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Toward the end of my late-April teardown of Walmart’s first-generation Google TV-based onn. 4K Streaming Box, which EDN quickly augmented by publishing my dissection of its “stick” sibling, the onn. Full HD Streaming Device, two weeks later, I wrote:

I’ve also got an onn. Google TV 4K Pro Streaming Device sitting here which I’ll be swapping into service in place of its Google Chromecast with Google TV (4K) predecessor. Near-term, stand by for an in-use review; eventually, I’m sure I’ll be tearing it down, too.

With apologies (although I know of at least one reader that won’t be disappointed), I’m going to alter that planned content-publication cadence. Thanks to a gently used onn. Google TV 4K Pro Streaming Device that I subsequently found at notable discount to MSRP on eBay, you’re going to get that teardown today. And although I hope that TheDanMan (and the rest of you) get something(s) useful out of this project, I already did. More on that after the break(down).

The onn. 4K Pro Streaming Device teardown

Let’s start with some overview shots of our patient, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes. I’d incorrectly mentioned back in the late April teardown that this device has dimensions of 7.71” x 4.92” x 2.71”…those are actually the package dimensions (in my slight defense, every other review I’ve found parrots the exact same info from Walmart’s website). It’s ~4.25” on each side (a rounded square in form factor) and 1.5” tall (rounded top, too), per my tape measure. And my kitchen scale says it weighs ~9.9 oz:

Around the front is a button that, when pressed, causes the remote control (assuming it’s in Bluetooth broadcast range) to emit a tone so you can find it buried between the sofa cushions (or wherever else you might have absentmindedly put it). Given its first-time inclusion and placement prominence, such scenarios are apparently quite common! Unseen behind the mesh on both sides of the button are microphones in an ambient noise-squelching array arrangement for the device’s also-first-time integrated Google Assistant (now Gemini, I guess) voice interface.

The left-side switch controls the mics’ muted-or-not status. Unmuted in its current state, it exposes a red background when slid to the right. You’ll see later what else turns red:

Around the rear are (left to right) the reset switch, a (first-time once again) optional wired Ethernet connector, the HDMI output, a USB-A 3.0 connector (useful for, among other things, tethering to local mass storage for media playback purposes), and the “barrel” power input:

Speaking of which, now’s as good a time as any to show you the “wall wart” power supply:

Back to our patient. The right side is comparatively bland:

And last, but not least, here’s the bottom:

with a closeup of the label, revealing (among other things) the 2AYYS-ORPK4VTG FCC ID.

If you were thinking that the rubber “foot” (specifically, screw heads underneath it) was a likely pathway inside…well, you’d be right:

And here we go (in what follows, I admittedly followed in the footsteps of this video)…

Hopefully, you’ll read this next bit before you go ahead and rip the top half off. Don’t. Two wiring harnesses require detachment first, one more fragile (and difficult to disconnect) than the other:

I’ll ruin the surprise at this point (sorry). The red-and-black wire combo in the lower left quadrant goes to the speaker. The flex PCB one in the upper right ends up at the dual-microphone array. Stay tuned for more revealing pictures to come.

The former was straightforward to detach:

The latter, a bit trickier:

requiring that I first lift up retaining clips on both sides of the connector soldered to the PCB.

Let’s focus on the top half of the chassis first:

The large metal piece is, likely already unsurprising to you, given the piece of grey thermal transfer tape attached to the middle of it, a big ol’ heatsink for the PCB-housed circuitry normally located directly below it (along with adding heft to the overall assemblage’s weight):

With the heatsink out of the way, the speaker underneath it (and at the very top of the device when fully assembled) is obvious:

Below the speaker are four side-by-side square light guides that route PCB-located LEDs’ illuminations to the outer topside of the device; you’ll see them in action shortly.

