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Aimed at AI/ML applications, Renesas’ RA8P1 MCUs leverage an Arm Ethos-U55 neural processing unit (NPU) delivering 256 GOPS at 500 MHz. The 32-bit devices also integrate dual CPU cores—a 1-GHz Arm Cortex-M85 and a 250-MHz Cortex-M33­—that together achieve over 7300 CoreMark points.

The NPU supports most commonly used neural networks, including DS-CNN, ResNet, Mobilenet, and TinyYolo. Depending on the neural network used, the Ethos-U55 provides up to 35× more inferences per second than the Cortex-M85 processor on its own.

RA8P1 microcontrollers provide up to 2 MB of SRAM and 1 MB of MRAM, which offers faster write speeds and higher endurance than flash memory. System-in-package options include 4 MB or 8 MB of external flash memory for more demanding AI tasks.

Dedicated peripherals and advanced security features support voice and vision AI, as well as real-time analytics. For vision AI, a 16-bit camera engine (CEU) handles image sensors up to 5 megapixels, while a separate two-lane MIPI CSI-2 interface provides a low pin-count connection at up to 720 Mbps per lane. Audio interfaces including I²S and PDM enable microphone input for voice AI. To protect edge AI and IoT systems, the devices integrate cryptographic IP, enforce immutable storage, and monitor for physical tampering.

The RA8P1 MCUs are available now in 224-pin and 289-pin BGA packages.

RA8P1 product page

Renesas Electronics 

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ST’s VIPER11B voltage converter integrates an 800-V avalanche-rugged MOSFET with PWM current-mode control to power smart home and lighting applications up to 8 W. On-chip high-voltage startup circuitry, a senseFET, error amplifier, and frequency-jittered oscillator help minimize external components. The MOSFET requires only minimal snubbing, while the senseFET enables nearly lossless current sensing without external resistors.

As an off-line converter operating from 230 VAC, the VIPER11B consumes less than 10 mW at no load and under 400 mW with a 250-mW load. Under light-load conditions, it operates in pulse frequency modulation (PFM) mode with pulse skipping to enhance efficiency and support energy savings. The controller runs from an internal VDD supply ranging from 4.5 V to 30 V.

Housed in a compact 10-pin SSOP package, the converter conserves space—especially in designs with strict form factors like LED lighting drivers and smart bulbs. It’s also well suited for home appliances, low-power adapters, and smart meters. The device includes output overload and overvoltage protection with automatic restart, along with VCC clamping, thermal shutdown, and soft-start features.

In production now, VIPER11B voltage converters are priced from $0.56 each in lots of 1000 units.

VIPER11B product page

STMicroelectronics

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Designed for automotive use, Murata’s 50-V multilayer ceramic capacitor (MLCC) delivers higher capacitance in a compact 0805-size (2.0×1.25-mm) SMD package. With a rated capacitance value of 10 µF, the GCM21BE71H106KE02 ranks among the smallest in its class.

The capacitor operates on 12-V automotive power lines while conserving PCB space and reducing the overall capacitor count. It delivers approximately 2.1 times the capacitance of Murata’s earlier 4.7-µF/50-V model in the same 0805 footprint. Compared to the previous 10-µF/50-V MLCC in the larger 1206 size (3.2×1.6 mm), it occupies about 53% less board area, offering significant space savings for automotive designs.

The GCM21BE71H106KE02 10-µF/50-V capacitor in the 0805 package is now in production. Use the product page link below to request samples, get a quote, or check availability.

GCM21BE71H106KE02 product page

Murata Manufacturing 

The post MLCC saves board space in vehicle designs appeared first on EDN.

Rohm has introduced the BM6GD11BFJ-LB, an isolated gate driver optimized for 600-V-class GaN HEMTs in industrial equipment such as motors and server power supplies. When paired with GaN transistors, the single-channel driver maintains stable operation under high-frequency, high-speed switching conditions.

The device ensures safe signal transmission by galvanically isolating the control circuitry during switching events with fast voltage rise and fall times. Its 4.5-V to 6.0-V gate drive range and 2500-Vrms isolation rating support a broad selection of high-voltage GaN devices, including Rohm’s 650-V EcoGaN HEMT. Low output-side current consumption—0.5 mA maximum—helps reduce standby power and improve overall system efficiency.

