Feed aggregator

Pure-play 8-inch specialty foundry DB HiTek of Seoul, South Korea has completed reliability qualification for its 1200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers. This marks a step in its expansion into the 8-inch SiC foundry market. Building on completion of this qualification, DB HiTek plans to strengthen product development support for customers, secure new customers and accelerate preparations for volume production in 2027...

Altera now provides post-quantum cryptography (PQC) support for Agilex 3 and Agilex 5 FPGAs, helping strengthen system security. The FPGAs’ reprogrammable architecture enables designs to evolve as new threats emerge and security requirements and cryptographic standards change. The devices form a scalable platform for embedded and edge applications by combining performance and power efficiency.

PQC-enabled secure boot authenticates trusted device configurations while protecting long-life systems against future quantum-era threats. A Secure Device Manager (SDM) provides additional security capabilities, including bitstream encryption for IP, physical anti-tamper support, key management, physically unclonable function (PUF) keys, embedded cryptographic cores, and platform attestation.

The PQC-enabled Agilex 3 and Agilex 5 devices are shipping today. Quartus Prime Pro Edition 26.1.1 includes a PQC software flow that simplifies implementation of post-quantum security protections.

Agilex 3 product page

Agilex 5 product page

Altera

The post Altera brings quantum-resistant security to FPGAs appeared first on EDN.

Two 600-V MOSFETs from AOS come in top-side-cooled packages with co-optimized electrical and thermal paths to maximize power density. The AOGT037V60DE2 and AOGT060V60DE2 αMOS E2 Super Junction MOSFETs feature a built-in fast body diode for enhanced robustness and reduced Qrr in high-stress applications.

The AOGT037V60DE2 has a maximum RDS(ON) of 37 mΩ and typical Qg of 146 nC, both at a VGS of 10 V. For the AOGT060V60DE2, the corresponding ratings are 60 mΩ and 85 nC under the same conditions. Both devices provide strong avalanche capability and in-rush current handling with a wide safe operating area (SOA).

AOS combines the αMOS E2 silicon with its GTPAK package to improve thermal performance through a top-side cooling pad, while gull-wing leads enhance board-level reliability. The MOSFETs are designed to prevent self-turn-on for reliable operation under dynamic conditions. Typical applications include rectifiers, solar inverters, motor drives, and industrial power systems using boost PFC, totem-pole PFC, LLC resonant, PSFB, and cyclo-converter topologies.

The AOGT037V60DE2 (600 V, 37 mΩ) and AOGT060V60DE2 (600 V, 60 mΩ) are now available in production quantities with a lead time of 16 weeks. Respective prices are $6 and $3 in quantities of 1000 units.

Alpha & Omega Semiconductor

The post AOS boosts power density with 600-V MOSFETs appeared first on EDN.

A SerDes chipset from EverProX, under its Silicon Line brand, aggregates two simultaneous MIPI D-PHY camera streams, each at up to 10 Gbps, over serialized links. As the first entry in the Silicon Line MIPI Serial Data Link (MSDL) family, the MSDL 20G dual-port chipset extends MIPI D-PHY connectivity to tens of meters.

Comprising the SL8582x serializer and SL8581x deserializer, the chipset overcomes the bandwidth, EMI, and reach limitations of conventional MIPI D-PHY while consuming less than 100 mW per link. It enables low-power connectivity between high-resolution cameras, displays, and processors.

The MSDL 20G supports up to two simultaneous single- or stereo-camera transmissions over one or two serialized links. Integrated VCSEL drivers and a transimpedance amplifier (TIA) enable optical links over tens of meters, while differential copper links can extend up to 2 meters. Typical power consumption is 71 mW per optical link and 87 mW per electrical link, excluding the integrated sideband SerDes.

The MSDL 20G (SL8582x/SL8581x) is sampling now to early-access customers in bare-die or 4×4-mm µBGA-78 packages. Evaluation kits are available now for link validation.

Silicon Line

The post Dual-port MIPI D-PHY SerDes delivers 20-Gbps bandwidth appeared first on EDN.

Marelli and Microchip have announced a display connectivity solution that uses the open-standard ASA Motion Link (ASA-ML) to stream graphics and video from a vehicle’s central computer directly to automotive displays. The companies say the approach can simplify display architectures, reduce system costs, and give automakers greater sourcing flexibility for software-defined vehicles.