And below them is a mini-PCB containing the MEMS microphones:

The mini-PCB is held in place by two brackets, themselves held in place by two screws:

With them removed, there’s still a minor matter of some adhesive to deal with:

Voila:

After retracing my steps to put the mic mini-PCB back in place, I tackled the output transducer next. First, I removed the transparent housing around its backside, which both transforms this portion of the design into a closed-box (i.e., “sealed”) speaker enclosure and suppresses the sound it generates from “leaking” into the microphones’ inputs:

Once again, with aspirations of returning the device to a fully functional state post-teardown, I reversed course and put everything back together again, then switched my attention to the lower half of the chassis. You can already tell, even from the overview image, where the thermal tape on the heatsink had originally attached:

Before going any further, here’s a look at both sides of the rectangular Wi-Fi 6 (802.11ax) antennae on both sides of the device, lower left (inside view first, then outside):

and upper right (ditto).

The Wi-Fi subsystem is dual-band (2.4 GHz and 5 GHz), so I’m guessing there’s one antenna dedicated to each band. The cables initiating at each antenna terminate at RP-SMA connectors on the lower right corner of the PCB. Also shown here is the Fn-Link Technology 6252B-SRB wireless communications module that manages both Wi-Fi 6 and Bluetooth, and the Bluetooth antenna itself. Also, in the lower left of the photo is one of the four PCB-resident LEDs, each surrounded by grey rubber, into which the square light guides seen earlier can be inserted:

Here’s another perspective on the Bluetooth antenna:

Above the wireless communications subsystem is a piece of grey tape which, when lifted out of place, reveals what I believe is the (presumably class D) audio amplifier for the speaker output, judging by its proximity to the speaker cable harness connector:

At lower left, again, identity-assumed per its connector proximity (this time for the microphone array flex PCB) is the corresponding (both amplification and digitization?) subsystem for the microphone inputs. To their right are the other three LEDs:

In the upper left is, I believe, the device’s power generation, regulation, and management subsystem (proximity-assessed once again; note the input barrel connector above it):

Underneath the piece of foam bridging between the USB-A 3.0 and HDMI connectors is what I originally thought might be something substantive, semiconductor-wise:

Alas, it ended up being just a few more passives:

And of course there’s the sizeable Faraday cage dominating the PCB landscape. But, putting whatever’s underneath it (although I already have ideas) aside for a moment, let’s first get the lay of the land overview of the PCB underside:

Whaddya know…there’s another thermal tape-augmented heatsink here:

And another foam square-augmented Faraday cage:

Prior to popping it off, I first need to fully free the PCB…which necessitated disconnecting those previously glimpsed Wi-Fi antennae connectors:

That’s better:

Note once again the antennae on either side of the underside chassis’ insides, and the heatsink in the middle. Above the left-side antenna is the microphone mute switch:

which, when assembled, mates with the PCB-mounted switch assembly at far right on this shot:

About that Faraday cage…as previously mentioned (and as always), I’m striving to return this device to full functionality post-teardown, so I need to be careful when popping the top off:

Success! Not much to see here, but a bunch of passives, likely associated with ICs on the other side of the PCB. The thermal tape similarly likely assists in removing heat generated by those other-side ICs. Even though heat generally goes up, some of it will also radiate through the PCB, ultimately destined for dissipation by the previously seen heatsink on the bottom of the device:

Speaking of which, let’s return to the larger Faraday cage on the PCB topside.

Careful…careful…

I’m two for two. And as expected, the “meat” of the semiconductor content is here:

In the upper left is the 3 GByte DRAM, likely multi-die stacked in construction (as I’ve discussed in detail recently), and marked thusly:

Rayson
RS768M32LX4
D4BNR63BT
2402CNPFV

The results of a web search on “RS768M32LX4” suggest that it’s LPDDR4 in technology and 3733 Mbps in peak data transfer rate.

To its right is the Amlogic S905X4 application processor ,whose presence I already tipped off to you in late April. And below them both is the 32 GByte e.MMC flash memory storage module:

FORESEE (from Longsys, strictly speaking)
FEMDNN032G-A3A55
H23092453972340
001

Here are some side views of the PCB, after putting the Faraday cage covers back in place:

And after carefully reconnecting the Wi-Fi antennas:

and the microphone and speaker cable harnesses:

squeezing the two halves of the enclosure back together and reinstalling the screws and rubber “foot”, I connected the wall wart, plugged it in, and crossed my fingers:

Huzzah! The four red lights you see in this photo indicate that the mic array is currently muted:

And lest you doubt, the HDMI output is fully functional, too:

About that on-screen remote-control notation…I earlier mentioned that the gently used device I tore down today delivered ancillary benefits for me. Had I not been an honest fellow, the benefits might have been even more bountiful. When it initially arrived, I powered it up and noticed that it still had the previous owner’s Google account info configured in it, including access to purchased content (and potentially, the ability to both buy and rent even more of it if I so desired). I immediately factory-reset it and then messaged the seller with a heads-up to be more thorough about wiping devices before shipping them to their new homes in the future!