The BM6GD11BFJ-LB uses proprietary on-chip isolation to reduce parasitic capacitance, enabling high-frequency operation up to 2 MHz and reducing external component count. Enhanced CMTI of 150 V/ns—reportedly 1.5× higher than conventional products—prevents malfunctions during fast GaN switching. A reduced minimum pulse width of 65 ns improves duty cycle control, allowing stable, efficient operation at higher frequencies.

The BM6GD11BFJ-LB isolated gate driver is now available through online distributors including DigiKey and Mouser. Samples are priced at $4 each.

BM6GD11BFJ-LB product page

Rohm Semiconductor 

The post Isolated driver enables fast, stable GaN control appeared first on EDN.

Primemas, a fabless company specializing in SoC Hublets (hub chiplets), is now sampling its Compute Express Link (CXL) 3.0 memory controller. The company is collaborating with Micron through its CXL ASIC Validation Lab (AVL) program to accelerate the commercialization of next-generation CXL controllers compatible with Micron’s advanced DRAM modules.

Hublets are SoC modules in a pluggable chiplet format, offering a range of IP infrastructure, including CPU, network-on-chip bus, memory controllers, and resource schedulers, along with high-bandwidth, low-latency die-to-die interfaces.

Unlike conventional CXL memory expansion controllers constrained by fixed form factors and limited DRAM capacity, Primemas says its chiplet technology offers greater scalability and modularity. Working with Micron, the company aims to deliver a reliable CXL 3.0 controller paired with Micron’s high-capacity 128-GB RDIMM modules.

The semiconductor startup has delivered engineering samples and development boards to strategic customers and partners, who have helped validate the performance and capabilities of its Hublet versus alternative CXL controllers. Building on this early success, Primemas is now ready to ship Hublet product samples to memory vendors, customers, and ecosystem partners.

Learn more about Primemas Hublets here.

Primemas

The post Primemas unveils CXL 3.0 SoC controller appeared first on EDN.

Договір між КПІ та ТОВ "Н-ІКС Делівері" відкриває нові можливості kpi чт, 07/03/2025 - 22:58

In cooperation with Erlangen-based Fraunhofer IISB (Institute for Integrated Systems and Device Technology) and Neuss-based bimanu Cloud Solutions GmbH in Germany, Herzogenrath-based deposition equipment maker Aixtron SE is leading a joint project ‘Increasing Energy Efficiency in SiC Epitaxy’...

Stephen Woodward’s DI, “Flip ON Flop OFF” does a wonderful job for DC voltages. I thought of extending this idea to much-needed AC voltages, as all our gadgets work with AC voltages.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 shows the compact circuitry using a simple counter IC. This circuit utilizes a single push-button (PB) to switch between ON and OFF states for AC voltages. When you push PB once, the output terminal J2 gets 230V/110V AC. For the next push, output at J2 becomes zero. This action continues for subsequent pushes. Accordingly, the gadget connected to J2 will be ON or OFF.

Figure 1 Pushbutton circuit that switches on ON and OFF for AC voltages using electromechanical relay (RL1).

In Figure 1’s circuit, when PB is momentarily pushed once, U1’s(counter 4024) Q1 goes HIGH, counting one input pulse, which makes the Darlington pair Q1 and Q2 conduct. Relay RL1 gets energized. Its NO contact closes and passes 230V/110V AC connected to J1 to J2. The gadget connected to J2 turns ON.

When you push PB again, the second pulse is generated and counted by U1. It’s Q1 (LSB of counter) becomes LOW, making Q1 and Q2 OFF. The relay gets de-energized, and the AC voltage to J2 gets disconnected, making the gadget turn off. R2 and C2 are for the power-on reset of U1.

If you prefer not to use an electromechanical relay, a solid-state relay can be used, as shown in Figure 2. In this circuit, when you push PB once, the Q1, Q2 pair starts conducting, current flows through the LED of U3, an optically coupled TRIAC, causing it to conduct. Due to this, U4 TRIAC conducts, passing 230V/110V to J2. When you push PB again, the Q1, Q2 pair opens, stopping current flow through the LED of U3. The TRIACs of U3 and U4 stop conducting, disconnecting power to J2.

