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Energy Resilience Lab: чеський виробник мобільних когенераційних рішень RSE та КПІ об'єднали зусилля заради нової генерації інженерів енергетики kpi пт, 07/11/2025 - 17:20

🌟 Запрошуємо на підготовче відділення для іноземних громадян kpi пт, 07/11/2025 - 16:55

Skyrocketing data consumption

The last few years have seen a tremendous amount of change in the mobile data world. Both in the United States and around the globe, data consumption is growing faster than ever before.

The number of internet users continues to rise, from 5.35 billion users in 2024 to an estimated 7.9 billion users in 2029—a 47% increase in just five years, according to Forbes. This has created an explosion in global mobile data traffic set to exceed 403 exabytes per month by 2029, up from an estimated 130 exabytes monthly at the end of 2023, according to the Ericsson Mobility Report. For context, in 2014, that amount was a mere 2.5 exabytes per month (Figure 1).

Figure 1 While some of the skyrocketing demand for data is associated with video conferencing, the vast majority is related to the increased usage of large language models (LLMs) like ChatGPT. Source: Infinite Electronics

A variety of simultaneous technological changes are also helping to drive this rapid increase in data consumption. Video-chat technology that went into wider usage during the pandemic has become a mainstay in office life, while autonomous vehicles and IoT devices continue to grow in variety and prevalence. The biggest sea change, however, has been the rapid integration of generative AI into mainstream culture since the introduction of ChatGPT4 in late 2023. Combined with state-of-the-art technology like Nvidia’s recently announced AI chips, these new innovations are placing an enormous strain on networks to keep up and maintain efficient data transfer.

Transceivers in high-speed data transfer

In response, internet service providers and data centers are hurriedly seeking solutions that enable the most efficient data transfer possible. Transceivers, which essentially provide the bridge between compute/storage systems and the network infrastructure, serve a critical but sometimes overlooked role in enabling high-speed data transfer over fiber or copper cables.

Driven by the need for increased data transfer capabilities, the window between transceiver data-rate upgrades continues to shorten. The 2023 introduction of 800G came roughly six years after its predecessor, 400G, and barely two years later, the latest iteration of optical transceivers, 1.6TB, could take place as soon as Q3 of this year. This so-called “arms race” of technology shifts and data growth creates various layers of concerns for network engineers that include validating new technology, maintaining quality, ensuring interoperability, speeding up implementation to maximize ROI and increasing network uptime. Network upgrades to boost speeds and bandwidth are crucial for staying ahead of competitors and driving new customer acquisition.

Data center power crunch

Unlike telecom sites, the massive power demands on data centers are a major consideration when evaluating upgrades. According to Goldman Sachs, the power demand from data centers is expected to grow 160% by 2030 due to the increased electricity needed to power AI usage. The massive power demands on data centers are even motivating some to build their own electrical substation facilities.

This push for data center upgrades doesn’t just include transceivers and other components, but full rack-level equipment changes as well, and the cost of making these upgrades can be significant. Hyperscalers like Google, Amazon, Microsoft and Facebook are continuously investing in cutting-edge infrastructure to support cloud services, AI, advertising and digital platforms. Despite the high cost, these companies feel compelled to invest in cutting-edge technology to ensure strong user experiences and avoid falling behind competitors. Similarly, enterprise data centers like those run by Equifax or Bloomberg often run their own infrastructure to support specific business operations and invest heavily in technology upgrades.

But in smaller data centers not built by hyperscalers or large enterprises—such as colocation providers, regional service providers, universities, or mid-sized businesses—the cost of transceivers can account for a significant portion of total network hardware spending, sometimes in excess of 50%, according to Cisco. Because these organizations may not upgrade transceivers as frequently, often skipping a generation, each purchasing decision is made with the goal of balancing performance, longevity, and cost.

