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Built a free timing diagram editor for hardware documentation. Visual editor - draw your signals instead of coding JSON. Useful for datasheets, protocol specs, or explaining timing to your team. Works for: SPI, I2C, UART, CAN timing FPGA/MCU signal interfaces Memory timing (DDR, SRAM) Any digital logic really Imports VCD from your simulator, exports PNG/SVG for docs. Browser-based: [https://www.wavepaint.net/](vscode-file://vscode-app/snap/code/220/usr/share/code/resources/app/out/vs/code/electron-browser/workbench/workbench.html) submitted by /u/maolmosma [link] [comments]

Friend asked me to make a time machine this is what I came up with on my lunch break. submitted by /u/CakeDOTexe [link] [comments]

Two touchscreen controllers join Microchip’s maXTouch M1 family, expanding support for automotive displays over a wider range of form factors. The ATMXT3072M1-HC and ATMXT288M1 cover free-form widescreen displays up to 42 in., as well as compact screens in the 2- to 5-in. range. Both devices are compatible with display technologies such as OLED and microLED.

The AEC-Q100-qualified controllers leverage Smart Mutual acquisition technology to boost SNR by up to 15 dB compared to previous generations. They deliver reliable touch detection even for on-cell OLEDs, where embedded touch electrodes are subjected to high capacitive loads and increased noise coupling.

The ATMXT3072M1-HC targets large, continuous touch sensor designs that span both the cluster and center information display, enabling a single hardware design for left-hand and right-hand drive vehicles. For smaller screens, the ATMXT288M1 is available in a TFBGA60 package, reducing PCB area by 20% compared to the previous smallest automotive-qualified maXTouch product.

For pricing and sample orders, contact a Microchip sales representative or authorized dealer.

ATMXT3072M1-HC product page 

ATMXT288M1 product page 

Microchip Technology 

The post Touch ICs scale across automotive display sizes appeared first on EDN.

Keysight’s Wireless Coexistence Test Solution (WCTS) is a scalable platform for validating wireless device performance in crowded RF environments. This automated, standards-aligned approach reduces manual setup, improves test repeatability, and enables earlier identification of coexistence risks during development.

To replicate real-world RF conditions, WCTS integrates a wideband vector signal generator. It covers 9 kHz to 8.5 GHz—scalable to 110 GHz—with modulation bandwidths up to 250 MHz (expandable to 2.5 GHz). A single RF port can generate up to eight virtual signals, enabling complex interference scenarios without additional hardware. Nearly 100 predefined, ANSI C63.27-compliant test scenarios are included, covering all three coexistence tiers.

Built on OpenTAP, an open-source, cross-platform test sequencer, WCTS delivers scalable and configurable testing through a user-friendly GUI and open architecture. Engineers can upload custom waveforms and validate test plans offline using simulation mode, accelerating test development and reducing lab time.

More information about the Keysight Wireless Coexistence Test Solution can be found here.

Keysight Technologies 

The post Keysight automates complex coexistence testing appeared first on EDN.

The first device in AOS’ αMOS E2 high-voltage Super Junction MOSFET platform is the AOTL037V60DE2, a 600-V N-channel MOSFET. It offers high efficiency and power density for mid- to high-power applications such as servers and workstations, telecom rectifiers, solar inverters, motor drives, and other industrial power systems.

Optimized for soft-switching topologies, the AOTL037V60DE2 delivers low switching losses and is well suited for Totem Pole PFC, LLC and PSFB converters, as well as CrCM H-4 and cyclo-inverter applications. The device is available in a TOLL package and features a maximum RDS(on) of 37 mΩ.

AOS engineered the αMOS E2 high-voltage Super Junction MOSFET platform with a robust intrinsic body diode to handle hard commutation events, such as reverse recovery during short-circuits or start-up transients. Evaluations by AOS showed that the body diode can withstand a di/dt of 1300 A/µs under specific forward current conditions at a junction temperature of 150 °C. Testing also confirmed strong Avalanche Unclamped Inductive Switching (UIS) capability and a long Short-Circuit Withstanding Time (SCWT), supporting reliable operation under abnormal conditions.

The AOTL037V60DE2 is available in production quantities at a unit price of $5.58 for 1000-piece orders.

