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Altum RF’s MMIC amplifiers are now part of Quantic’s plug-and-play X-MWblocks, enabling seamless integration into RF designs. The modular format streamlines design, evaluation, prototyping, and production for rapid RF and microwave system assembly.

The initial offering includes five of Altum RF’s low-noise and driver amplifiers: ARF1200Q2, ARF1201Q2, ARF1202Q2, ARF1203Q2, and ARF1205Q2. These devices cover frequency bands from 13 GHz to 43.5 GHz, with noise figures as low as 1.6 dB. Additional Altum RF MMICs will join the X-MWblocks platform in the coming months.

Quantic X-Microwave offers a catalog of over 6000 RF components for configuring modules, assemblies, and subassemblies. Find Altum RF products here.

Quantic X-Microwave 

Altum RF

The post Altum amps speed RF design with Quantic blocks appeared first on EDN.

Expanding Qorvo’s GaN-on-SiC SATCOM portfolio, the QPA1722 K-band power amplifier improves Low Earth Orbit (LEO) satellite performance. Qorvo reports the amplifier delivers three times the instantaneous bandwidth and 10% higher efficiency than comparable devices, all within a 38% smaller footprint. These enhancements enable higher data throughput and support more compact, efficient satellite payload designs.

The QPA1722 operates from 17.7 GHz to 20.2 GHz, delivering up to 10 W (40 dBm) saturated and 6 W (37 dBm) linear output power. It provides more than 1 GHz of instantaneous bandwidth to support high data-rate applications, with 36% efficiency for improved power handling and thermal performance. Additional specifications include 26 dB small-signal gain, 35% power-added efficiency, and –25 dBc third-order intermodulation distortion.

Housed in a 6.0×5.0×1.64-mm surface-mount package, the QPA1722 is fully matched to 50 Ω with DC-grounded input and output ports. On-chip blocking capacitors follow the DC grounds at both ports.

The QPA1722 power amplifier is sampling now, with volume production planned for fall 2025. Evaluation kits are available upon request.

QPA1722 product page 

Qorvo

The post Amp elevates K-band throughput for LEO sats appeared first on EDN.

Anritsu has added a simultaneous sweep feature to its ShockLine MS46131A 1-port vector network analyzer (VNA), which operates up to 43.5 GHz. The capability supports parallel 1-port S-parameter measurements across up to four MS46131A units.

Simultaneous sweep enables coordinated triggering through an external signal, aligning the start of sweeps across multiple VNAs. Each unit can be configured independently with different start and stop frequencies, IF bandwidths, and point counts while performing synchronized sweeps.

Well-suited for multi-band, multi-configuration test environments, the MS46131A supports synchronized antenna characterization for LTE and Wi-Fi 7, sub-6 GHz and mmWave 5G (FR2 and FR3), and phased array validation. Remote operation is enabled via SCPI commands over uniquely assigned TCP port numbers, allowing full automation and integration into distributed test systems.

The simultaneous sweep feature is available with software version 2025.4.1 and supported on all MS46131A VNAs.

MS46131A product page 

Anritsu

The post Simultaneous sweep boosts multi-VNA test speed appeared first on EDN.

Powered by an eGaN FET, EPC’s EPC9196 is a 25-A RMS, 3-phase BLDC inverter optimized for 96-V to 150-V battery systems. The reference design targets medium-voltage motor drives, including steering in AGVs, traction in compact autonomous vehicles, and robotic joints.

The EPC9196 is built around the EPC2304, a 200-V, 3.5- mΩ (typical) eGaN FET in a thermally enhanced QFN package. This device enables high-efficiency operation with a peak phase current of 35 A and switching frequencies up to 150 kHz. GaN technology reduces switching losses and dead time, enabling smoother, quieter motor operation even at high PWM frequencies.

Featuring a wide input voltage range from 30 V to 170 V, the EPC9196 integrates gate drivers, housekeeping power, current and voltage sensing, overcurrent protection, and thermal monitoring. The reference design provides dv/dt control below 10 V/ns and supports both sensor-less and encoder-based control configurations. It is compatible with motor drive controller platforms from Microchip, ST, TI, and Renesas.

EPC9196 reference design boards cost $812.50 each and are available from DigiKey. The EPC2304 eGaN FET sells for $3.68 each in reels of 3,000 units.

EPC9196 product page

Efficient Power Conversion 

The post Eval board eases battery motor-drive design appeared first on EDN.

Renesas offers one of the first microcontroller families to support USB-C Revision 2.4 with its RA2L2 group of low-power Arm Cortex-M23 MCUs. The updated USB Type-C cable and connector specification lowers voltage detection thresholds to 0.613  V for 1.5 -A sources and 1.165  V for 3.0-A sources, enhancing compatibility with newer USB-C cables and devices.

Low-power operation makes the RA2L2 MCUs well-suited for portable devices such as USB data loggers, charging cases, barcode readers, and PC peripherals like gaming mice and keyboards. These entry-level MCUs consume just 87.5 µA/MHz in active mode, dropping to 250 nA in software standby. An independent UART clock enables wake-up from standby when receiving data from Wi-Fi or Bluetooth LE modules.