Additional factors like uptime, reliability, and time to market are also shifting network engineers’ priorities, with a heavy focus on quality products that offer operational flexibility. Some engineers are aligning with vendors that have a strong track record of quality, technical support teams that can be leveraged, and strong financials to ensure that the vendors will be capable of supporting warranties in the future and have parts in inventory to support urgent needs. Network engineers know that lowering the cost of network equipment is crucial for maintaining ROI for their businesses, but they also understand that quality and reliability are vital for business operations by eliminating failures and liabilities due to outages.

Transceiver procurement

These considerations are leading engineers toward the choice of purchasing transceivers from original equipment manufacturers (OEMs) or from third-party vendors. While each option offers its own benefits, as shown in Table 1, there are meaningful differences between the two.

Table 1 The major differences between OEM transceivers and third-party transceivers in key categories. Source: Infinite Electronics

Transceivers from reputable third-party vendors are built to the same MSA (multi-source agreement) standards followed by optics from OEMs, ensuring they have the same electrical and optical capabilities. However, OEM transceivers often carry much higher costs (frequently between 2x and 5x) than equivalent third-party optics. In a data center with thousands of ports, the difference in cost can be significant, reaching hundreds of thousands of dollars.

Transceivers from OEMs come hard-coded to run on one specific platform: Cisco, Sienna, IBM or any of hundreds of others on the market. It’s common for a fiber-optic network to include multiple installations of different OEM equipment, but additional complexity can be created through the acquisition of a company that used transceivers from an entirely different set of vendors. This often forces organizations to maintain separate inventories of backup transceivers coded to each platform in current use. In addition, using optics from one OEM can tie an organization to it indefinitely, reducing its flexibility for future upgrades.

Vendor agnostic functionality

Third-party vendors often offer a wider variety of form factors, connector types, and reach options than brand-name vendors. It’s also possible to get custom-programmed optics for multi-vendor environments where compatibility is an issue. Some vendors are able to code or recode transceivers out in the field in minutes, effectively allowing organizations to cover the same range of operations with less inventory.

Whereas OEM optics tend to have long procurement cycles due to internal processes, certifications, or global supply chain issues, third-party suppliers often offer the ability to ship same day or within days, which can be crucial given the time constraints on maintenance windows and rapid expansion plans.

With data demands forecasted to continue escalating to the end of the decade, data providers will have to make a substantial investment to manage the shifts in technology and keep up with customer needs. To maintain network uptime, it will be increasingly critical to partner with vendors that can provide technical support as well as competitive products that maintain high quality and reliable performance.

Third-party transceiver benefits

For hospitals, banking, retail, and other businesses with employees working from home, connectivity will be essential for executing even the simplest daily tasks. Maintaining a business’s reputation and customer loyalty depends on limiting liability, making it critical to maintain a robust network that is built on uptime.

By providing versatility through shorter lead times and broader compatibility, third-party transceiver solutions help ensure that infrastructure upgrades can keep up with the pace of business needs. In a landscape defined by rapid change, having access to reliable, standards-compliant alternatives can offer organizations a crucial strategic advantage.

For organizations navigating the challenges of scaling their networks while managing costs, third-party transceivers offer a practical path forward, helping ensure that networks remain both resilient and future-ready.

Jason Koshy is Infinite Electronics’ global VP of sales and business development, leading its outside sales team and installations. He brings to this position more than 28 years of experience covering all facets of the business. His previous roles include applications engineer, quality and manufacturing engineer, new acquisition evaluations, regional sales manager, director of sales for North America and, most recently, VP of sales for the Americas and ROW. Jason also participated in the integration of Integra, PolyPhaser and Transtector into the Infinite Electronics brand family. He holds a Bachelor of Science in electrical engineering from the University of South Florida.

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• Data center solutions take center stage at APEC 2025
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• Power Tips #140: Designing a data center power architecture with supply and processor rail-monitoring solutions
• Cloud data center server power and optical transceivers: a dynamic duo
• Designing with 10GBase-T transceivers

The post Why the transceiver “arms race” is turning network engineers toward versatility appeared first on EDN.