Figure 2 Circuit switches AC power on and off for output-connected gadgets using a solid-state relay formed by U3 and U4.

Jayapal Ramalingam has over three decades of experience in designing electronics systems for power & process industries and is presently a freelance automation consultant.

Related Content

• Flip ON Flop OFF
• To press ON or hold OFF? This does both for AC voltages
• Elaborations of yet another Flip-On Flop-Off circuit
• Flip ON flop OFF without a flip/flop

The post Push ON, Push OFF for AC voltages appeared first on EDN.

Участь КПІ ім. Ігоря Сікорського у HR Wisdom Summit 2025 KPI4U-2 чт, 07/03/2025 - 16:21

When gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA announced a strategic partnership for Taiwanese foundry Powerchip Semiconductor Manufacturing Corp (PSMC) to start production of 100V GaN products on 200mm silicon wafers in first-half 2026, this includes Navitas’ 650V devices transitioning from its existiing sole GaN-on-Si wafer foundry supplier Taiwan Semiconductor Manufacturing Company Ltd (TSMC) to Powerchip over the next 12–24 months...

📰 Газета "Київський політехнік" № 27-28 за 2025 (.pdf) Інформація КП чт, 07/03/2025 - 15:00

Mouser Electronics Inc (a Berkshire Hathaway company) has announced a global distribution agreement with Ampleon B.V. of Nijmegen, The Netherlands, which manufactures radio frequency power devices based on gallium nitride (GaN) and LDMOS technologies. Ampleon says that its portfolio offers flexibility in scaling design and production for any volume and addresses a wide range of applications, including 5G infrastructure, industrial, scientific & medical (ISM), navigation, broadcast communications, and safety radio...

Антикорупційний квест 2.0 — “Вибір за вами” kpi чт, 07/03/2025 - 11:43

Murata company pSemi Corp of San Diego, CA, USA – a fabless provider of radio-frequency (RF), analog and mixed-signal solutions – has announced leadership changes and organizational restructuring to support its evolving business strategy and future growth...

Less than a month after Qualcomm announced its acquisition of Alphawave Semi, another chiplet deal is in play. Artificial intelligence (AI) chip developer Tenstorrent has snapped up Blue Cheetah Analog Design after licensing its die-to-die (D2D) interconnect IP for AI and RISC-V chiplet solutions.

Blue Cheetah was founded in 2018 with an initial investment from Marvell co-founders Sehat Sutardja and Weili Dai and their pioneering vision for chiplets. Its BlueLynx D2D interconnect subsystem IP provides physical (PHY) and link layer chiplet interfaces compatible with both Open Compute Project (OCP) Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) standards.

Blue Cheetah also brings a wealth of analog mixed-signal expertise in developing D2D, DDR, SerDes, and other technologies critical in chiplet design. It’s co-founder and CEO Elad Alon is an expert in analog and mixed-signal design. He is also the technical lead of the Bunch of Wires PHY standard.

In addition to chiplet designers, Blue Cheetah offers chiplet interconnect IP solutions to various foundries and process nodes. Earlier this year, it announced the successful tape-out of its BlueLynx D2D PHY on Samsung Foundry’s 4-nm SF4X process node.

The latest version of BlueLynx PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps. As a result, the BlueLynx subsystem IP enables chip architects to meet the bandwidth density and environmental robustness necessary to ensure successful production deployment.

Qualcomm’s acquisition of Alphawave Semi and Tenstorrent buying Blue Cheetah mark an important step in the consolidation of the chiplet ecosystem. With the acquisition of Blue Cheetah, Tenstorrent will gain in-house capabilities for advanced interconnects and other analog and mixed-signal components.

Will 2025 be the year of chiplets? Are there more chiplet acquisitions in the works? There are several chiplet upstarts, such as Baya Systems and Chipuller, and likely, larger semiconductor outfits are currently eyeing them to acquire chiplet design capabilities.

