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Introducing Open-Schematics: largest public hardware schematic dataset, paired with images. submitted by /u/themoonbender [link] [comments]

Aerospace, Defense & security firm Leonardo S.p.A. of Rome, Italy has announced a major step forward in the development and implementation of the Michelangelo Dome advanced integrated defence system technology enablers, signing a contract with Italy-based TELEDIFE (Direzione Informatica Telematica e Tecnologie Avanzate) for the development and delivery of four next-generation radars, designed to counter long-range ballistic threats (3000km)...

Omnivision’s OP03021 liquid crystal on silicon (LCOS) panel integrates the display array, driver, and memory into a low-power, single-chip design. The full-color microdisplay delivers a resolution of 1632×1536 pixels at 90 Hz in a compact 0.26-in. optical format, enabling smart glasses to achieve higher resolution and a wider field of view.

The microdisplay features a 3.0-µm pixel pitch and operates with a 90-Hz field-sequential input using a MIPI C-PHY trio interface. Panel dimensions are just 7.986×25.3×2.116 mm, saving board space in wearables such as augmented reality (AR), extended reality (XR), and mixed-reality (MR) smart glasses and head-mounted displays.

The OP03021 is offered in a compact 30-pin FPCA package. Samples are available now, with mass production scheduled to begin in the first half of 2026. For more information, contact a sales representative here.

OP03021 product page

Omnivision

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Voyant has announced the Helium family of fully solid-state 4D FMCW LiDAR sensors and modules for simultaneous depth and velocity measurement. Based on a proprietary silicon photonic chip, the platform provides scalable sensing and high-resolution point-cloud data.

Helium employs a dense 2D photonic focal plane array with integrated 2D on-chip beam steering, enabling fully electronic scanning. A 2D array of surface emitters implements FMCW operation in a compact, solid-state architecture with no moving parts.

Key advantages of Helium include:

• Configurable planar array resolution: 12,000–100,000 pixels
• FMCW operation with per-pixel radial velocity measurement
• Software-defined LiDAR enabling adaptive scan patterns and regions of interest
• Ultra-compact form factor: <150 g mass, <50 cm³ volume

Helium sensors and modules will be available in multiple resolution and range configurations, supporting FoVs ranging from up to 180° wide to narrow long-range optics.

Voyant is offering early access to Helium for collaborators to explore custom chip resolutions, FoVs, module configurations, multi-sensor fusion, and software-defined scanning. To participate or request more information, contact earlyaccess@voyantphotonics.com.

Helium product page 

Voyant Photonics

The post FMCW LiDAR delivers 4D point clouds appeared first on EDN.

Diodes has expanded its series of automotive-compliant bipolar transistors with 12 NPN and PNP devices designed to achieve ultra-low VCE(sat). With a saturation voltage of just 17 mV at 1 A and on-resistance as low as 12 mΩ, the DXTN/P 78Q and 80Q series minimize conduction losses by up to 50% versus previous generations, enabling cooler operation and easier thermal management.

The transistors feature collector-emitter voltage ratings (BVCEO) of 30 V, 60 V, and 100 V, and can handle continuous currents up to 10 A (20 A peak), making them suitable for 12‑V, 24‑V, and 48‑V automotive systems. They can be used for gate driving MOSFETs and IGBTs, power line and load switching, low-dropout voltage regulation, DC/DC conversion, and driving motors, solenoids, relays, and actuators.

Rated for continuous operation up to +175°C and offering high ESD robustness (HBM 4 kV, CDM 1 kV), the devices ensure reliable performance in harsh automotive environments. Housed in a compact 3.3×3.3-mm PowerDI3333-8 package, they reduce PCB footprint by up to 75% versus SOT223, while a large underside heatsink delivers low thermal resistance of 4.2°C/W.

The DXTN/P 78Q series is priced from $0.19 to $0.21, while the DXTN/P 80Q series is priced from $0.20 to $0.22, both in 6000-piece quantities. Access product pages and datasheets here.

Diodes

The post Bipolar transistors cut conduction voltage appeared first on EDN.

Samsung Electro-Mechanics’ CL32C333JIV1PN# high-voltage MLCC is designed for use in CLLC resonant converters targeting xEV applications such as BEVs and PHEVs. The capacitor provides 33 nF at 1000 V in a compact 1210 (3.2×2.5 mm) package, leveraging a C0G dielectric for high stability.