With features optimized for motor control, Renesas’ RA2T1 MCUs drive fans, power tools, home appliances, and other single-motor systems. The MCUs integrate a 32-bit Arm Cortex-M23 processor running at 64 MHz and a 12-bit ADC with a 3-channel sample-and-hold function that simultaneously captures the 3-phase currents of BLDC motors for precise control.

A PWM timer supports automatic dead-time insertion and asymmetric PWM generation, features tailored for inverter drive and control algorithm implementation. Safety functions include PWM forced shutdown, SRAM parity check, ADC self-diagnosis, clock accuracy measurement, and unauthorized memory access detection.

Renesas’ Flexible Software Package (FSP) for the RA2T1 microcontroller streamlines development with middleware stacks for Azure RTOS and FreeRTOS, peripheral drivers, and connectivity, networking, and security components. It also provides reference software for AI, motor control, and cloud-based applications.

The RA2T1 series of MCUs is available now, along with the FSP software.

RA2T1 product page

Renesas Electronics 

The post MCUs power single-motor systems appeared first on EDN.

Cadence taped out an LPDDR6/5X memory IP system running at 14.4 Gbps—up to 50% faster than previous-generation LPDDR DRAM. The complete PHY and controller system optimizes power, performance, and area, while supporting both LPDDR6 and LPDDR5X protocols. Cadence expects the IP to help AI infrastructure meet the memory bandwidth and capacity demands of large language models (LLMs), agentic AI, and other compute-heavy workloads.

The memory system features a scalable, adaptable architecture that draws on Cadence’s DDR5 (12.8 Gbps), LPDDR5X (10.7 Gbps), and GDDR7 (36 Gbps) IP lines. As the first offering in the LPDDR6 IP portfolio, it supports native integration into monolithic SoCs and enables heterogeneous chiplet integration through the Cadence chiplet framework for multi-die system designs.

Customizable for various package and system topologies, the LPDDR6/5X PHY is offered as a drop-in hardened macro. The LPDDR6/5X controller, provided as a soft RTL macro, includes a full set of industry-standard and advanced memory interface features, such as support for the Arm AMBA AXI bus.

The LPDDR6/5X memory IP system is now available customer engagements.

LPDDR product page

Cadence

The post Cadence debuts LPDDR6 IP for high-bandwidth AI appeared first on EDN.

The nPM1304 PMIC from Nordic offers precise fuel gauging for products with small rechargeable batteries and strict energy budgets. It charges single-cell Li-ion, Li-poly, and LiFePO4 batteries—intended for devices like smart rings and trackers—with charging currents as low as 4 mA and a programmable termination voltage from 3.5 V to 4.65 V.

Estimating battery state of charge, the nPM1304 applies an algorithm-based fuel gauging method that tracks voltage, current, and temperature alongside a mathematical battery model. This approach reportedly achieves accuracy comparable to dedicated fuel gauge ICs, without their added power consumption or error accumulation.

According to Nordic, dedicated fuel gauge ICs can draw up to 50 µA during active operation and 7 µA in sleep mode—significant figures for products averaging just 200 µA. In contrast, the nPM1304 consumes only 8 µA when active and zero in sleep, delivering accurate state-of-charge estimates without noticeably impacting battery life.

In addition to battery charging (4 mA to 100 mA) and fuel gauging, the nPM1304 provides two 200-mA buck regulators and two configurable 100-mA load switches or 50-mA LDOs. 

Contact Nordic Sales to join the early sampling program.

nPM1304 product page

Nordic Semiconductor 

The post PMIC suits tiny wearables with low standby drain appeared first on EDN.

Infineon’s ID Key S USB integrates a security controller and USB bridge controller in one package, supporting a range of USB and USB/NFC token applications. Built on a high-assurance security architecture, the device supports authentication, cryptographic functions, access control, and crypto hardware wallets.

 

 

The ID Key S USB includes a 32-bit CPU running at 100 MHz and 24 kB of RAM, enabling fast and secure application execution. It has up to 800 kB of non-volatile memory for storing data, cryptographic keys, software, and multiple applications.