The remote control 

But about that remote control…as alluded to earlier, this is actually the second onn. 4K Pro in my possession. I bought the first one from Walmart last August, right after they were released:

which you can chronologically tell, among other reasons, because Walmart has subsequently transitioned the packaging’s color scheme and broader contents:

The other means of indicating when I’d bought it is that, although Walmart advertises it as including a remote control that not only supports the aforementioned “Find Remote” functionality and embeds a Google Assistant-supportive microphone in addition to the mics in the device itself, but also offers backlit keys and a “Free TV” button:

at least some (including mine) initial onn. 4K Pro shipments came for unknown reasons bundled with a prior-revision remote control absent those latter two features. Here’s the one that was in the box alongside my original device:

And, to my ancillary-benefits comments, here’s the full-featured newer-version one that came with the device I more recently acquired off eBay:

Here are both remotes alongside my original device and other in-box goodies that came with it:

mimicking another one of Walmart’s “stock” images.

Here’s a PDF copy of the Quick Start guide that’s also in the box. And speaking of which, here are the results of my packing everything back into the box, simulating (in reverse, albeit also including both remotes; I now have a spare in case “Find Remote” ever fails!) what the insides looked like when I unpacked the original device late last summer:

With that, having passed through 2,000 words a few paragraphs ago, I’ll wrap up and await your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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• Google’s Chromecast: impressively (and increasingly) up for the video streaming task
• The Google Chromecast Gen 3: Gluey and screwy
• Google’s Chromecast Ultra: More than just a Stadia consorta
• Google’s Chromecast with Google TV: Dissecting the HD edition
• The Google Chromecast Gen 2 (2015): A Form Factor Redesign with Beefier Wi-Fi, Too
• Google’s Chromecast with Google TV: Car accessory similarity, and a post-teardown resurrection opportunity?
• The Google Chromecast with Google TV: Realizing a resurrection opportunity

The post Perusing Walmart’s onn. 4K Pro Streaming Device with Google TV: Storage aplenty appeared first on EDN.

Two channel I2C level-shifting interface with a lot of safety components (our products got a lotta ATEX conditions to meet) for the firmware engineers to wield. Not pretty, but it needed doing QUICK. submitted by /u/Rodifex [link] [comments]

Rushed it so all but the hologram part of my features don't work. Doesn't matter since THE HOLOGRAM PART WORKS. Based largely on the andotrope invented by mike ando which is based largerly on the zoetrope. However I made a couple of my own modifications to achieve a see through display. I did open source it: https://github.com/very-high-priest/Andotrope submitted by /u/vvdb_industries [link] [comments]

Under the new Electronics Component Manufacturing Scheme (ECMS) recently commenced in India, it is alleged that investment proposals worth ₹16,000 crore have come in so far. The scheme was implemented on the first of May, 2025, with the view to foster manufacture of essential electronic components within the country and thus curtail the import.

Undoubtedly, the scheme has attracted a great deal of attention from industry players, including large companies such as Tata Electronics, Dixon Technologies, and Foxconn, who are now eager to tap into the growing electronics eco-system in India and entice government incentives for building a self-sustainable supply chain.

ECMSs are part of the bigger strategy that the Indian government has implemented to invigorate electronics manufacturing in India, which is anticipated to reach USD 500 billion by the year of 2030. However, the major identified challenge is developing the demand for components projected to reach USD 248 billion. Currently, most are imported, especially from China, which exposes the Indian electronics sector to uncertainties in the global supply chain.

The scheme operates with a budget of ₹22,805 crore, covering four major categories:

Category A: Sub-assemblies such as camera and display modules.

Category B: Bare components and enclosures for mobile/IT hardware.

Category C: Flexible PCBs and SMD passive components.

Category D: Capital goods and parts required to make A–C category components.

