication.”

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7layers successfully validated its Interlab Test Solution Bluetooth RF for Channel Sounding qualification, running with the R&S CMW wideband radio communication tester. Developed jointly with Rohde & Schwarz and leading chipset manufacturers, it is the first test platform listed by the Bluetooth SIG to perform Channel Sounding qualification testing with Bluetooth RFPHY release 6.0. Bluetooth Channel Sounding is a new secure fine ranging feature that will enable unprecedented positioning accuracy for consumer and commercial applications.

For many years, 7layers, a Bureau Veritas Group company, and Rohde & Schwarz have collaborated in developing Bluetooth RF test solutions for Bluetooth Qualification Test Facilities (BQTF), Bluetooth Recognized Test Facilities (BRTFs) as well as for chipset and module vendors. Thanks to this close partnership with Rohde & Schwarz and leading chipset vendors, 7layers has now validated the Channel Sounding feature within its Interlab Test Solution Bluetooth RF. Bluetooth SIG has listed it as a validated test solution for Channel Sounding qualification testing with Bluetooth RFPHY version 6.0.

Bluetooth Low Energy devices with improved positioning accuracy
The rollout of Bluetooth Low Energy devices supporting Channel Sounding will significantly improve positioning accuracy for ‘Digital Key’ and ‘Find My’ applications. In addition, these devices will feature improved power consumption and superior security, all critical features for Bluetooth enabled products. Since September, the Bluetooth SIG has introduced test cases to qualify these new features.

The Interlab Test Solution Bluetooth RF fulfils all qualification requirements for Bluetooth Classic, Low Energy (LE), including Direction Finding, as well as the latest Core feature Bluetooth Channel Sounding. Comprehensive test automation and the highly accurate implementation of the Bluetooth test cases are crucial to ensure compliance to the Bluetooth specifications.

The Interlab Test Solution for Bluetooth Channel Sounding runs with a wideband radio communication tester of the R&S CMW platform and offers an integrated RF path calibration, high measurement accuracy as well as precise analysis capabilities. The test platform from Rohde & Schwarz supports the corresponding RF physical layer measurements for the usage in development and for prequalification tests as a standalone box.

Frank Spiller, Manager Interlab Test Products, at 7layers emphasizes: “The industry is eagerly anticipating the qualification of a test solution for Bluetooth Channel Sounding by the Bluetooth SIG. We are proud to offer the first validated test solution, implemented thanks to the advanced test capabilities of our partner Rohde & Schwarz. We enable our customers to perform high quality and automated testing as part of the internal verification and regression process for a smooth transition to qualify products.”

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz, said: “Thanks to our close partnership with 7layers, we were able to quickly integrate the required test cases into the test solution. This means, that vendors of wireless chipsets and modules can now validate the new Bluetooth Channel Sounding feature with an R&S CMW Bluetooth RF tester and the Interlab Test Solution for Bluetooth Channel Sounding. This tester can be used for R&D tests, pre-qualification and production testing. Using the same test solution as BQTFs and BRTFs increases the likelihood of their products achieving the Bluetooth qualification on the first attempt, significantly reducing time to market.”

The Interlab Test Solution Bluetooth RF for Channel Sounding is part of the Interlab portfolio. It is now available from 7layers as qualification test solution for BQTFs and BRTFs. For further information please contact sales@interlab.com.

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Chiplets are reshaping microprocessor design by offering modularity, cost-effectiveness, and performance gains. By breaking traditional monolithic chips into smaller, specialized components, chiplets simplify design improvements and enable scalability. However, this promising technology faces several challenges hindering its broader adoption. Let’s explore these obstacles in detail.

Technological Complexity

Chiplets bring advanced design possibilities but also introduce technical hurdles. Achieving efficiency across multiple chiplets is not a straightforward task.

Interconnect Standards

One of the most prominent issues is the lack of standardized interconnect protocols. Chiplets from different manufacturers often struggle to communicate seamlessly. Current interconnect solutions, like those based on proprietary designs, limit interoperability. This forces companies to either develop their ecosystem or adhere to rigid standards, slowing innovation. A universal interconnect standard, such as Universal Chiplet Interconnect Express (UCIe), could address this bottleneck, but widespread adoption is still a distant goal.