Microchip is extending its ASA-ML products from camera connectivity to automotive displays, with Marelli providing the display-side integration. The demonstration uses Microchip’s VS7000 ASA-ML chipset to process and transmit graphics and video generated by the vehicle’s central computer over a high-speed standardized link. Marelli configures and optimizes the ASA-ML deserializer to decode the video stream directly at the display, simplifying the display-side electronics.

The ASA-ML connection supports data rates up to 16 Gbps and incorporates link-layer authentication and encryption. The open standard also enables interoperability among products from multiple technology providers, giving automakers greater sourcing flexibility.

For more information about Microchip’s ASA-ML solutions, visit the ASA Motion Link product page.

Microchip Technology 

Marelli

The post Marelli, Microchip extend ASA-ML to displays appeared first on EDN.

SECO has developed a 5-in. industrial HMI panel and a compact SBC, both based on the Qualcomm Dragonwing IQ-2390 processor. The Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390 target industrial connected devices for HMI, control, vending, building automation, industrial vision, and other compact embedded applications.

With a quad-core CPU and 1.1-TOPS NPU, the Compact Vision 5 Dragonwing IQ-2390 is designed for applications requiring touch interaction, industrial reliability, and entry-level on-device AI. It integrates a 5-in. (800×480-pixel) touchscreen, 3D GPU, up to 4 GB of RAM, and 16 GB of eMMC storage in a 145.5×102.4×33.4-mm enclosure. The panel-mount unit supports Wi-Fi and Bluetooth and includes MIPI-DSI, RS-232, CAN, Gigabit Ethernet, and USB-C interfaces.

Aimed at custom embedded systems, the SBC-Dragonwing-IQ-2390 provides the same processing, memory, and connectivity as the Compact Vision 5 on a small 47×114-mm board. Both platforms run Clea OS, based on Yocto Linux, providing a software environment for development, deployment, and lifecycle management.

Register for the Early Access Program to receive information on evaluation options and next steps for the Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390.

SECO

The post SECO pairs Dragonwing with HMI and SBC appeared first on EDN.

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has added Tom Bawol as its new director of strategic sales & market development, and Lieutenant General Steve Smith to its Strategic Advisory Board in the role of strategic advisor...

submitted by /u/SpecialistRare832 [link] [comments]

Epiwafer and substrate maker IQE plc of Cardiff, Wales, UK has reported greater-than-expected revenue of £64.6m for first-half 2026, up 43% from £45.3m in first-half 2025, supported by strong demand across all of the firm’s core segments...

Someday, Somehow, I'll buy a solder. submitted by /u/Curious_Deal5981 [link] [comments]

Courtesy of this circuit’s flexibliity, you can select and adjust both, one, or none of the channels of a dual digipot.

One huge advantage that digital potentiometers have over electromechanicals is, of course, the inherent flexibility the electronic interface provides versus the mechanical alternative. Figure 1 shows an example.

Figure 1 The 256-step (8-bit) resolution, dual-channel DPOT U2 can be programmed up/down with single step-per-push or auto-repeat (button held), with operating mode options including channel X or Y alone per switch S2’s position on X or Y, both ganged together with S2 in X&Y, or setting-protected (where accidental button pushing won’t disturb the setting) with S1 in LOCK.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Dual tandom pots have certainly existed for a very long time, and are sometimes extremely useful. Adusting the volume on a stereo sound system, or tuning a two-pole filter, are obvious examples. But when mechanical pots share a common shaft, of course, they must turn in lockstep together forever, whether that suits the application at hand perfectly. Or not.

Figure 1’s circuit allows U2’s dual pots to step together, singly, or not at all as determined by simple switches S1 (SPST) and S2 (SPDT three position with center off). Convenient autorepeat is accessed by holding the desired step UP/DOWN button depressed for longer than a half second.

Which is certainly a step up in flexibility.

Stephen Woodward‘s relationship with EDN’s DI column goes back quite a long way. Over 200 submissions have been accepted since his first contribution back in 1974.  They have included best Design Idea of the year in 1974 and 2001.