An amount of ₹21,093 crore is allotted under Category A, partly owing to the government’s inclination toward assemblies that are of high value and high demand. The remaining ₹1712 crore is for the other categories. While applications were invited for Categories A, B, and C for three months starting May, Category D will be open for two years, giving a long-term incentive for infrastructure investment.

Strategic partnerships are at work here as well. Of importance is the fact that Dixon Technologies has concluded an agreement with Chinese firms Chongqing Yuhai and Kunshan Q Technology for the manufacture of certain key components in India, all signaling the shift in localization of supply chains.

Shortlisting of proposals is in process and the final approvals are likely by September 2025. The scheme is designed to be in tandem with other ongoing schemes like SPECS and Semicon India Programme, thereby all working towards a-robust semiconductor and electronics manufacturing base within India.

Conclusion:

The ₹16,000 crore investment interest under ECMS reflects growing confidence in India’s aspirations to manufacture electronics. When implemented, the plan could reduce dependency on imports and make India a major global supplier of electronic components, fostering innovation, increasing economic stability, and creating thousands of highly skilled jobs over the coming years.

The post Govt secures ₹16,000 cr investment proposals under electronics component drive appeared first on ELE Times.

When it comes to surveillance technology, the USA boasts a variety of CCTV brands providing state of the art security solutions. Ranging from high-resolution IP cameras to AI-based analytics, these brands serve businesses, homes, and public places, providing safety and efficiency. Top manufacturers concentrate on innovation, reliability, and easy to use designs to fulfill the increasing need for smart security. Here is the list of the top 10 CCTV camera brand in USA.

1. Bosch

A German-based division of Bosch Group, Bosch Security provides quality surveillance solutions, AI cameras, and smart access control system. Bosch is a topnotch supplier of high-quality CCTV systems, Bosch combines video analysis, infrared technologies, and night time vision to build surveillance capabilities.

Features:

Flexidome Panramic Cameras: Delivers 360 or 180degree, blind spot free coverage to enable maximum situational awareness.

Dinion Bullet Cameras: Ideal for both indoor and outdoor use with zoom lenses and infrared lighting.

Bosch further develops video security through the addition of artificial intelligence analytics, improved night time vision, infrared sensors, Real-time video processing, data privacy security aspects for securing and adhering to data laws and regulations.

2. HIK VISION

Hikvision is a world leader in AIoT security solutions, providing innovative surveillance technology for industrial, commercial and public security applications.

Features:

DeepinView AI Cameras: Fitted with sophisticated AI algorithms, the cameras feature face recognition, behavioural analysis and perimeter protection in high- security locations.

Thermal Imaging Cameras: Allow high-sensitivity thermal detection, enhancing visibility in poor lighting conditions.

Hikvision’s dedication to AI based security solutions make it the preferred choice among businesses and governments globally.

3. Honeywell

Honeywell offers enterprise-grade security products, such as IP cameras and AI-powered surveillance. A subsidiary of Honeywell International, located in Charlotte, North Carolina, USA. It offers AI-powered video analytics, infrared, and advanced imaging to extend security functionality.

Features:

PTZ Cameras: Enable remote zoom control and direction, for effective surveillance of vast areas.

Multi-Sensor Cameras: With their separate imagers, multi-sensors cameras offer panoramic images from multiple perspectives.

Honeywell is the world’s top supplier of AI security solutions for usage by businesses and the government.

4. Panasonic

Panasonic is a world leader in state-of-the art security systems, supplying AI-based surveillance technology for industrial, commercial, and public security usage. Panasonic fuses AI-enabled video analytics, infrared technology, and high-resolution imaging to heighten security abilities.

Features:

High Zoom Bullet Cameras: Boasting 10x and 30x zoom capabilities, in 2MP, 5MP, and 4K resolutions, with long-range IR LED features for best-in -class low light performance.

Multi-sensor Cameras: With multiple independent cameras, wide- angle images are captured from multiple perspectives.

Panasonic continues to lead the evolution of security technology with Edge computing, Cloud-based video management for remote access and monitoring.

5. Lorex

Lorex is a market leader in delivering advanced security systems, providing AI- based surveillance technology, combines AI-enabled video analytics, infrared technology, and high-resolution imaging to boost security features.

