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ST’s four-channel high-side switches, the IPS4140HQ and IPS4140HQ-1, drive resistive, capacitive, and inductive loads with one side connected to ground. The IPS4140HQ handles up to 0.6 A per channel, while the IPS4140HQ-1 supports up to 1.0 A. Both have a maximum RDS(on) of 80 mΩ per channel and include extensive diagnostic and protection features.

Housed in compact 8×6-mm QFN48 packages, the devices operate from a 10.5-V to 36-V supply and tolerate up to 41 V for enhanced system safety and reliability. Applications include programmable logic controllers, industrial PC I/O ports, and numerical control machines.

These intelligent power switches provide per-channel short-circuit protection, temperature monitoring, and independent restart to boost fault tolerance and simplify automated recovery. Additional safeguards include case-overtemperature shutdown with sequential restart, output current limiting, undervoltage lockout, and input overvoltage protection. With 5-V/3.3-V logic compatibility, EAS ratings up to 2.5 J per channel, and compliance with IEC 61000-4 and IEC 61131-2 standards, they ensure robust performance in industrial applications.

Prices for the IPS4140HQ and IPS4140HQ-1 high-side switches start at $2.59 in lots of 1000 units.

STMicroelectronics

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Intelligent high-side switches manage diverse loads appeared first on EDN.

Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247. A single high-current IGBT in a DTO247 can replace multiple lower-current TO247 IGBTs connected in parallel. Engineering samples of the 200-A and 350-A H7 IGBT variants are available now.

The DTO247 enables high power density and bridges the gap between TO247-based designs and module architectures. Additionally, its compatibility with both DTO247- and TO247-based architectures within the same system provides greater flexibility and customization. H7 IGBTs can be used in solar inverters, uninterruptible power supplies, and energy storage systems.

The DTO247-packaged portfolio will include 1200-V and 750-V H7 IGBTs with current ratings of 200 A, 250 A, 300 A, and 350 A. They feature 2-mm-wide leads for optimal conduction, a 7-mm pin-to-pin clearance, and a 10-mm creepage distance for enhanced safety and reliability. An integrated Kelvin emitter pin enables faster, more efficient switching.

Volume production of the TRENCHSTOP H7 IGBTs in DTO247 packages is scheduled for mid-2026. Datasheets were not available at the time of this announcement.

Infineon Technologies

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Infineon prepares DTO247-packaged IGBTs appeared first on EDN.

Keysight Technologies Inc of Santa Rosa, CA, USA and materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA have collaborated on a 200G multimode technology demonstration showcased for the first time at the Optical Fiber Communications Conference & Exposition (OFC 2025) in San Francisco (1–3 April). The 200G-per-lane vertical-cavity surface-emitting laser (VCSEL) technology provides higher data transfer rates and addresses industry demand for higher bandwidth in data centers. It should enable the industry to deliver AI/ML services while reducing power consumption and capital expense of short-reach data interconnects...

One of my jobs as an engineer was working in the engineering department of an electronic contract manufacturer. Our department designed test equipment for the manufacturing lines, but we also assisted customers with their products issues.

Do you have a memorable experience solving an engineering problem at work or in your spare time? Tell us your Tale

The product being built on the line was a PCB assembly for a coffee maker. One day, the boss came to me and said the customer is getting some complaints about the coffee maker display and controls locking up. He assured the customer we could fix their problem (even though no one knew what the issue was).

The first task was to reproduce the problem. With no clue as to how this problem happened, I started by just letting the coffee makers run. After a few days, nothing—so I tried other things like banging it and shaking it…nothing. I then pushed the buttons in every combination and cadence I could come up with – still no luck. Next ,I tried varying the line voltage slowly from the specified minimum to the specified maximum. The coffee maker still worked fine. I was running out of ideas. Finally, I tried one last thing: I plugged it into a controller that turns the line voltage on and off at varying rates. After a while it locked up.