Maintaining capacitance across –55°C to +125°C with minimal sensitivity to temperature and bias, the device is well suited for high-frequency resonant tanks where electrical consistency directly impacts efficiency and control margin. The surface-mount capacitor enables power electronics designers to reduce component count and footprint in high-voltage CLLC resonant converter designs without compromising reliability.

Alongside the CL32C333JIV1PN#, the company offers two additional 1210-size C0G capacitors. The CL32C103JXV3PN# provides 10 nF at 1250 V, while the CL32C223JIV3PN# provides 22 nF at 1000 V. All three devices are manufactured using proprietary fine-particle ceramic and electrode materials, combined with precision stacking processes, and are optimized for EV charging systems.

The CL32C333JIV1PN#, CL32C103JXV3PN#, and CL32C223JIV3PN# are now in mass production.

Samsung Electro-Mechanics 

The post MLCC powers efficient xEV resonant circuits appeared first on EDN.

Nordic Semiconductor’s nRF9151 SMA Development Kit (DK) helps engineers build cellular IoT, DECT NR+, and non-terrestrial network (NTN) applications. The kit’s onboard nRF9152 SiP module now features updated modem firmware that enables direct-to-satellite IoT connectivity, adding support for NB-IoT NTN in 3GPP Release 17. The firmware also supports terrestrial LTE-M and NB-IoT networks, along with GNSS.

By replacing internal antennas with SMA connectors, the development board allows direct connection to lab equipment or external antennas for precise RF characterization, power measurements, and field testing. Based on an Arduino Uno–compatible form factor, the board features four user-programmable LEDs, four user-programmable buttons, a Segger J-Link OB debugger, a UART interface via a VCOM port, and a USB connection for debugging, programming, and power.

To accelerate prototyping, the DK includes Taoglas antennas for LTE, NTN, and NR+, along with a Kyocera GNSS antenna. It also provides IoT SIM cards and trial data, enabling immediate terrestrial and satellite connectivity through Deutsche Telekom, Onomondo, and Monogoto.

The nRF9151 SMA DK is available now from Nordic’s distribution partners, including DigiKey, Braemac, and Rutronik. The alpha modem firmware can be downloaded free of charge from the product page linked below.

nRF9151 SMA DK product page 

Nordic Semiconductor 

The post Dev kit brings satellite connectivity to IoT appeared first on EDN.

Lumileds of Eindhoven, The Netherlands says that its Versat 2016 is designed to address the necessary illumination specifications, reduce the engineering complexity and support the economic requirements for the growing segment of animated, personalized car-body lighting. With LUXEON Versat 2016 singular optical elements, backlit optical surfaces and 3D illuminated structures can all be successfully addressed, ushering in the expansion of car illumination beyond traditional signaling into styling and communication lighting...

Electronics design engineers spend substantial effort on schematics, simulation, and layout. Yet, a component’s long-term success also depends on how well its physical form aligns with downstream mechanical manufacturing processes.

When mechanical design for manufacturing (DFM) is treated as an afterthought, teams can face tooling changes, line stoppages, and field failures that consume the budget and schedule. Building mechanical constraints into design decisions from the outset helps ensure that a concept can transition smoothly from prototype to production without surprises.

The evolving electronic prototyping landscape

Traditional rigid breadboards and perfboards still have value, but they often fall short when a device must conform to curved housings of wearable formats. Engineers who prototype only on flat, rigid platforms may validate electrical behavior while missing mechanical interactions such as strain, connector access, and housing interface.

Scientists are responding with prototype approaches that behave more like the eventual product. For example, MIT researchers, who developed the flexible breadboard called FlexBoard, tested the material by bending it 1,000 times and found it to be fully functional even after repeated deformation.

This bidirectional flexibility allowed the platform to wrap around curved surfaces. It also gave designers a more realistic way to evaluate electronics for wearables, robotics and embedded sensing, where hardware rarely follows a simple planar shape. As these flexible platforms mature, they encourage engineers to think of mechanical behavior not as a late-stage limitation but as a design parameter from the very first version.

Integrating mechanical processes in design

Once a prototype proves the concept, the conversation quickly shifts toward how each part will be manufactured at scale. At this stage, the schematic on paper must reconcile with press stroke limits, tool access, wall thickness, and fixturing. Designing components with specific processes in mind reduces the risk of discovering later that geometry cannot be produced within the budget or timeline.

Precision metal stamping

Metal stamping remains a core process for electrical contacts, terminals, EMI shields, and mini brackets. It excels when parts repeat across high volumes and require consistent form and dimensional control.