AOTL037V60DE2 product page

Alpha & Omega Semiconductor 

The post 600-V MOSFET enables efficient, reliable power conversion appeared first on EDN.

Based on Rohm’s Nano Cap ultra-stable control technology, the BD9xxN5 series of LDO regulator ICs delivers 500 mA of output current. The series is intended for 12-V and 24-V primary power supply applications in automotive, industrial, and communication systems.

The BD9xxN5 series builds on the earlier BD9xxN1 series, increasing the output current from 150 mA to 500 mA while maintaining stability with small-output capacitors. The ICs provide low output voltage ripple (~250 mV) for load current changes from 1 mA to 500 mA within 1 µs. Using a typical output capacitance of 470 nF, they enable compact designs and flexible component selection.

All six new variants in the BD9xxN5 series are AEC-Q100 qualified and operate over a temperature range of –40°C to +125°C. Each device provides a single output of 3.3 V, 5 V, or an adjustable voltage from 1 V to 18 V, accurate to within ±2.0%. The absolute maximum input voltage rating is 45 V.

The BD9xxN5 LDO regulators are available now from Rohm’s authorized distributors. Datasheets for each variant can be accessed here.

Rohm Semiconductor 

The post Stable LDOs use small-output caps appeared first on EDN.

Five 1200-V SiC power modules in SOT-227 packages from Vishay serve as drop-in replacements for competing solutions. Based on the company’s latest generation of SiC MOSFETs, the modules deliver higher efficiency in medium- to high-frequency automotive, energy, industrial, and telecom applications.

The VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 power modules are available in single-switch and low-side chopper configurations. Each module’s SiC MOSFET integrates a soft body diode with low reverse recovery. This reduces switching losses and improves efficiency in solar inverters and EV chargers, as well as server, telecom, and industrial power supplies.

The modules support drain currents from 50 A to 200 A. The VS-SF50LA120 is a 50-A low-side chopper with 43-mΩ RDS(on), while the VS-SF50SA120 is a 50-A single-switch device rated at 47 mΩ. Single-switch options scale to 100 A, 150 A, and 200 A with RDS(on) values of 23 mΩ, 16.8 mΩ, and 12.1 mΩ, respectively.

Samples and production quantities of the VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 are available now, with lead times of 13 weeks.

Vishay Intertechnology 

The post 1200-V SiC modules enable direct upgrades appeared first on EDN.

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — says that the Committee on Foreign Investment in the United States (CFIUS) has formally cleared its issuance of equity to Renesas Electronics America Inc, completing a key component of Wolfspeed’s restructuring agreement with its lender group in support of its Chapter 11 process...

Specialty semiconductor and performance materials producer 5N Plus Inc (5N+) of Montréal, Québec, Canada has been awarded a US$18.1m grant by the US Government to expand capabilities and increase capacity to recycle and refine germanium at its St. George, Utah facility, to feed optics and solar germanium crystal supply chains...

There is a Neil deGrasse Tyson video covering the topic of the Chandra X-ray Observatory. This essay is in part derived from that video. I suggest that you view the discussion. It will be sixty-five minutes well spent.

This device doesn’t look anything like a planar mirror because X-ray photons cannot be reflected by any known surface in the way you see your reflection above your bathroom sink.

If you aim a stream of X-ray photons directly toward any particular surface, either a silvered mirror or some kind of intended lens, those photons will either pass right on through (which is what your medical X-rays do) or they will be absorbed. You will not be able alter the trajectory of an X-ray photon stream, at least not with any device like that.

However, X-ray photons can be grazed off a reflective surface to achieve a slight trajectory change if their initial angle of approach to the mirror surface is kept very small. With the surface of the Chandra X-ray mirror made extremely smooth, almost down to the atomic level, repeated grazing permits X-ray focus to be achieved. This is the operating principle of the Chandra X-ray Telescope’s mirror, as shown in Figure 1.

Figure 1 The Chandra X-Ray Observatory mirrors showing a perspective view, a cut-away view, and x-ray photon trajectories. (Source: StarTalk Podcast)

The Chandra Observatory was launched on July 23, 1999, and has been doing great things ever since. Regrettably, however, its continued operation is in some jeopardy. Please see the following Google search result.

