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📰 Газета "Київський політехнік" № 7-8 за 2026 (.pdf) Інформація КП пт, 02/27/2026 - 15:15

Viasat and Rohde & Schwarz are set to collaborate to boost testing for Narrowband Non-terrestrial Networks (NB-NTN) IoT devices connecting via satellite. By thoroughly validating devices and confirming interoperability with Viasat’s network, the collaboration aims to help ensure uninterrupted connectivity for a wide range of satellite-based Internet of Things (IoT) applications. Visitors to MWC Barcelona 2026 can experience the test plan in action.

The collaboration aims to ensure that chipsets, modules and devices interoperate seamlessly with Viasat’s satellite network and comply with 3GPP Release 17 standards.

Deploying advanced testing methodologies upholds the highest standards of quality, performance and reliability for Viasat’s connectivity services: delivering ubiquitous IoT applications in areas without terrestrial network coverage.

The certification test plan with Viasat entails protocol, performance and RF test scenarios. It is based on the CMX500 one-box signalling tester from Rohde & Schwarz, a versatile solution designed for testing various NTN technologies, including New Radio (NR-NTN) and NB-NTN. In a single instrument, the CMX500 covers R&D through certification and carrier acceptance tests, guaranteeing reliable and repeatable results. It empowers engineers to accelerate development, ensure quality and confidently deploy reliable NTN services, safeguarding that the whole ecosystem can achieve the highest levels of performance.

The post R&S and Viasat collaborate on NB-NTN IoT test plan for connectivity via satellite at MWC Barcelona 2026 appeared first on ELE Times.

Japan-based ROHM Semiconductor has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of foundry Taiwan Semiconductor Manufacturing Company Ltd (TSMC), with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group. Licensing TSMC GaN technology will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles, ROHM reckons...

Keysight Technologies, Inc. will demonstrate lab-based validation of new radio non-terrestrial networks (NR-NTN) devices at Mobile World Congress 2026 in collaboration with Samsung Electronics’ System LSI Business. The demo will showcase testing capabilities aligned with planned Low Earth Orbit (LEO) satellite deployments, including Starlink Direct to Cell.

As satellite connectivity becomes integral to 5G evolution and future 6G networks, chipset and device vendors must validate NR-NTN performance well in advance of large-scale deployment. Satellite systems in LEO introduce new challenges, including rapid motion, frequent handovers, dynamic link conditions, and stringent positioning requirements. Without access to live satellite networks during early development, organisations need accurate laboratory-based methods to assess mobility, service continuity, and throughput performance under realistic operating conditions in a laboratory.

Keysight’s NTN Network Emulator Solutions recreate LEO satellite characteristics in a controlled laboratory environment. The MWC demonstration integrates Keysight’s 5G Network Emulator with a Samsung NR-NTN modem to validate satellite and device mobility, service continuity, and higher-throughput Multiple-Input, Multiple-Output (MIMO) configurations under parameters aligned with Starlink deployment scenarios.

The demonstration also showcases Keysight’s positioning emulation capabilities, enhanced through its recent Spirent acquisition. PNT Xe enables accurate global navigation satellite system-based positioning as part of an end-to-end validation workflow.

Jungwon Lee, Executive Vice President of System LSI Modem Development Team at Samsung Electronics, said: “NR-NTN introduces new technical challenges for modem design, particularly around mobility, handover, and link adaptation in LEO environments. This demonstration with Keysight allows us to validate NR-NTN modem performance under representative satellite conditions, helping ensure readiness for future satellite-based 5G services.”

Peng Cao, Vice President and General Manager, Keysight’s Wireless Test Group, said: “Direct-to-device satellite connectivity is moving from concept to deployment, making early end-to-end NR-NTN validation essential. Our lab-based, live-application testing gives the ecosystem a repeatable way to prove interoperability and performance, cutting risk and time-to-market while keeping users connected beyond terrestrial coverage.”

The post Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung appeared first on ELE Times.