This behavior hinted at the micro’s reset circuit so I dug into that. It wasn’t the typical design used in those days, a simple RC circuit. The resistor tied to Vcc and the capacitor tied to digital ground, then the other ends of the resistor and capacitor were tied together, and that tied to the micro’s reset.

After a little more testing I concluded that it was due to a fast interruption in the line voltage or a brownout. Either would cause the reset capacitor to discharge partway and then to reset back to Vcc. The micro wasn’t happy with this as it lost power but didn’t get a valid reset.

The boss was happy I found the root cause but now said “fix it” and the fix had to be something easy to tack on to the existing PCB. I spent a few days looking at things like changing the resistor or capacitor value or adding a 555 timer, comparator, or op-amp, but these either didn’t work or were too difficult or expensive to add to the PCB.

That’s when I remembered an obscure device I had read about, a programmable unijunction transistor, or PUT. This has some properties like an SCR. The PUT has 3 pins: anode, cathode, and gate. So, the circuit I came up with was this:

The schematic of the coffee maker fix, introducing the PUT to successfully manage failures due to interruptions in the line voltage or brownouts.

When Vcc is good, the anode to cathode is not conducting, but when the Vcc drops the capacitor stays up for a while, but the PUT triggers if the gate drops below the anode by 0.7v or more. This trigger turns on the anode to cathode path and the capacitor is quickly discharged. This fixed the problem and the PUT and resistor were easily tacked onto the existing PCB.

Damian Bonicatto is a consulting engineer with decades of experience in embedded hardware, firmware, and system design. He holds over 30 patents.

Phoenix Bonicatto is a freelance writer.

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The post PUT a reset in its place appeared first on EDN.

Milestone Systems, a leading provider of open platform video management software announced the release of XProtect 2025 R1, featuring expanded cloud integration capabilities and advanced vehicle identification video analytics. This release demonstrates Milestone’s commitment to platform accessibility and enhanced security features across its XProtect product line.

Extended Arcules Plugin Support Broadens Cloud Integration Options

The XProtect 2025 R1 release, available from March 18 marks a significant expansion in platform accessibility, with the Arcules Plugin now supporting XProtect Professional+, Expert, and Corporate editions. This enhanced integration enables seamless video and alarm flow from the Arcules Video Surveillance as a Service (VSaaS/cloud solution) to XProtect across a broader range of deployments, opening new possibilities for system integrators and end users.

Previously available only for XProtect Corporate users, the Arcules Plugin has been redesigned as a standalone device solution, eliminating the requirement for interconnect licensing. This strategic enhancement allows organizations using XProtect Professional+, Expert, and Corporate to leverage Arcules’ capabilities, significantly expanding market accessibility and integration options.

Advanced Analytics Transform Vehicle Identification and Tracking

The XProtect License Plate Recognition extension in XProtect 2025 R1 introduces comprehensive enhancements that elevate vehicle identification to new levels of sophistication. These updates enable more precise and efficient vehicle analytics, including:

• Vehicle Classification: Enables differential processing based on vehicle type, from motorcycles to buses
• Color Recognition: Facilitates rapid vehicle identification for security and law enforcement
• Make/Model Detection: Enhances vehicle identification accuracy for investigative purposes
• Vehicle Angle Detection: Determines vehicle orientation relative to camera position

These advanced capabilities within the XProtect LPR extension accelerate vehicle identification processes, allowing security personnel and law enforcement to quickly locate and identify vehicles of interest. The system’s enhanced capabilities support rapid filtering of video data based on specific vehicle characteristics, speeding up investigation processes and improving response times.

Transformative Impact on City Operations

Beyond security applications, the enhanced vehicle analytics provide valuable insights for urban planning and traffic management. The system’s ability to analyze various vehicle types and their movement patterns enables:

• Data-driven traffic flow optimization
• Strategic congestion management
• Environmental impact assessment through traffic pattern analysis
• Informed infrastructure development planning

This latest release continues Milestone’s tradition of innovation in video management technology, providing partners and customers with advanced tools to enhance security operations and leverage video data for broader operational insights.