Related Content

• Tony Pialis: A SerDes technology design veteran
• Chiplets advancing one design breakthrough at a time
• Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
• Tenstorrent Shows Off Single-User LLM Speed For Workstation
• Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
• Qualcomm’s Alphawave Acquisition Targets Data Centers and AI, But What’s Next?

The post Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree appeared first on EDN.

The rapid advancement of electrification has revolutionized the energy and mobility sectors and provides decisive impulses for industry and society. Power electronics is the indispensable driver of this transformation. With the acquisition of ZES ZIMMER Electronic Systems GmbH, Rohde & Schwarz complements its broad T&M portfolio.

In the constantly changing market environment of the past few decades, ZES ZIMMER Electronic Systems GmbH has managed to achieve continuous growth through innovative solutions and products. The ZES ZIMMER Electronic Systems GmbH portfolio will contribute to expanding the market position of Rohde & Schwarz in the field of power electronics. The family owned company in Hesse with around sixty employees will be fully integrated into the Rohde & Schwarz group. The location will be retained and will continue to be used for power measurement equipment.

For Christina Geßner, Executive Vice President Test & Measurement Division, the acquisition is an important next step that contributes to the sustainable growth strategy of the global technology group: “Both Rohde & Schwarz and ZES ZIMMER Electronic Systems GmbH are privately owned companies with a long tradition. A passion for technology and innovation has always been in the DNA of both our companies. The acquisition will further strengthen our position as a relevant and reliable technology partner for our customers in the field of power measurements, create synergies and generate further growth.”

ZES ZIMMER Electronic Systems GmbH has been an established name in the power measurement market for more than 40 years and not only has a broad customer base but also a strong sales network. The privately-owned company’s exceptionally strong product portfolio supports a wide range of industry-leading use cases and applications, particularly in the electromobility, industrial electronics and renewable energy sectors. The future consolidation and bundling of expertise and portfolios represent a significant expansion of the Test & Measurement Division’s existing offering in the field of power electronics.

Dr. Conrad Zimmer, Managing Partner of ZES ZIMMER Electronics Systems GmbH, says: “Decarbonisation and electrification of various industries will have a major impact on the demand for power electronics and power measurements in the coming decades. A merger with Rohde & Schwarz will allow ZES ZIMMER to make the best use of these growth opportunities. Georg Zimmer founded the company in 1980, and over the last four decades, the employees have built a company with a passion for technology and engineering, whose products are known and appreciated worldwide. I thank our customers for their trust in the company and its products, and all our employees for their dedication and loyalty, and I believe that as a privately-owned company that thinks long term, Rohde & Schwarz will continue the success story of ZES ZIMMER.”

The complete takeover of ZES ZIMMER Electronic Systems GmbH into the Rohde & Schwarz group is an important building block in the long-term growth strategy. At the same time, Rohde & Schwarz is expanding its development capacity with the acquisition and strengthening Germany as an industrial and technological powerhouse.

The post Rohde & Schwarz acquires ZES ZIMMER Electronic Systems GmbH and expands its T&M portfolio for power electronics appeared first on ELE Times.

Designed for Permanent Contact With Variety of Liquids, AEC-Q200 Qualified Device Eliminates the Need for Costly Wire to Wire Connectors

Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified NTC immersion thermistor. Featuring a miniature design with a compact sensor tip and thin insulated wire, the Vishay BCcomponents NTCAIMM66H is ideal for the small spaces of liquid-cooled automotive systems, where it provides a fast 1.5 s response time to temperature changes.

The rugged device released consists of a miniature NTC thermistor mounted in a stainless steel 316L housing with lead (Pb)-free brass, and 0.35 mm² AWG#22 insulated lead wires with a FLR2X construction that enables a traction force higher than 30 N. These wires allow for direct crimping with automotive connectors eliminating the need for costly wire to wire connectors while the stainless-steel housing enables permanent contact with water or other liquids.

