Feed aggregator

submitted by /u/Advanced_Director358 [link] [comments]

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The high-speed operation, large integration density, cost-effectiveness, and excellent reliability have contributed to the widespread adoption of DRAM technology in many electronic devices.

DRAM bit cell—the element that stores one bit of information—has a very basic structure. It consists of one capacitor (1C) and one transistor (1T) integrated close to the capacitor. While the capacitor’s role is to store a charge, the transistor is used to access the capacitor, either to read how much charge is stored or to store a new charge.

The 1T-1C bit cells are arranged in arrays containing word and bit lines, and the word line is connected to the transistors’ gate, which controls access to the capacitor. The memory state can be read by sensing the stored charge on the capacitor via the bit line.

Over the years, the memory community introduced subsequent generations of DRAM technology, enabled by continuous bit-cell density scaling. Current DRAM chips belong to the ’10-nm class’ (denoted as D1x, D1y, D1z, D1a…), where the half pitches of the active area in the memory cell array range from 19 nm down to 10 nm. However, the AI-driven demand for better performing and larger capacity DRAM is propelling R&D into beyond 10-nm generations.

This requires innovations in capacitors, access transistors, and bit cell architectures. Examples of such innovations are high-aspect ratio pillar capacitors, the move from saddle-shaped (FinFET-based) access transistors to vertical-gate architectures, and the transition from 6F2 to 4F2 cell designs—F being the minimum feature size for a given technology node.

A closer look inside a planar 1T-1C DRAM chip: The peripheral circuit

To enable full functionality of the DRAM chip, several other transistors are needed besides the access transistors. These additional transistors play a role in, for example, the address decoder, sense amplifier, or output buffer function. They are called DRAM peripheral transistors and are traditionally fabricated next to the DRAM memory array area.

Figure 1 The 1T-1C-based DRAM memory array and DRAM peripheral area are shown inside a DRAM chip. Source: imec

DRAM peripheral transistors can be grouped into three main categories. The first category is regular logic transistors: digital switches that are repeatedly turned on and off. The second category is sense amplifiers—analog types of transistors that sense the difference in charge between two-bit cells. A small positive change is amplified into a high voltage (representing a logic 1) and a small negative change into zero voltage (representing a logical 0).

These logical values are then stored in a structure of latches called the row buffer. The sense amplifiers typically reside close to the memory array, consuming a significant area of the DRAM chip. The third category is row decoders: transistors that pass a relatively high bias (typically around 3 V) to the memory element to support the write operation.

To keep pace with the node-to-node improvement of the memory array, the DRAM periphery evolves accordingly in terms of area reduction and performance enhancement. In the longer term, more disruptive solutions may be envisioned that break the traditional ‘2D’ DRAM chip architecture. One option is to fabricate the DRAM periphery on a separate wafer, and bond it to the wafer that contains the memory array, following an approach introduced in 3D NAND.

Toward a single and thermally stable platform optimized for peripheral transistors

The three groups of peripheral transistors come with their own requirements. The regular logic transistors must have good short channel control, high on current (Ion), and low off current (Ioff). With these characteristics, they closely resemble the logic transistors that are part of typical systems-on-chips (SoCs). They also need to enable multiple threshold voltages (Vth) to satisfy different design requirements.

The other two categories have more dissimilar characteristics and do not exist in typical logic SoCs. The analog sense amplifier requires good amplification, benefitting from a low threshold voltage (Vth). In addition, since signals are amplified, the mismatch between two neighboring sense amplifiers must be as low as possible. The ideal sense amplifier, therefore, is a very repeatable transistor with good analog functionality.

Finally, the row decoder is a digital transistor that needs an exceptionally thick gate oxide—compared to an advanced logic node—to sustain the higher bias. This makes the transistor inherently more reliable at the expense of being slower in operation.

Figure 2 Here are the main steps needed to fabricate a transistor for DRAM peripheral applications; the critical modules requiring specific developments are underlined. Source: PSS

In addition to these specific requirements, there are a number of constraints that apply to all peripheral transistors. One critical issue is the thermal stability. In current DRAM process flows with DRAM memory arrays sitting next to the periphery, peripheral transistors are fabricated before DRAM memory elements. The periphery is thus subjected to several thermal treatments imposed by the fabrication of the storage capacitor, access transistor, and memory back-end-of-line.