A key example is progressive stamping, in which a coil of metal advances through a die set, where multiple stations perform operations in rapid sequence. It strings steps together, so finished features emerge with high repeatability and narrow dimensional spread, making the process suitable for high-volume component manufacturing.

Early collaboration with stamping specialists is beneficial. Material thickness, bend radii, burr direction, and grain orientation all influence tool design and reliability. Features such as stress-relief notches or coined contact areas can often be integrated into the strip layout with little marginal cost once they are considered before the tool is built.

CNC machining

CNC machining often becomes the preferred option where only a few pieces are necessary or shapes are more complicated. It supports complex 3D forms, small production runs, and late-stage changes with fewer up-front tooling costs compared to stamping.

Machined aluminum or copper heatsinks, custom connector housings, and precision mounting blocks are common examples. Designers who plan for machining will benefit from consistent wall thicknesses, accessible tool paths, and tolerances that fit the machine’s capability.

Advanced materials for component durability

The manufacturing method is only part of the process. The base material choice can determine whether a design survives thermal cycles, vibrations, and electrostatic exposure over years of service. Recent work in advanced and responsive materials provides design teams with additional tools to manage these threats. Self-healing polymers and composites are notable examples.

Some of these materials incorporate conductive fillers that redirect electrostatic charge. By steering current away from a single microscopic region, the structure avoids excessive local stress and preserves its functionality for a longer period. For applications such as wearables and portable electronics, this behavior can support longer service intervals and a greater perceived quality.

Engineers are also evaluating high-temperature polymers, filled elastomers, and nanoengineered coatings for use in flexible and stretchable electronics. Each material brings trade-offs in cost, process compatibility, recyclability, and performance. Considering those alongside mechanical processes and board layout helps establish a coherent path from prototype through volume production.

The next generation of electronic products demands a perspective that merges circuit behavior with how parts will be formed, assembled, and protected in real-world environments. Flexible prototyping platforms, process-aware designs for stamping and machining, and careful selection of advanced materials all contribute to this mindset.

When mechanical manufacturing is considered from the get-go, design teams position their work to run reliably on production lines and in the hands of end users.

Ellie Gabel is a freelance writer and associate editor at Revolutionized.

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• A PCB Design Tool That Mechanical Engineers Will Love
• Design considerations for harsh environment embedded systems
• Mechanical Design Proving Beastly for EEs Who Deal in Bits & Bytes

The post Electronic design with mechanical manufacturing in mind appeared first on EDN.

To further strengthen its strategic and technological leadership as it advances its semiconductor innovation roadmap, Sweden-based AlixLabs AB (which was spun off from Lund University in 2019) has appointed Arthur van der Poel to its advisory board...

Engineers and technicians who work with oscilloscopes are used to seeing waveforms that plot a voltage versus time. Almost all oscilloscopes these days include the Fast Fourier Transform (FFT) to view the acquired waveform in the frequency domain, similar to a spectrum analyzer.

In the frequency domain, the waveforms plot amplitude versus frequency. This view of the signal uses a different scaling. The default vertical scaling of the frequency domain is dBm, or decibels relative to one milliwatt, as shown in Figure 1.

Figure 1 An oscilloscope’s spectrum display (lower grid) uses default vertical units of dBm to display power versus frequency. (Source: Art Pini)

The FFT displays the signal’s frequency spectrum as either power or voltage versus frequency. The default dBm scale measures signal power; alternative units include voltage-based magnitude. In its various forms, the decibel has long confused well-trained technical professionals accustomed to the time domain.  If dB is a mystery to you, this article covers the basics you need to know.

The dB was originally a measure of relative power in telephone systems. The unit of measure was named the Bel after Alexander Graham Bell.  The decibel (dB) is one-tenth of a Bel and is more commonly used in practice. The definition of the decibel is for electrical applications:

dB = 10 log10 (P2/P1)

Where P1 and P2 are the two power levels being compared.

There are a few key points to note. The first is that the dB is a relative measurement; it measures the ratio of two power levels, P1 and P2, in this example. The second thing is that the dB scale is logarithmic.  The log scale is non-linear, emphasizing low-amplitude signals and compressing higher-amplitude signals. This scaling is particularly useful in the frequency domain, where signals tend to exhibit large dynamic ranges.

Based on this definition, some common power ratios and their equivalent dB values are shown in Table 1.