The post Milestone Systems Expands XProtect with Enhanced CLOUD Integration, Advanced Vehicle Analytics appeared first on ELE Times.

Automotive Grade Device Allows for the Calculation of Color Temperature, Light Source Differentiation, and Placement behind Dark Cover Glass

The Optoelectronics group of Vishay Intertechnology, Inc. introduced the industry’s first AEC-Q100 qualified RGBIR color sensor. The Vishay Semiconductors VEML6046X00 features a highly sensitive photodiode, low noise amplifier, and 16-bit ADC in a miniature, opaque 2.67 mm by 2.45 mm surface-mount package with a low 0.6 mm profile.

With separate red, green, blue, and infrared channels, the Automotive Grade device released today allows for the calculation of the color temperature to enable white point balancing for displays. The spectral sensitivity of the VEML6046X00’s green channel matches that of the human eye to ensure highly accurate measurements, while IR channel facilitates a stable output over a wide range of light sources. With an ambient light range from 0 lx to 176 klx, the sensor will not saturate in daylight, while its high sensitivity of 0.0053 lx/ct allows the device to be placed behind dark cover glass.

Offering a high operating temperature range to +110 °C, the VEML6046X00 will be used for automotive display backlight controls, infotainment systems, rear view mirror dimming, interior lighting control systems, heads-up displays, color recognition, CCT measurement, mood lighting, and laser front light monitoring. The sensor supports the easy to use I²C bus communication interface for these applications and offers an interrupt function.

The VEML6046X00 features a supply voltage range of 2.5 V to 3.6 V, I²C bus voltage range of 1.7 V to 3.6 V, and low shut down current consumption of 0.5 μA typical. RoHS-compliant, halogen-free, and Vishay Green, the device offers a Moisture Sensitivity Level of 2a and a floor life of four weeks in accordance with J-STD-020E.

The post Vishay Intertechnology Releases AEC-Q100 Qualified RGBIR Color Sensor in Compact 2.67 mm x 2.45 mm x 0.6 mm Package appeared first on ELE Times.

• Validates the performance of AI infrastructure by emulating real-world workloads
• Evaluates how new algorithms, components, and protocols improve the performance of
  AI training
• Adjusts and optimizes the parameters of both AI workloads and system infrastructure without investing in expensive large-scale deployments

Keysight Technologies, Inc. introduces Keysight AI Data Center Builder, an advanced software suite that emulates real-world workloads to evaluate how new algorithms, components, and protocols impact the performance of AI training.KAI Data Center Builder’s workload emulation capability integrates large language model and other artificial intelligence model training workloads into the design and validation of AI infrastructure components – networks, hosts, and accelerators. This solution enables tighter synergy between hardware design, protocols, architectures, and AI training algorithms, boosting system performance.

AI operators use various parallel processing strategies, also known as model partitioning, to accelerate AI model training. Aligning model partitioning with AI cluster topology and configuration enhances training performance. During the AI cluster design phase, critical questions are best answered through experimentation. Many of the questions focus on data movement efficiency between the graphics processing units. Key considerations include:

• Scale-up design of GPU interconnects inside an AI host or rack
• Scale-out network design, including bandwidth per GPU and topology
• Configuration of network load balancing and congestion control
• Tuning of the training framework parameters

The KAI Data Center Builder workload emulation solution reproduces network communication patterns of real-world AI training jobs to accelerate experimentation, reduce the learning curve necessary for proficiency, and provide deeper insights into the cause of performance degradation, which is challenging to achieve through real AI training jobs alone. Keysight customers can access a library of LLM workloads like GPT and Llama, with a selection of popular model partitioning schemas like Data Parallel, Fully Sharded Data Parallel, and three-dimensional parallelism.