Peripheral transistors must, therefore, be able to withstand ‘DRAM memory anneal’ temperatures as high as 550-600°C for several hours. Next, the cost-effectiveness of DRAM chips must be preserved, driving the integration choices toward simpler process solutions than what logic flows are generally using.

To keep costs down, the memory industry also favors a single technology platform for various peripheral transistors—despite their individual needs. Additionally, there is a more aggressive requirement for low leakage and low power consumption, which benefits multiple DRAM use cases, especially mobile ones.

The combination of all these specifications makes a direct copy of the standard logic process flow impossible. It requires optimization of specific modules, including the transistors’ gate stack, source/drain junctions, and source/drain metal contacts.

Editor’s Note: This is first part of the article series about the latest advancements in DRAM designs. This part focuses on DRAM basics, peripheral circuits, and the journey toward a single, cost-effective, and thermally stable technology platform optimized for peripheral transistors. The second part will provide a detailed account of DRAM periphery advancements.

Alessio Spessot, technical account director, has been involved in developing advanced CMOS, DRAM, NAND, emerging memory array, and periphery during his stints at Micron, Numonyx, and STMicroelectronics.

Naoto Horiguchi, director of CMOS device technology at imec, has worked at Fujitsu and the University of California Santa Barbara while being involved in advanced CMOS device R&D.

Related Content

• DRAM gets more exotic
• FCRAM 101: Understanding the Basics
• DRAM: the field for material and process innovation
• Winbond’s innovative DRAM design and the legacy of Qimonda
• DRAM technology for SOC designers and—maybe—their customers

The post DRAM basics and its quest for thermal stability by optimizing peripheral transistors appeared first on EDN.

Візит делегації компанії NZIA Connect Inc. kpi пн, 02/17/2025 - 19:58

A blast from the past

Older folks may recall the famous Tektronix 576 and 577 curve tracers from half a century ago. A few of these have survived the decades and ended up in some lucky engineer’s home/work lab.

Wow the engineering world with your unique design: Design Ideas Submission Guide

We were able to acquire a Tek 577 curve tracer with a Tek 177 standard test fixture from a local surplus house that had been used at Sandia Labs, but it was not functional. Even being non-functional, these old relics still command a high price, which set us back $500!! With the help of an on-line service manual and some detailed troubleshooting, the old 577 was revived by replacing all the power supply’s electrolytic capacitors and a few op-amps, plus removing the modifications Sandia had installed.

Once operational we went looking for the various Tek device under test (DUT) adapters for the Tek 177 standard test fixture, these adapters are indeed rare and likewise expensive which sent us on the DIY journey!

The DIY journey

Observing a similar path to Jay_Diddy_B1 [1], we set out to develop a DIY adapter to replace the rare and expensive Tek versions. Like the popular T7 multi-function component tester, which employs a small ZIF socket for leaded-component attachment that works very well; we decided to do the same for the custom Tek adapter using the right and left sides of the ZIF socket to facilitate DUT comparisons with the Tek 177 standard test fixture. This can be seen in Figure 1.

Figure 1 Custom ZIF-based Tek 577 adapter where the right and left sides of the ZIF socket facilitate DUT comparisons with the Tek 177 standard test fixture.

As shown in Figure 2, a low-cost PCB was developed with SMD ferrites added to the nominal “Collector” and “Base” 577 terminals to help suppress any parasitic DUT oscillations. Connectors were also added to allow for external cables if desired (something we have never used). The general idea was to use the 6 banana jacks as support for holding the PCB in place with the ZIF on top of the PCB where one can directly attach various DUTs.

This approach has worked well and allows easy attachment of various leaded-components including the T0-126 and T0-220 power devices.

Figure 2 The custom adapter installed on the Tek 177 standard test fixture.

Applying the curve tracer to an SMD DUT

However, this still leaves the SMD types in need of a simple means to apply with the Tek 577 curve tracer with the 177 fixture; we set out to investigate this.

After studying the methods Tektronix utilized, we discovered some low-cost toggle clamps (found on AliExpress and elsewhere) which are used for clamping planar objects to a surface for machining. Figure 3 shows the custom toggle clamps used on a custom SMD DUT along with the custom adapter installed on the Tek 177 standard text fixture.

Figure 3 Custom toggle-type SMD adapter for the Tek 577 where using the pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

These clamps could be repurposed to act as a clamp to hold a SMD DUT in place, which resulted in a custom PCB being developed to mount directly on top of the ZIF-based PCB previously discussed (Figure 4).