P2/P1	dB
2:1	3
4:1	6
10:1	10
100:1	20
1:2	-3
1:4	-6
1:10	-10
1:100	-20

Table 1 Common power ratios and the equivalent decibel values. (Source: Art Pini)

The decibel can also compare root power levels, such as the volt.  The definition of the decibel for voltage ratios derived from the definition for power ratios is:

dB = 10 [Log10 (V22/R)/(V12/R)]
= 10 Log10 (V2/V1)2
= 20 log10 (V2/V1)

Where V1 and V2 are the two voltage levels being compared, and R is the terminating resistance.

This derivation utilizes the fact that exponentiation in a logarithm is equivalent to multiplication. The variable R, the terminating resistance (usually 50 Ω), is canceled in the math but still can affect decibel measurements when different resistance values are involved

The voltage-based definition of dB yields the following dB values for these voltage ratios, as shown in Table 2. 

V2/V1	dB
2:1	6
4:1	12
10:1	20
100:1	40
1:2	-6
1:4	-12
1:10	-20
1:100	-40

Table 2 Common voltage ratios and their equivalent decibel values. (Source: Art Pini)

Relative and absolute measurements

As we have seen, the decibel is a relative measure that compares two power or voltage levels.  As such, it is perfect for characterizing transmission gain or loss and is used extensively in scattering (s) parameter measurements.

An absolute measurement can be made by referencing the measurement to a known quantity. The standard reference values in electronic applications are the milliwatt (dBm), the microvolt (dBmV), and the volt (dBV). 

The decibel is used in various other applications, such as acoustics. The sound pressure level in acoustic applications is also measured in dB, and the standard reference is 20 microPascals (μPa).

Using dBm

Based on the definition of dB for power ratios and using 1 mW (0.001 Watt) as the reference, dBm is calculated as:

 dBm = 10 log10 (P2/0.001)

Where P2 is the power of the signal being measured

 Converting from measured power in dBm to power in watts uses the same equation in reverse.

P2 =0.001*10(dBm/10)

For example, the power level in watts (W) for the highest spectral peak is given by the first measure table entry in Figure 1: -5.8 dBm at 5 MHz. The power, in watts, is calculated as follows:

P2 = 0.001 * 10(-5.8 /10)
 P2= 2.63*10-4 W =233 mW

Common power levels and their equivalent dBm values are shown in Table 3.

Power Level	dBm
1 mW	0
2 mW	3
0.5 mW	-3
10 mW	10
0.1 mW	-10
100 mW	20
0.01 mW	-20
1 W	30
10 W	40
100 W	50
1000 W	60

Table 3 common power levels and their equivalent dBm values. (Source: Art Pini)

The calculation of absolute voltage values for voltage-based decibel measurements is similar. To calculate the voltage level for a decibel value in dBV, the equation is:

V2 = 1 * 10(dBV/20)

 For a measured dBV value of 0.3 dBV, the equivalent voltage level is:

 V2 = 1 * 10(0.3/20)
V2 = 1.035 volts

Converting from dBV to dBmV is a scaling or multiplication operation.  So, if you remember the characteristics of logarithms, multiplication within the logarithm becomes addition, and division becomes subtraction. The conversion requires a simple additive constant as derived below:

dBmV = 20 Log10(V2/1×10-6)
dBmV = 20 Log10(V2/1) – 20 Log (1-6)

But:

dBV= 20 log10 (V2/1)
 dBmV = dBV + 120

 A little basic algebra and the reverse operation is:

dBV = dBmV – 120

What if the source impedance isn’t 50 Ω?

Typically, RF work utilizes cables and terminations with a characteristic impedance of 50 Ω. In video, the standard impedance is 75 Ω; in audio, it is 600 Ω.  Reading dBm and matching the source calibration to a 50 Ω input oscilloscope requires adjustments.

First, it is standard practice to terminate sources with their characteristic impedances. A 75-Ω or 600-Ω system signal source requires an appropriate impedance-matching device to connect to a 50-Ω measuring instrument.  The most common is the simple resistive impedance-matching pad (Figure 2).

Figure 2 This schematic of a typical 600 to 50 Ω impedance matching pad reflects a 600 Ω load to the source and provides a 50 Ω source impedance for the measuring instrument. (Source: Art Pini)

The matching pad presents a 600-Ω load to the signal source, while the instrument sees a 50-Ω source, so both devices present the expected impedances. This decreases signal losses by minimizing reflections. The impedance pad is a voltage divider with an insertion loss of 16.63 dB, which must be compensated for in the measurement instrument.