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Was at the Super Bowl (a bit drunk ngl) and the hole for the RF control was to the left of the actual LEDs, I can’t stop wondering if I could turn it back on if I had the right equipment. The LEDs also looked a bit strange, not like the normal ones I see. submitted by /u/scoobertsonville [link] [comments]

Keysight’s XR8 real-time oscilloscope accelerates high-speed interface debug and compliance validation with powerful parallel, multicore analysis. A newly designed frontend ASIC combined with an integrated 12-bit ADC and DSP engine preserves signal integrity, enhances timing accuracy, and delivers consistent, repeatable measurements across high-speed serial, memory, and mixed-signal designs.

Powered by Infiniium 2026 software, the XR8 streamlines workflows with flexible waveform windows and productivity tools including drag-and-drop functionality and an integrated SCPI recorder. Intrinsic jitter as low as 13 fs rms and noise below 130 µV at 8-GHz bandwidth maintain compliance margin for high-speed interfaces including USB4v2, DisplayPort 2.1, and DDR5. The integrated ADC/DSP engine increases acquisition, analysis, and reporting throughput by up to 3×, helping engineers complete high-speed interface validation faster and more efficiently.

The XR8’s redesigned mechanical architecture reduces power consumption, improves thermal efficiency, and minimizes acoustic noise in a compact footprint. This smaller, quieter platform can be deployed in space-constrained labs or positioned closer to the device under test for stable, low-noise operation.

For more information about the XR8 4-channel, 8-GHz to 33-GHz bandwidth oscilloscope, click the product page link below.

XR8 product page

Keysight Technologies 

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MasterGaN6 from ST integrates two 650-V enhancement-mode GaN transistors with typical RDS(on) of 140 mΩ in a half-bridge configuration, delivering a compact, efficient power stage. This power system-in-package also integrates a high-voltage gate driver and linear regulators for both high-side and low-side supplies to further reduce external components.

As the second generation of the MasterGaN half-bridge family, MasterGaN6 adds dedicated fault and standby pins to enable enhanced system monitoring and power management. Integrated LDOs and a bootstrap diode ensure reliable, optimized gate driving for improved efficiency and performance in high-density power applications.

MasterGaN6 handles output currents up to 10 A, with an overall driver propagation delay of 45 ns and a minimum pulse width of 35 ns. Its 3.3-V to 15-V logic-compatible inputs feature hysteresis and an integrated pull-down for robust noise immunity. A comprehensive protection set includes cross-conduction prevention, thermal shutdown, and undervoltage lockout to ensure safe and reliable operation.

Prices for the MasterGaN6 half-bridge in a 9×9-mm QFN package start at $4.14 in lots of 1000 units.

MasterGaN6 product page 

STMicroelectronics

The post GaN half-bridge simplifies 650-V power stages appeared first on EDN.

Kyocera AVX has expanded its 550/560 series of ultra-broadband MLCCs to support high-speed, high-bandwidth optical communication systems. The capacitors provide reliable, repeatable RF/microwave performance from 7 kHz to 110 GHz and exhibit low insertion loss and flat frequency response. Depending on case size and capacitance value, typical insertion loss remains below 0.5 dB through 40–70 GHz and below 1 dB through 70–110 GHz.

The four new devices are available in 0402-size cases with capacitance values of 1 nF, 10 nF, 25 nF, and 47 nF and maximum working voltage ratings from 16 V to 100 V. With these additions, the 550/560 series offers a total of 15 devices in 01005, 0201, and 0402 case sizes with capacitance values spanning 1 nF to 220 nF. All of the capacitors operate over a temperature range of -55°C to +125°C.

The 550/560 lineup features a rugged one-piece construction with tin- or gold-plated nickel barrier terminations compatible with reflow soldering. These terminations are designed to prevent base metallization from leaching into the solder and forming brittle intermetallic compounds, which could cause cracking and solderability issues.

Visit the 550/560 series product page to download the datasheet, which includes S-parameter data and S2P Touchstone files for RF and microwave simulation. The four new part numbers will be stocked this November and available for order at DigiKey and Mouser Electronics.

550/560 series product page

Kyocera AVX 

The post Low-loss MLCCs deliver wideband RF performance appeared first on EDN.