Figure 2 Google search result of the Chandra Telescope showing science funding budget cuts for the Chandra X-ray Observatory going from $69 million to zero. (Source: Google, 2026)

I’m keeping my fingers crossed.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Chandra X-Ray Mirror appeared first on EDN.

Vishay Intertechnology, Inc. has introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems. The Vishay Semiconductors VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 feature Vishay’s latest generation silicon carbide (SiC) MOSFETs in the industry-standard SOT-227 package.

Offered in single switch and low side chopper configurations, each power module released today features a SiC MOSFET integrated with a soft body diode offering low reverse recovery. The result is reduced switching losses and increased efficiency for solar inverters, off-board chargers for electric vehicles (EV), SMPS, DC/DC converters, UPS, and HVAC systems; large-scale battery storage systems, and telecom power supplies.

The compact SOT-227 package of the VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 allows the devices to serve as drop-in replacements for competing solutions in existing designs, enabling designers to adopt one of the newest SiC technologies without the expense of changing PCB layouts. The moulded package also offers electrical insulation up to 2500 V for one minute, lowering costs by eliminating the need for additional insulation between the component and heatsink.

The power modules provide continuous drain current from 50 A to 200 A and low on-resistance down to 12.1 mΩ. The RoHS-compliant devices deliver high-speed switching with low capacitance and offer a high maximum operating junction temperature of +175 °C.

Device Specification Table:

Part #	VDSS	ID	RDS(ON)	Configuration	Package
VS-SF50LA120	1200 V	50 A	43 mΩ	Low side chopper	SOT-227
VS-SF50SA120		50 A	47 mΩ	Single switch
VS-SF100SA120		100 A	23 mΩ	Single switch
VS-SF150SA120		150 A	16.8 mΩ	Single switch
VS-SF200SA120		200 A	12.1 mΩ	Single switch

Samples and production quantities of the VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 are available now, with lead times of 13 weeks.

The post Vishay Intertechnology’s 1200 V SiC MOSFET Power Modules for Power Efficiency appeared first on ELE Times.

As the Union Budget approaches, the spotlight intensifies on India’s aerospace and defence technology sector, a vertical that has transitioned from a heavy importer to a nascent global manufacturing hub. The numbers tell a story of aggressive scaling: under the aegis of “Atmanirbhar Bharat,” domestic defence production surged to a historic ₹1.27 lakh crore in FY 2023-24.

However, for an industry eyeing a $5 trillion economy, this record high is viewed not as a finish line, but as a baseline. The shift toward indigenous manufacturing has fundamentally rewired the nation’s military-industrial complex, replacing foreign dependency with homegrown R&D and high-tech sovereignty. As the government prepares to lay out its fiscal roadmap, the industry is looking for more than just procurement orders; it is looking for deep-tech incentives, streamlined export pathways, and sustained capital outlay.

This budget will be a litmus test for India’s self-reliance commitment. Stakeholders are bracing for announcements that could further catalyse the aerospace ecosystem, ensuring that “Made in India” weaponry and avionics don’t just meet internal security needs but become a cornerstone of India’s global economic footprint.

The Tech-Sovereignty Mandate

As the lines between commercial innovation and battlefield superiority blur, technology has emerged as the definitive fulcrum for India’s tri-service modernisation. Industry experts argue that the upcoming Budget presents a pivotal window to institutionalise this convergence through aggressive structural reforms.

Central to this discourse is the evolution of the Production Linked Incentive (PLI) Scheme. While the current framework has provided a vital tailwind for the drone industry, there is a growing consensus that a “narrow-lens” approach is no longer sufficient. To truly insulate India’s supply chain from global volatility, the PLI umbrella must expand to cover the high-stakes world of dual-use technologies.

In terms of using technology in aerospace and defence technology development, the use of AI and related features will play a significant role.

“Investing in digital twins and simulation technology for testing and research in aviation and defence can boost precision and efficiency in the electronic manufacturing industry. Tecknotrove urges the government to prioritize use of digital twin technology in this financial budget. It’s a strategic move that will amplify innovation, save research and development and manufacturing costs, and drive India’s self-reliance in manufacturing. Digital twins aren’t just a trend—they’re a game-changer. With decades of expertise in digital twins for aviation and defence, we have seen this technology helping in at least 30% reduction in costs,” says Payal Gupta, Co-Founder, Director-Business Development, Tecknotrove Systems India Pvt. Ltd. 

