Feed aggregator

What looks like a simple port is in fact a silent architect—quietly shaping how energy and data flow between your car and your mobile world. Hidden inside that small rectangle of metal and plastic is a choreography of power regulation, signal integrity, and protocol negotiation.

It’s the unseen engineering that turns a “plug” into a lifeline, ensuring your EV and your phone don’t just connect, but truly communicate.

From socket to smart port

Once upon a dashboard, the humble “cigarette lighter” socket was nothing more than a dumb power tap—12 volts, no questions asked. Fast forward to today, and the USB-C port in your EV is no longer a passive outlet; it’s an intelligent node in a vast digital ecosystem. That tiny connector is the handshake between two massive computers: your phone and your car.

It juggles a delicate balance, delivering high-wattage energy to keep devices alive while simultaneously orchestrating millisecond-sensitive data streams that define navigation, entertainment, and even safety. In short, your USB port is not just a plug; it’s a bridge, a translator, and a silent engineer behind the scenes of modern mobility.

Power architecture: From traction to tablet

Unlike traditional cars, EVs don’t carry an alternator humming under the hood. Instead, they rely on a DC-DC converter—a silent workhorse that steps down the traction battery’s 400-V or even 800-V supply to the familiar 12-V rail that powers the cabin. That same rail feeds the USB ports, infotainment systems, and auxiliary electronics.

Think of it as an “infinite power bank”: charging your phone at 15 W for an hour consumes only about 0.015 kWh. Put that in perspective, a 75 kWh Tesla battery could technically recharge an iPhone 15 Pro Max more than 4,000 times. In other words, your EV’s energy reserves make mobile charging almost trivial, yet the engineering behind that seamless handoff is anything but.

Figure 1 Onboard DC-DC converter services the low-voltage auxiliary rail by extracting energy from the high-voltage traction battery. Source: Brogen EV Solution

Sidenote: Instead of combustion fuel, the high-voltage traction pack stores electrical energy at hundreds of volts, driving the motor and, through the DC-DC converter, sustaining the 12-V system.

The “signal” side: The handshake

If the power architecture is the muscle, the signal side is the brain. In USB-C, no current flows until a negotiation takes place. That negotiation happens over the Configuration Channel (CC) pins, where your EV and your phone exchange digital hellos before any electrons move.

Through this handshake, they decide critical roles: Who is the host? (almost always the car), and how much voltage can the phone safely accept?—whether it’s 5 V for legacy devices, 9 V or 15 V for fast-charging, or even 20 V for high-power modes. Only after this millisecond-level dialogue does energy begin to flow, ensuring that what looks like a simple plug-in is actually a carefully choreographed agreement between two computers.

Figure 2 Integrated electronics drive a 60-W USB-C car power socket, providing native support for Power Delivery, Quick Charge, and other fast-charging protocols. Source: Pro Car

Once the roles and voltage levels are agreed, the conversation doesn’t stop—it deepens into data protocols. Over the very same power pins, USB Power Delivery (USB-PD) runs a digital dialogue, negotiating charging speed and ensuring both sides stay within safe limits.

Parallel to that, separate high-speed differential pairs carry the real payload: the streams of audio, video, and control signals that make Apple CarPlay and Android Auto feel seamless. In effect, your EV’s USB port is multitasking—one channel whispering about volts and watts, another racing to deliver maps, playlists, and messages—all in perfect sync.

The challenge: Noise and interference

Your EV’s cabin is far from electrically serene. High-frequency switching from motor inverters and power electronics creates a “dirty” environment filled with electromagnetic noise. To keep your USB connection clean, manufacturers rely on shielded twisted pairs (STP) cables designed to resist interference and preserve signal integrity, so your music and navigation don’t glitch under the influence of stray magnetic fields.

But shielding alone isn’t enough. The electronics inside the USB interface must also withstand sudden voltage spikes and magnetic surges. That’s where common-mode transient immunity (CMTI) comes in; it’s a design requirement that ensures the transceivers can survive and keep data flowing even when the EV’s power electronics throw out nanosecond-scale noise bursts. Without strong CMTI performance, those spikes could corrupt packets or drop connections.