The Iridium 9604 IoT module integrates satellite, LTE-M (Cat-M1), and multi-constellation GNSS into a compact 16×26×2.4-mm form factor. Built on the u-blox SARA-R5 platform, it integrates Iridium Short Burst Data (SBD), cellular connectivity, and GPS in a single device, enabling cost-effective dual-mode IoT deployments for industrial, infrastructure, and mobility applications.

The module supports GPS, GLONASS, Galileo, and BeiDou, and operates across an industrial temperature range of −40°C to +85°C. Optimized sleep modes and a unified power architecture across all three subsystems support ultra-low-power IoT designs.

Independent control of the satellite, LTE-M, and GNSS radios allows application-defined, GNSS-informed connectivity decisions, from simple failover to advanced routing logic. A unified AT command set simplifies firmware development across all functions.

The 9604 features dual RF ports—one shared for Iridium SBD and GNSS and one dedicated for LTE-M—reducing board space and simplifying RF design. The beta program was oversubscribed, with participants reporting lower system cost and up to 60% PCB footprint reduction.

Commercial availability is scheduled for June 2026, with development kits available for evaluation. Reserve priority access on the product page linked below.

9604 product page 

Iridium Communications 

The post 3-in-1 IoT module cuts complexity appeared first on EDN.

Cavli’s CQM220 5G Reduced Capability (RedCap) module provides power- and cost-optimized 5G connectivity for IoT applications. Compliant with 3GPP Release 17, it delivers downlink speeds up to 220 Mbps and uplink up to 120 Mbps, with LTE Cat 4 fallback for 4G compatibility.

The module features an Arm Cortex-A7 processor running up to 1.9 GHz, flexible memory configurations, and advanced power management options including eDRX/DRX modes. It comes with the OpenWrt-based OpenSDK for on-module application development, reducing external MCU dependency.

Integrated multi-constellation, dual-band GNSS with L1 and L5 support enables precise positioning using GPS, GLONASS, Galileo, BeiDou, NavIC, QZSS, and SBAS in urban, industrial, and remote environments.

The CQM220 is available in a 28.0×25.5×2.7-mm LGA package for compact embedded designs and an M.2 form factor for routers, gateways, and CPE. It provides USB 2.0, PCIe Gen2, I2C, UART, SPI, SDIO, I2S, and ADC interfaces, along with main, diversity, and GNSS antenna connections.

Samples and evaluation kits can be ordered on the product page linked below.

CQM220 product page 

Cavli Wireless 

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The South Wales-based compound semiconductor cluster CSconnected has announced the fourth and final funding round of its £1m Supply Chain Development Programme, which is delivered in partnership with Cardiff Capital Region (CCR) to accelerate the expansion of the compound semiconductor supply chain, with the aim of driving job creation, stimulating economic growth, and strengthening the UK’s strategic position in advanced semiconductor manufacturing...

submitted by /u/Daniels998 [link] [comments]

A solar charging kit, inexpensive as-is and purchased after further promotional enticement, enables keeping a remotely located vehicle battery topped off.

One of the things I enjoy most about technology is watching a new approach (along with products based on it) hit its high-volume stride, typically driven by one or only a couple of early applications, and then just explode from there, both replacing precursor technologies and expanding into brand new applications and markets. This has certainly been the case, for example, with LEDs. See, for example, my recent teardown (where they replaced fluorescent tubes) for an example of the former, and an earlier teardown (where their low power consumption and DC voltage foundation enabled the development of a light bulb with integrated battery backup) for an example of the latter.

