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I built a simple LED flasher circuit using a 2N2222 transistor, resistors, capacitors and LEDs. This project helped me better understand transistor switching and timing circuits. The circuit was assembled and tested on a breadboard, and the LEDs flashed successfully submitted by /u/Flashy_Knowledge5080 [link] [comments]

I've been working on a virtualized version of the old spring and wire electronics kit. It's far from finished, how ever I would like to show it off. Play: https://ellisgl.github.io/virtual_65-in-1_28-250/ Code: https://github.com/ellisgl/virtual_65-in-1_28-250 submitted by /u/ellisgl [link] [comments]

Made a simple power supply from an old atx psu. Wiring is pretty ugly but it works. submitted by /u/SearchPlane561 [link] [comments]

L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services successfully concluded Engineering Intelligence (EI) OpenHack 2026, a first-of-its-kind global innovation challenge conducted simultaneously across nine locations spanning India, the U.S. and Europe.

The hackathon brought together nearly 4,000 engineers (770+ teams) from Bengaluru, Mysuru, Chennai, Hyderabad, Pune, Vadodara, Mumbai, Dallas and Munich to tackle complex engineering challenges through AI-led innovation. More than 500 challenge statements were aligned with company’s strategic growth priorities, spanning Software Defined Mobility, Plant Buildout & Modernization, Energy & Automation, Next-Gen Compute & AI Infrastructure, Digital Manufacturing, MedTech, and Software Platforms & AI. By combining domain expertise with emerging technologies, participants developed AI-powered solutions across industrial automation, cybersecurity, autonomous systems, supply chain intelligence, enterprise optimization, and healthcare – all aimed at helping enterprises reimagine products, operations, and decision-making.

An esteemed jury comprising senior LTTS leaders and technology experts evaluated the solutions through multiple rounds, assessing entries on innovation, technical excellence, scalability, real-world relevance and effective use of AI. Winning teams were awarded cash prizes worth over INR 30 lakh, while standout innovations received opportunities for further development through Project Equinox, an LTTS platform that supports promising, scalable solutions. Patent-worthy innovations were also shortlisted for special recognition, enabling participants to transform breakthrough ideas into valuable intellectual property.

Congratulating the participants and winning teams, Mritunjay Kumar Singh, Chief Operating Officer, L&T Technology Services, said “The EI OpenHack 2026 reflects LTTS’ vision of Engineering Intelligence, where engineering expertise and AI come together to solve real-world industry challenges. What stood out was not only the scale of participation, but the ability of our engineers to apply contextual understanding, domain knowledge and AI prowess to develop solutions with tangible business relevance. Initiatives like OpenHack create opportunities for our talent to experiment, collaborate and develop solutions that will shape the future of engineering.”

The post L&T Technology Services Global EI Hackathon Sparks the Next Wave of AI-Native Engineering Solutions appeared first on ELE Times.

Keysight Technologies today announced Keysight Eggplant Find by Description, which allows automation engineers to locate interface elements by describing them rather than capturing and matching screenshots. Each test targets an element by its description rather than its visual appearance, enabling it to keep running through redesigns, theme changes, and resolution shifts. This removes the manual recapture work that has historically wasted engineering resources.

‘Half of Organizations’ believe a chief test automation barrier is the upkeep of scripts that fail as applications change. Maintaining image-based scripts is a hidden cost, as they break when the interface shifts, even when the underlying software runs correctly. Engineers then spend hours recapturing screenshots for cases that should still pass, a cycle that repeats across every release and environment.

With Keysight Eggplant Find by Description, part of Eggplant Studio and Eggplant Functional, an engineer can describe an element, such as a ticket price for a given date, and the software locates it without reference to screenshots, document object model access, or changes to the system under test. In a Keysight demonstration, this reduced script volume by 92 percent and cut the task from over an hour to under 15 minutes. This extends Keysight Eggplant’s use of AI and computer vision in test automation, which lets a description keep working as the design changes and applies across legacy desktop, embedded, and web applications.

Gareth Smith, Software Quality Engineering General Manager, Keysight, said, “Our goal is to help teams automate more of their testing. However, for too long, the maintenance burden has held that back. Keysight Eggplant Find by Description clears one of the biggest barriers, moving us toward a future where teams automate what they want, not only what their tools allow.”

 

The post Keysight Targets the Hidden Cost of UI Test Authoring and Maintenance appeared first on ELE Times.

The post Infineon Launches SECORA ID Key S USB Security Solution appeared first on ELE Times.