Features:

4k Ultra HD Security Cameras: Offer crystal-clear resolution for guaranteed detailed video footage for greater security.

Multi-Sensor Cameras: Have several independent imagers, taking wide views from various angles.

6. Dahua Technology

Dahua Technology is a global leader in video-centric AIoT solutions, providing innovative technology for industrial, commercial, and public security use. Dahua combines AI-enabled video analytics, infrared technology, and high-definition imaging to upgrade security capabilities.

Features:

WizSense Series: Budget-performance balance-oriented cameras featuring AI-enabled motin detection and smart alerts.

Multi-Sensor Cameras: Offer independent multiple imagers, viewing wide angles from a variety of perspectives.

7. Hanwa Techwin

Hanwha Techwin, now Hanwha Vision, is a world leader in cutting-edge security systems providing AI-based surveillance technology and high-resolution imaging to augment security capability.

Features:

Wisenet AI Cameras: Fitted with sophisticated AI algorithms, the cameras provide facial recognition, behavior analysis, and perimeter defense for high-security levels.

Q Series AI Cameras: Engineered with cost-performance balance, the cameras come with AI-based, the cameras come with AI-based motion detection and smart alerting.

8. FLIR System

Founded in Wilsonville, Oregon, USA, FLIR is well-known for thermal imaging, infrared cameras, and night vision applications across security, the military and industry. FLIR Systems, now a part of Teledyne Technologies, is a world leader in thermal imaging, night vision, and infrared camera systems.

Features:

FLIR Quarsor: Provide 5MP HD and 4kUHD resolution to ensure excellent surveillance.

FLIR A500f/A700f Smart Sensor Cameras: Suitable for condition monitoring and early fire detection.

FLIR Systems continues to advance the art of imaging technology with AI-driven analytics for motion, risk assessment, and automated notification.

9. Vivotek

Vivotek is a pioneer in delivering state of the art security systems with AI-powered surveillance technology used for industrial, commercial and public security use. Vivotek CCTV systems combines AI-driven video analytics, infrared technology and high-definition imaging to further improve security functions.

Features:

IB9383-HV AI Bullet Camera: Includes 5MP resolution, Smart Motion Detection, and Trend Micro IoT Security for added cyber protection.

MA9311-EHTV Panoromic AI Camera: Includes two-way panoramic coverage Smart VCA powered by AI and integrated IR illuminators for optimal low-light performance.

Vivotek keeps challenging the frontiers of security technology with AI driven analytics, data security and privacy compliance.

10. Avigilon

Based in Vancouver, Canada, Avigilon is a high-definition video surveillance, AI driven analytics, and enterprise security solutions company. Avigilon, a subsidiary of Motorola Solutions, boasts a solid reputation for innovation through the integration of AI-enabled video analytics, infrared technology, and high-resolution imaging to advance security capabilities.

Features:

Aviailon AI-Powered IP Cameras: With sophisticated AI algorithms, these cameras enable facial recognition, behavior analysis, and perimeter protection for high-security areas.

Specialty Security Cameras: For specialized applications, such as thermal imaging and high-impact environments.

 

Technology & Model Comparison:

Brand	Key Technologies	Example Model
Bosch	Intelligent Video Analytics, Starlight Imaging, Edge Recording, NDAA-compliant	FLEXIDOME IP panoramic 7000
Hikvision	AcuSense AI Detection, ColorVu Night Vision, Deep Learning NVRs	DS-2CD2387G2-LU ColorVu
Honeywell	Smart Motion Detection, NDAA Compliance, Secure Encryption	H4W4PER2, Honeywell 4MP IR Dome
Panasonic	i-PRO AI Analytics, H.265 Compression, Edge Recording, Face Recognition	WV-S2536L Dome AI Camera
Lorex	4K UHD, Smart Deterrence, Color Night Vision, Cloud & Local Storage	Lorex 4K Smart Deterrence IP Cam
Dahua	WizSense AI, Smart H.265+, Starlight Night Vision, Perimeter Protection	IPC-HDW3849HP-AS-PV
Hanwha	Wisenet AI, Audio Analytics, Cybersecurity Compliance	Wisenet XNO-C7083R AI Bullet
FLIR	Thermal Imaging, Radar, Long-Range Detection, Multi-Sensor Fusion	FLIR Quasar 4K UHD Dome
Vivotek	Smart Stream III, Deep Learning, Trend Micro IoT Security	IB9383-HV AI Bullet
Avigilon	H5A AI Cameras, Appearance Search, Adaptive IR, 30MP Resolution	Avigilon H5A 8MP Dome Camera

 

Conclusion:

The United States CCTV camera industry is witnessing constant growth due to rising security threats and evolving surveillance technology.