Related Content

• Finger friendly DPOT pushbuttons do ups, downs, and dittos
• Push to increase, decrease a digital potentiometer
• Synthesize precision Dpot resistances that aren’t in the catalo
• Op-amp wipes out DPOT wiper resistance

The post Double DPOT programming: Parallel gang-up, singleton, or none appeared first on EDN.

I couldn’t find any decent DAC/amp combos locally, and importing one would cost a small fortune. After digging into DIY audio designs, I realized I could build one myself for a fraction of the cost and get around 80–90% of the performance of commercial units. Specs: Controller: ESP32-S3 acting as a USB Audio Class (UAC) device. DAC: PCM5102A breakout board fed via I2S. Power Supply: ±12V linear power supply Two NE5532 dual op-amps: Op-amp 1: Stereo buffer stage. Op-amp 2: Stereo gain stage (~3.1x gain). (Opted for this layout to keep wiring simple for my first major soldering project!) Volume Control: Couldn't source 10k dual-gang logarithmic pots locally, so I implemented software volume control with a rotary encoder. Layout: Everything wired to a single star ground point. Sound Impressions: It drives my Beyerdynamic DT 990 Pro (250 ohm) effortlessly. Going from my laptop's built-in jack to this is night and day—it feels like the headphones were practically starving before. Noise floor is pitch black silence with zero audible hum or hiss. Really happy with how this turned out for my first major electronics build. (Note: I’m currently out and forgot to take photos of the back of the amp perfboard, but I can upload solder-side pics once I'm back home if anyone wants to see them!) submitted by /u/supergamer1185 [link] [comments]

Вітаємо ректора КПІ Анатолія Мельниченка з входженням у топ-100 найвпливовіших українців за версією «Фокусу» KPI4U-2 ср, 09/09/2026 - 12:21

A new flash cost calculator helps OEMs identify potential savings and explore alternative storage strategies for flash chips at a time when market conditions are putting growing pressure on memory costs. The calculator reduces component costs by selecting flash capacity closer to what the product actually requires, rather than paying for oversized managed components.

According to Gartner, NAND flash prices are forecast to rise 234% in 2026 with a meaningful pricing relief not expected until late 2027. But much of the industry conversation has focused on supply constraints and component prices, noted Steffan Schumacher, CEO of Tuxera. “The more important question is what engineers can do in response.”

Source: Tuxera

Schumacher added that the opportunity isn’t simply to source a cheaper component today, but to design storage architectures that use flash more efficiently and give manufacturers more choice as costs, availability, and technology inevitably change again. Here, Tuxera’s flash cost calculator gives OEMs greater flexibility in how they design and manage embedded storage.

In other words, the calculator increases sourcing flexibility by opening a wider choice of supported raw flash parts and vendors. It also reduces dependence on a single component roadmap. For instance, a product may need only 4 GB of storage, but manufacturers can face increasingly limited choices at lower eMMC capacities.

If the required capacity is no longer available, OEMs may be forced to move to a significantly higher-capacity alternative, potentially paying for far more storage than the product actually needs. Here, the calculator enables OEMs to move from managed flash such as eMMC to raw NAND. “Manufacturers cannot control NAND prices, component availability or suppliers’ product roadmaps, but they can build greater flexibility into how they use flash,” Schumacher said.

This design flexibility is crucial for manufacturers of automotive electronic control units (ECUs) and zone control units (ZCUs), smart meters, industrial equipment, and medical devices, where the impact comes not only from higher flash prices but also from the capacity options available to them. NAND flash prices and sourcing pressures are also likely to rise in edge AI and physical AI designs because devices will demand more storage and data infrastructure.

This is how the calculator works. OEMs can enter their required capacity, annual production volumes, and production lifetime to estimate potential savings, for instance, from moving from managed flash to right-sized raw flash. Moreover, they can enter their own supplier pricing to reflect their individual purchasing agreements.

The flash cost calculator is available now at Tuxera.com/flash-cost-calculator.

Related Content

• AI Triggers a New Memory Super Cycle
• NOR Flash Next in AI-Driven Memory Crunch
• Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads
• Flash vendors show pricing restraint in surging market
• The Truth About Memory Supply, Pricing and What Comes Next

The post Flash calculator promising cost savings, design flexibility appeared first on EDN.