Thermal Management

Heat dissipation becomes more complex in chiplet architectures. Each chiplet generates heat, and when these are packed tightly within a system, thermal management turns into a challenging puzzle. Standard cooling systems may no longer suffice, requiring innovative solutions like 3D stacking techniques and advanced cooling materials. Without effective heat control, performance suffers, and longevity decreases.

Market Competition

While the chiplet market is growing, it is tightly contested by industry giants and budding startups.

Dominance of Large Semiconductor Firms

Major players dominate advanced semiconductor technologies and often dictate industry trends. Companies like Intel, AMD, and TSMC hold much of the market share, making it harder for smaller businesses to compete. Their massive resources allow them to innovate and deploy at a scale that smaller competitors cannot match. This monopoly stifles competition and leads to slower industry-wide progress.

Emerging Startups and Innovations

Startups are essential for fostering innovation. However, they often face financial and technological barriers to entering the chiplet market. Disruptive ideas struggle to gain traction when pitted against well-funded incumbents. While venture capital investment in these companies is increasing, many promising ideas die because of insufficient funding or technical expertise.

Supply Chain and Manufacturing Issues

COVID-19 exposed the fragility of global supply chains, and the chiplet market is no exception. Key materials and manufacturing networks face significant setbacks.

Material Shortages

High demand for semiconductors has strained the availability of raw materials. Critical components like rare earth metals remain limited, leaving manufacturers unsure about how to fulfill orders. The situation worsens as geopolitical tensions over resource control further delay material acquisition.

Manufacturing Process Complexity

Chiplet production often relies on cutting-edge manufacturing processes, such as extreme ultraviolet (EUV) lithography. These processes are expensive, labor-intensive, and prone to errors. Scaling production while maintaining consistent quality adds to the challenge, driving up both costs and timelines.

Regulatory and Compliance Challenges

Navigating industry regulations is another hurdle for chiplet developers. Meeting global standards while protecting intellectual property (IP) rights is no easy feat.

Compliance with International Standards

International semiconductor markets impose various standards to ensure quality, safety, and compatibility. As different regions adopt different regulations, manufacturers must develop chips that satisfy multiple legal frameworks. This can increase costs and introduce engineering challenges.

Intellectual Property Issues

Efforts to integrate chiplets require collaborative innovation, which often leads to IP sharing. Disputes over patent ownership and usage rights can slow the development process. In a market where innovation drives value, IP issues remain a significant concern.

Chiplets Market Outlook 2034

The chiplet industry is set for explosive growth over the next decade. Valued at around $7.14 billion in 2023, the market is projected to skyrocket to $555 billion by 2034, reflecting a staggering CAGR of 46.47%. This surge highlights not only a growing demand for chiplet solutions but also ongoing advancements in semiconductor production. With applications ranging from data centers to consumer electronics, chiplets will likely become even more essential to the technology ecosystem.

Conclusion

While chiplets have transformative potential, the path forward is riddled with challenges. From standardization hurdles and thermal issues to supply chain constraints and regulatory obstacles, each roadblock requires careful navigation. Collaboration across industry stakeholders, investment in research, and regulatory clarity are all essential to unlock the true promise of chiplets. If these challenges can be overcome, the future of computing will be shaped by the success of the chiplet market.

The post What Challenges Does the Chiplet Market Face Today? appeared first on ELE Times.

Anritsu Corporation is pleased to announce the release of enhanced software functions for its Signal Analyzers MS2830A/MS2840A/MS2850A. These enhancements enable the analyzers to extend the spectrum measurement frequency range to encompass the millimeter-wave band by connecting VDI or Eravant external mixers.

Millimeter-wave sensing device can detect subtle changes in human body surfaces caused by breathing and heartbeat, as well as identify the position of people and objects. These advancements open up new applications in diverse fields, such as medical care, automotive, and facial-recognition security systems. Anritsu contributes to the development of a safer and more secure society by providing solutions to evaluate millimeter-waveband signals and enhancing of millimeter-wave device quality.

Development Background

The growing demand for sensing technologies using millimeter-wave radar, particularly in the 60 GHz band, has driven advancements in medical applications. This technology is also employed in facial-recognition security systems. Furthermore, automotive radar technology is undergoing advancements with the development of wideband 79 GHz band radar capable of detecting small targets such as pedestrians and bicycles at high resolution.

To accurately evaluate sensors designed for detecting mobile objects and automotive radars using ultra-wideband millimeter-wave signals, simple solutions are required to measure transmission signal characteristics.