The next step is where the terminating resistances come into play. If the source and load impedances differ, this difference must be considered, as it affects the decibel readings. Going back to the basic definition of decibel:

dB = 10 Log10 [(V22/R2)/(V12/R1)]

Consider how the impedance affects the voltage level equivalent to the one-milliwatt power reference level. The reference voltages equivalent to the one-milliwatt power reference differ between 50 and 600 Ω sides of the measurements:

Pref = .001 Watt = Vref600 2/ 600 = Vref502/50
dBm600 = 10 LOG10 [ (V22) / (Vref6002)]
= 10 LOG10 [(V22) / (Vref502/50/600)]
=10 LOG10 [(50/600) (V22/ (Vref502)]
=10 LOG10 [ (V22)/(Vref502)] + 10 LOG10(50/600)
dBm600 = dBm50 – 10.8

The dBm reading on the 50-Ω instrument is 10.8 dB higher than that on the 600-Ω source because the reference power level is different for the two load impedances.  

The oscilloscope’s rescale operation can scale the spectrum display to dBm referenced to 600 Ω. Assuming a 600-Ω to 50-Ω impedance matching pad, with an insertion loss of 16.63 dB, is used, and the above-mentioned -10.8 dB correction factor is added, the net scaling factor is 5.83 dB must be added to the FFT spectrum as shown in Figure 3.

Figure 3 Using the rescale function of the oscilloscope to recalibrate the instrument to read spectrum levels in dBm relative to a 600-Ω source. (Source: Art Pini)

The 600-Ω source is set to output a zero-dBm signal level. A 600-Ω to 50-Ω impedance matching pad with an insertion loss of 16.63 dB properly terminates the signal source into the oscilloscope’s 50-Ω input termination.  The oscilloscope’s rescale function is applied to the FFT of the acquired signal, adding 5.83 dB to the signal’s spectrum display.  This yields a near-zero dBm reading at 5 MHz.

The measurement parameter P1 measures the RMS input to the oscilloscope, showing the attenuation of the external impedance matching pad. The peak-to-peak (P2) and peak voltage (P3) readings are also measured.  The peak level of the 5 MHz signal spectrum (P4) of near zero dBm (22 milli-dB).  The uncorrected peak spectrum level (P5) is -5.8 dBm

The vertical scale of the spectrum display is now calibrated to match the 600-Ω source. Note that the signal at 5 MHz reads 0 dBm, which matches the signal source setting of 0 dBm (0.774 Vrms) into the expected 600-Ω load.

The decibel

Due to its large dynamic range, the decibel is a useful unit of measure and is used in various applications, mainly in the frequency domain. Converting between linear and logarithmic scaling takes some getting used to and possibly a lot of math.

Arthur Pini is a technical support specialist and electrical engineer with over 50 years of experience in electronics test and measurement.

Related Content

• Converting between dBm and dBuV units
• Decibels: Make them absolute levels
• How to think in dB

The post The DiaBolical dB appeared first on EDN.

Rohde & Schwarz showcased the support precise measurement technology can provide to the automotive industry’s transformation at CES 2026. The company highlighted an extensive range of solutions engineered to support both market progress and technical excellence, from electric drivetrain optimisation and high-speed in-vehicle connectivity to radar validation, UWB-based safety applications and satellite-enabled communications.

“The automotive industry is undergoing its most significant transformation in a century,” said Juergen Meyer, Vice President Market Segment Automotive at Rohde & Schwarz. “From electric drivetrains to new automotive connectivity like non-terrestrial networks and next-generation sensors enabling higher levels of autonomous driving, every innovation requires precise, reliable testing. At CES 2026, we’re showcasing the solutions that enable automakers and suppliers to bring safer, smarter, and more sustainable vehicles to market faster.”

Electric drivetrain testing
Efficiency remains the cornerstone of electric mobility, and Rohde & Schwarz addresses this challenge with advanced tools for inverter and battery management system characterisation. The solution provides deep insights into switching behaviour, EMI performance and electrical power efficiency. Early detection of signal anomalies, precise impedance measurements and multi-channel visibility help Tier 1s and OEMs optimise EV drivetrains faster and more reliably.

