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Photonic simulation CAD software developer Photon Design Ltd of Oxford, UK says that the quantum dot (QD) module for its HAROLD laser simulation tool is now available as a release candidate for customer evaluation...

Zhiting Tian, a professor in Cornell University’s Sibley School of Mechanical and Aerospace Engineering, has been selected as the recipient of the Defense Advanced Research Projects Agency (DARPA) Director’s Fellowship Award, a selective award given annually to the top performers in the DARPA Young Faculty Award pool...

Вступ на бакалаврат до КПІ ім. Ігоря Сікорського 2025 kpi пн, 08/04/2025 - 11:19

MPU Integrates a Quad-Core CPU, an NPU, High-Speed Connectivity and Advanced Graphics to Power Next-Generation HMI Devices with Full HD Display

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm Cortex-A55 running at up to 1.8GHz with a Neural Processing Unit (NPU), the RZ/G3E brings high-performance edge computing with AI inference for faster, more efficient local processing. With Full HD graphics support and high-speed connectivity, the MPU targets HMI systems for industrial and consumer segments including factory equipment, medical monitors, retail terminals and building automation.

High-Performance Edge Computing and HMI Capabilities

At the heart of the RZ/G3E is a quad-core Arm Cortex-A55, a Cortex-M33 core, and the Ethos-U55 NPU for AI tasks. This architecture efficiently runs AI applications such as image classification, object recognition, voice recognition and anomaly detection while minimizing CPU load. Designed for HMI applications, it delivers smooth Full HD (1920×1080) video at 60fps on two independent displays, with output interfaces including LVDS (dual-link), MIPI-DSI, and parallel RGB. A MIPI-CSI camera interface is also available for video input and sensing applications.

“The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,” said Daryl Khoo, Vice President of Embedded Processing at Renesas. “By using the same Ethos-U55 NPU as our recently announced RA8P1 microcontroller we’re expanding our AI embedded processor portfolio and offering a scalable path forward for AI development. These advancements address the demands of next-generation HMI applications across vision, voice and real-time analytics with powerful AI capabilities.”

The RZ/G3E is equipped with a range of high-speed communication interfaces essential for edge devices. These include PCI Express 3.0 (2 lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual-channel Gigabit Ethernet for seamless connectivity with cloud services, storage, and 5G modules.

Low-Power Standby with Fast Linux Resume

Starting with the third-generation RZ/G3S, the RZ/G series includes advanced power management features to significantly reduce standby power. The RZ/G3E maintains sub-CPU operation and peripheral functions while achieving low power consumption around 50mW and around 1mW in deep standby mode. It supports DDR self-refresh mode to retain memory data, enabling quick wake-up from deep standby for running Linux applications.

Comprehensive Linux Software Support

Renesas continues to offer the Verified Linux Package (VLP) based on the reliable Civil Infrastructure Platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP Plus, including support for the latest LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments.

Key Features of RZ/G3E

• CPU: Quad-core Cortex-A55 (up to 1.8GHz), Cortex-M33
• NPU: Ethos-U55 (512 GOPS)
• HMI: Dual Full HD output, MIPI-DSI / Dual-link LVDS / Parallel RGB, 3D graphics, H.264/H.265 codec
• Memory Interface: 32-bit LPDDR4/LPDDR4X with ECC
• Connectivity for 5G Communication: PCIe 3.0 (2 lanes), USB 3.2 Gen2, USB 2.0 x2, Gigabit Ethernet x2, CAN-FD
• Operating Temperature: -40°C to 125°C
• Package Options: 15mm square 529-pin FCBGA, 21mm square 625-pin FCBGA
• Product Longevity: 15-year supply under Product Longevity Program (PLP)

The post Renesas Introduces 64-bit RZ/G3E MPU for High-Performance HMI Systems Requiring AI Acceleration and Edge Computing appeared first on ELE Times.

AEC-Q101 Qualified Devices Save Board Space While Offering High Stability for Automotive Applications

Vishay Intertechnology, Inc. introduced a new series of uni/bidirectional 1500 W surface-mount PAR transient voltage suppressors (TVS) in the SMB (DO-214AA) package. To meet the demands of automotive applications, the Vishay General Semiconductor T15BxxA and T15BxxCA series are AEC-Q101 qualified and offer high temperature operation to +185 °C.