Product Features

Anritsu’s mid-range benchtop MS2830A, MS2840A, and MS2850A signal analyzers provide high-performance capabilities and comprehensive options for wireless signal measurements across diverse applications. These models span the RF to microwave/millimeter-wave frequency bands and accommodate narrow- to wide-band signals.

For spectrum, signal, and phase-noise measurements, the measurement frequency range can be extended by installing Anritsu’s External Mixer Connection Function MX284090A. This function supports connection of a recommended external mixer from Eravant or VDI to the signal analyzer’s 1st Local Output port.

● Image-Response-Free Spectrum Measurement up to 7.5 GHz

An image response can occur when measuring with external mixers lacking preselectors to eliminate unwanted signals, causing erroneous reception of signals at different frequencies from the intended signal. Anritsu’s signal analyzers boast industry-leading* intermediate frequencies (IF) of 1.875 GHz (MS2830A) and 1.8755 GHz (MS2840A/MS2850A), facilitating conversion of received high-frequency signals to manageable frequencies for processing. This enables suppression of image-response effects up to 7.5 GHz using Anritsu’s proprietary PS (Preselector Simulation) function, facilitating measurement of hard-to-distinguish variable signals.

*At December 2024

● Simple Measurement Setup

The single coaxial-cable connection between the signal analyzer and recommended external mixers enhances flexibility in positioning the signal analyzer and allows the external mixer to be placed close to the device under test.

The MS2830A offers exceptional cost-effectiveness and is suitable for a broad range of applications, including R&D, manufacturing, and maintenance.

The MS2840A stands out with its exceptional phase noise performance and provides a comprehensive suite of options to support higher-performance measurements. These options include 2dB attenuator resolution and noise floor suppression.

The MS2850A signal analyzer function supports signal analysis at bandwidths up to 1 GHz.

The post Anritsu Extend Spectrum Measurement Frequency to Millimeter-wave Band with External Mixer from VDI or Eravant appeared first on ELE Times.

LED soldering is the process of joining electronic components of light-emitting diodes (LEDs) to a printed circuit board (PCB) or other substrates using a soldering material, typically a tin-lead alloy or lead-free solder. The process ensures proper electrical and mechanical connections between the LED terminals and the PCB.

How LED Soldering Works

1. Preparation:
   • Ensure that the PCB and LED components are clean and free from debris or oxidation.
   • Apply solder paste to the PCB pads where the LED will be placed.
2. Placement:
   • Position the LED on the solder-pasted area using precision tools like tweezers or pick-and-place machines.
3. Soldering Process:
   • Hand Soldering:
     • Use a soldering iron to heat the LED terminals and solder pads.
     • Apply solder wire to create a strong electrical connection.
   • Reflow Soldering (for mass production):
     • The PCB with the LED is placed in a reflow oven, where heat melts the solder paste, creating a secure connection.
   • Wave Soldering:
     • For through-hole LEDs, the PCB is passed over a molten solder wave to attach the components.
4. Inspection:
   • Verify the connections using visual inspection, automated optical inspection (AOI), or X-ray inspection.
5. Testing:
   • Test the soldered LED for functionality, ensuring it emits light and operates as intended.

LED Soldering Process

1. Manual Soldering:
   • Used for prototypes or small batches.
   • Involves a soldering iron and manual placement.
2. Automated Soldering:
   • Uses pick-and-place machines and reflow ovens for large-scale production.
3. Soldering Techniques:
   • Surface-Mount Technology (SMT): Common for LEDs mounted on flat PCBs.
   • Through-Hole Technology (THT): Used for LEDs requiring a stronger mechanical bond.
4. Cooling:
   • Allow the soldered assembly to cool, solidifying the solder joints.

Uses & Applications of LED Soldering

1. Consumer Electronics:
   • LED displays, backlights, and indicators in devices.
2. Automotive:
   • Headlights, tail lights, and dashboard indicators.
3. Industrial:
   • Machine vision lighting and control panels.
4. Residential and Commercial Lighting:
   • LED bulbs, tube lights, and architectural lighting.
5. Signage and Displays:
   • Advertising boards, billboards, and traffic signals.

Advantages of LED Soldering

1. Durability:
   • Provides a robust mechanical and electrical connection.
2. Scalability:
   • Suitable for mass production using automated techniques.
3. Efficiency:
   • Reflow soldering ensures uniform heat distribution and reliable connections.
4. Versatility:
   • Applicable to various LED sizes and designs.
5. Energy Efficiency:
   • LED soldering supports energy-efficient lighting technologies.