Figure 3 Oscillogram illustrates an EV-style CMTI spike waveform during a high-speed transient event. Source: Author (AI-generated)

Sidenote: In high-performance EV architectures, the drive for faster switching efficiency can turn CMTI into a critical bottleneck. As platforms move to 800-V systems, the steep voltage transitions (dv/dt) from wide bandgap (WBG) semiconductors—notably SiC and GaN—produce intense high-frequency transients. These spikes can leak through parasitic capacitances in isolation barriers (in gate drivers or digital isolators), risking shoot-through events where both switches conduct simultaneously, a destructive failure mode for traction inverters.

Especially, GaN’s ultra-fast switching makes it more vulnerable. To protect control logic and safeguard costly WBG modules, modern EV designs now require isolated gate drivers with ultra-high CMTI ratings (often >150 kV/µs, specified for both positive-and negative-going transients), a design safeguard that directly underpins range, reliability, and performance.

Also, it’s worth noting that there are two types of CMTI: static and dynamic. Static CMTI refers to the test condition where the input is held at a fixed logic high or logic low, and the output state is monitored during a common-mode transient strike. The requirement is that the gate driver output remains in its specified state across variations in process, voltage, and temperature.

Dynamic CMTI, by contrast, evaluates immunity while the device is actively switching. This measures whether the transient causes timing jitter or pulse distortion—making it the more demanding metric and the true limiter in fast-transition EV platforms using WBG devices.

And then there’s the subtle menace of ground loops: a cheap, poorly shielded cable can create electrical conflict between the car’s ground and your phone’s ground, producing that familiar buzzing in the speakers. What seems like a trivial accessory choice can make the difference between crystal-clear audio and noisy rides.

Why do some ports “only charge”

Ever noticed that not every USB port in your car lets you run CarPlay or Android Auto? That’s by design. Many automakers follow a hub strategy: one “Master Data Port” up front, usually near the driver, and several “dummy ports” in the rear that are charge-only. The reason is cost and complexity.

A data-capable port requires an automotive-grade controller, shielded wiring, and careful integration into the infotainment system—all of which add expense and engineering overhead. By contrast, a charge-only port is far simpler: just a buck converter stepping down voltage to feed your device. It’s a deliberate hardware trade-off, balancing convenience for passengers with the realities of automotive design budgets.

V2L: The ultimate USB upgrade

If USB-C feels powerful, Vehicle-to-Load (V2L) takes the idea to an entirely new scale. Cars like the Hyundai IONIQ 5 or Kia EV6 don’t stop at charging your phone; they turn the whole vehicle into a rolling generator. Instead of 60 W from a USB-C port, V2L delivers up to 3.6 kW through a standard AC outlet at 120 V (North America) or 230 V (Europe/Asia). That’s enough to run a full desk setup: monitor, laptop, and lights, all powered via a USB-C multi-charger.

And in trucks like the Ford F-150 Lightning, the concept scales even further with Pro Power Onboard, offering up to 9.6 kW across multiple AC outlets. At that level, the EV isn’t just a power bank; it’s a backup generator capable of supporting tools, appliances, or even parts of a home during an outage. In essence, V2L is the logical extension of the same engineering principles—scaling from watts to kilowatts—while keeping the promise of mobility and connectivity intact.

Sidenote: V2L technology depends on a coordinated handshake between the vehicle and adapter, primarily through the Proximity Pilot (PP) and Control Pilot (CP) pins defined by IEC 61851. The PP resistor identifies the adapter type and signals readiness, while the CP line maintains PWM-based communication for safe connection and disconnection.

In bi-directional on-board chargers, detection of the correct PP resistance or proprietary handshake prompts the system to enter discharge mode, closing internal contactors to deliver AC power outward. If the CP signal drops or the adapter is unplugged, the vehicle instantly opens the contactors to prevent arcing—ensuring safe, reliable V2L operation across varying manufacturer implementations.

Figure 4 A universal V2L adapter with a mode selector supports multiple EV platforms by initiating the vehicle’s power-discharge sequence. Source: Author

The future: Wireless vs. wired

Convenience is pushing hard toward wireless, but the trade-offs are real. Wireless charging pads promise a cable-free cabin, yet they come with hidden costs: extra heat from inductive transfer and a slight latency in power delivery compared to the precision of a wired USB-C port. That means slower charging and less efficiency, especially when you’re juggling multiple devices.