In a significant addition to India’s growing portfolio of home-grown enterprise intellectual property, Novac Technology Solutions, a distinguished leader in technology and AI solutions, has secured an Indian patent for its proprietary innovation, “System and Method for Managing a Project by Integrating Set of Modules” (Patent No. 595218). Designed and developed in India, the platform addresses one of the software industry’s most persistent challenges: fragmented project execution, highlighting the country’s growing role in creating globally relevant enterprise technologies through indigenous engineering and innovation.

Granted by the Indian Patent Office under the Controller General of Patents, Designs and Trade Marks (CGPDTM), the patent provides protection for Novac’s patented invention to enterprise software delivery. The innovation brings together every critical stage of the software development lifecycle, including project estimation, scheduling, project reviews, testing, defect tracking and maintenance, into a unified platform that enables organisations to manage software projects through a connected ecosystem rather than disconnected tools and workflows.

As software development becomes increasingly complex, organisations often rely on multiple tools to manage project estimation, planning, scheduling, testing and maintenance. While each serves a specific purpose, disconnected systems often result in fragmented workflows, manual coordination, inconsistent tracking and limited visibility across teams. Novac’s patented innovation addresses this challenge by integrating the key stages of software project management into a single integrated platform, enabling integrated information flow, stronger collaboration and a unified view of project execution.

A key differentiator of the patented platform is its dynamic scheduling and task-dependency management capability, which automatically updates interconnected tasks whenever changes are made to lower-level activities. This reduces manual intervention, improves planning accuracy and helps organisations improve resource utilisation while adapting to changing project requirements. The platform also integrates testing, defect management and project reviews, providing end-to-end traceability, better governance and timely insights that enable better-informed decision-making throughout the software delivery lifecycle.

Speaking about the patent, Mr. N.S Nanda Kishore, Managing Director & CEO, Novac Technology Solutions said, “Software engineering is becoming increasingly interconnected, yet many organisations continue to manage complex projects through disconnected systems and fragmented workflows. The future of enterprise software delivery lies in creating intelligent ecosystems that connect every stage of the development lifecycle, enabling greater visibility, seamless collaboration and informed decision-making. This patented solution reflects Novac’s continued commitment to engineering innovation by bringing an integrated approach to software project management.”

The patent marks an important milestone in Novac’s innovation journey and further strengthens its intellectual property portfolio. More broadly, it reflects the evolution of India’s technology ecosystem, where companies are increasingly creating proprietary enterprise technologies alongside delivering world-class technology services. As organisations worldwide continue to modernise software engineering and digital operations, innovations developed in India are playing an increasingly important role in shaping the future of enterprise technology.

The post Novac Technology Solutions Secures Indian Patent for Home-grown Innovation Transforming Enterprise Software Delivery appeared first on ELE Times.

Critical Manufacturing, the Industrial Operations Platform company that unites execution, connectivity, analytics and trusted AI, will exhibit at SEMICON India from September 17–19, demonstrating how semiconductor manufacturers can establish connected, data-driven operations that support intelligent production.

Exhibiting in collaboration with ASMPT, Critical Manufacturing will bring its vision of the factory of the future to life, showing how manufacturers can transform operational complexity into actionable intelligence through a unified platform.

India is moving from semiconductor ambition towards ecosystem development, with investment spanning fabrication, compound semiconductors, assembly and testing, advanced packaging and chip design. As new manufacturing capacity is established, companies will need to build digital production foundations that can support quality, traceability and coordination from the outset.

From execution to intelligence

At SEMICON India, Critical Manufacturing will demonstrate how its Industrial Operations Platform extends beyond traditional Manufacturing Execution Systems (MES). MES acts as the execution core within a broader platform that continuously connects production data, analytics and AI, enabling a closed-loop system where insights are generated and acted upon in real time.

For manufacturers developing new semiconductor operations, decisions made at an early stage can shape production performance for years to come. Establishing consistent processes, data structures and traceability from the beginning helps prevent fragmented systems from developing as facilities, product portfolios and production volumes grow.

The platform captures data at source, structures it across equipment, systems and sites, and provides the operational context needed to support informed decisions. This gives manufacturers a foundation that can scale with their operations while maintaining control over quality and production processes.