Compared to TVS in the SMC (DO-214AB) package, the Automotive Grade devices released today provide a 58 % smaller footprint to save board space and lower system costs. The unidirectional T15BxxA series offers extremely stable breakdown voltages from 12 V to 51 V, while the bidirectional T15BxxCA series provides breakdown voltages from 12V to 100 V. The devices offer excellent clamping capability — 17.0 V to 70.1 V for the T15BxxA and 17.0 V to 137 V for the T15BxxCA — and very fast response times.

The TVS are designed to protect sensitive electronics against voltage transients induced by inductive load switching and lightning. Typical applications will include lighting, electro-mechanical brake (EMB), and fuel pump control; 48 V DC/DC converters and inverters; integrated starter generators, BMS, vehicle control units (VCU), and on-board chargers; and telematics control units (TCU) for audio, electronic stability control (ESC), and radar sensors.

The devices meet MSL level 1 standards per J-STD-020 and are RoHS-compliant and halogen-free.

The post Vishay Intertechnology Uni/Bidirectional 1500 W PAR TVS Solutions Offer High Temperature Operation to +185 °C in SMB (DO-214AA) Package appeared first on ELE Times.

I made this dummy PCB on my 3D printer before submitting a front panel board to the PCB manufacturer. Turned out to be a nice method to avoid part alignment mishaps. The accuracy was in fact down to about 0.1 mm 💪 submitted by /u/Party-Butterfly-4857 [link] [comments]

I had to add a bypass set of capacitors at the voltage divider that was feeding the + input of the opamp. I also had to add a low - pass filter on the signal input, especially if I attempted to use my phone as audio input it had a lot of noise on it and apparently the phone expects a somewhat low impedance or it will get even noiser. I then also had to put a capacitor / resistor network across the feedback resistor to enforce lowering the gain at higher frequencies which prevented the opamp from oscillating during large signal swings. And now it is fully functional, mounted to a heatsink. Puts out about 14watts into 4 ohms at 30volts supply. Will do almost 20 watts into 2ohm load. I will be switching the potentiometer out for a smaller PCB style one and also integrating the input filter directly on the board soon. submitted by /u/Perfect-Campaign9551 [link] [comments]

In this article, we'll investigate how varying the amplitude and frequency of the modulating tone impacts the bandwidth of FM signals. We'll also compare the modulation index in AM and FM schemes.

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This is a pico 2 clone I made called PicoPlus. It's a drop in replacement* of the Raspberry Pi Pico 2. It has a WS2812B neopixel, 128MB SPI Flash on SPI0, 64MB PSRAM on SPI1, and a user button on GP24. I spent a bunch of time getting all the components to fit together, and reflowing this board myself. GitHub *GP0 is used as the chip select for the PSRAM chip, but can be disabled by cutting a solder jumper on the back submitted by /u/Badbird_5907 [link] [comments]

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InnoScience (Suzhou) Technology Holding Co Ltd — which manufactures gallium nitride on silicon (GaN) power chips on 8” silicon wafers — says that, with large AI models and high-performance computing placing higher demands on power supply systems, it is collaborating with NVIDIA of Santa Clara, CA, USA to jointly promote the large-scale implementation of an 800VDC power architecture in AI data centers...

A new organic electrochemical transistor-based device offers a needle-free solution for managing bipolar disorder.

There was an engineer I met who gave me a laptop with Altium 09 on it and told me that if I could get him the gerbers for a fun kids' soldering project for the STEM booth, he'd hire me as his EE. He let me know that he wanted silver teeth and spoke about layers and silk screening - his eyes glazed over - but I accepted the challenge, as I had no idea what a Gerber was at this point. I took it on, fumbled through and figured out how to use Altium and TxRex was born! The second pic is 6 months into my Altium experience. Love this stuff! submitted by /u/gotoline10 [link] [comments]

КПІ ім. Ігоря Сікорського і Ericsson: новий рівень співпраці у сфері 5G kpi пт, 08/01/2025 - 18:39

It was a fun project for one day, the idea came from the thought "what circuit can I fit in the one box of matches?" So I did, the boards fit, of course, without the battery. I kind of like this "naked" look of it. submitted by /u/TmxFsd [link] [comments]