Certified to CC EAL 6+ and compliant with FIPS 140-3 hardware requirements, the device satisfies robust security needs and allows customers to pursue FIPS certification. Its compact VQFN28 package eases integration into space-constrained token devices.

The ID Key S USB secure token controller is now available for early access customers.

ID Key S USB product page 

Infineon Technologies 

The post Secure token controller targets USB and NFC appeared first on EDN.

Three Gen 3 SiC Schottky diodes from Vishay come in low-profile SlimSMA HV (DO-221AC) packages with a minimum creepage distance of 3.2 mm. The 1200-V/1- A VS-3C01EJ12-M3, 650-V/2-A VS-3C02EJ07-M3, and 1200-V/2-A VS-3C02EJ12-M3 use a merged PIN Schottky structure that supports high-speed operation. They combine low capacitive charge with temperature-stable switching behavior, helping improve efficiency in hard-switching power designs.

In high-voltage applications, the diodes’ extended creepage distance enhances electrical isolation. Their SlimSMA HV package uses a molding compound with a CTI of ≥600 for strong insulation. The package also has a low profile of just 0.95 mm—significantly thinner than the 2.3 mm height of standard SMA and SMB packages with a similar footprint.

All three diodes operate reliably up to +175°C and feature negligible reverse recovery, making them well-suited for bootstrap, anti-parallel, and PFC circuits in DC/DC and AC/DC converters used in server power supplies, energy systems, and industrial drives.

Samples and production quantities of the Gen 3 SiC diodes are available now, with lead times of 14 weeks.

Vishay Intertechnology 

The post SiC diodes boost isolation and efficiency appeared first on EDN.

Як я потрапив в інженерію Інформація КП пт, 07/11/2025 - 15:30

I wanted to test the chip before the PCB arrives. It works well! STMicro LSM6DSL submitted by /u/EuphoricCatface0795 [link] [comments]

Furnishings to test and characterise a logic level translator IC that our hardware engineer is considering using. submitted by /u/Rodifex [link] [comments]

X Міжнародна конференція «Теорія і практика раціонального використання традиційних і альтернативних паливно-мастильних матеріалів» kpi пт, 07/11/2025 - 13:52

Offered in the Compact SlimSMA HV (DO-221AC) Package, 1 A and 2 A Devices Offer Low Capacitive Charge and High Minimum Creepage Distance of 3.2 mm

Vishay Intertechnology, Inc. introduced three new Gen 3 650 V and 1200 V silicon carbide (SiC) Schottky diodes in the compact, low profile SlimSMA HV (DO-221AC) package. Featuring a merged PIN Schottky (MPS) design and minimum creepage distance of 3.2 mm, the 1 A VS-3C01EJ12-M3 and 2 A VS-3C02EJ07-M3 and VS-3C02EJ12-M3 combine low capacitive charge with temperature-invariant switching behavior to increase efficiency in high speed, hard-switching power designs.

For high voltage applications, the high creepage distance of the Vishay Semiconductors devices provides improved electrical isolation, while their SlimSMA HV package features a molding compound with a high CTI ≥ 600 to ensure excellent electrical insulation. For space-constrained designs, the diodes offer a low profile of 0.95 mm compared to 2.3 mm for competing SMA and SMB packages with a similar footprint.

Unlike silicon diodes, the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 maintain a low capacitive charge down to 7.2 nC irrespective of temperature, resulting in faster switching speeds, reduced power losses, and improved efficiency for high frequency applications. In addition, the devices have virtually no recovery tail, which further improves efficiency, while their MPS structure delivers a reduced forward voltage drop down to 1.30 V.

With a high operating temperature of +175 °C, typical applications for the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 will include bootstrap, anti-parallel, and PFC diodes for DC/DC and AC/DC converters in server power supplies; energy generation and storage systems; industrial drives and tools; and X-ray generators. For easy paralleling in these applications, the devices offer a positive temperature coefficient.

RoHS-compliant and halogen-free, the diodes feature a Moisture Sensitivity Level of 1 in accordance with J-STD-020 and meet the JESD 201 class 2 whisker test.