A solar revolution

Or take, as another technology case study, solar cells. Their combination of efficiency and cost-effectiveness, in combination with equally pervasive lithium battery technology, has enabled widespread replacement of predecessor SLA-based energy storage systems, both portable and whole-home permanent installations, while dramatically expanding the accessible market for such devices. At the same time, they’re helping create entirely new categories of products. Take, as a humble example, Renogy’s 10W solar trickle charger kit, two of which I purchased back in October 2024 and one of which I recently, belatedly, and finally pressed into service:

Right now, as I write this, they’re selling on Amazon for $25.17 each, brand new. A year-plus ago, during Amazon’s Prime Days sales, I got them off the Resale (formerly Warehouse) site in used, like-new condition for $17.74. I don’t think they’d even been opened by the prior purchaser(s) prior to getting returned. The intent at the time was to use them to keep the batteries in two of my vehicles, then outdoor-stored at a lot about a half hour drive away, trickle-charged up. But I could never figure out how to securely attach the solar cells to the vehicle covers, far from routing their outputs to the battery compartments. That said, I eventually figured that latter part out: SAE extension cables:

One of the vehicles, my 2001 Volkswagen Eurovan Camper, is now parked in my garage for critter-protection purposes. The other, a 2006 Jeep Wrangler Unlimited Rubicon, most recently mentioned last March when I discussed its then-drained battery state, is still down there (now with a permanently disconnected battery). A few months back, when I drove down and checked on it, my preparatory suspicion was confirmed; as happens every few years, the combination of persistent sun and still-frequent precipitation (rain, snow, hail…) exposure, along with also-frequent wind, had disintegrated the cover:

Successful experimentation

While waiting for the replacement cover to arrive, I had a bright idea; this’d be the perfect time to finally try out that solar cell kit! My original idea was to mount it to the now-exposed vehicle hood. But then I realized that I had an even better option available, inside the vehicle:

in combination with the 12V auxiliary power connector built into the console:

As you can see from the above image (which I snagged from an enthusiast forum thread post to save me an hour-long round-trip drive to the storage lot to take my own shot; that’s not actually my rig), there are two of them. One, the “cigarette lighter” located within the ashtray, is ignition-switched. It obviously won’t work for my purposes. The other, while (I think) still fused, otherwise routes directly to the battery; it’s always “hot”. That’s the one I needed and used:

And it works perfectly! My perhaps-obvious concern was two-fold:

• It’d either not work sufficiently (or at all), leaving me with an eventually-drained battery once again, or
• It’d work too well, not terminating the trickle charge when it sensed a “full” state, thereby also leading to the battery’s demise (along with who-knows-what other issues).

Two weeks later, when I went back and checked (in the process of installing the new vehicle cover), I happily discovered that all my worrying was for naught; it was working exactly as planned. Now I just need to figure out how to securely attach the solar cell to the outside of the new cover, and I’ll be set! Suggestions, along with more general thoughts, are as-always welcomed in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

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The post Jumping the Jeep: An alternative cost-effective solar cell example app appeared first on EDN.

As AI and machine learning workloads accelerate, data center power consumption is beginning to outstrip existing infrastructure capacity. To meet this rising demand, new high-voltage DC standards support the higher-power, denser server racks now found at gigawatt-scale facilities. These high-voltage standards create engineering challenges when monitoring high-voltage power rails.

Designers need reliable, accurate, and fast-acting voltage supervision to prevent overvoltage damage to downstream components, and to help ensure a timely system response to undervoltage conditions. This article presents a supervision approach that addresses these requirements and enables the reliable deployment of next-generation high-voltage DC architectures.

 The push toward high-voltage DC architectures

The power profile of modern data centers is undergoing a dramatic shift as AI becomes the dominant application. Machine learning with large graphics processing unit arrays consumes power at levels once associated with industrial equipment rather than IT hardware. It is increasingly common for a single rack to draw 60 kW to 100 kW. Next‑generation AI systems are expected to push beyond 150 kW per rack.

Because traditional 48-V distribution designs cannot efficiently support these levels, designers are turning to a new class of high‑voltage DC standards centered around ±400 V or 800 V distribution. This shift, as shown in Figure 1, is not simply an incremental upgrade; it represents a fundamental change in the delivery of power across gigawatt‑scale facilities.

Figure 1 Conventional versus high-voltage data center power distribution. (Source: Texas Instruments)

Efficiency continues to drive the transition to higher voltages. Higher voltages reduce current and the I²R losses that dominate high power distribution, while also substantially cutting current and reducing conduction losses in cables, busbars, and connectors. Higher efficiency at large AI campuses means lower cooling requirements, improved energy performance, and increased computing density.