The strategic roadmap for the FY 2026-27 fiscal cycle should ideally prioritise:

• The Full Drone Spectrum: Moving beyond basic assembly to incentivise the manufacturing of high-endurance propulsion systems and autonomous flight controllers.
• Electronic Warfare & Surveillance: Bringing Airborne Early Warning (AEW) systems, jamming devices, and advanced radar arrays under the incentive net to neutralise import dependencies.
• The Robotics Frontier: Providing fiscal stimulus for indigenous sensors and robotic systems that will define the future of unmanned combat and deep-space communication.

By widening these incentive corridors, the government can transform the “Make in India” initiative from a manufacturing slogan into a high-tech powerhouse, ensuring that the next generation of aerospace sensors and AI-driven robotics are conceived, designed, and built on Indian soil.

By: Shreya Bansal, Sub-Editor

The post Budget 2026-27: Can New PLI Schemes Drive India’s A&D Tech Sovereignty? appeared first on ELE Times.

Speaking at the Auto EV Tech Vision Summit 2025, Suresh D highlights the major cyber vulnerabilities and the corresponding technologies required to enable a safer and more resilient automotive ecosystem. 

Since the electronic components in passenger vehicles are set to increase by 20-40 percent, as the recent studies suggest, including infotainment, ADAS, etc, drawing in a lot of sensors in the near future, automobiles are emerging as the new battlefield for cyber developments. Underlining this growing phenomenon, Suresh D, Group CTO, Minda Corporation, CEO, Spark Minda Tech Centre & Board Member, Spark Minda Green Mobility says, “A passenger vehicle is expected to see a 20–40 percent increase—nearly doubling in some cases—over the next two to three years, bringing in a large number of on-board electronic systems. This will significantly increase software content and complexity,” at the Auto EV Tech Vision Summit 2025 held at KTPO, Bengaluru, on November 18–19, 2025.

He further goes on to add that the phenomenon will make Operating Systems and other software indispensable, escalating the security question in automobiles. 

Critical Challenges on the way 

He says that the new architectural parameter of SDVs, where the distributed architecture is being replaced by controlled or zonal architecture, also poses certain security challenges. Also, as the new vehicles remain entirely connected, as in V-2-V or V-2-I connection, the proximity of cyber risks escalates. 

Further, he touches upon the critical challenges that are to be tackled, including phishing, hacking, snooping, malware, etc. He goes on to underline some of the crucial cyberattacks that the automotive industry has seen in the recent past, ranging from CAN spoofing a Jeep Cherokee in 2014 to the latest TESLAMATE attack on Tesla cars in 2025, underlining how the question of cybersecurity becomes more relevant than ever. 

Curious Case of SDVs & EVs 

As EVs are on the rise across the world, Suresh D highlights how EV expansion and the need for robust charging systems also aggravate the risk. He explains that if a charging station compromises a supplier’s build server, it can be manipulated to tamper with BMS parameters via a compromised internal bus or a malicious charging station.

While for SDVs, potential risk sources he underlines include attack scenarios ranging from unprivileged root access and pivoting through fleet management backends, to compromised third-party apps and poorly protected cryptographic keys.

How to Tackle this? 

In the latter part, he touches upon the important steps that can be taken to avoid the potential risks and create a safer and reliable cyber ecosystem for automotives. First among them is the System Architecture approach. He says, “It refers to developing a robust architecture—understanding the OEM’s architecture and aligning the product accordingly.” He sums it up as thinking way ahead of the OEMs. It also includes encryption and decryption of the hardware to ensure that no vulnerability remains open to exploitation. 

Further, he also outlines a distinct approach, which is Embedded Edge Solutions, which means solving the problem at the source. It includes several protections, including secure flashing and secure boot. This is done through the plant server of the OEM that generates distinct private keys for each of the units for further authorization.  