The post Vishay Intertechnology Gen 3 650 V and 1200 V SiC Schottky Diodes Increase Efficiency While Enhancing Electrical Insulation appeared first on ELE Times.

Industrial digital input chips provide serialized data by default. However, in systems that require real time, low latency, or higher speed, it may be preferable to provide level-translated, real-time logic signals for each industrial digital input channel.

So, some industrial digital inputs sample and serialize the state of eight 24-V current sinking inputs under SPI or pin-based (LATCH) timing control, allowing for readout of the eight states via SPI. A serial interface is used to minimize the number of logic signals requiring isolation, which is particularly beneficial in high channel count digital input modules.

Serialization of logic signals uses simultaneous sampling of the signals so that the signals become time quantized. This means that real-time information content is lost, which can be of concern in certain systems. Examples are applications where timing differences between switching signals are of concern, such as incremental encoders or counters.

These applications either necessitate the use of high-speed sampling with high-speed serial readout or the use of non-serialized parallel data, as provided by the MAX22195, an industrial digital input with parallel output. Using the MAX22190/MAX22199 industrial digital input devices with parallel operation provides the benefit of diagnostics and configurability.

This article delves into the characteristics, limitations, and design considerations regarding techniques for generating parallel logic outputs with industrial digital inputs.

Design details

The technique is based on repurposing the eight LED outputs to function as logic signals. LEDs serve to provide a visual indication of the digital input’s state—useful for installation, maintenance, and in service. The characteristics and specifications of industrial inputs are clearly defined in the IEC 61131-2 standard, with the output state being binary in nature: either on or off.

The MAX22190/MAX22199 chips feature energyless LED drivers that power the LEDs from the sensor/switch in the field, not drawing current/power from a power supply in the digital input module. These devices limit the input current to a level settable by the REFDI resistor. This is done to achieve the lowest power dissipation in the module.

For the common Type 1/Type 3 digital inputs, the input current is typically set to a level of ~2.3 mA (typ) to be larger than the 2.0 mA minimum required by the IEC standard. The ICs channel most of the ~2.3 mA field input (IN) current to the LED output pins, and only ~160 µA are consumed by the chip.

With the LED drivers being current outputs, not voltage, the current needs to be converted to voltage for interfacing with other logic devices like digital isolators and microcontrollers. Resistors are the simplest trans-resistance element for this purpose, as shown in Figure 1.

Figure 1 LED pins are used as voltage-based logic outputs. Source: Analog Devices Inc.

Using the LED output pins in this manner is not documented in the product datasheets. This article investigates the characteristics and possible limitations.

LED pin characteristics

When using ground-connected resistors on the LED pins to create voltage outputs, the following needs to be considered:

• What is the maximum voltage allowed on the LED pins?
• Is there interaction/feedback from the LED_ pin to the IN_ pin?
• Specifically, does voltage on the LED pins result in a change of the input current, as minimum current levels are mandated by the IEC standards?
• Do the LED output currents show undesired transient behavior, such as overshoots or slow rise/fall times?
• Are the LED outputs suitable for use as high-speed logic signals when the inputs switch at high rates?
• Are the LED outputs filtered (as programmable by SPI)?

The MAX22190/MAX22199 datasheets’ absolute maximum ratings specify the maximum allowed LED pin voltages as +6 V. This indicates that the LED pins are suitable for use as 5 V (and 3.3 V) logic outputs, with the caveat that the voltage may not be higher than 6 V.

The impact of the LED pin voltage on other critical characteristics needs to be evaluated. Of particular concern is the change of the input current with the presence of high LED pin voltages, as the current is specified by the standards. The critical case is with the field voltage close to the 11 V on-state threshold voltage, as defined for Type 3 digital inputs.

Figure 2 shows the measured field input current dependence on the LED pin voltage for three field input voltages close to the 11-V level: 9 V, 10 V, and 11 V. The 10-V and 9-V levels were chosen as these are within the transition region for Type 3 inputs, and their input currents have no defined minimum, while the minimum for the 11 V input case is 2 mA.