Higher voltages also unlock greater power‑delivery capability. Delivering 150 kW to 300 kW per rack at 48V requires heavy conductors, parallel cabling, and complex routing. High voltages deliver the same power with manageable current levels, enabling simpler infrastructures and longer distribution distances without excessive copper mass.

Cost provides yet another compelling factor. Smaller conductors, lighter busbars, and reduced copper usage lower material and installation expenses. At modern hyperscale data center campuses, these reductions are substantial.

Challenges in monitoring high-voltage power rails

As data‑center power architectures migrate toward higher‑voltage DC distribution, the need for monitoring and protection circuitry increases significantly. Higher-voltage DC distribution increases demands on monitoring and protection circuitry. Operating at ±400 V or 800 V means that every disturbance or transient condition carries more stored energy, with components operating closer to their absolute limits. These conditions reduce the margin for error and make precise power‑rail supervision essential.

Designers must contend with higher fault energy levels, faster electrical dynamics, increased electromagnetic noise, and tighter system‑level coordination requirements. In this environment, monitoring circuits must distinguish between harmless fluctuations and true fault conditions, with far greater accuracy and speed than lower‑voltage systems.

With these broader challenges in mind, let’s look more closely at two specific issues surrounding under- and overvoltage events:

• Response time. The voltage monitor must respond to faults fast enough to prevent damage to downstream components, but should not trigger erroneously from a noisy environment or short transient voltage fluctuations. For example, imagine a large current spike causing the supply voltage to drop while the power supply responds. If the voltage drops for only a very short time, it may not be considered a fault condition, thus requiring no action. As soon as the voltage is low enough to be considered a fault, however, the voltage monitor should take action as soon as possible to prevent damage.
• Size requirements are another common challenge for voltage monitoring. High-voltage data-center power supplies have extremely limited space, requiring the smallest possible monitoring solution. But it also has to be reliable. Ensuring that the voltage monitoring solution can be trusted to respond to faults is imperative to a reliable power supply and distribution system.

Requirements for monitoring high-voltage power rails

Figure 2 shows a minimal high-voltage monitoring circuit implementation using:

• A high-voltage resistor ladder to step down the power rail for sensing comparators.
• Two comparators to signal under- and overvoltage faults.
• A voltage reference for comparators.
• Filtering components.
• An amplifier to provide a scaled-down voltage for the analog-to-digital converter (ADC) for analog monitoring and telemetry of the power rail.

Figure 2 High-voltage monitoring circuit building blocks. (Source: Texas Instruments)

Implementing this circuit with discrete components may present significant drawbacks. Individual component tolerances will add together, resulting in significant errors requiring costly, high-accuracy, low-temperature-drift components. Resistors are especially problematic, as each resistor’s uncorrelated error will sum to create a significant cumulative error in the resistor-divider. Discrete components consume significant board space, which is typically at a premium in data-center applications.

Figure 3 shows a reference layout with space requirements for high-voltage monitoring with discrete components.

Figure 3 A discrete high-voltage monitoring implementation. (Source: Texas Instruments)

An integrated solution

An integrated device for high-voltage supervision addresses these challenges by fully integrating the high-voltage resistor-divider, comparators, buffer, and additional features. The functional diagram in Figure 4 illustrates this approach, helping reduce total solution size while maintaining high performance.

By integrating the resistors, reference, and comparators, TI’s TPS371K-Q1 achieves an accuracy of 1% across the –40°C to 125°C temperature range, with a fast fault detection time of <5 µs, programmable glitch rejection and release delay time, as well as a 1% accurate high-bandwidth buffer that can directly drive 16-bit ADCs or downstream control circuits.

Figure 4 TPS371K-Q1 functional block diagram. (Source: Texas Instruments)

An integrated monitoring solution also provides significant board space savings in a compact package (Figure 5), requiring minimal external components.

Figure 5 Integrated high-voltage monitoring solution. (Source: Texas Instruments)

Application example

The implementation of a voltage monitoring system using the TPS371K-Q1 is straightforward. Figure 6 shows a basic schematic for monitoring the ±400V or 800V input to a DC/DC converter.