Experience the Factory of the Future

Visitors will be invited to “step into the factory of the future” through live demonstrations showing how machines, processes and data can be connected across the shopfloor.

The demonstration will highlight how real-time information flows between equipment and manufacturing systems, helping teams understand relationships between process conditions and production outcomes. This supports a shift from reacting to problems towards anticipating and addressing issues before they affect quality, output or delivery.

Together, these capabilities reflect the industry’s transition from digital transformation to intelligence-driven operations. By incorporating connectivity and manufacturing intelligence from the beginning, manufacturers can support continuous learning and improvement while avoiding isolated systems that later become difficult and costly to integrate.

“India has an important opportunity to build modern semiconductor operations without being constrained by the fragmented legacy systems found in many established manufacturing environments,” said Weng Keong Lan, Managing Director of Critical Manufacturing Malaysia, responsible for India’s Go-to-Market. “As new facilities and capabilities are developed, manufacturers can put the right execution, connectivity and data foundations in place from the outset rather than attempting to integrate them later.”

AI copilots for smarter decision-making

A key feature of the demonstration will be Critical Manufacturing’s AI Copilots, embedded directly within the MES environment. The copilots enable users to interact with manufacturing data using natural language and generate dashboards, charts and insights without complex queries or specialist expertise.

By making production information easier to access and interpret, AI Copilots can help engineers, operators and decision makers investigate changing conditions, identify trends and respond with greater confidence.

A joint approach with ASMPT

The joint presence with ASMPT reinforces the importance of considering manufacturing equipment and software as part of one coordinated production environment. Closely connected equipment and software ecosystems can provide greater coordination, control and performance across the production lifecycle.

Lan added, “At SEMICON India, we will demonstrate how a unified Industrial Operations Platform can help manufacturers standardise processes, establish end-to-end traceability and maintain control as production scales. Building these capabilities early will be essential if India’s growing semiconductor ecosystem is to translate investment into reliable, high-quality manufacturing.”

Experience the platform in action

Visitors to SEMICON India 2026 can experience live demonstrations at the ASMPT booth 1346, where Critical Manufacturing experts will showcase how the Industrial Operations Platform supports connected and intelligent semiconductor manufacturing.

Attendees are invited to explore how the platform can help manufacturers establish scalable operations, maintain production traceability and manage increasing complexity as facilities and output grow.

The post Critical Manufacturing to Showcase MES-Powered Industrial Operations Platform for Intelligent Semiconductor Manufacturing at SEMICON India 2026 appeared first on ELE Times.

The demand for low-voltage clock drivers continues to grow with the rapid adoption of advanced FinFET process nodes used in high-performance FPGAs, SoCs, AI accelerators and next-generation CPUs. Printed circuit board designers face increasing challenges due to the limited availability of standard 1.2V LVCMOS clock buffers and level-translating buffers capable of converting higher-voltage clock signals to the lower-voltage levels required by these advanced devices. Conventional approaches that rely on discrete components and voltage-divider techniques can compromise signal integrity and clock duty cycle accuracy while increasing board complexity and component count.

Microchip Technology has introduced the SY757xx family, a comprehensive portfolio of 1.2V-output LVCMOS clock buffers, designed to address these challenges. The new devices simplify system design by eliminating the need for traditional discrete component implementations while delivering ultra-low additive jitter performance. To provide flexibility for supporting legacy board power supplies and different clock-source voltage levels, the devices support a broad range of supply voltage (VDD) and a wide operating frequency range. The SY757xx family enables ultra-low additive jitter clock distribution while maintaining the high clock resolution and signal integrity required for today’s high-speed FPGA, SoC and CPU platforms.

“Our SY757xx family of clock buffers helps customers overcome the growing clock distribution challenges associated with next generation high-performance FPGA, SoC and CPU platforms,” said Maamoun Abou Seido, appointed vice president of Microchip’s timing and communications business unit. “By combining ultra-low additive jitter performance with broad VDD and wide frequency support in a single-chip solution, the SY757xx devices simplify board design, reduce component count and help customers maintain the signal integrity and timing accuracy required in today’s high-performance computing applications.”