Figure 2 Field input current is dependent on the LED pin voltage. Source: Analog Devices Inc.

With the field voltage at the 11-V threshold, the blue curve shows that the input current starts decreasing when the LED voltage is higher than ~5.8 V. The current decrease is only 0.6% at 6 V. For cases of 9 V and 10 V, which are in the transition where the currents are not defined, the measurements show that the input current is still above 2 mA for up to 5.5-V inputs.

In conclusion, this shows that the MAX22190/MAX22199 will produce 5-V LED logic outputs (as well as lower voltage logic like 3.3 V) and still be compatible with Type 3 digital inputs. For Type 1 digital inputs, the case is trivial since the on-threshold is much higher at 15 V, meaning that the LED pins will also provide 5-V logic levels without any impact on the field input current.

Parallel operation example

Figure 3 shows a 10-kHz field input (yellow curve) with the resulting LED output voltage in blue. A 1.5-kΩ resistor was used on the LED output, which provides a 3.3 V logic signal. Glitch filtering was disabled (default bypass mode).

Figure 3 In 10-kHz switching, Channel 1 has field input and Channel 2 has LED output. Source: Analog Devices Inc.

Regarding the transient behavior of the LED output current under switching conditions, Figure 3 shows a case of 10-kHz switching. A 1.5-kΩ resistor was used to convert current to voltage. The scope shot illustrates that the LED outputs do not produce transient overshoots or undershoots that could damage logic input devices. The rise and fall times are fast and do not lead to signal distortion.

Using the SPI interface

The MAX22190/MAX22199 devices feature SPI-programmable filters to enable per-channel glitch/noise filtering. Eight filter time constants up to the 20-ms level are available as well as a filter bypass for high-speed applications. The selected noise filtering also applies to the LED outputs to make the visual representation consistent with the electrical signals.

Diagnostics are provided via SPI, like low power supply voltage alarms, overtemperature warnings, short-circuit detection on the REFDI and REFWB pins, and as wire-break detection of the field inputs.

The power-up default state of the register bits is:

• All eight inputs are enabled
• All input filters are bypassed
• Wire-break detection is disabled
• Short-circuit detection of the REFDI and REFWB (only MAX22199) pins is disabled

Hence, the SPI interface does not need to be used in applications that do not require glitch filtering (for example, for high-speed signals) and diagnostics. In cases where the per-channel selectable glitch/noise filtering is needed or diagnostic detection is wanted, SPI can be used.

The LED output waveform does not show overshoots or other undesired irregularities such as varying voltage in the on-state. This illustrates that the LED outputs can be used as voltage outputs. Its characteristics and limitations are investigated.

Glitch filtering

The MAX22190 and MAX22199 devices provide per-channel selectable glitch filtering. The following content demonstrates the effect of the glitch filters on the LED outputs by example of a 200-Hz switching signal with filter time set to 800 µs. Defined glitch widths were emulated by changing the duty cycle. Both positive and negative glitches were investigated.

Figure 4 shows an example of 750-µs positive pulses being filtered out by the 800-µs glitch filter. So, positive glitch filtering works both for the LED outputs as well as the SPI data.

Figure 4 Here is an example of positive glitch filtering. Source: Analog Devices Inc.

Negative glitches are, however, not filtered out at the LED outputs, as shown in Figure 5, where a 750-µs falling pulse propagates to the LED output. This differs from using the SPI readout, for which both positive and negative glitches are successfully filtered.

Figure 5 This image shows negative glitch filtering. Source: Analog Devices Inc.

Figure 6 shows the LED output signal with an 800-µs glitch filter enabled and input switching with a 50% duty cycle. The rising edges are delayed by ~770 µs while the falling edges show no delay. This illustrates that the filters do not work properly with the LED outputs.

Figure 6 This image highlights the filtering effect on LED output. Source: Analog Devices Inc.