Disadvantages of LED Soldering

1. Heat Sensitivity:
   • LEDs are sensitive to high temperatures, which can damage components if not controlled.
2. Complexity:
   • Requires precision in placement and temperature control during soldering.
3. Material Costs:
   • Lead-free solders and automated equipment can increase production costs.
4. Risk of Cold Solder Joints:
   • Improper soldering can result in weak or intermittent connections.
5. Environmental Concerns:
   • Lead-based solder can pose environmental and health risks if not disposed of properly.

The post LED Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

Indian government policies drive electronics manufacturing growth, aiming for global leadership by 2030

Rubix Data Sciences, a technology and analytics-based B2B risk management and monitoring platform provider, today announced, is pleased to announce its latest report Rubix Industry Insight—Electronics Manufacturing, offering an in-depth analysis of the country’s rapid growth towards vying for a spot as the global hub for electronics production. The report highlights opportunities driven by strategic government initiatives, robust domestic demand, and the global shift in supply chains, while also addressing the challenges that must be overcome to sustain this momentum. Packed with actionable insights and critical data, the report is a valuable resource for decision-makers across the electronics value chain.

Key Highlights from the Report:

• Vying for a spot in the Global Value Chain
  India is aiming to achieve an electronics production target of USD 500 billion by FY2030. To facilitate this, Government initiatives like the Production Linked Incentive (PLI) scheme have attracted investments of over USD 17 billion, driving growth across key sectors including mobile phones, semiconductors, and consumer electronics.
• Semiconductors: Powering the Future
  India’s semiconductor market is projected to reach USD 109 billion by 2030, spurred by projects like Tata Electronics’ fabrication plants and Micron Technology’s USD 2.75 billion ATMP facility. These initiatives aim to localise production and reduce the reliance on imports.
• Growth in the Manufacturing of Smartphones
  India’s mobile phone exports grew by over 40% in FY2024 to USD 15.6 billion. Domestic value addition in mobile manufacturing increased from 6% in 2017 to 16% in 2023, with aspirations to reach 50% by 2030.
• Shifting Supply Chains: The “China Plus One” Advantage
  Global players such as Apple and Samsung are capitalising on India’s growing manufacturing ecosystem. Tamil Nadu alone has seen electronics exports grow exponentially, from USD 1.66 billion in FY2021 to USD 9.56 billion in FY2024.
• Import Dependency
  Despite growth in local manufacturing, India continues to rely on imports for high-value components like semiconductors, Printed Circuit Board Assemblies (PCBAs), and chipsets, contributing to a significant trade imbalance. Electronics imports from China alone exceeded USD 12 billion in FY2024.
• High Tariffs and Cost Competitiveness
  India’s average electronics tariff rate of 7.5% places the country at a 5% to 6% cost disadvantage in assembly and a 4% to 5% disadvantage in component manufacturing compared to competitors like Vietnam and Malaysia. This contributes to a 10% to 14% cost disability in assembly and 14% to 18% in component manufacturing.
• Limited R&D Investment
  India’s investment in Research & Development (R&D) remains at just 0.64% of India’s GDP, compared to 2.41% in China and 5.71% in Israel. This limits innovation in critical sectors such as semiconductors and Internet of Things (IoT) devices.
• Underdeveloped Component Ecosystem
  While India has seen success in assembly operations, component manufacturing remains nascent. High-complexity components like silicon chips are still largely imported, accounting for 64% of the demand in the automotive electronics sector alone.

What Does This Mean for Businesses?

The current state of India’s manufacturing sector is a dual narrative of opportunity and challenge. From mobile devices to semiconductor manufacturing, businesses have tremendous opportunities to grow. However, addressing structural issues such as tariff complexity, R&D gaps, and infrastructure development is crucial to unlocking the sector’s full potential.

“The electronics industry in India represents a unique blend of opportunities and challenges. Companies that act swiftly to invest in innovation and value addition will be at the forefront of this transformation,” said Mohan Ramaswamy, Co-founder & CEO of Rubix Data Sciences. “This report is a must-read for stakeholders aiming to play a significant role in India’s electronics revolution.”

Mohan Ramaswamy_Co-Founder & Chief Executive Officer, Rubix Data Science

The post India Targets $500 Billion in Electronics Production by 2030: Rubix Data Sciences appeared first on ELE Times.