OpenGMSL compliance testing
High-resolution radar, video and sensor data are essential for autonomous driving and vehicle infotainment. Rohde & Schwarz supports the emerging OpenGMSL standard and showcases comprehensive validation using the R&S RTP oscilloscope. Integrated PMA tests, real-time signal integrity tools, jitter analysis and built-in eye masks ensure robust link performance. Complementary vector network analysers enable detailed cable and channel characterisation – crucial as OpenGMSL becomes a foundational technology for camera and display systems or satellite radars.

Accelerated radar sensor development with simulation software
R&S strategic partner fiveD, an innovation leader in hyper-realistic radar simulations, bridges the gap between the real and virtual worlds in radar simulation with its Radar Simulation Suite to generate complete environment models and radar digital twins. This allows radar sensor vendors to simulate the complete radar module performance in its host environment even before a hardware prototype exists, providing awareness of errors at an earlier stage and accelerating the development process.

UWB for in-cabin detection and digital key testing
With UWB gaining momentum in automotive in-cabin detection and access systems, Rohde & Schwarz demonstrates advanced target simulation using the R&S SMW200A signal generator and R&S FSW26 spectrum analyser. The setup enables realistic testing of UWB modules used for child-presence detection, hands-free access and intrusion sensing.

Non-Terrestrial Network (NTN) testing
The automotive industry wishes to ensure a seamless user experience for safety, autonomous driving and infotainment services, wherever the vehicle is located and is exploring the role that non-terrestrial networks (NTNs) can have in providing ubiquitous wireless connectivity. Testing at chipset, TCU, antenna and vehicle level has a critical role in creating the always-connected vehicle, and the CMX500 radio communication tester is the complete solution to ensure correct operation of all implementations of NTN.

eCall testing
Meeting critical RF performance and modern protocol stack requirements is essential for ensuring reliable connectivity in systems such as NG eCall. This capability will be mandatory for all vehicles sold in the European market. In parallel, China is introducing a new automotive GNSS test standard, expected to become mandatory by 2027 for its AECS emergency call system. Rohde & Schwarz supports both regulatory frameworks with a comprehensive test setup combining the CMX500 communication tester and the R&S SMBV100B vector signal generator for precise GNSS simulation.

The post Rohde & Schwarz drives the future of mobility at CES 2026 appeared first on ELE Times.

Messe Frankfurt has joined GMTX Co Ltd as co-organiser of Automation Expo, further expanding the company’s portfolio of manufacturing trade events in Southeast Asia. This collaboration extends the company’s presence in Thailand, connecting the region’s manufacturers with the international expertise and resources of Messe Frankfurt’s global network. The next edition will run from 25 – 27 February 2026 at the Nongnooch International Convention and Exhibition Center (NICE) in Pattaya, which sits at the centre of the Eastern Economic Corridor (EEC), the country’s flagship initiative for high-tech industrial development.

 Mr Wolfgang Marzin, President & CEO of Messe Frankfurt Group remarked: “Messe Frankfurt currently organises 11 events and conferences worldwide as part of its Electronics & Automation Technologies portfolio, covering smart and digital automation, intelligent motion and power electronics, alongside energy management solutions. With this new addition, we are reinforcing our commitment to supporting Thailand’s manufacturing sector through the next phase of digital transformation, ensuring that both local SMEs and multinational enterprises benefit from the same high standards and international connections found in our events worldwide.”

 Thailand is a major regional economy where manufacturing accounts for nearly 25% of the national GDP. However, the country is facing a severe demographic shift, with record-low birth rates and a rapidly ageing population, shrinking the workforce. Economists have warned that to maintain regional competitiveness, the industrial sector must urgently shift focus to high-tech industries and automation. Consequently, manufacturers are looking to technology providers to help bridge this labour gap and sustain the sector’s high-value production.

Serving this industrial base, Automation Expo is held in Chonburi province, one of the three provinces that make up the country’s Eastern Economic Corridor (EEC). The EEC initiative aims to advance the region’s role as a major global production hub for the automotive, electronics, and petrochemical industries by focusing investment and policy on twelve designated “S-curve” sectors prioritised for their high growth potential.

Of these, automation and robotics are themselves a priority sector, while also serving as a critical enabler for other targeted industries such as next-generation automotive, intelligent electronics, and aviation and logistics.

To create a favourable ecosystem, the government has implemented investment policies to ease regulatory processes, alongside major infrastructure projects to upgrade the region’s transport and logistics capacity. This combination of policy and infrastructure has strengthened the region’s appeal to international investors. In the first half of 2025, the EEC attracted USD 1.7 billion in foreign capital, representing 56% of Thailand’s total foreign investment, while new company registrations rose by 36% compared to the same period in 2024.