Figure 6 Voltage monitoring for a high-voltage DC/DC converter. (Source: Texas Instruments)

Using resistors on the ADJ OV and ADJ UV pins, designers can select under- and overvoltage thresholds to fit their system. The CTR and CTS pins allow the use of a capacitor to program a delay before assertion of a fault and a delay before deassertion once the voltage returns to normal. Open-drain outputs enable easy interface with logic levels other than the device’s own supply voltage. The VSENSE output pin provides a scaled representation of the SENSE input voltage for direct connection to an ADC. Designers can select voltage sense output factors with options ranging from 200 to 900.

Integrated monitoring solutions

The transition to high‑voltage DC architectures is reshaping design requirements for next‑generation data‑center power systems, especially as AI workloads continue to push rack‑level power far beyond the limits of today’s distribution schemes. Reliable voltage supervision becomes foundational, helping ensure high‑energy power-rail monitoring with the speed, accuracy, and reliability required to protect downstream converters and maintain system stability.

Integrated monitoring solutions such as the TPS371K-Q1 address these challenges by combining precise threshold detection, fast fault response, programmable filtering, and compact implementation into a single device optimized for the electrical and space constraints of modern data centers. By adopting advanced monitoring approaches, designers can confidently deploy ±400 V and 800 V architectures that deliver the efficiency, power density, and reliability needed to support the continued growth of AI‑driven computing at the gigawatt scale.

Henry Naguski is an applications engineer for Linear Power at Texas Instruments, working with voltage references and supervisors. He specializes in shunt voltage references and high-voltage supervisors. Henry holds a bachelor’s degree in computer engineering from Montana State University.

 

 

Masoud Beheshti leads application engineering and marketing for Linear Power at Texas Instruments. He brings extensive experience in power management, having held roles in system engineering, product line management, and marketing and applications leadership. Masoud holds a bachelor’s degree in electrical engineering from Ryerson University and an MBA with concentrations in marketing and finance from Southern Methodist University.

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• Power Tips

The post Power Tips #150: Overcoming high-voltage monitoring challenges in gigawatt-scale data centers appeared first on EDN.

Variable reluctance (VR) sensors transform mechanical motion into electrical signals by exploiting changes in magnetic flux. As a ferromagnetic target moves past the sensor’s pole piece, the reluctance of the magnetic circuit varies, inducing a voltage in the coil.

This simple yet robust principle has made VR sensors indispensable in applications ranging from automotive crankshaft speed detection to industrial position monitoring. Their ability to deliver precise motion feedback without requiring external excitation makes them a cost-effective choice for engineers designing systems that demand reliable speed and position sensing.

Magnetic reluctance and VR sensors

Reluctance is a physical quantity that describes the opposition a magnetic circuit offers to the flow of magnetic flux. For instance, in the air gap of a permanent magnet—an essential part of a magnetic circuit—the reluctance is high because air has very low magnetic permeability.

This reluctance drops significantly when a piece of soft iron is placed in direct contact with the magnet’s poles, while it assumes an intermediate value if the same iron piece is positioned within the air gap without touching the poles. In each case, the magnetic field is altered accordingly.

VR sensors exploit this property by combining a permanent magnet with a coil to detect changes in magnetic flux. As ferromagnetic targets—such as gear teeth—modulate the magnetic circuit’s reluctance, an alternating voltage is induced in the coil. These passive magnetic transducers are widely applied in engine speed sensing and crankshaft/camshaft timing, valued for their ruggedness in high‑temperature and high‑performance environments.

The diagram below illustrates the operation of a VR sensor. The coil’s core is positioned close to a rotating gear, and each time a tooth passes near the sensor, the reluctance of the magnetic circuit formed by the permanent magnet changes. This variation alters the magnetic field, inducing a current in the coil and producing a voltage signal.

The frequency and amplitude of this signal are directly proportional to the gear’s rotational speed, while the direction of rotation has no effect. The signal amplitude, however, decreases as the air gap between the sensor and the gear teeth increases. Consequently, the primary limitation of VR sensors is their inability to reliably detect very slow or distant movements.