Microchip’s SY757xx family strengthens the clock buffer’s role as a critically important SoC and FPGA interface for clock distribution and clock fanout functionality in application platforms where signal integrity is paramount. These platforms demand high-speed parallel processing, hardware reconfigurability, low latency and efficient real-time computing. These capabilities are required for applications ranging from embedded vision and video processing to AI/ML acceleration, industrial control and IoT, networking and communications, and signal processing and embedded systems.

Launching three products in production and eight that are sampling in limited volumes, the family spans a wide array of configurations in three space-saving packaging options. The devices protect against clock distortion across a 0 Hz to 250 MHz frequency spectrum while also offering a broad range of power supply input and output options across the 1.2V to 3.3V voltage-translation input range. This includes a single-chip option that reliably interconnects 3.3V components to FPGAs and SoCs with a 1.2V clock signal requirement. Additive jitter is as low as 26 femtoseconds (fs).

Compared to traditional discrete component solutions for these FPGA and SoC applications, the Microchip buffers simplify design and reduce bill-of-materials costs while helping to optimize AC coupling and biasing and maintain signal integrity. Voltage dividers using discrete components may not provide adequate design margin and can degrade signal integrity by causing duty-cycle distortion.

Microchip clock buffers complement the company’s comprehensive range of flash-based FPGAs and SoC FPGAs spanning ultra low density to mid-range density devices. These and other Microchip products that range from microcontrollers and analog components to power management, timing, connectivity and memory devices are pre-engineered and validated to enable a simplified, lower-risk and more holistic approach to system design.

The post Microchip’s 1.2V Clock Buffers Link Latest SoCs and FPGAs with Higher Voltage Components appeared first on ELE Times.

India is one of the favourite destinations for international tourists, but security concerns often curtail the opportunities and growth prospects. The Indian tourism sector needs to tap this opportunity by sprucing up its act with adequate security measures and adoption of the latest security technologies to assure the large pool of tourists travelling to India’s popular tourist destinations.

When planning a security strategy for the tourism sector, one needs to understand the key challenges and threats that exist in India’s vast tourism sector. The Indian tourism sector includes popular tourist destinations, national monuments and cultural heritage sites. Religious tourism offers diverse options for tourists; there are many world-famous places of worship in India that attract millions of visitors from around the world. India offers a wealth of opportunities for religious tourism, attracting millions of pilgrims and spiritual seekers from around the world.

Tourism Security Challenges

Tourism in India faces several security challenges that can impact both domestic and international travelers. Here are some of the key issues:

Safety and Security: Concerns about the safety of tourists, especially women, have been prominent. Incidents of theft, harassment, and even violence have been reported, which can deter potential visitors.

Infrastructure: Inadequate infrastructure, including poor transportation and healthcare facilities, can pose risks to tourists. This includes issues like unsafe roads and lack of emergency medical services.

Environmental Degradation: Overcrowding and lack of proper waste management at popular tourist spots can lead to environmental degradation, which not only affects the natural beauty but also poses health risks.

Regulatory Challenges: The tourism sector often faces regulatory hurdles, including complex visa processes and inconsistent enforcement of safety regulations.

Human Resources: There is a shortage of skilled manpower in the tourism and hospitality sectors, which can affect the quality of services and safety measures available to tourists.

Security & Safety Awareness: Insufficient media promotion about tourism security and safety awareness protocols and guidelines lead to uncertainity and misinformation among tourists.

Addressing these challenges requires coordinated efforts from the government, private sector, and local communities to ensure a safe and enjoyable experience for all tourists.

How Security Solutions Can Help the Tourism Sector

Advanced video security solutions can significantly enhance the safety and security of tourists in several ways:

Video Security and Monitoring: High-definition cameras installed at key tourist spots, hotels, and public transport hubs can monitor activity in real time. This helps quickly identify and respond to any suspicious behaviour or incidents.

Crime Deterrence: The presence of visible security cameras can deter potential criminals. Knowing they are being watched reduces the likelihood of theft, vandalism, and other crimes.

Incident Response: In the event of an incident, video footage can provide crucial evidence to law enforcement agencies. This helps in the swift resolution of cases and enhances the overall sense of security.

Crowd Management: Video analytics can help manage large crowds at popular tourist destinations. By analysing foot traffic patterns, authorities can prevent overcrowding and ensure smooth movement of people, reducing the risk of accidents.