Use of AI analytics, IoT connectivity, and cloud- based monitoring is adding strength to surveillance solutions. Demand for intelligent surveillance solutions is increasing steadily, top brands are pushing boundaries to offer smart, responsive, and future-proof security systems across home, commercial, and government sectors.

The post Top 10 CCTV Camera Brands in USA appeared first on ELE Times.

https://x.com/theapache64/status/1949763814351843547 submitted by /u/theapache64 [link] [comments]

If you have on old and/or faulty dehumidifier, rip the fan out of it. They are quite small and have quite a powerful airflow. Just add a filter to it and you have a perfect little fune extractor. It’s a bit loud though. submitted by /u/A55H0L3_WindowsXP [link] [comments]

The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics, and the need for faster processing across all industries fuel this surge.

Application-specific integrated circuits (ASICs), typically implemented as system-on-chip (SoC) devices, are central to today’s AI and HPC solutions. However, traditional implementation technologies can no longer meet the escalating requirements for computation and data movement in next-generation systems.

From chips to chiplets

Traditionally, SoCs have been implemented as a single, large monolithic silicon die presented in an individual package. However, multiple issues manifest as designers push existing technologies to their limits. As a result, system houses are increasingly adopting chiplet-based solutions. This approach implements the design as a collection of smaller silicon dies, known as chiplets, which are connected and integrated into a single package to form a multi-die system.

For example, Nvidia’s GPU Technology Conference (GTC) has grown into one of the world’s most influential events for AI and accelerated computing. Held annually, GTC brings together a global audience to explore breakthroughs in AI, robotics, data science, healthcare, autonomous vehicles, and the metaverse.

During his GTC 2025 keynote, Nvidia president, co-founder, and CEO Jensen Huang emphasized the need for advanced chiplet designs, stating: “The amount of computation we need as a result of agentic AI, as a result of reasoning, is easily 100 times more than we thought we needed this time last year.”

Despite a wide range of analyst expectations, explosive growth is undisputed; chiplets are becoming the default way to build large AI/HPC dies (Figure 1).

Figure 1 Chiplet market forecast illustrates its explosive growth. Source: Nomura and MarketUS

Figure 1 above represents the center of gravity of several published forecasts. Tools, technologies, and ecosystems are coming together with a 2026-27 inflection point to facilitate designers’ goal of being able to purchase complex chiplet IP on the open market.

These chiplets will adhere to standard die-to-die (D2D) interfaces, allowing them to operate plug-and-play or mix-and-match. This is expected to generate explosive growth in the chiplet market, reaching at least USD 100 billion by 2035, with some forecasts more than doubling this forecast.

Why chiplets?

One increasingly popular approach is to take an existing monolithic die design and disaggregate it into multiple chiplets. A simplistic representation of this is depicted in Figure 2.

Figure 2 Monolithic die (left) is shown vs. multi-die system (right). Source: Arteris

In monolithic implementations, reticle limits impact scalability, and yields fall as the die size increases. It’s also harder to reuse or modify IP blocks quickly, and implementing all the IPs at the same process technology node can be inefficient.

Chiplet-based multi-die systems offer multiple advantages. When the design is disaggregated into various smaller chiplets, yields improve, and it’s easier to scale designs, currently up to 12x of today’s reticle limit. Also, each IP can be implemented at the most appropriate technology node. For example, high-speed logic chiplets may use the 3-nm node, SRAM memory chiplets the 7-nm node, and high-voltage input/output (I/O) interfaces the 28-nm node.

Observe the red bands shown in Figure 2. These represent a network-on-chip (NoC) interface IP. In a multi-die system, each chiplet can have its own NoC. The chiplet-to-chiplet interfaces, known as die-to-die connections, are typically implemented using bridges based on standard interconnect protocols and physical layers such as BoW, PCIe, XSR, and UCIe.