Figure 1 Schematic depicts the core arrangement of a variable reluctance sensor near a gear tooth. Source: Author

In essence, a permanent magnet forms the core of a VR sensor, establishing a fixed magnetic field. When a ferrous metal target—such as a gear tooth—approaches and passes the pole piece, the field strength changes. The alternating presence and absence of the ferrous material modulates the reluctance, or “resistance to the flow” of the magnetic field. This dynamic variation alters the field strength, inducing a current in the coil winding connected to the output terminals.

This has led to the widespread use of VR sensors across many industries. Consequently, they are also known by a range of application-specific names, including magnetic pickups, passive speed sensors, motion sensors, pulse generators, frequency generators, variable reluctance speed sensors, transducers, magnetic probes, and timing probes.

From this point onward, the discussion turns to the principal theme of the post—variable‑reluctance speed (VRS) sensors. Let us take a quick look at VRS sensors in action and the practical factors that matter most.

Note on terminology: To prevent confusion between VR and VRS, VR designates the broader class of magnetic transducers that convert motion into electrical signals, while VRS identifies the specialized subset engineered for rotational speed measurement.

Understanding VRS industrial magnetic speed sensors

A variable reluctance speed (VRS) sensor—often marketed by manufacturers as an industrial magnetic speed sensor—is a rugged, self-powered device that requires no external voltage source. It’s widely used to deliver speed, timing, and synchronization data to control circuits or displays as a pulse train, and is valued for its reliability in high temperature, high-performance environments.

In basic terms, a VRS industrial magnetic speed sensor employs a permanent magnet, pole piece, and coil to convert the motion of a ferrous target—such as a gear tooth—into an electrical signal.

The most common target is metal gear, but examples include bolt heads, disc perforations, and turbine blades. In every case, the target must be ferrous—preferably unhardened steel—to ensure reliable signal generation.

The output of a VRS sensor is an AC voltage whose amplitude and waveform vary with the speed of the monitored device. This signal is typically specified in terms of peak-to-peak voltage (Vp-p). Each complete waveform (cycle) is generated as a target passes the sensor’s pole piece (sensing area). When a standard gear is used, the resulting output signal closely resembles a sine wave when observed on an oscilloscope.

Figure 2 Diagram illustrates an application example of an industrial variable reluctance speed sensor. Source: Phoenix America

Signal conditioning for VRS sensors

Conditioning the output signal from a VRS sensor is crucial before it’s processed by downstream electronics such as a microcontroller. Proper conditioning ensures that the analog signal is efficiently and reliably converted into a clean, usable form—free from interference and with an amplitude compatible with the rest of the circuitry.

Not to refrain, but converting a possibly noisy analog signal with variable amplitude and frequency into a TTL/CMOS-compatible signal is a challenging task that demands careful design and robust signal-conditioning techniques.

Although signal conditioning can be implemented with discrete electronics, several semiconductor manufacturers now offer ICs specifically designed to handle this demanding task. Notably, onsemi provides the NCV1124, while Maxim Integrated, now part of ADI, offers the MAX992x family, both tailored for reliable conversion of variable-reluctance sensor outputs into clean, logic-level signals.

As a related note, this recalls some of my earlier experiments with classic interface and frequency-to-voltage converter ICs such as LM1815, LM2907, and LM2917. These devices, though older in design, provided valuable insight into the challenges of conditioning variable-reluctance sensor outputs and converting them into usable forms for measurement and control applications.

Figure 3 Simplified block diagram of MAX9924 highlights the IC’s role in transforming noisy variable-reluctance sensor inputs into clean, microcontroller-compatible signals. Source: Analog Devices

Just a quick tip: STMicroelectronics’ L9788 is a multifunction IC for automotive engine management systems. Among its many integrated features, it includes a dedicated VRS interface. This block processes crankshaft and camshaft sensor signals, offering both normal operation (conversion of differential voltages) and diagnostic mode (detecting shorts or open conditions). With adaptive hysteresis and built-in filtering, the VRS interface ensures reliable engine synchronization while reducing the need for external conditioning circuits.