Акредитація освітніх програм КПІ ім. Ігоря Сікорського 2025/01/14 kpi чт, 01/16/2025 - 11:00

While semiconductors remain in high demand, electronics engineers must stay abreast of associated developments that could eventually affect their work. Case in point: significant advancements in transition metal dichalcogenides (TMDs).

These two-dimensional materials are of particular interest to electronics engineers due to their structural phase and chemical composition; they possess numerous properties advantageous to electronic devices.

The 2D materials like TDM are prominent in the future semiconductor manufacturing landscape. Source: Nature

The ongoing semiconductor shortage has caused some engineers to delay projects or alter plans to acquire readily available supplies rather than those that are challenging to source. However, physical resource concentrations are more significant contributors to the shortage than actual scarcity.

When most of the critical raw materials used in semiconductor production come from only a few countries or regions, supply chain constraints happen frequently.

TDM learning curve

If it was possible to make the materials locally rather than relying on outside sources, electronics engineers and managers would enjoy fewer workflow hiccups. So, researchers are focusing on that possibility while exploring TMD capabilities. They are learning how to grow these materials in a lab while overcoming notable challenges.

One concern was making the growth occur without the thickness irregularities that often negatively affect other 2D materials. Therefore, this research team designed a shaped structure that controls the TMD’s kinetic activities during growth.

Additionally, they demonstrated an option to facilitate layer-by-layer growth by creating physical barriers from chemical compound substrates, forcing the materials to grow vertically. The researchers believe this approach could commercialize the production of these 2D materials. Their problem-solving efforts could also encourage others to follow their lead as they consider exploring how to produce and work with TMDs.

Semiconductor manufacturing is a precise process requiring many specific steps. For example, fluorinated gases support everything from surface-etching activities to process consistency. Although many production specifics will remain constant for the foreseeable future, some researchers are interested in finding feasible alternatives.

So, while much of their work centers around furthering the development of next-generation computer chips, succeeding in that aim may require prioritizing different materials, including TMDs. People have used silicon for decades. Although it’s still the best choice for some projects, electronics engineers and other industrial experts see the value in exploring other options.

Learning more about TMDs will enable researchers to determine when and why the materials could replace silicon.

TDM’s research phase

In one recent case, a team explored TMD defects and how these materials could impact semiconductor performance. Interestingly, the outcomes were not always adverse because some imperfections made the material more electrically conductive.

Another research phase used photoluminescence to verify the light frequencies emitted by the TMDs. One finding was that specific frequencies would characterize five TMDs with defects called chalcogen vacancies.

An increased understanding of common TMD defects and their impacts will allow engineers to determine the best use cases more confidently. Similarly, knowing effective and efficient ways to detect those flaws will support production output and improve quality control.

These examples illustrate why electronics engineers and managers are keenly interested in TDMs and their role in future semiconductors. Even if some efforts are not commercially viable, those involved will undoubtedly learn valuable details that shape their future progress.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

Related Content

• 2D Material Beats Graphene
• Chip Makers Must Learn New Ways to Play ‘D’
• 2D TMD Materials Enabling Future Electronics
• Imec’s Van den hove: Moving to Chiplets to Extend Moore’s Law
• Semiconductor Manufacturers Must Adapt to Shifting Landscape

The post How TMDs can transform semiconductor manufacturing appeared first on EDN.

Using an Arduino to control some stepper motors and servos. submitted by /u/treftstechnologies [link] [comments]

Camera lenses were originally fully mechanical (and in some cases, still are; witness my Rokinon Cine optics suite). The user manually focused them, manually set the aperture, and manually zoomed them (for non-fixed-focal length optics, that is). Even when the aperture was camera body-controlled—in shutter-priority and fully auto-exposure modes, for example—the linkage between it and the lens was mechanical, not electrical, in nature.