On the data side, the shift is already happening. Wireless CarPlay and Android Auto bypass the USB port entirely, riding on the car’s internal Wi-Fi signal. In this setup, the USB port is relegated to pure power duty, while your phone streams navigation, music, and messages over a wireless link. It’s a glimpse of the future—where the port becomes less about data and more about energy, while the car’s network takes over the role of digital bridge.

The car as a service

We used to choose cars based on horsepower; now we choose them based on their digital horsepower. Infotainment speed, connectivity options, and seamless integration with our mobile lives have become as decisive as torque or acceleration. And at the center of that experience sits the most-used interface in the cabin: the USB port.

It’s no longer just a plug—it’s the gateway to energy, data, and the services that define modern mobility. In this sense, the car has evolved into a platform, a service hub on wheels, where the humble port is the everyday touchpoint between driver, device, and digital ecosystem.

From volts to vision, engineering isn’t just power, it’s empowerment.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• USB Keypad Reference Design
• USB Proves Ready for T&M Tasks
• Top 10 innovative USBs and peripherals
• Take off with Simplified USB Type-C Development
• The USB takeover: Why modern T&M is moving to your pocket
• A quick and practical view of USB Power Delivery (USB-PD) design

The post More than a plug: The hidden USB engineering in your EV appeared first on EDN.

submitted by /u/KrisMakesRandomStuff [link] [comments]

Built a hardware bridge UART-CPU for 8080(known as the КР580ВМ80А or VM80 in the postUSSR region) architecture microcomputers parallel bus. Heart of this small project is КР580ВВ51A(Intel8251) manufactured nearly 40 years ago. Below it sits a baudrate generator on some discrete logic gates: К155ЛА3(7400) as xtal generator with frequency 4.9152 MHz, К155ТМ2(7474) as 1/4 predivider, К561ИЕ10(4520, two CMOS dividers). Seven jumper headers under the blue UART connector are selecting current dividers output from 4800 Hz (300 baud) up to 307.2 kHz (19200 baud). Everything is point-to-point wired on both sides of 50mm x 70mm perfboard. And the brain of this circuit is an Arduino Nano which is emulating 8080 bus and control signals(CS, RD, WR, C/D), sadly I don't have a real computer from that era. submitted by /u/Most_Sentence2425 [link] [comments]

submitted by /u/AutoModerator
[link] [comments]

I built a simple LED flasher circuit using a 2N2222 transistor, resistors, capacitors and LEDs. This project helped me better understand transistor switching and timing circuits. The circuit was assembled and tested on a breadboard, and the LEDs flashed successfully submitted by /u/Flashy_Knowledge5080 [link] [comments]

I've been working on a virtualized version of the old spring and wire electronics kit. It's far from finished, how ever I would like to show it off. Play: https://ellisgl.github.io/virtual_65-in-1_28-250/ Code: https://github.com/ellisgl/virtual_65-in-1_28-250 submitted by /u/ellisgl [link] [comments]

Made a simple power supply from an old atx psu. Wiring is pretty ugly but it works. submitted by /u/SearchPlane561 [link] [comments]

L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services successfully concluded Engineering Intelligence (EI) OpenHack 2026, a first-of-its-kind global innovation challenge conducted simultaneously across nine locations spanning India, the U.S. and Europe.

The hackathon brought together nearly 4,000 engineers (770+ teams) from Bengaluru, Mysuru, Chennai, Hyderabad, Pune, Vadodara, Mumbai, Dallas and Munich to tackle complex engineering challenges through AI-led innovation. More than 500 challenge statements were aligned with company’s strategic growth priorities, spanning Software Defined Mobility, Plant Buildout & Modernization, Energy & Automation, Next-Gen Compute & AI Infrastructure, Digital Manufacturing, MedTech, and Software Platforms & AI. By combining domain expertise with emerging technologies, participants developed AI-powered solutions across industrial automation, cybersecurity, autonomous systems, supply chain intelligence, enterprise optimization, and healthcare – all aimed at helping enterprises reimagine products, operations, and decision-making.

An esteemed jury comprising senior LTTS leaders and technology experts evaluated the solutions through multiple rounds, assessing entries on innovation, technical excellence, scalability, real-world relevance and effective use of AI. Winning teams were awarded cash prizes worth over INR 30 lakh, while standout innovations received opportunities for further development through Project Equinox, an LTTS platform that supports promising, scalable solutions. Patent-worthy innovations were also shortlisted for special recognition, enabling participants to transform breakthrough ideas into valuable intellectual property.