Using the workload emulation application in the KAI Data Center Builder enables AI operators to:

• Experiment with parallelism parameters, including partition sizes and their distribution over the available AI infrastructure
• Understand the impact of communications within and among partitions on overall job completion time Identify low-performing collective operations and drill down to identify bottlenecks
• Analyze network utilization, tail latency, and congestion to understand the impact they have on JCT

The KAI Data Center Builder’s new workload emulation capabilities enable AI operators, GPU cloud providers, and infrastructure vendors to bring realistic AI workloads into their lab setups to validate the evolving designs of AI clusters and new components. They can also experiment to fine-tune model partitioning schemas, parameters, and algorithms to optimize the infrastructure and improve AI workload performance.

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “As AI infrastructure grows in scale and complexity, the need for full-stack validation and optimization becomes crucial. To avoid costly delays and rework, it’s essential to shift validation to earlier phases of the design and manufacturing cycle. KAI Data Center Builder’s workload emulation brings a new level of realism to AI component and system design, optimizing workloads for peak performance.”

KAI Data Center Builder is the foundation of the Keysight Artificial Intelligence architecture, a portfolio of end-to-end solutions designed to help customers scale artificial intelligence processing capacity in data centers by validating AI cluster components using real-world AI workload emulation.

Keysight will showcase KAI Data Center Builder and its workload emulation capabilities in booth 1301 at the OFC 2025 conference, April 1-3, at the Moscone Center, San Francisco, California.

The post Keysight Introduces AI Data Center Builder to Validate and Optimize Network Architecture and Host Design appeared first on ELE Times.

18 x 2n2222 transistors submitted by /u/Careful-Rich9823 [link] [comments]

Device Offers Wide Power Supply Range from 1.65V to 3.6V and
Fast Access Time Down to 10 ns

To meet the demand for high-density fast CMOS SRAMs, Alliance Memory today introduced a new 32Mb device in the 6 mm by 8 mm 48-ball FBGA package. Configured as 2M x 16, the AS7CW2M16-10BIN offers a wide power supply range from 1.65V to 3.6V.

“As other manufacturers continue to phase out their SRAM offerings, Alliance Memory remains committed to supporting the market with a wide range of fast memory solutions,” said David Bagby, president and CEO of Alliance Memory. “Our latest device not only provides our customers with a higher density option but also offers increased flexibility by supporting both 1.8V and 3.3V operating voltages in a single part.”

Operating from a single 1.8V, 2.5V, or 3.3V power supply, the device released today is optimized for consumer TVs and digital cameras, industrial robotics, networking routers, medical equipment, and high-speed automotive systems. For these applications, the AS7CW2M16-10BIN provides fast access times down to 10 ns minimum, data retention voltages down to 1.5V minimum, and low power consumption with operating currents down to 43mA typical and standby current of 10mA typical.

The SRAM features TTL-compatible inputs and outputs, tri-state output, easy memory expansion with chip select (CS) and output enable (OE) functionality, and data control for upper and lower bytes. The RoHS-compliant device operates over a -40°C to +85°C temperature range.

The AS7CW2M16-10BIN is the latest addition to Alliance Memory’s full range of fast SRAMs, which include devices with densities from 64Kb to 16Mb. Fabricated using high-performance, high-reliability CMOS technology, the ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions.

Device Specification Table:

Part	Density	VCC (V)	tAA (ns)	VDR (V)	ICC (mA)	ISB1 (mA)	Package	Temp. (°C)
AS7CW2M16-10BIN	32Mb	3.3	10	2.0	45	10	48-ball FBGA	-40 to +85
		2.5	10	2.0	45	10
		1.8	12	1.5	43	10

Samples and production quantities of the new fast SRAM are available now, with lead times of eight to 10 weeks. The AS7CW2M16 32Mb fast SRAM part will also be available in a TSOP package later in Q2 2025.

The post Alliance Memory Launches New 32Mb Fast SRAM in 48-ball FBGA Package appeared first on ELE Times.

submitted by /u/irf3205 [link] [comments]

Works with basically everything, the sound card is from a usb-c headset submitted by /u/The-Devil-Itself [link] [comments]