Analogies between lenses and fly-by-wire aircraft are apt, however, as the bulk of today’s lenses are electronics-augmented and, perhaps more accurately, -dependent. Take, for example, optical image stabilization (OIS), which harnesses electromagnets paired with floating lens elements and multiple gyroscope and accelerometer sensors to counteract one-to-multiple possible variants of unwanted camera system movement:

• Axis rotation (roll)
• Horizontal rotation (pitch)
• Vertical rotation (yaw)
• And both horizontal and vertical motion (caused, for example, by imperfect panning)

Not only is OIS within the lens itself image quality-desirable (at admitted tradeoffs of added size, weight and cost), its effectiveness can be further boosted when paired with in-body image stabilization (IBIS) within the camera itself. Olympus’ (now OM Systems’) Sync IS and Panasonic’s conceptually similar, functionally incompatible Dual I.S. are examples of this mutually beneficial coordination, which of course requires real-time bidirectional electronic communication. Why, you might ask, is OIS even necessary if IBIS already exists? The answer is particularly relevant for telephoto lenses, where the deleterious effects of camera system movement are particularly acute given the lens’s narrow angle of view, and where subtle movement may be less effectively corrected at the camera body versus at the other end of the long lens mounted to it.

More modest but no less electronics-dependent lens function examples include:

• Motor-driven autofocus (controlled by focus-determining sensors and algorithms in the camera body)
• Electronics-signaled, motor-based aperture control (some modern lenses even dispense completely with the manual aperture ring, relying solely on body controls instead)
• And motor-assisted zoom

And user setting optimization (fine-tuned focus, for example) and customization (constraining the focus range to minimize autofocus-algorithm “hunting”, etc.) is also often desirable.

All these functions, likely unsurprisingly to you, are managed by in-lens processors running firmware which benefits from periodic updates to fix bugs, add features, and augment the compatibility list to support new camera models (a particularly challenging task for third-party lens suppliers such as aforementioned Rokinon, Sigma, and Tamron). I’ve come across several lens firmware update approaches, the first two most practically implemented when the camera and lens come from the same manufacturer (i.e., a first-party lens):

• The lens’ new firmware image is downloaded to a memory card, which is inserted in the connected camera and activated via an update menu option or control button sequence
• The lens and body are again mated, but this time the body is then USB-tethered to a computer running a manufacturer-supplied update utility
• The lens is directly USB-tethered to the computer, with a manufacturer-supplied update utility then run. The key downside to this approach, therefore its comparative uncommonness, is that it requires a dedicated USB port on the lens, with both size and potential dust and water ingress impacts
• And the approach we’ll be showcasing today, which relies on a lens manufacturer- and camera mount-specific USB port-inclusive intermediary docking station to handle communications between the lens and computer.

Specifically, today’s teardown victim is a Tamron TAP-in Console, this particular model intended for the Canon EF mount used by my Canon DSLRs and one of my BlackMagic Design video cameras (Nikon mount stock images of the TAP-01 from Tamron’s website follow)

Here are some example screenshots of Tamron’s TAP-in Utility software in action, with my Mac connected to my Tamron 15-30 mm zoom lens via the TAP-01E dock intermediary:

along with my 100-400 mm zoom lens:

And both lenses post-firmware updates through the same utility:

Tamron isn’t the only lens manufacturer that goes the intermediary dock route. Here, for example, is Sigma’s UD-01 USB Dock in action with the company’s Optimization Pro software and two of that supplier’s Canon EF mount zoom lenses (24-105 and 100-400 mm) that I own:

Enough with the conceptual chitter-chatter, let’s get to real-life tearing down, shall we? In addition to the TAP-in Console I’ve already screenshot-shown you in action, which I bought used back in January 2024 from KEH Camera for $34.88, I’d subsequently picked up another one for teardown purposes off eBay open-box for about the same price. However, after it arrived and I confirmed it was also functional, I didn’t have the heart to disassemble perfectly good hardware in a potentially permanently destructive manner. I decided instead to hold onto it for future gifting to a friend who also owns Canon EF-mount Tamron lenses, and instead bought one claimed to be a “faulty spares-and-repairs” from MPB for $9. After it arrived, and to satisfy my curiosity, I decided to hook it up. It seems to work just fine, too! Oh well…

By the way, that dock-embedded LED shown in the first photo only illuminates when the TAP-in Utility software is running on the computer and detects a valid lens installed in the mount:

As usual, I’ll start out with some outer-box shots (yes, even though the dock was advertised as a “faulty spares-and-repairs” it still came with the original box, cable and documentation):

Open it up:

(I suspect that in its original brand-new condition there was more padding, etc. inside)

and the contents tumble out (I’m being overly dramatic; I actually lifted them out and placed them on my desk as shown):

Here’s the USB-A to micro-USB power-and-data cable:

Re the just-mentioned “data”, I always find it interesting to encounter a ferrite bead (or not) and attempt to discern whether there was a logical reason for its presence or absence (or not):

A bit of documentation (here’s a PDF version), supplemented by online video tutorials:

And last, but not least, our patient, already-seen LED end first, and as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Two side views: one of the micro-USB connector:

and another, of the lens release button:

Finally, here’s the mount end, first body-capped:

and now uncapped and exposed:

See those four screws around the shiny outer circumference? You know what comes next, right?