The NTCAIMM66H will be used for temperature measurement, sensing, and control in liquid-cooled automotive systems such as HEV/EV on-board chargers (OBC) and charging plugs and sockets, in addition to solar heating systems, energy storage systems, industrial drives and tools, and servers. The device can be customized with different cable and stripping lengths, gauges, and conductor plating to meet the need of specific applications, enabling Vishay customers to integrate the thermistor into their complete sensor solutions for HEV / EV thermal management systems (TMS).

The immersion sensor offers resistance at +25 °C (R25) of 10 kΩ, with tolerance of ± 2 %, and beta (B25/85) of 3984 K, with tolerance of ± 0.5 %. The device features maximum power dissipation of 100 mW and an operating temperature range of -40 °C to +125 °C.

The post Vishay Intertechnology NTC Immersion Thermistor Delivers Fast 1.5 s Response Time for Liquid-Cooled Automotive Systems appeared first on ELE Times.

Empowering Secure and Open Compute Infrastructure with Industry-Leading BMC Solutions

Nuvoton Technology Corporation announced that its latest BMC chip revision, NPCM8mnx, has been officially certified under the Open Compute Project (OCP) Security Appliance Framework Enablement (S.A.F.E.) program. This milestone underscores Nuvoton’s commitment to advancing security, transparency, and collaboration within the server and data center industry.

OCP S.A.F.E. certification affirms that Nuvoton’s NPCM8mnx BMC chip meets the highest standards of hardware and firmware security, openness, and supply chain trust. The certification process includes rigorous evaluation against OCP’s secure boot, firmware integrity, and secure recovery requirements, ensuring readiness for hyperscale deployment.

As part of the certification process, Nuvoton completed a comprehensive security audit conducted by NCC Group, an OCP-approved third-party security review provider. The audit validates the robustness of Nuvoton’s security design and implementation. The NPCM8mnx chip integrates a dedicated security enclave called the Trusted Integrated Processor (TIP). The TIP firmware implements Platform Root of Trust (pRoT) functionality and provides a secure foundation for both the BMC and the platform. TIP is provisioned during chip manufacturing by Nuvoton to embed the customer’s Secure Boot keys and a Unique Device Secret (UDS), used by the DICE (Device Identifier Composition Engine) software stack. This built-in trust anchor is key to enabling robust and scalable platform security in modern data center environments.

The OCP S.A.F.E. certification applies to the NPCM8mnx A3 revision of the TIP ROM code and Cryptography Library. This version introduces Post-Quantum Cryptography (PQC) support, including LMS (Leighton-Micali Signatures) verification for Secure Boot. The A3 ROM supports a hybrid signature scheme, combining LMS with the legacy ECDSA-384 to enhance resilience against both classical and quantum attacks during firmware authentication.

In addition to the OCP S.A.F.E. certification, the previous NPCM8mnx A2 chip revision has already achieved FIPS 140-3 certification, including:

• CMVP certificate
• CAVP listing
• Entropy Source Validation (ESV)

“We’re honored to receive OCP S.A.F.E. certification for our NPCM8mnx BMC chip,” said Uri Trichter, VP of Server Products at Nuvoton. “This validates our long-term commitment to empowering open infrastructure with trustworthy, secure, and high-performance silicon. As the ecosystem advances toward zero-trust architecture, Nuvoton is proud to contribute resilient solutions for hyperscale and enterprise deployments.”

Nuvoton is actively working toward FIPS 140-3 certification for the A3 revision as well, continuing its commitment to meeting stringent global security standards.

The post Nuvoton’s NPCM8mnx BMC Chip Achieves OCP S.A.F.E. Certification appeared first on ELE Times.

Apologies for the messy point to point wiring, thats just how I build circuits on this type of board. The other side has a 20 pin SMD IC soldered to the same wire, and to 2x 10 pin headers, on its own carrier. Turning the chip into a DIP package submitted by /u/aspie_electrician [link] [comments]

My wife spotted a $5 remote control at a Thrift Store/Op Shop so I decided to build Doc Brown's DeLorean remote from Back to the Future (1985). The digits are multiplexed using a 74HC595 shift register but I didn't use a 7-segment BCD display driver because the "6" and "9" digits don't use the top or bottom segments that we are familiar with. The movie was released on the 3rd of July back in good old 1985. submitted by /u/Tominator2000 [link] [comments]