Emergency Situations: In emergencies, such as natural disasters or terrorist attacks, video security can provide real-time information to emergency responders, helping them to coordinate their efforts more effectively.

Enhanced Visitor Experience: By ensuring a safe environment, video security solutions can enhance the overall visitor experience. Tourists are more likely to enjoy their stay and recommend the destination to others if they feel secure. Implementing these solutions requires collaboration among local authorities, private-sector stakeholders, and technology providers to create a comprehensive security network that prioritises the safety and well-being of tourists. Places of worship face several unique security challenges, balancing the need to be open and welcoming with the necessity of ensuring safety. Here are some of the key challenges:

Open Access: Places of worship are designed to be open and accessible to everyone, which can make it difficult to control who enters and exits the premises.

Vandalism and Theft: These locations can be targets for vandalism and theft, especially if they house valuable artefacts or donations.

Violence and Terrorism: Unfortunately, places of worship can be targets for violent attacks, including hate crimes and terrorism. Ensuring the safety of congregants during services and events is a significant concern.

Cybersecurity: With the increasing use of digital systems for managing operations and communications, places of worship are also vulnerable to cyberattacks. This includes threats like ransomware, data breaches, and online harassment.

Emergency Preparedness: Many places of worship may lack comprehensive emergency response plans. This includes preparedness for natural disasters, medical emergencies, and other unexpected incidents.

Addressing these challenges requires a holistic approach that includes physical security measures, community engagement, and emergency preparedness planning. Collaboration with local law enforcement and security experts can also enhance the safety and security of these important community spaces.

Securing Places of Worship: Installing video security cameras and security systems can significantly enhance safety and provide peace of mind for devotees. By implementing these measures, places of worship can create a secure environment that allows congregants to focus on their spiritual activities without safety concerns.

Protecting Cultural Heritage Sites: It requires a combination of advanced security systems and thoughtful planning to preserve their historical and aesthetic value. By combining advanced security measures, cultural heritage sites can be effectively protected while maintaining their historical integrity and ensuring a safe and enjoyable experience for visitors.

PRAMA Solutions Secure Tourist Locations & Tourists

PRAMA offers advanced Security  Solutions for Tourism, Cultural Heritage Sites and Religious Places. PRAMA offers a range of specialised security solutions tailored for tourism, cultural heritage sites, and religious places.

Here are some of the  key offerings for the tourism sector:

Smart Video Security Systems: These include advanced CCTV cameras with AI capabilities for real-time monitoring and threat detection. The systems are designed to ensure the safety of tourists and protect valuable cultural assets.

Integrated Remote Monitoring Intrusion Solutions (IRMIS): This solution enables centralised monitoring across multiple sites, providing a comprehensive security overview and rapid response capabilities.

AI Sense Solutions: Utilising artificial intelligence, these solutions enhance security by identifying potential threats and unusual activity, enabling proactive measures.

Advanced Traffic Management Systems (ATMS): These systems help manage and monitor traffic around tourist sites and religious places, ensuring smooth and secure access for visitors.

Specialised Temple Solutions: Tailored for religious places, these solutions include high-definition cameras and access control systems to manage large crowds and ensure devotees’ safety. PRAMA India’s solutions are designed to provide robust security while maintaining the sanctity and accessibility of cultural and religious sites.

The post PRAMA’s Tourism Security Solutions Helps Secure Tourists and Tourist Sites appeared first on ELE Times.

Murata Manufacturing Co., Ltd. has expanded the line-up of its automotive-grade metal power inductors in the DFE2MCPH_JL series by adding nine new inductance values. This expanded line-up enables broader support for the diverse circuit design requirements of automotive power circuits used in advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and other automotive electronic equipment. Mass production has already begun.

In recent years, the increasing performance and functionality of ADAS and IVI systems have driven demand for automotive power circuits that are smaller, more efficient, and lower in power loss. At the same time, increasingly diverse power supply requirements across different applications have created the need for a wider range of inductance values, allowing designers to select the most suitable inductor for each power circuit.