The now-unencumbered shiny metal ring, as it turns out, consists of two stacked rings. Here are the top and bottom views of the outer (upper) one:

and the even shinier inner (lower) one:

If you’re thinking those look like “springs” on the bottom, you’re not off-base:

With the rings gone, my attention next turned to the two screws at the inside top, holding a black-colored assembly piece in place:

Four more screws around the inside circumference:

In the process of removing them, the locking pin also popped out:

As you can see, the pin is spring-loaded and normally sticks out from the dock’s mount. When you mate a lens with the dock, with the former’s bayonet tabs aligned with the latter’s recesses, the lens mount presses against the pin, retracting it flush with the dock mount. Subsequently rotating the lens into its fully mounted position mates the pin with a matching indentation on the lens mount, allowing the pin to re-extend and locking the lens in place in the process.

Pressing the earlier-seen side release button manually re-retracts the pin, enabling rotation of the lens in the opposite direction for subsequent removal.

Onward. With the four screws removed:

the middle portion of the chassis lifts away, revealing the PCB underneath:

In the process of turning the middle portion upside-down, the release button (now absent its symbiotic locking pin partner) fell out:

I had admittedly been a bit concerned beforehand that the dock might be nothing more than a high-profit-margin (the TAP-in Console brand-new price is $59) “dummy” USB connection-redirector straight to the mount contacts, with the USB transceiver intelligence built into the lens itself. Clearly, and happily so, my worries were for naught:

Two screws hold the contacts assembly in place:

Four more for the PCB itself:

And with that, ladies and gentlemen, we have achieved liftoff:

Let’s zoom in (zoom…camera lens accessory…get it? Ahem…) on that PCB topside first:

As previously mentioned, the TAP-in Console comes in multiple product options for various camera manufacturers’ lens mounts. My pre-dissection working theory, in the hope that the dock wasn’t just a “dummy” USB connection-redirector as feared, was that the base PCB was generic, with camera manufacturer mount hardware customization solely occurring via the contacts assembly. Let’s see if that premise panned out.

At left is the USB-C connector. At bottom is the connector to the ribbon cable which ends up at the mount contacts assembly (which we’ll see more closely shortly). But what’s that connector at the top for? I ended up figuring out the answer to that question indirectly, in the process of trying (unsuccessfully) to identify the biggest IC in the center of the PCB, marked:

846AZ00
F51116A
DFL

I searched around online for any other published references to “F51116A”, and found only one. It was for the Nikon version of the TAP-in Console (coincidentally the same version in the stock images at the beginning of this piece) and was in Japanese (which I can’t read, far from speak), but Google Translate got me to something I could comprehend. Two things jumped out at me:

• This time, the upper connector was used to ribbon-cable tether to the contacts assembly
• And the IC was marked somewhat differently this time, specifically in the first line

734AZ00
F51116A
DFL

So, here’s my revised working theory. The PCB itself is the same (with confirmation that you’ll shortly see), as are the bulk of the components mounted to it. The main IC is either a PLD or FPGA appropriately programmed for the intended product model, a model-specific ASIC, or a microcontroller with camera mount-specific firmware. And depending on the product variant, either the top or bottom connector (or maybe both in some cases) gets ribbon-cable-populated.

Let’s flip the PCB over now:

Not much to see versus the other side, comparatively, although note the LED at bottom and another (also unpopulated this time) connector to the right of it. And to my recent comments, note that the stamp on the right:

TAMRON
AY042-901
-0000-K1

exactly matches the markings shown on the PCB in the Nikon-version teardown.

About that contacts assembly I keep mentioning…here’s the “action” (electrically relevant) end:

And here’s the seemingly (at least initially) more boring side:

I thought about stopping here. But those two screws kept calling to me:

And I’m glad I listened to them. Nifty!