The 2026 edition of Automation Expo will present a comprehensive range of technologies across every stage of the production cycle, from factory floor systems to enterprise-level infrastructure. Industrial automation systems, robotics, smart sensor technology, and digital infrastructure will be featured alongside software for design, simulation, and process control. Professional services for project analysis and financing will also be available, supporting companies at different stages of automation adoption.

Covering 7,500 sqm of exhibition space, the event is expected to bring together around 150 exhibitors and attract a professional audience of company owners, investors, factory managers, system integrators, and engineers, with a focus on the country’s primary industrial verticals, including automotive, iron and sheet metal, food, agriculture, and plastics.

In addition to the exhibition, a comprehensive conference programme will offer technical insights across more than 50 topics. Sessions will focus on practical implementation, covering areas such as hyperautomation, AI for Quality 5.0, factory cybersecurity, and zero downtime strategies, alongside predictive maintenance, IT/OT integration and carbon footprint management.

The event is supported by many prominent organisations and industry associations, including:

• The Federation of Thai Industries (FTI)
• Logistics Division, Department of Industrial Promotion
• Industrial Promotion Center Region 9, Department of Industrial Promotion
• National Science and Technology Development Agency (NSTDA)
• National Electronics and Computer Technology Center (NECTEC)
• Software Park Thailand
• Eastern Economic Corridor of Innovation (EECi)
• EEC Automation Park
• Thailand Productivity Institute (FTPI)
• Thai-German Institute (TGI)
• Sumipol Institute of Manufacturing Technology
• Thai-Nichi Institute of Technology
• Thai Automation and Robotics Association (TARA)
• Thai IoT Association
• Artificial Intelligence Association of Thailand (AIAT)
• Technology Promotion Association (Thailand-Japan)
• Thai PLC Center

Automation Expo is jointly organised by Messe Frankfurt (HK) Ltd and GMTX Company Ltd, joining Messe Frankfurt’s global portfolio of Electronics & Automation Technologies events.

The post Messe Frankfurt adds Automation Expo to growing event portfolio in Southeast Asia appeared first on ELE Times.

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Відкритий діалог КПІшників із Надзвичайним і Повноважним Послом Держави Ізраїль в Україні Міхаелем Бродським kpi пт, 12/19/2025 - 12:18

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Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA has signed a collaboration agreement with GlobalFoundries of Malta, NY (GF, the only US-based pure-play foundry with a global manufacturing footprint, including facilities in the USA, Europe and Singapore) to develop and manufacture gallium nitride (GaN) power products using GF’s 200mm eMode GaN-on-silicon process for critical markets, starting with 650V...

As we look ahead to 2026, we see intelligence increasingly being embedded within physical products and everyday interactions. This shift will be powered by rapid adoption of digital identity technologies such as near-field communication (NFC) alongside AI and agentic AI tools that automate workflows, improve efficiency, and accelerate innovation across the product lifecycle.

The sharp rise in NFC adoption—with 92% of brands already using or planning to use it in products in the next year—signals appetite to unlock the true value of the connected world. Enabling intelligence in new places gives brands the opportunity to bridge physical and digital experiences for positive social, commercial, and environmental outcomes.

Regulatory milestones, such as the phased rollout of the EU Digital Product Passport, along with sustainability pressures and the need to ensure transparency to drive trust will be key catalysts for edge and item-level AI.

In the year ahead, companies will unlock significant benefits in customer experience, sustainability, compliance, and supply chain efficiency by embedding intelligence from the edge to individual items and devices.

Let’s dig deeper into the technology trends shaping 2026.

1. Edge AI is the fastest growing frontier in semiconductors

Driven by the shift from pure inference to on-device training and continuous, adaptive learning, 2026 will see strong growth in edge AI demand. Specialized chips such as low-power machine learning accelerators, sensor-integrated chips, and memory-optimized chips will be used in consumer electronics, smart cities, and industrial IoT.

Next, new packaging approaches will become the proving ground for performance, cost efficiency, and miniaturization in intelligent edge devices.

2. Item-level intelligence is accelerating digital transformation

Intelligence will not stop at the device. Over the next 12 months, low-cost sensing, NFC, and edge AI will push computation down to individual items.