Figure 4 The custom SMD PCB that can be used with toggle clamps. This can be installed on the Tek 177 fixture for the Tek 577.

The toggle arms allow slight pressure to be applied to the SMD DUT where the leads make contact with the PCB’s exposed surfaces. Using a pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

A connector on the rear of the PCB is mounted on the bottom side and mates with another connector on the ZIF type PCB, which allows connection to the 6 banana jacks that plug into the Tek 177 Fixture. Four nylon standoffs provide mechanical support and hold the two PCBs together. This setup allows easy SMD component installation and removal with little effort. Figure 5 shows both adapters for the Tek 577 with 177 standard test fixture.

Figure 5 Both adapters for the Tek 577 with 177 standard test fixture.

Both the ZIF and the SMD Adapters have served well and allow most components to be easily evaluated with the old Tektronix 576 and 577 curve tracers. Figure 6 shows the custom toggle-type SMD adapter in action with pair of DUTs.

Figure 6 Custom toggle-type SMD adapter in operation with pair of DUTs.

A word of caution

Just a word of caution when using these and any adapters, fixtures, or leads with the Tek 576 and 577 curve tracers: these instruments can produce lethal voltages across the exposed terminals. The Tek 177 standard test fixtures were originally supplied with plastic protective covers and sensor switches which removed the DUT stimulus when the plastic cover was open. In the old Tek service manuals, there was a modification method to defeat the Tek 177 sensor switch which many engineers employed, and many also removed the plastic protective covers.

Anyway, I hope some folks lucky enough to have an old Tek 576 or 577 curve tracer with Tek 177 standard test fixture find these custom DIY adapters useful if they don’t already have the old Tek OEM elusive adapters!

Michael A Wyatt is a life member with IEEE and has continued to enjoy electronics ever since his childhood. Mike has a long career spanning Honeywell, Northrop Grumman, Insyte/ITT/Ex-elis/Harris, ViaSat and retiring (semi) with Wyatt Labs. During his career he accumulated 32 US Patents and in the past published a few EDN Articles including Best Idea of the Year in 1989. All posts by Mike Wyatt below:

References

1. “EEVblog Electronics Community Forum.” SMD Test Fixture for the Tektronix 576 Curve Tracer – Page 1, www.eevblog.com/forum/projects/smd-test-fixture-for-the-tektronix-576-curve-tracer/.

Related Content

• Tracing a transistor’s curves
• Throw it a curve (tracer)
• Trace voltage-current curves on your PC
• Using oscilloscope X-Y displays

The post DIY custom Tektronix 576 & 577 curve tracer adapters appeared first on EDN.

In recent years, the proliferation of unmanned aerial vehicles (UAVs) has necessitated the development of robust counter-drone technologies to address security concerns. India, recognizing this imperative, has seen a surge in companies specializing in anti-drone systems.

This article highlights ten leading Indian manufacturers at the forefront of this critical sector, detailing their technological innovations and contributions.

1. Zen Technologies

Established in 1993, Zen Technologies has been a pioneer in defense training solutions and has expanded into anti-drone technologies. Their comprehensive anti-drone system encompasses detection, tracking, and neutralization capabilities. Utilizing radar, radio frequency (RF) sensors, and electro-optical systems, Zen’s solution can detect and track multiple drones simultaneously. For neutralization, they offer both ‘soft kill’ options, such as RF jamming to disrupt drone communications, and ‘hard kill’ measures, including kinetic systems to physically eliminate threats. Notably, Zen Technologies provides a net-based drone capture mechanism, deploying a dedicated drone equipped with a hanging net to intercept and secure rogue UAVs safely.

2. Bharat Electronics Limited (BEL)

A state-owned enterprise, BEL has collaborated with the Defence Research and Development Organisation (DRDO) to produce an advanced anti-drone system. This system is capable of real-time detection, tracking, and neutralization of micro and small UAVs. It integrates radar, RF detectors, and electro-optical sensors to provide comprehensive situational awareness. The neutralization suite includes both ‘soft kill’ options, like jamming the drone’s communication and navigation signals, and ‘hard kill’ solutions, such as laser-based directed energy weapons to destroy the target.

3. Alpha Design Technologies

Specializing in electronic warfare systems, Alpha Design Technologies has developed advanced solutions to counter UAV threats. Their anti-drone systems are designed to detect, track, and neutralize unauthorized drones using a combination of radar, RF monitoring, and electro-optical tracking. The neutralization methods include jamming and spoofing techniques to disrupt the drone’s control and navigation systems, effectively mitigating potential threats.