MALVERN, Pa.- July 9, 2026 – Vishay Intertechnology, Inc. (NYSE: VSH) today introduced an automotive 1 MBd high speed optocoupler in a new SOP-5 package with a narrow width of 3.6 mm. Combining a comparative tracking index (CTI) of 400 with industry-leading minimum guaranteed common mode transient immunity (CMTI) of 40 kV/µS, the Vishay Semiconductors VOMHA43A is designed to deliver improved signal transmission quality and save space in applications requiring isolation voltages (VIORM) up to 707 Vpeak.

The AEC-Q102 qualified device released today is optimized for isolated data communication, fast signal switching, ground signal isolation, and logic voltage level shifting in automotive, industrial, home and building control, and telecom applications. In electric (EV), hybrid electric (HEV), and low speed electric (LSEV) vehicles, the optocoupler provides communication bus isolation for CAN, LIN, I²C, and SPI interfaces, as well as isolated drive circuit applications such as intelligent power module (IPM) drivers.

While previous SOP-5 packages offered a width of 4.4 mm, the narrower SOP-5 of the VOMHA43A requires less PCB space, while supporting stackable designs. The device’s minimum CMTI — which is more than double that of the closest competing device — provides enhanced robustness against electrical spikes and RF and EMI issues. And while competing devices offer maximum repetitive peak isolation voltages of 567 Vpeak, the optocoupler’s isolation voltage performance of 707 Vpeak meets the requirements of 400 V battery systems.

The VOMHA43A consists of a GaAlAs infrared emitting diode, optically coupled with an integrated photodetector and a high speed transistor. The photodetector is junction-isolated from the transistor to reduce miller capacitance effects. The optocoupler features an open collector output function that allows designers to adjust load conditions when interfacing with different logic systems, while a Faraday shield on the detector chip allows the device to reject and minimize high input to output common mode transient voltages.

The RoHS-compliant and halogen-free optocoupler operates over a temperature range of -40 °C to +125 °C and is pin to pin compatible with leading competing parts to provide a direct replacement and eliminate the need for electrical and mechanical redesigns.

Samples and production quantities of the VOMHA43A are available now, with lead times of six weeks.

About Vishay Intertechnology

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.

The post Vishay Intertechnology Automotive Optocoupler in SOP-5 Package With 3.6 mm Width Saves Space While Improving Signal Transmission appeared first on ELE Times.

The automotive industry is undergoing a fundamental transformation. Vehicles are no longer static machines defined at production. They are becoming dynamic, software-defined platforms that evolve over time through updates, new features, and continuous improvements.

This shift is changing the role of semiconductors. What was once a supporting function is now central to how vehicles operate, differentiate, and deliver value. As software increasingly defines the vehicle experience, compute and power architectures must support far more than fixed functionality.

By the next decade, software-defined vehicle (SDV) architectures are expected to dominate new vehicle platforms. Automakers are investing heavily to move toward systems that can adapt over long lifecycles, even as software and AI evolve at a much faster pace.

The result is a new set of challenges that go beyond incremental improvements in performance.

A growing mismatch between lifecycles

At the core of the SDV transition is a structural mismatch.

While vehicles must operate safely and reliably for more than a decade, software does not follow the same timeline. New capabilities are introduced continuously—through AI model updates, over-the-air (OTA) features, and evolving applications that extend beyond the original vehicle design.

This creates a system that operates on multiple timelines at once. Safety-critical control systems require stability and certification, while AI-driven functions demand flexibility and rapid iteration. Traditional architectures struggle to accommodate both.

The conventional model, built around tightly coupled hardware and software and distributed electronic control units (ECUs), cannot scale to this level of complexity. Even as industry transitions toward centralized and zonal architectures, the underlying challenge remains: how to support continuous evolution without increasing risk.

Compute is now a system-level challenge

At the same time, the demand for in-vehicle compute is increasing dramatically.

Advanced driver assistance, higher levels of autonomy, and AI-driven experiences all require high-performance processing at the edge. These workloads must operate within strict constraints—limited power, tight thermal envelopes, and automotive-grade reliability.

Monolithic system-on-chip (SoC) designs make it difficult to balance these competing demands. A single device must meet performance, cost, safety, and lifecycle requirements simultaneously, which introduces inefficiencies and limits flexibility. As a result, compute is no longer a component decision. It’s a system-level problem that affects how the entire vehicle is designed and evolves over time.

Moving toward heterogeneous and modular architectures

The industry is beginning to respond by shifting toward more flexible architectures.

Instead of integrating all functionality into a single chip, new designs increasingly rely on heterogeneous systems that combine multiple compute elements—CPUs, GPUs, and AI accelerators—working together. This approach allows different parts of the system to be optimized independently while still functioning as a unified platform.

More importantly, it enables alignment with real-world requirements. Safety-critical functions can rely on mature, well-understood technologies, while AI workloads can take advantage of leading-edge processing. Memory, connectivity, and I/O can be placed where they deliver the best efficiency.