Congratulating the participants and winning teams, Mritunjay Kumar Singh, Chief Operating Officer, L&T Technology Services, said “The EI OpenHack 2026 reflects LTTS’ vision of Engineering Intelligence, where engineering expertise and AI come together to solve real-world industry challenges. What stood out was not only the scale of participation, but the ability of our engineers to apply contextual understanding, domain knowledge and AI prowess to develop solutions with tangible business relevance. Initiatives like OpenHack create opportunities for our talent to experiment, collaborate and develop solutions that will shape the future of engineering.”

The post L&T Technology Services Global EI Hackathon Sparks the Next Wave of AI-Native Engineering Solutions appeared first on ELE Times.

Selective oscillation achieves desired attention aspirations absent undesirable side effects.

Someone I knew long ago had a small electronics company with a client who wanted to make an attention-grabbing light display for a store window. This fellow’s office was set up with six light sources that were to be part of that display, where each source was a mirrored half-globe roughly one foot in diameter with a very bright light bulb that would turn on and off at its own independent rate.

As these bulbs would flash on and off asynchronously, the visual effect was quite stunning. There was one problem, though. Now and then, all six bulbs would go dark at the same time and when they did, the visual effect was actually jarring. That was a problem. I was asked if there was something we could do to avoid the jarring darkness, but quite frankly, I had no idea how this could be achieved with the items at hand.

This past December, a local diner set up a flashing light display out front in celebration of the holiday. It reminded me of my past-history display issue…and then I realized something.

Figure 1 A selective flashing light display still cultivates sizeable viewer attention.

The diner’s flashing light display was as visually striking as the globe set up was supposed to have been, but the diner’s display never went entirely dark. That was because only some of the light sources were blinking. Most of the light sources stayed lit all the time. Only a few of them needed to be blinking to achieve the desired visual effect.

Had I been smarter, I might have been able to solve that client’s problem. But since I don’t have a time machine, I couldn’t go back and do anything.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• Creating smart brightness-controlled lamp with a motion sensor
• Bicycle LED Headlight
• LED driver enables animated automotive lighting

The post Blinkers appeared first on EDN.

Keysight Technologies today announced Keysight Eggplant Find by Description, which allows automation engineers to locate interface elements by describing them rather than capturing and matching screenshots. Each test targets an element by its description rather than its visual appearance, enabling it to keep running through redesigns, theme changes, and resolution shifts. This removes the manual recapture work that has historically wasted engineering resources.

‘Half of Organizations’ believe a chief test automation barrier is the upkeep of scripts that fail as applications change. Maintaining image-based scripts is a hidden cost, as they break when the interface shifts, even when the underlying software runs correctly. Engineers then spend hours recapturing screenshots for cases that should still pass, a cycle that repeats across every release and environment.

With Keysight Eggplant Find by Description, part of Eggplant Studio and Eggplant Functional, an engineer can describe an element, such as a ticket price for a given date, and the software locates it without reference to screenshots, document object model access, or changes to the system under test. In a Keysight demonstration, this reduced script volume by 92 percent and cut the task from over an hour to under 15 minutes. This extends Keysight Eggplant’s use of AI and computer vision in test automation, which lets a description keep working as the design changes and applies across legacy desktop, embedded, and web applications.

Gareth Smith, Software Quality Engineering General Manager, Keysight, said, “Our goal is to help teams automate more of their testing. However, for too long, the maintenance burden has held that back. Keysight Eggplant Find by Description clears one of the biggest barriers, moving us toward a future where teams automate what they want, not only what their tools allow.”

 

The post Keysight Targets the Hidden Cost of UI Test Authoring and Maintenance appeared first on ELE Times.

The post Infineon Launches SECORA ID Key S USB Security Solution appeared first on ELE Times.

MALVERN, Pa.- July 9, 2026 – Vishay Intertechnology, Inc. (NYSE: VSH) today introduced an automotive 1 MBd high speed optocoupler in a new SOP-5 package with a narrow width of 3.6 mm. Combining a comparative tracking index (CTI) of 400 with industry-leading minimum guaranteed common mode transient immunity (CMTI) of 40 kV/µS, the Vishay Semiconductors VOMHA43A is designed to deliver improved signal transmission quality and save space in applications requiring isolation voltages (VIORM) up to 707 Vpeak.