4. Adani Defence & Aerospace

A significant player in India’s defense sector, Adani Defence & Aerospace is actively engaged in developing counter-drone technologies. Their approach focuses on creating integrated systems that combine detection and neutralization capabilities. Utilizing radar and RF sensors for detection, their systems can identify and track multiple drone threats. For neutralization, they employ electronic countermeasures to disrupt drone operations, ensuring the protection of critical infrastructure and airspace.

5. Indo Wings Private Limited

As one of India’s fastest-growing drone and anti-drone manufacturers, Indo Wings specializes in advanced UAVs and counter-UAV systems. Their anti-drone solutions are equipped with sophisticated detection technologies, including radar and RF sensors, to identify and track unauthorized drones. Neutralization is achieved through electronic jamming and other countermeasures, effectively addressing potential threats in various environments.

6. Hindustan Aeronautics Limited (HAL)

A state-owned aerospace and defense company, HAL is developing artificial intelligence-driven advanced drones and counter-drone systems for strategic missions. Their focus includes creating solutions capable of operating in high-altitude areas, addressing security challenges along India’s frontiers. HAL’s anti-drone technologies aim to detect and neutralize UAV threats, enhancing the country’s defense capabilities.

7. Paras Aerospace

A subsidiary of Paras Defence and Space Technologies, Paras Aerospace offers a range of UAVs and counter-drone solutions. Their anti-drone systems are designed to detect and neutralize rogue drones using advanced sensor technologies and electronic countermeasures. These systems are suitable for protecting critical infrastructure, public events, and sensitive areas from unauthorized drone activities.

8. Kadet Defence Systems

Specializing in defense technologies, Kadet Defence Systems has developed anti-drone solutions focusing on detection and neutralization. Their systems utilize radar and RF sensors to detect unauthorized drones and employ jamming technologies to disrupt their operations. These solutions are designed to protect military installations, government facilities, and other critical assets from potential drone threats.

9. Throttle Aerospace Systems

Throttle Aerospace Systems has developed the ‘Defender,’ an innovative anti-drone platform that employs vision-based techniques and artificial intelligence. The Defender is capable of actively tracking and neutralizing rogue drones weighing up to 5 kg. This system enhances security by providing an effective solution to counter unauthorized UAVs in various environments.

10. DSE Technologies Pvt. Ltd.

DSE Technologies has secured projects for high-end tactical drone detection and neutralization systems. Their solutions offer both ‘soft-kill’ and ‘hard-kill’ options, emphasizing their expertise in security solutions for Indian forces and national security agencies. These systems are designed to detect, track, and neutralize unauthorized drones, ensuring the protection of critical assets and airspace.

 

India’s anti-drone industry is rapidly evolving, with these companies leading the charge in developing advanced technologies to counter the growing threat of unauthorized UAVs. Through continuous innovation and collaboration, they are enhancing the nation’s security infrastructure and contributing to global counter-drone capabilities.

The post Top 10 Anti Drone Manufacturers in India appeared first on ELE Times.

The drone industry in the United States has witnessed remarkable growth, driven by startups pioneering advancements across various sectors. From defense and agriculture to public safety and logistics, these companies are redefining the capabilities of unmanned aerial systems (UAS).

This article highlights ten leading U.S.-based drone startups, delving into their innovative technologies and contributions to the industry.

1. Anduril Industries

Founded in 2017, Anduril Industries specializes in AI-driven surveillance and reconnaissance solutions for the defense sector. Their flagship product, the Lattice platform, integrates sensor fusion, machine learning, and mesh networking to provide autonomous monitoring and control of defense assets. Additionally, Anduril has developed the Ghost drone, an autonomous single-rotor UAV controllable via web platforms or mobile applications, enhancing situational awareness in complex environments.

2. Skydio

Established in 2014, Skydio is renowned for its autonomous drones equipped with advanced AI and computer vision. Their drones, such as the Skydio 2+, utilize six 4K navigation cameras to construct a 3D map of their surroundings, enabling obstacle avoidance and autonomous navigation even in GPS-denied environments. Skydio’s technology serves various applications, including infrastructure inspection, public safety, and cinematic content creation.

3. Shield AI

Founded in 2015 by former Navy SEAL Brandon Tseng and his brother Ryan, Shield AI focuses on developing AI-powered drones for military applications. Their V-BAT drone is notable for its vertical takeoff and landing (VTOL) capabilities and autonomous navigation without reliance on GPS or remote control. The V-BAT has demonstrated resilience in electronic warfare environments, successfully identifying and aiding in the neutralization of hostile assets.