High frequency switching

For applications with high switching frequencies, low propagation, or low skew requirements, glitch filtering would be disabled. In bypass mode (glitch filters) and 100-kHz input, the LED output results in the waveforms shown in Figure 7.

Figure 7 The 100-kHz input switching is shown with filter bypass. Source: Analog Devices Inc.

While the falling edges show low propagation delay of ~60 ns, the rising edges have significant propagation delay as well as jitter. The rising edge jitter is in the range of ±0.5 µs with an average propagation delay of ~1 µs. The rising delay and jitter are due to the ~1 MHz sampling documented in the datasheet. Sampling does not occur on the falling edges, hence the fast response.

This illustrates that the LED outputs have rise time/fall time skews of up to ~1.5 µs with jitter. Channel-to-channel skew is low on the falling edges but much higher on the rising edges. This could limit the use of the LED outputs in some applications.

Design considerations

This section discusses some considerations required when using the LED output pins as voltage outputs.

Ensure that the MAX22190/MAX22199 current-drive LED outputs are voltage limited to not exceed the safe levels of the logic inputs that they drive. While the REFDI resistor sets the field input current to a typical current level, the actual input current has a tolerance of ±10.6%, as specified in the datasheets. Thus, the voltage across the resistor will be in the ±10.6% range.

Logic inputs typically have tightly specified absolute maximum ratings, like VL + 0.3 V, where VL is the logic supply voltage. When interfacing two logic signals, a common VL supply is often used to ensure matching as standard logic outputs have push-pull or open-drain outputs whose maximum output voltage is defined/limited by a logic supply, VL.

One can make the typical LED pin’s output voltage lower to ensure that absolute maximum ratings are not exceeded for the input. Alternatively, one can consider that the LED pin’s ~2.3 mA output current will not damage a logic input, as these are commonly specified for tolerating much higher latch-up currents, in the 50 mA to 100 mA range. This needs to be verified for the device under consideration. The third, less attractive, option is to limit the voltage by clamping.

Standard logic outputs are push-pull and thus low impedance, providing high flexibility in driving logic inputs. In contrast, the LED outputs are open-drain outputs where the pull-down resistor with parasitic capacitance determines the switching speeds.

Without additional capacitors, switching rates of 100 kHz and higher are feasible.

The MAX22190/MAX22199 industrial digital inputs can be used as an octal input having eight parallel outputs, despite being documented for serialized data operation. To this purpose, the LED drivers, originally intended for visual state indication, are repurposed as voltage-based or current-based logic outputs. When using parallel operation in this manner, the use of the SPI interface is optional and provides all the diagnostics as well as device configurability with some limitations.

Wei Shi is an applications engineer manager in the Industrial Automation business unit of Analog Devices based in San Jose, California. She joined Maxim Integrated (now part of Analog Devices) in 2012 as an applications engineer.

Reinhardt Wagner was a distinguished engineer with Analog Devices in Munich, Germany. His 21-year tenure primarily involved the product definition of new industrial chips in the areas of communication and input/output devices.

Editor’s Note

This article was written in cooperation with Chin Chia Leong, senior staff engineer for hardware at Rockwell Automation.

Related Content

• Analog outputs for industrial applications
• Isolating analog signals using a digital isolator
• Isolated PLC digital inputs for industrial control
• Audio chip moves machine learning from digital to analog
• Using Smart I/Os to build pin-level digital logic functionality and reduce CPU loading

The post Design digital input modules with parallel interface using industrial digital inputs appeared first on EDN.

New Devices from MCU Leader Meet Demands for Performance and Compact Size; Offer Peripheral Set Targeted for Motor Control

Renesas Electronics Corporation introduced the RA2T1 microcontroller (MCU) group based on the Arm Cortex -M23 processor optimized for motor control systems. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.

Feature Set Optimized for Motor Control

The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.

The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.

Renesas Leadership in Embedded Processing for Motor Control

Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.

“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”

Key Features of the RA2T1 Group MCUs

• Core: 64 MHz Arm Cortex-M23

• Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash
• Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators
• System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes
• Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection
• Operating Temperature Range: Ta = -40°C to 125°C

• Operating Voltage: 1.6V to 5.5V

• Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)

The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions.