The AEC-Q102 qualified device released today is optimized for isolated data communication, fast signal switching, ground signal isolation, and logic voltage level shifting in automotive, industrial, home and building control, and telecom applications. In electric (EV), hybrid electric (HEV), and low speed electric (LSEV) vehicles, the optocoupler provides communication bus isolation for CAN, LIN, I²C, and SPI interfaces, as well as isolated drive circuit applications such as intelligent power module (IPM) drivers.

While previous SOP-5 packages offered a width of 4.4 mm, the narrower SOP-5 of the VOMHA43A requires less PCB space, while supporting stackable designs. The device’s minimum CMTI — which is more than double that of the closest competing device — provides enhanced robustness against electrical spikes and RF and EMI issues. And while competing devices offer maximum repetitive peak isolation voltages of 567 Vpeak, the optocoupler’s isolation voltage performance of 707 Vpeak meets the requirements of 400 V battery systems.

The VOMHA43A consists of a GaAlAs infrared emitting diode, optically coupled with an integrated photodetector and a high speed transistor. The photodetector is junction-isolated from the transistor to reduce miller capacitance effects. The optocoupler features an open collector output function that allows designers to adjust load conditions when interfacing with different logic systems, while a Faraday shield on the detector chip allows the device to reject and minimize high input to output common mode transient voltages.

The RoHS-compliant and halogen-free optocoupler operates over a temperature range of -40 °C to +125 °C and is pin to pin compatible with leading competing parts to provide a direct replacement and eliminate the need for electrical and mechanical redesigns.

Samples and production quantities of the VOMHA43A are available now, with lead times of six weeks.

About Vishay Intertechnology

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.

The post Vishay Intertechnology Automotive Optocoupler in SOP-5 Package With 3.6 mm Width Saves Space While Improving Signal Transmission appeared first on ELE Times.

The automotive industry is undergoing a fundamental transformation. Vehicles are no longer static machines defined at production. They are becoming dynamic, software-defined platforms that evolve over time through updates, new features, and continuous improvements.

This shift is changing the role of semiconductors. What was once a supporting function is now central to how vehicles operate, differentiate, and deliver value. As software increasingly defines the vehicle experience, compute and power architectures must support far more than fixed functionality.

By the next decade, software-defined vehicle (SDV) architectures are expected to dominate new vehicle platforms. Automakers are investing heavily to move toward systems that can adapt over long lifecycles, even as software and AI evolve at a much faster pace.

The result is a new set of challenges that go beyond incremental improvements in performance.

A growing mismatch between lifecycles

At the core of the SDV transition is a structural mismatch.

While vehicles must operate safely and reliably for more than a decade, software does not follow the same timeline. New capabilities are introduced continuously—through AI model updates, over-the-air (OTA) features, and evolving applications that extend beyond the original vehicle design.

This creates a system that operates on multiple timelines at once. Safety-critical control systems require stability and certification, while AI-driven functions demand flexibility and rapid iteration. Traditional architectures struggle to accommodate both.

The conventional model, built around tightly coupled hardware and software and distributed electronic control units (ECUs), cannot scale to this level of complexity. Even as industry transitions toward centralized and zonal architectures, the underlying challenge remains: how to support continuous evolution without increasing risk.

Compute is now a system-level challenge

At the same time, the demand for in-vehicle compute is increasing dramatically.

Advanced driver assistance, higher levels of autonomy, and AI-driven experiences all require high-performance processing at the edge. These workloads must operate within strict constraints—limited power, tight thermal envelopes, and automotive-grade reliability.

Monolithic system-on-chip (SoC) designs make it difficult to balance these competing demands. A single device must meet performance, cost, safety, and lifecycle requirements simultaneously, which introduces inefficiencies and limits flexibility. As a result, compute is no longer a component decision. It’s a system-level problem that affects how the entire vehicle is designed and evolves over time.

Moving toward heterogeneous and modular architectures

The industry is beginning to respond by shifting toward more flexible architectures.

Instead of integrating all functionality into a single chip, new designs increasingly rely on heterogeneous systems that combine multiple compute elements—CPUs, GPUs, and AI accelerators—working together. This approach allows different parts of the system to be optimized independently while still functioning as a unified platform.