The capability to gather real-time data at item level in a move away from batch data, combined with AI, will enable personalized experiences, automation, and predictive analytics across smart packaging, healthcare and wellness products, retail, and logistics. Applications include real-time tracking, AI-driven personalization, automated supply chain optimization, predictive maintenance, and dynamic authentication.

This marks a fundamental shift as every item becomes a data node and source of intelligence.

3. Connected consumer experiences are driving breakthrough NFC adoption

NFC adoption is accelerating alongside the explosion of connected consumer experiences—from wearables and hearables to smart packaging, digital keys and wellness applications. NFC will become a central enabler of trust, personalization, and seamless connectivity.

Figure 1 NFC has become a key enabler in personalization-centric connectivity. Source: Pragmatic Semiconductor

As consumers increasingly expect intelligent product interaction, for example, to track provenance or engage with wellness apps to build a personalized profile and derive usable insights, the opportunity for NFC is clear. Brands will favor ultra-low-cost and thin NFC solutions—where flexible and ultra-thin semiconductors excel—to deliver frictionless, high-quality consumer experiences.

4. Heterogeneous integration will unlock design innovation

Heterogeneous integration through chiplets, interposers, and die stacking will become the preferred approach for achieving higher density and improved yields. This is a key enabler for miniaturization and differentiated form factors in facilitating customization for edge AI.

At the same time, the rise of agentic AI-driven EDA tools will lower design barriers and fuel cost-effective innovation through natural language tools. This will ignite startup growth and increase demand for agile, cost-effective foundry design services.

5. Compliance shifts from cost to competitive advantage

New regulatory frameworks such as Digital Product Passports, circularity, and Extended Producer Responsibility (EPR) will require authentication, traceability, and lifecycle visibility. Rather than a burden, this presents a strategic opportunity for competitive advantage and market expansion.

Embedded digital IDs with NFC capability allow businesses to secure product authentication, meet compliance and governance expectations, and unlock new value in consumer engagement. As compliance moves from paper systems to embedded intelligence, the opportunity will expand across consumer goods, industrial components, and supply chains.

6. Energy constraints are driving efficiencies in semiconductor manufacturing

As semiconductor manufacturing scales to serve AI demand, growing energy consumption in data centers is forcing industry to focus on power-efficient architectures. This is accelerating a shift away from centralized compute toward fully distributed sensing and intelligence at the edge. Edge AI architectures are designed to process data locally rather than transmit it upstream and will be essential to sustaining AI growth without compounding energy constraints.

Figure 2 Semiconductor manufacturing will increasingly adopt circular design principles such as reuse, recycling, and recoverability. Source: Pragmatic Semiconductor

The capability to establish and scale domestic manufacturing will also play a critical role in cutting embedded emissions and enabling more sustainable and efficient supply chains. Semiconductor manufacturing facilities, known as foundries, will be evaluated on their energy and material efficiency, supported by circular design principles such as reuse, recycling, and recoverability.

Companies that can demonstrate strong environmental commitments will gain long-term competitive advantage, attracting customers, partners, and skilled talent.

Intelligence right to the edge

These trends point toward a definitive shift as intelligence moves dynamically into the physical world. Compute will become increasingly distributed and identity embedded, unlocking efficiencies and delivering real-time insights into the fabric of products, infrastructure, and supply chains.

Semiconductor manufacturing will sit at the heart of the next phase of digital transformation. Flexible and ultra-thin chip technologies will enable new classes of innovations, from emerging form factors such as wearables and hearables to higher functional density in constrained spaces, alongside more carbon-efficient manufacturing models.

The implications for businesses are clear. Companies can accelerate innovation, deepen consumer engagement, and turn compliance into a source of competitive advantage. Those that embed connected technologies into their 2026 strategy will be those that are best positioned to take advantage of the digital transformation opportunities ahead.

Richard Price is co-founder and chief technology officer of Pragmatic Semiconductor.

 

 

Related Content

• AI at the edge: It’s just getting started
• The AI Future is Now All About the Edge
• Edge AI: Bringing Intelligence Closer to the Source
• Powering E-Paper Displays with NFC Energy Harvesting
• Edge AI powers the next wave of industrial intelligence

The post Semiconductor technology trends and predictions for 2026 appeared first on EDN.

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WIP screenshots for some RP2040 based cyberpunk sunglasses I've been working on this year. Hopefully someone will one day create a kicad or easyeda extension that allows me to route at 30° / 60° angles, so I can make hexagonal traces submitted by /u/babel_infoc [link] [comments]