Aggregation, disaggregation, and re-aggregation

As chiplet-based designs gain traction, it’s essential to understand how today’s SoCs are typically assembled. Currently, the predominant method is to gather a collection of soft IPs, represented at the register transfer level (RTL) of abstraction, and aggregate them into a single, monolithic design. Most of these IPs are sourced from trusted third-party vendors, with the SoC design team creating one or two IPs that will differentiate the device from competitive offerings.

To successfully integrate these IPs into a cohesive design, two other aspects are essential beyond the internal logic that accounts for most of an IP block’s transistors. The first is connectivity information, including port definitions, data widths, operating frequencies, and supported interface protocols. The second is the configuration and status registers (CSRs) set, which must be placed appropriately within the overall SoC memory map to ensure correct system behavior.

Because of this complexity, performing this aggregation by hand is no longer possible. IP-XACT is an IEEE standard (IEEE 1685) that defines an XML-based format for describing and packaging IPs. To facilitate automated aggregation, each IP has an associated IP-XACT model.

As SoC complexity continues to rise, it is becoming increasingly common to take an existing monolithic die design and disaggregate it into multiple chiplets. To support this chiplet-based design, the tools must be able to disaggregate an SoC design into multiple chiplets, each of which may contain many original soft IPs. In addition to partitioning the logic, the tools must generate IP-XACT representations for each chiplet, including connectivity and registers.

Technology Is here now

AI and HPC workloads are advancing quickly, driving a fundamental shift toward chiplet-based architectures. These designs provide a practical solution to meet the increasing demands for scalability and efficient data movement. They require new methodologies and supporting technology to manage multi-die systems’ design, assembly, and integration.

Take, for instance, Arteris’ multi-die solution, which automates key aspects of multi-die design. Magillem Connectivity and Magillem Registers support the assembly and configuration of systems built from IP blocks or chiplets. These tools manage both disaggregation of monolithic designs and re-aggregation into multi-die systems across the design flow.

On the interconnect side, Arteris supplies both coherent and non-coherent NoC IP. Ncore enables cache-coherent communication across chiplets, presenting a unified memory system to software. FlexNoC and FlexGen provide non-coherent options that are compatible with monolithic and multi-die implementations.

Andy Nightingale, VP of product management and marketing at Arteris, has over 37 years of experience in the high-tech industry, including 23 years in various engineering and product management positions at Arm

 

Register for the virtual event The Future of Chiplets 2025 held on 30-31 July.

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The post Chiplet design basics for engineers appeared first on EDN.

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...

India seems to be adjusting its stance toward Chinese investment within the electronics manufacturing space. Government actions indicate a willingness to adopt a flexible and pragmatic posture, weighing both geopolitical and economic concerns.

Change in Engagement Strategy:

China continues to dominate the electronics supply chain globally, engaging in nearly 60% of worldwide electronics manufacturing activities. Under this recognition of interdependence on each other, India seems to be reconsidering its previous hardline approach to allow for strategic collaboration in industries of key importance.

Recent events, namely the restoration of tourist visas for the two countries and diplomatic engagement, have pointed toward a potential gradual thawing of bilateral relations. And this softening of relations on the diplomatic front seems to be reflected now on the industrial policy side, especially for electronics, where global collaboration matters.

The Dixon-Longcheer Deal:

The government turned its gaze onto this matter after it approved the joint venture between Dixon Technologies, a major domestic manufacturer, and Longcheer Intelligence, a Chinese ODM. The agreement states that Longcheer will own 26 percent of the business and Dixon will maintain controlling control. This framework reflects India’s intention to engage with Chinese companies through closely monitored minority-stake agreements.

Following this approval, it is understood that several other Indian electronics companies have developed a keen interest in forming similar joint ventures with Chinese technology partners.

Focus on Value Addition and Technology Transfer

According to the Indian government, Chinese investments will be allowed only if there is significant technology transfer involved and not mere low-level assembly operations. The Ministry of Electronics and IT (MeitY) stated that such collaborations should factor in the improvement of domestic capabilities and local value addition.