4. DroneDeploy

Since its inception in 2013, DroneDeploy has become a leading provider of drone software solutions, enabling users to create detailed aerial maps and 3D models. Their platform supports various industries, including agriculture, construction, and mining, by offering tools for real-time data analysis, progress tracking, and resource management. DroneDeploy’s software is compatible with a wide range of drone hardware, providing flexibility for enterprise applications.

5. Epirus

Epirus, established in 2018, specializes in directed energy systems designed to counter unmanned aerial threats. Their flagship product, the Leonidas system, employs high-power microwave technology to disable swarms of drones instantaneously. This compact and mobile system offers a scalable solution for defense against evolving aerial threats, providing protection for critical infrastructure and military assets.

6. Zipline

Founded in 2014, Zipline has revolutionized logistics through autonomous drone delivery services. Initially focusing on medical supply deliveries in remote regions, Zipline has expanded its operations to include commercial partnerships, such as delivering retail products in urban areas. Their drones are designed for long-range missions, capable of operating in diverse weather conditions to ensure timely deliveries.

7. Corvus Robotics

A participant in Y Combinator’s 2018 cohort, Corvus Robotics develops autonomous indoor drones for warehouse inventory management. Their drones navigate complex indoor environments to perform automated inventory scans, reducing the need for manual counts and increasing operational efficiency. Equipped with advanced sensors and AI algorithms, these drones can operate in GPS-denied spaces, providing real-time data to warehouse management systems.

8. Rotor Technologies

Established in 2021, Rotor Technologies focuses on converting traditional helicopters into unmanned aerial systems. Their Sprayhawk model, based on the Robinson R44 platform, is designed for agricultural applications, featuring a 120-gallon spray tank and autonomous flight capabilities. This approach leverages existing aircraft designs, retrofitting them with advanced avionics and control systems to perform tasks such as crop spraying and cargo transport autonomously.

9. BRINC Drones

Founded in 2018, BRINC Drones develops UAVs tailored for public safety and emergency response. Their drones are designed for both indoor and outdoor operations, featuring two-way communication systems, the ability to breach barriers, and payload delivery capabilities. These features enable first responders to assess situations remotely, communicate with individuals in hazardous environments, and deliver essential supplies during emergencies.

10. Unusual Machines

Unusual Machines, based in Florida, specializes in the manufacturing of drone components and systems. In November 2024, the company garnered attention by appointing Donald Trump Jr. to its advisory board, aiming to repatriate drone manufacturing to the United States. This strategic move aligns with broader efforts to reduce dependence on foreign technology and strengthen domestic production capabilities in the drone industry.

 

These startups exemplify the dynamic and rapidly evolving landscape of the U.S. drone industry. Through innovative technologies and applications, they are expanding the horizons of what unmanned aerial systems can achieve across various sectors.

The post Top 10 Drone Startups in USA appeared first on ELE Times.

У співпраці з НАЕК "Енергоатом" Інформація КП пн, 02/17/2025 - 13:00

SPEAG and Rohde & Schwarz expand their long-term collaboration with the combination of the CMX500 wideband radio communication tester with the DASY8-3D utilising the enhanced DASY8 Application Programming Interface. This combination allows manufacturers of wireless devices to perform Specific Absorption Rate tests of 5G FR1 devices using the future-proof CMX500 multi-technology, multi-channel one-box signaling tester.

SPEAG, a global leader of dosimetric test systems, has combined the CMX500 OBT from Rohde & Schwarz with its advanced specific absorption rate (SAR) measurement system, DASY83D. The CMX500 OBT emulates a 5G new radio (NR) FR1 base station, fulfilling the requirements for SAR testing of 5G NR devices and providing ease of use for the test engineer. The CMX500 radio communication tester supports cellular technologies such as LTE, 5G NR, as well as non-cellular technologies like Wi-Fi, all in a single instrument. The latest test feature sets, including state-of-the-art wireless technologies like NR-NTN, 5G RedCap, and Wi-Fi 7, provides a long-term, future-proof callbox platform.