Application considerations for VRS sensors

VRS sensors are not intended for sensing extremely low rotational speeds. The target passing the pole piece must travel at a minimum velocity or surface speed to generate an adequate output voltage. Proper sensor selection requires ensuring that the device delivers the necessary Vp-p at the lowest speed of interest, while still operating reliably at the maximum frequency of the application.

In most cases, the polarity of the output signal is inconsequential; when polarity matters, simply reversing the output leads resolves the issue. Furthermore, for every gear-tooth configuration, there exists an optimum pole-piece size and shape that maximize sensor output voltage, a relationship clearly documented in manufacturer datasheets. In addition, correct load resistance and precise air-gap setting are critical to achieving stable performance and consistent signal quality across the operating range.

That is all for now. While simplifying complex topics to fit into the pocket of fundamentals, there is always more detail waiting in the wings. This time, the essentials have been chalked out; deeper layers can follow in future installments—so if you found this technical take useful, share it with colleagues or add your thoughts in the comments to help shape the next deep dive.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

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The post Variable‑reluctance sensors: From fundamentals to speed sensing appeared first on EDN.

Combining TSMC’s Process Technology to Build an End-to-End, In-Group Production System

ROHM has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group. By licensing TSMC GaN technology, ROHM will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles.

GaN power devices offer excellent high-voltage and high-frequency performance, helping to improve efficiency and reduce size in a wide range of applications, and are already used in consumer products such as AC adapters. Adoption is also expanding in high-voltage applications such as power units for AI servers and on-board chargers for electric vehicles (EVs), and demand is expected to continue growing.

ROHM began developing GaN power devices at an early stage and established a mass-production system for 150V GaN at ROHM Hamamatsu in March 2022. In the mid-power range, ROHM has built its supply structure while advancing external collaborations. One of the key partners in this effort has been TSMC: ROHM has adopted a 650V GaN process since 2023, and in December 2024, the two companies entered into a partnership related to automotive GaN, further deepening their collaboration.

This latest integration represents an evolution of that partnership. Under a newly concluded license agreement, TSMC’s process technology will be transferred to ROHM Hamamatsu. ROHM aims to establish the production system in 2027 to meet expanding demand in applications such as AI servers.

Upon completion of the technology transfer, ROHM and TSMC will amicably conclude their automotive GaN partnership. At the same time, the two companies will continue to strengthen collaboration for higher efficiency and more compact power supply systems.

The post ROHM Strengthens Supply Capability for GaN Power Devices appeared first on ELE Times.

element14, an Avnet Community, in collaboration with ADI, has launched a new design challenge inviting engineers and makers to develop advanced security and surveillance prototypes.

Participants are tasked with designing a prototype or test rig utilising ADI’s MAX32630FTHR, a versatile development platform, and Würth Elektronik’s SMD LEDs with an integrated WL-ICLED controller. The challenge encourages creative applications of these components to deliver innovative security features.

Selected challengers will receive a free kit of components, with ADI’s MAX32630FTHR as the core element, to assist in building their prototypes. Each participant will document the build process and final outcome through blogs on the element14 Community platform.

Examples of potential applications include facial recognition door entry systems, voice and face detection, environmental monitoring, crowd sentiment analysis, break-in detection and remote security sentry solutions.

“Through this challenge, we’re inviting our global community to showcase creativity and problem-solving in the field of security and surveillance,” said Andreea Teodorescu, Global Director of Product Marketing & element14 Community. “It’s an opportunity for participants to learn, share ideas, and demonstrate how innovative thinking can address real-world safety challenges.”

“We’re excited to collaborate with the element14 Community on a challenge that inspires creativity and problem-solving,” said Stephane Di Vito, ADI Distinguished Engineer, Product Security. “This initiative brings together passionate designers and engineers to explore new ideas and develop solutions that can make security smarter and more effective.”

The post element14 Community launches smart security and surveillance design challenge appeared first on ELE Times.

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КПІ розширює партнерство в гуманітарному розмінуванні kpi ср, 02/25/2026 - 22:23