For SDVs, he highlights a telematics-based approach which consists of 3 layers, namely Layer 1- In-vehicle security, Layer 2- Vehicle Communication Security & Layer 3- The cloud infrastructure. When Internet Protocol is used for communication, it enables whitelisting of the IPs through encryption and decryption through SSL, enabling a better and safer environment. 

High Frequency Options:  Granting More Immunity

He also underlines how automobiles these days usually come with smart keys or keyless access to the vehicle. While the technology is referred to as Low-Frequency Radio Frequency (LFRF), it is immune to relay attacks. However, the industry is gradually moving towards safer and more reliable options like Bluetooth and Ultra Wide Bandgap (UWB), with high-frequency technology making decoding highly difficult.   

He adds that even these technologies are prone to cyberattacks, either at the server level or the device level. Conclusively, some techniques like channel sounding with Bluetooth-based technology have been developed, which are more precise and help make authentication more secure. It offers a turnkey secure foundation, making automobiles reliable and secure. 

The post How to Build a Hacker-Proof Car: Insights from the Auto EV Tech Summit appeared first on ELE Times.

As enterprises increasingly rely on AI to run digital operations, protect assets, and drive growth, success depends on one critical factor: trusted, high-quality, real-time data. Palo Alto Networks, the global cybersecurity leader, announced the completion of its acquisition of Chronosphere, addressing a core challenge of the AI era: the inability to see and secure the massive data volumes running modern businesses.

Chronosphere, a Leader in the 2025 Gartner Magic Quadrant for Observability Platforms, was purpose-built to handle this scale. While legacy tools break down in cloud-native environments, Chronosphere gives customers deep visibility across their entire digital estate. With this acquisition, Palo Alto Networks is redefining how organisations run at the speed of AI—by enabling customers to gain deep, real-time visibility into their applications, infrastructure, and AI systems — while maintaining strict control over data cost and value.

The planned integration of Palo Alto Networks Cortex AgentiX with Chronosphere’s cloud-native observability platform will allow customers to apply AI agents that can now find and fix security and IT issues automatically—before they impact the customer or the bottom line. AI security without deep observability is blind; this acquisition delivers the essential context across models, prompts, users, and performance to move from manual guessing to autonomous remediation.

Nikesh Arora, Chairman and CEO, Palo Alto Networks:

“Enterprises today are looking for fewer vendors, deeper partnerships, and platforms they can rely on for mission-critical security and operations. Chronosphere accelerates our vision to be the indispensable platform for securing and operating the cloud and AI. We believe that great security starts with deep visibility into all your data, and Chronosphere provides that foundation for our customers.”

Martin Mao, Co-founder and CEO, Chronosphere, is joining Palo Alto Networks as SVP, GM Observability and comments:

“Chronosphere was built to help the world’s most complex digital organisations operate at scale with confidence. Joining Palo Alto Networks allows us to bring AI-era observability to a global audience. Together, we’re delivering a new standard — where observability, security, and AI come together to give organisations control over their most valuable asset: data.”

The Chronosphere Telemetry Pipeline remains available as a standalone solution, enabling organisations to eliminate the ‘data tax’ associated with modern security operations. By acting as an intelligent control layer, the pipeline filters low-value noise to reduce data volumes by 30% or more while requiring 20x less infrastructure than legacy alternatives. This is key to Palo Alto Networks Cortex XSIAM strategy, ensuring customers can scale their security posture—not their spending—as they transition to autonomous, AI-driven operations.

The post Palo Alto Networks Unifies Observability and Security for the AI Era through Chronosphere Acquisition appeared first on ELE Times.

Учений КПІ Юрій Яворський — лауреат премії Верховної Ради України kpi чт, 01/29/2026 - 22:07

КПІ та КНДІСЕ посилюють співпрацю у сфері судових експертиз kpi чт, 01/29/2026 - 21:18

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has introduced its new TOLT package portfolio, which enables maximum power density in a power supply for data-center rack applications...

Tokyo-based NEC Corp has developed a high-efficiency, compact power amplifier module (PAM) for the sub-6GHz band, designed for integration into 5G base-station radio units (RUs)...

Discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc of Malvern, PA, USA has introduced five new 1200V MOSFET power modules designed to increase power efficiency for medium- to high-frequency applications in automotive, energy, industrial and telecom systems...