This shift reflects a broader transition from optimizing individual components to designing systems that balance performance, cost, and lifecycle considerations.

This system-level evolution is already visible in current automotive compute platforms.

High-performance SoC families such as R‑Car illustrate how architectures are adapting to SDV requirements. These platforms bring together heterogeneous compute, safety capabilities, and efficient power management in a scalable framework that can be deployed across different vehicle domains.

They are designed not only for central compute in ADAS and autonomous applications, but also to integrate with zonal controllers and broader vehicle systems. This enables automakers to build platforms that can evolve over time, rather than redesigning from scratch for each new generation.

The key point is not peak performance alone. It’s the ability to deliver consistent, predictable behavior across a wide range of use cases and over long operational lifetimes.

Supporting diverse OEM strategies

The transition to software-defined vehicles is not uniform across the industry.

Some automakers are moving toward fully centralized architectures, while others are adopting hybrid or zonal approaches. Different strategies reflect different priorities, including cost structure, time-to-market, and control over software ecosystems.

This diversity requires flexibility. Suppliers must support multiple architectural paths and allow automakers to make trade-offs that fit their specific goals. An open, scalable approach becomes increasingly important as vehicles evolve from isolated products to connected, long-lifecycle platforms.

AI is accelerating the need for change

Artificial intelligence is amplifying these challenges.

Early automotive AI focused on discrete functions such as perception. Today, vehicles must handle multiple AI-driven workloads simultaneously, from sensor fusion to planning to in-cabin interactions. These systems must operate in real time while meeting strict safety requirements.

This shifts the focus away from simplified performance metrics toward broader system considerations. Latency, determinism, power efficiency, and data movement all become critical. Supporting AI at scale requires architectures that can orchestrate diverse workloads efficiently while maintaining predictable performance. This reinforces the need for heterogeneous, system-level design.

From products to platforms

In other words, as complexity increases, the industry is moving toward integrated platforms.

Automakers are no longer looking solely for components. They are looking for solutions that combine hardware, software, and development ecosystems in a way that reduces integration risk and accelerates deployment.

This shift reflects a broader change in the semiconductor industry—from delivering individual devices to enabling complete system solutions. And this transition to software-defined vehicles is a long-term shift that will unfold over the next decade.

What is already clear is that success will depend on the ability to design systems that balance long-term reliability with rapid innovation. This requires new thinking—not just in silicon, but in architecture, development processes, and ecosystem collaboration.

The industry is moving beyond optimizing individual parts. It’s designing vehicles as cohesive, adaptable systems. And compute sits at the center of that transformation.

Vivek Bhan is senior VP and GM of high-performance computing at Renesas Electronics.

Related Content

• SDVs: Big Picture and Challenges
• Why the Cloud Is Essential for SDV Development
• Unveiling the Transformation of Software-Defined Vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Taming the Increasing Complexity of the Software-Defined Vehicle

The post Rethinking automotive compute in the software-defined era appeared first on EDN.

Aehr Test Systems of Fremont, CA, USA — which provides solutions for testing, burning-in and stabilizing semiconductor devices in wafer-level, singulated die, and packaged-part form — has received an additional follow-on production order from its lead silicon photonics customer for a fully automated FOX-XP wafer-level burn-in (WLBI) system. The system will support high-volume production burn-in of silicon photonics devices used in AI optical interconnect and hyperscale data-center applications...

Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has received a new order from 3SP Technologies S.A.S. of Nozay, Essonne, France — a long-standing customer for more than 20 years — for an industrial passivation platform. The system is scheduled for delivery in 2027...

Found these in a old CRT TV and the second transistor does have a marking it just isnt visible on the photo submitted by /u/Remote_Air_6433 [link] [comments]

These are all my Tesla transistors I have a KU 611 with a CA mark, KFY 18 and a KF 506 submitted by /u/Remote_Air_6433 [link] [comments]

📈 КПІ ім. Ігоря Сікорського — серед лідерів української вищої освіти у Webometrics 2026 KPI4U-2 пт, 07/10/2026 - 10:26

Нові перемоги на ICOA 2026: як КПІ ім. Ігоря Сікорського готує кіберчемпіонів kpi пт, 07/10/2026 - 10:19

I like going through the electronics trash bins at my college, here's some stuff i found today. The second item is a speaker part, the ring is super magnetic it was a challenge to pry it apart! submitted by /u/SwabluOnACloud [link] [comments]

submitted by /u/OkParsley6142 [link] [comments]

Закріплення освітніх програм за структурними підрозділами університету kpi чт, 07/09/2026 - 17:20

📰 Газета "Київський політехнік" № 25-26 за 2026 (.pdf) Інформація КП чт, 07/09/2026 - 16:45