With that I’ll wrap up and, after the writeup’s published, see if I might be able to get it back together again…functionally, that is…mindful of the Japanese teardown enthusiast’s comments that “The lens lock release switch part was a bit of a pain to assemble (lol).” Reader thoughts are as-always welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Tamron’s TAP-in Console: A nexus for camera lens update and control appeared first on EDN.

submitted by /u/1Davide
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Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has completed the offering of shares of its common stock under its previously announced ‘at the market’ (ATM) offering program pursuant to a shelf registration statement filed with the US Securities and Exchange Commission and a prospectus supplement dated 9 December...

Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA has completed its acquisition of the silicon carbide junction field-effect transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, of Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) for $115m in cash...

КПІ імені Ігоря Сікорського реалізує міжнародний проект з підвищення спроможності місцевих громад kpi ср, 01/15/2025 - 17:23

Found this disassembled smoking device in the car of a friend of mine. The battery itself even has a cross shaped vent on top of it. submitted by /u/NergoN123 [link] [comments]

It’s not difficult to drive an LED indicator from the AC line, but it requires many active and passive components. It also poses safety challenges. EDN and Planet Analog blogger Bill Schweber explains how engineers can replace LEDs with neon lamps to design AC power-on indicators while addressing modern design challenges.

Read full story at EDN’s sister publication, Planet Analog.

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The post How neon lamps can replace LEDs in AC-powered designs appeared first on EDN.

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has introduced the EPC91200, a fully configured motor drive inverter reference design that is said to deliver exceptional performance and flexibility for a variety of industrial and battery-powered applications...

Партнерство з Іnstitut Polytechnique de Paris kpi ср, 01/15/2025 - 13:21

Старий Новий рік можна зустрічати не лише в ніч проти 14 січня kpi ср, 01/15/2025 - 13:20

CNC (Computer Numerical Control) soldering is an automated process where soldering tasks are performed using a programmable CNC machine. It allows precise control over the soldering process, ideal for repetitive and intricate soldering tasks in electronic manufacturing. The CNC system guides the soldering tool along pre-defined paths to achieve accurate solder joints.

How CNC Soldering Works:

1. Design Input: The process starts with CAD/CAM software to create a digital design of the soldering task.
2. Programming: The design is converted into machine-readable G-code, which guides the CNC soldering machine.
3. Machine Setup: The soldering tool (e.g., soldering iron, laser, or ultrasonic tool) is mounted on the CNC arm.
4. Execution: The machine follows the programmed path, precisely applying solder to designated areas, ensuring consistent quality.
5. Inspection: Automated or manual inspection ensures solder joints meet required standards.

CNC Soldering Process:

1. Preparation:
   • Load the components and PCB (Printed Circuit Board) onto the machine.
   • Input the soldering design and settings.
2. Heating and Solder Application:
   • The CNC tool applies heat to the solder and component leads.
   • Solder flows to form a secure joint.
3. Cooling:
   • The joint is allowed to cool naturally or with cooling systems to solidify.
4. Quality Check:
   • Joints are inspected for accuracy and integrity.

CNC Soldering Uses & Applications:

• Electronics Manufacturing: Ideal for PCBs in consumer electronics, automotive electronics, and medical devices.
• Prototype Development: Rapid soldering of prototype boards with consistent quality.
• Aerospace and Defense: Precise soldering for high-reliability applications.
• LED Assembly: Used for accurate placement and soldering of LED components.
• Telecommunications: Efficient soldering of intricate circuit boards for communication devices.

CNC Soldering Advantages:

1. Precision: Ensures accurate soldering with minimal errors.
2. Consistency: Delivers uniform quality across all joints.
3. Speed: Automates repetitive tasks, reducing production time.
4. Scalability: Suitable for both small-scale and mass production.
5. Safety: Minimizes manual handling, reducing risks to operators.
6. Versatility: Compatible with various soldering tools and techniques, including laser and ultrasonic soldering.

CNC Soldering Disadvantages:

1. High Initial Cost: Significant investment in CNC machines and setup.
2. Complex Setup: Requires skilled personnel for programming and maintenance.
3. Limited Flexibility: Less adaptable to on-the-fly changes compared to manual soldering.
4. Material Compatibility: May not suit all types of soldering materials or components.
5. Maintenance Requirements: Machines need regular calibration and upkeep.

CNC soldering is a cornerstone of modern electronics manufacturing, combining efficiency and precision while offering cost-effective solutions for high-quality soldering needs.

The post CNC Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.