To address these market requirements, Murata has added nine new inductance options to the DFE2MCPH_JL series. Despite their compact 0806-inch (2.0 × 1.6 mm) package, the new inductors achieve low DC resistance, high current capability, and 40 V withstand voltage. They are also compliant with the AEC-Q200 automotive qualification standard, making them well suited for power circuits used in increasingly sophisticated automotive electronics, including ADAS and IVI systems. By expanding the available inductance range, Murata enables designers to select the optimum inductance value according to application and power supply requirements, thereby improving design flexibility for automotive power circuits.

Murata will continue expanding its line-up of automotive-grade power inductors to meet evolving market needs and contribute to further advances in vehicle performance, functionality, and electrification.

≪DFE2MCPH_JL Seres Specifications≫

Category	Part Number	Inducta-nce Nomina l value (μH)	Tolerance	DC Resistance (Ω) Max	Typ.	Related current (mA) Based on Inductance Change Max.	Typ.	Based on temperature Rise Max.	Typ.
New	DFE2MCPHR10MJLL Q	0.10	±20％	0.01 0	0.00 7	11100	13900	7500	9400
New	DFE2MCPHR15MJLL Q	0.15	±20％	0.01 2	0.00 9	8400	10500	6500	8200
New	DFE2MCPHR22MJLL Q	0.22	±20％	0.01 5	0.01 2	8200	10200	5600	7000
Existing	DFE2MCPHR33MJLL Q	0.33	±20％	0.01 8	0.01 4	6900	8100	5100	6400
Existing	DFE2MCPHR47MJLL Q	0.47	±20％	0.02 2	0.01 9	5400	6300	4400	5500
New	DFE2MCPHR68MJLL Q	0.68	±20％	0.04 0	0.03 1	4400	5500	3400	4200
New	DFE2MCPH1R0MJLL Q	1.0	±20％	0.04 8	0.04 1	3900	4900	2900	3700
New	DFE2MCPH1R5MJLL Q	1.5	±20％	0.08 0	0.06 7	3100	3900	2300	2800
New	DFE2MCPH2R2MJLL Q	2.2	±20％	0.12 0	0.10 5	2600	3300	1800	2200
New	DFE2MCPH3R3MJLL Q	3.3	±20％	0.23 0	0.19 0	2000	2500	1300	1600
New	DFE2MCPH4R7MJLL Q	4.7	±20％	0.36 0	0.30 0	1600	2000	1000	1200

 

The post Murata Expands Automotive-Grade Metal Power Inductor Line-up with Nine New Inductance Values appeared first on ELE Times.

OKW’s award-winning CONTROL-KNOBS for rotary potentiometers and encoders can now be specified customized and ‘production line ready’.

These ergonomic knobs, which won an iF DESIGN AWARD, are ideal for touch/click functions on menu-driven interfaces. Applications include measurement and control, medical/wellness, laboratory equipment, HVAC, communications, building control systems and Smart Factory technology.

CONTROL-KNOBS can now be specified custom machined and printed with legends, logos and graphics. OKW can also supply the knobs with laser marking – perfect for consecutive numbering or machine-readable QR codes, bar codes and DataMatrix codes. Other customization services include installation/assembly of accessories.

These ergonomic collet knobs combine a robust polycarbonate inner body with a soft-touch TPE outer shell for anti-slip operation. Functional grooves on the edge ensure a good grip.

CONTROL-KNOBS for rotary potentiometers and encoders (Source: OKW Enclosures Inc.)

CONTROL-KNOBS can be specified (as standard) with or without a pointer line on the side for fine scaling. Optional LED illumination and a translucent optic ring enable operation in low light conditions and further enhance the aesthetics. Energy-saving (5 V) SMD RGB LEDs allow individual illumination and colors.

The knobs are available in two diameters, ø36 mm and ø46 mm – both for 6 mm, 1/4″ boreholes – and in two standard colors: nero and volcano. Top covers and bases (accessories) can also be specified in these colors. Accessories also include round nuts and a spanner.

The minimum component specification for one CONTROL-KNOB without illumination is a knob and cover; a base can be added if required. A base and illumination kit (accessory) are essential for the LED backlit version. On request, OKW can supply the knobs with accessories pre-assembled.

For more information, view the OKW website: https://www.okwenclosures.com/en/Potentiometer-Tuning-knobs/Control-Knobs.htm

The post Control knobs are customizable and production-ready appeared first on EDN.