The post Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More appeared first on ELE Times.

The IoT Platform specifically designed for industrial applications, integrating Ethernet, RS485, CAN, and SD interfaces into a single system, and fully compatible with Arduino.

Nuvoton Technology introduced the NuMaker-UNO-M4 development board, an IoT platform based on the NuMicro M467 Ethernet / Crypto microcontroller series. It continues the classic design with industrial-grade standards, offering both ease of use and professional performance. The development board is fully compatible with Arduino pinout and additionally integrates essential industrial communication interfaces: Ethernet, RS485, CAN bus, and an SD card interface. It’s suitable for diverse application scenarios such as smart transportation, smart healthcare, smart industry, and smart homes.

The NuMaker-UNO-M4 features robust network connectivity, supporting wired connections and extendable wireless communication. It is equipped with an SD card interface for convenient long-term data logging and local storage, eliminating the need for additional data recording devices. This is particularly useful for applications requiring extensive data collection, such as smart agriculture, smart transportation, and health monitoring.

Powered by an Arm Cortex-M4 processor, it boasts hardware floating-point operations and DSP acceleration capabilities, supporting audio processing, vibration analysis, and small-scale AI applications, enhancing system performance and intelligence.

The NuMaker-UNO-M4 seamlessly integrates with the Arduino integrated development environment (IDE) and Nuvoton’s exclusive libraries, lowering development barriers. It also supports USB direct programming, streamlining the development process. Through Nuvoton’s comprehensive software development tools, combined with Nuvoton NuForum resources and a rich collection of example codes, even novice programmers can quickly generate code with the assistance of generative AI, accelerating development efficiency. This affordable and powerful industrial-grade development board offers developers an ideal choice that combines ease of use with professional capabilities.

Key Features of the NuMaker-UNO-M4 Development Board:

• Integrated Industrial Communication Interfaces: Ethernet, RS485, CAN bus, and SD card interface.
• Designed for Industrial-Grade Applications: Supports Modbus RTU/Modbus TCP, CAN, and MQTT applications.
• Suitable for Data Collection and Processing: Up to 1024 KB Flash Memory and 512 KB SRAM, with SD card support for long-term data logging.
• Compatible with Arduino Development Interface: Provides a high-quality and user-friendly development experience.
• Supports Network Functionality: Wired network support with optional WiFi / Sub-GHz connectivity for real-time monitoring and remote transmission.

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Leveraging its expertise in magnetic position sensors, Infineon Technologies AG has launched the third generation of the XENSIV 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance.

The new sensor family measures the magnetic field in three orthogonal dimensions and operates as an I²C or SPI bus slave. The devices offer enhanced magnetic performance and accuracy, with very low deviation over their lifetime (X/Y < 1.7% X-Y/Z = 6.75%). The 3D magnetic measurement principle and platform adaptability enabled by the device’s configurability allow for a reduction in the number of required components. Additionally, the system’s power consumption is very low due to its wake-up mode. The TLE493D-X3XX supports a supply voltage of 3.3 V and 5 V and offers 3D magnetic field measurement ranges of ±50 mT, ±100 mT, and ±160 mT. With these linear magnetic range options, the sensors are well-suited for controlling elements in infotainment and navigation systems and multifunction steering wheels. Furthermore, the devices operate reliably in a temperature range of -40°C to 150°C.

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Aeluma Inc of Goleta, CA, USA — which develops compound semiconductor materials on large-diameter substrates — has won new contracts with NASA and the US Navy that could accelerate development and commercialization for next-generation quantum and sensing systems...

Інститут кібернетики НАН України ім. В. М. Глушкова відзначений почесною відзнакою КПІ ім. Ігоря Сікорського kpi чт, 07/10/2025 - 22:32

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — says that its stockholders have overwhelmingly approved key proposals in support of its financing strategy, a pivotal milestone in its strategic transformation for defense-tech and operational resilience through its Defense & Security Hub initiative...