The evolution of wireless technology has enabled the creation of an increasing number of wireless products that function close to the human body. These products range from cell phones and smart watches to AR/XR goggles, all of which need to ensure their SAR values meet the essential regulatory requirements imposed by many countries. For instance, the Federal Communications Commission (FCC) in the USA, Innovation, Science and Economic Development (ISED) in Canada, and the European Union have all established stringent SAR regulations and continuously developed safety standards for decades. Several other countries, including China, Vietnam, and India, have gradually adopted similar market access regulation requirements regarding the SAR of radio equipment in recent years. Globally, numerous regulatory test labs and market surveillance test labs are equipped with SPEAG systems for SAR testing.

The successful collaboration between SPEAG and Rohde & Schwarz is testimony to the long-term strategy of both companies for leadership and innovation in test and measurement applications for the wireless industry.

The post SPEAG combines CMX500 OBT with the DASY83D system for automated SAR testing of 5G NR devices appeared first on ELE Times.

What’s going on at Intel, the largest beneficiary of the U.S. push to onshore chip manufacturing? While the semiconductor industry was still reeling from a Bloomberg report about TSMC in talks for a controlling stake in Intel Foundry at the Trump administration’s request, The Wall Street Journal threw another stunner about Broadcom considering a bid for Intel’s CPU business.

Figure 1 Despite its financial woes, Intel has the largest and most advanced chip manufacturing operation owned by a U.S. company.

Intel, once a paragon of semiconductor technology excellence, has been on a losing streak for nearly a decade. Pat Gelsinger, the company’s overly ambitious former CEO, made an expensive bid to take Intel into the chip contract manufacturing business, which eventually became a liability for the Santa Clara, California-based semiconductor giant.

Meanwhile, it continued to lose market share in its bread-and-butter CPU business to archrival AMD and largely ceded the artificial intelligence (AI) chips boom to Nvidia. In this backdrop, according to Bloomberg, the previous U.S. administration considered Intel Foundry’s merger with GlobalFoundries (GF), which produces older generation chips and abandoned cutting-edge process nodes years ago.

While that was a non-starter, the present U.S. administration seems to have taken a more pragmatic approach by engaging TSMC to take partial ownership of Intel’s fabs, thus throwing a financial lifeline to money-losing Intel. Moreover, TSMC, in full control of its chip manufacturing operations, is expected to bring stability with its highly successful fabrication process recipes.

However, as the Bloomberg report points out, these talks are in an early stage and it’s not clear what’s in it for TSMC. While Taiwanese super fab expressed its lack of interest in Intel’s foundries a few months ago, its about-face on this matter seems to be linked to the current geopolitical turmoil. More details on this matter are expected to emerge in the coming days.

Broadcom eying Intel’s CPU business

The case for Broadcom potentially acquiring Intel’s CPU and related design businesses is less mysterious. The WSJ story claims that Broadcom is studying the possibility of acquiring Intel’s chip design business. If this matures alongside TSMC’s potential takeover of Intel Foundry, it’ll be the end of the road for the Intel brand as we know it.

However, the report clarifies that, like the TSMC matter, Broadcom’s talks regarding Intel are preliminary and largely informal. Furthermore, Broadcom will only proceed if Intel finds a manufacturing partner; here, it’s important to note that Broadcom and TSMC are working separately.

Figure 2 Despite losing market share to AMD and Nvidia, Intel owns a rich array of semiconductor design resources and patents.

The semiconductor industry rumor mill is in full swing, and we are likely witnessing the fall of an American corporate icon in real-time. This is a stark remainder of the semiconductor industry’s hyper competitive nature, which doesn’t spare missteps of even storied companies like Intel.

Intel’s woes are clearly beyond the reflection phase, and the damage done during Gelsinger’s tenure seems irreparable. However, the U.S. administration also sees Intel as an entity critical to national security. Will that be a blessing in disguise or a catalyst for its quick demise? Time will tell.

Related Content

• EU Chips Act: After Theory, Practice
• Intel Will Rely on TSMC for its Rebound
• Intel: Gelsinger’s foundry gamble enters crunch
• Intel Foundry: Leveraging Process Edge for Profit
• Intel Halts Products, Slows Roadmap in Years-Long Turnaround

The post Intel: The disintegration of a semiconductor giant? appeared first on EDN.

The electronics industry is experiencing a significant shift towards more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer significantly improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve excellent robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.

The post New industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density appeared first on ELE Times.

For fiscal second-quarter 2025 (for continuing operations, to 29 December 2024), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $180.5m, down 7% on $194.7m last quarter and 13% on $208.4m a year ago, but slightly above the midpoint of the $160–200m guidance range...