Proposal of Policy Reforms

In an attempt to ease out the process and bring down red tape, the NITI Aayog, India’s think tank, has recommended allowing up to 24% foreign direct investment (FDI) by Chinese firms in Indian electronics companies without requiring stringent multi-agency approvals. As these recommendations are being examined, MeitY officials have stated their support for them, citing their importance in attracting high-tech investments without endangering national security.

India is enjoying a window of opportunity with global dynamics undergoing shifts. With U.S. trade policy being uncertain and a reorientation on global supply chains, India seeks to be an important destination for electronics manufacturing. Strategic engagement with select Chinese firms would hasten the process of technology absorption at the component stage and create employment.

Indian leadership, meanwhile, continues to stress that such flexibility will be limited in scope, transparent, and oriented around the national interest. Any lifting of restrictions will be closely scrutinized with country-level mechanisms put in place to ensure that the long-term technological sovereignty and security of the country will not be jeopardized.

Conclusion:

Changing economic realities and investment in China in electronics by India show it as having an evolving approach toward becoming a true manufacturing center. This new stage of pragmatic economic engagement is characterized by an investment model that is more technology-focused and selective.

The post India Eases Curbs on Chinese Investment in Electronics with Strategic Conditions appeared first on ELE Times.

Deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany says that the UK’s University of Cambridge has purchased a Close Coupled Showerhead system for 2D materials for its photonics and optoelectronics R&D...

For now it’s just a led and a resistor. Anode is soldered to the resistor. submitted by /u/Grid_Rider [link] [comments]

Along with introducing Carson's rule for bandwidth estimation, this article explains how to calculate the required transmission bandwidth based on either the sidebands or the total power of the signal.

I made a binary seven-segment wristwatch. Each segment represents a binary multiplier: segment B is 1, C is 2, D is 4, and so on. Project info submitted by /u/olxu [link] [comments]

Yep, I’ve used 1970’s to 1980’s era parts from Japan and Taiwan only. The whole thing is built around a mitsubishi jungle IC. The controller is external though. I have no way of testing it because analog TV was shut down a long time ago here in Czech Republic. Just built it out of love and compassion for RF circuits. Fun fact: I’ve spent 6 hours just soldering all the components into their respective holes. There isn’t a single hole unused on that perfboard. submitted by /u/A55H0L3_WindowsXP [link] [comments]

Hey everyone! I’d like to share a fun and useful project I recently built: a PI-controlled soldering iron system based on a Hakko handle, designed specifically for heat insert pressing into 3D prints. You can enjoy this project from a few different angles: A DIY Tool That Actually Works I originally bought a so-called "digital soldering iron" to make a heat press, but it turned out to be fake—it just used open-loop power control with a 7-segment display. No temperature sensor, no feedback, no reliability. So I decided to build my own closed-loop system using proper RTD feedback, MOSFET switching, and a real PI controller running on an STM32. Now it gives stable heat control, perfect for insert work. A Showcase for My Snapboard Platform This project is also a working demo of Snapboard, my modular prototyping platform for embedded hardware. It’s like a LEGO base for breakout boards—strong and swappable, yet reusable across multiple projects. The potentiometer, OLED display, and power modules all snap into place cleanly with perfboard support. It’s been rock solid for building functional prototypes. A Control-Theory Driven Design Instead of trial-and-error tuning or just using bang-bang control like most DIY temp controllers, I took a full control engineering approach: Collected step response data Fitted it to a first-order model Designed the PI gains using pole placement, not guesswork Analyzed performance metrics like settling time, overshoot, etc. You can get a ready-to-go PI controller without hand-tuning. I even wrote a short doc on the theory and design [Notion link here]. What You See: OLED display shows SP, PV, and OP Potentiometer sets the temperature Serial data logging for step response capture Clean 12 V/24 V DC input with a switching regulator RTD temperature sensing and MOSFET power control submitted by /u/menginventor [link] [comments]

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Credit goes to @i509VCB on the KiCAD Discord submitted by /u/cyao12 [link] [comments]

Images floating around. Heard this is unconfirmed. submitted by /u/RineMetal [link] [comments]

The family brings 18-channel monitoring and SPI-to-TPL bridge to electric vehicle and energy storage applications.