More importantly, it enables alignment with real-world requirements. Safety-critical functions can rely on mature, well-understood technologies, while AI workloads can take advantage of leading-edge processing. Memory, connectivity, and I/O can be placed where they deliver the best efficiency.

This shift reflects a broader transition from optimizing individual components to designing systems that balance performance, cost, and lifecycle considerations.

This system-level evolution is already visible in current automotive compute platforms.

High-performance SoC families such as R‑Car illustrate how architectures are adapting to SDV requirements. These platforms bring together heterogeneous compute, safety capabilities, and efficient power management in a scalable framework that can be deployed across different vehicle domains.

They are designed not only for central compute in ADAS and autonomous applications, but also to integrate with zonal controllers and broader vehicle systems. This enables automakers to build platforms that can evolve over time, rather than redesigning from scratch for each new generation.

The key point is not peak performance alone. It’s the ability to deliver consistent, predictable behavior across a wide range of use cases and over long operational lifetimes.

Supporting diverse OEM strategies

The transition to software-defined vehicles is not uniform across the industry.

Some automakers are moving toward fully centralized architectures, while others are adopting hybrid or zonal approaches. Different strategies reflect different priorities, including cost structure, time-to-market, and control over software ecosystems.

This diversity requires flexibility. Suppliers must support multiple architectural paths and allow automakers to make trade-offs that fit their specific goals. An open, scalable approach becomes increasingly important as vehicles evolve from isolated products to connected, long-lifecycle platforms.

AI is accelerating the need for change

Artificial intelligence is amplifying these challenges.

Early automotive AI focused on discrete functions such as perception. Today, vehicles must handle multiple AI-driven workloads simultaneously, from sensor fusion to planning to in-cabin interactions. These systems must operate in real time while meeting strict safety requirements.

This shifts the focus away from simplified performance metrics toward broader system considerations. Latency, determinism, power efficiency, and data movement all become critical. Supporting AI at scale requires architectures that can orchestrate diverse workloads efficiently while maintaining predictable performance. This reinforces the need for heterogeneous, system-level design.

From products to platforms

In other words, as complexity increases, the industry is moving toward integrated platforms.

Automakers are no longer looking solely for components. They are looking for solutions that combine hardware, software, and development ecosystems in a way that reduces integration risk and accelerates deployment.

This shift reflects a broader change in the semiconductor industry—from delivering individual devices to enabling complete system solutions. And this transition to software-defined vehicles is a long-term shift that will unfold over the next decade.

What is already clear is that success will depend on the ability to design systems that balance long-term reliability with rapid innovation. This requires new thinking—not just in silicon, but in architecture, development processes, and ecosystem collaboration.

The industry is moving beyond optimizing individual parts. It’s designing vehicles as cohesive, adaptable systems. And compute sits at the center of that transformation.

Vivek Bhan is senior VP and GM of high-performance computing at Renesas Electronics.

Related Content

• SDVs: Big Picture and Challenges
• Why the Cloud Is Essential for SDV Development
• Unveiling the Transformation of Software-Defined Vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Taming the Increasing Complexity of the Software-Defined Vehicle

The post Rethinking automotive compute in the software-defined era appeared first on EDN.

Aehr Test Systems of Fremont, CA, USA — which provides solutions for testing, burning-in and stabilizing semiconductor devices in wafer-level, singulated die, and packaged-part form — has received an additional follow-on production order from its lead silicon photonics customer for a fully automated FOX-XP wafer-level burn-in (WLBI) system. The system will support high-volume production burn-in of silicon photonics devices used in AI optical interconnect and hyperscale data-center applications...

Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has received a new order from 3SP Technologies S.A.S. of Nozay, Essonne, France — a long-standing customer for more than 20 years — for an industrial passivation platform. The system is scheduled for delivery in 2027...

Found these in a old CRT TV and the second transistor does have a marking it just isnt visible on the photo submitted by /u/Remote_Air_6433 [link] [comments]

These are all my Tesla transistors I have a KU 611 with a CA mark, KFY 18 and a KF 506 submitted by /u/Remote_Air_6433 [link] [comments]

📈 КПІ ім. Ігоря Сікорського — серед лідерів української вищої освіти у Webometrics 2026 KPI4U-2 пт, 07/10/2026 - 10:26