In addition to USB-C cable and connector detection up to 15 W (5 V/3A) and USB Full-Speed support, the MCUs offer a low-power UART, I3C, SSI, and CAN interfaces for design flexibility. The 48-MHz Cortex-M23 core is paired with up to 128 KB of code flash, 4 KB of data flash, and 16 KB of SRAM.

RA2L2 microcontrollers are now available. Samples and evaluation kits can be ordered from the Renesas website and authorized distributors.

RA2L2 product page

Renesas Electronics 

The post MCUs enable USB-C Rev 2.4 designs appeared first on EDN.

The 300 is just an approximation. It might be more, but probably not less. submitted by /u/PhoenixfischTheFish [link] [comments]

Have you ever heard the idiom “ripping off the band-aid? With thanks to Wiktionary for the definition, it means:

To perform a painful or unpleasant but necessary action quickly so as to minimize the pain or fear associated with it.

That’s not what Apple’s doing right now with the end stages of its Intel-to-Apple Silicon transition, which kicked off five years ago (fifteen years, ironically, after its previous announced transition to x86 CPUs, two decades ago). And although I’m (mostly) grateful for it on a personal level, I’m also annoyed by what’s seemingly the company’s latest (but definitely not the first, and probably also not the last) example of “obsolescence by (software, in this case) design”.

Nearing the end of the line for Intel

Upcoming MacOS “Tahoe” 26, publicly unveiled at this week’s Worldwide Developer Conference (WWDC) and scheduled for a “gold” release later this year (September or October, judging from recent history), still supports legacy Intel-based systems, but only four model/variant combos. That’s right; four (and in those few cases still absent any Apple Intelligence AI capabilities):

• MacBook Pro (16-inch, 2019)
• MacBook Pro (13-inch, 2020, Four Thunderbolt 3 ports)
• iMac (27-inch, 2020)
• Mac Pro (2019)

My wife owns the first one on the list, courtesy of a Christmas present from yours truly last year. I’m typing these words on the second one. The other two are the “end of the line” models of the Intel-based iMac and Mac Pro series, both of which subsequently also switched to Apple Silicon-based varieties. Not included, long-time readers may have already noticed, is my storage capacity-constrained 2018 Mac mini; its M2 Pro successor is already sitting on a shelf downstairs in storage, awaiting its turn in the spotlight (that said, I’ll probably cling to my 2018 model longer than I should in conjunction with OpenCore Legacy Patcher, even if only motivated by hacker curiosity and because I’m so fond of the no-longer-offered Space Gray color scheme…).

But let’s go back to the second (also my) system in the previous bullet list. Did it also seem strange to you that Apple specifically referenced the model with “Four Thunderbolt 3 ports”? That’s because Apple also sold a 2020 model year variant with two Thunderbolt 3 ports. If you compare the specs of the two options, you’ll see that there’s at least some tech rationalization for the supported-or-not differentiation; the two-port model is based on a 8th-generation “Coffee Lake” Intel Core i5 8257U SoC, while my four-port model totes a 10th-generation “Ice Lake” Core i5 1038NG7. That said, they both support the same foundation x86 instruction set, right? And the integrated graphics is Intel Iris Plus in generation for both, too. So…

A one-year delay in sentencing for (some of) the Dipert family system stable aside, the endgame verdict for Intel on Apple is now coming into clear view. Apple confirmed that “Tahoe” is x86’s last hurrah; MacOS will be Arm-only beginning with next year’s (2026) spin. The subsequent 2028 edition will also drop Rosetta 2 dynamic software-translation support, so any x86-only coded apps will no longer run. And given these moves, along with Apple’s longstanding tradition of supporting not only the current but also prior two major O/S generations, it would make no sense for any developer to bother continuing to make and support “Universal” versions of apps (dual-coded for both x86 and Arm) once “Tahoe” drops off the support list in 2028…if they even wait that long, that is, considering that the predominant percentage of legacy Intel systems will be incapable of running a supported MacOS variant way before then. This forecast echoes what played out last time, when PowerPC was phased out in favor of x86.

The Liquid Glass interface

The other key announcement at the pre-recorded 1.5-hour keynote that kicked off this week:

which Apple itself condensed down to a 2 minute summary (draw your own “sizzle vs steak” conclusions per my recent comments on Microsoft and Google’s full and abridged equivalents):

involves the Liquid Glass UI revamp which, after conceptually originating with the two-years-back Vision Pro headset, now spans the broader product line. Translucency, rounded corners and expanded color vibrancy are its hallmarks; Apple even did a standalone video on it:

It looks…OK, I guess. On the Vision Pro, the translucency makes total sense, because UI elements need to be not only spatially arranged with respect to each other but also in front of the real-life scene behind them (and in front of the user), reproduced for the eyes by front-facing cameras and embedded micro-OLEDs. But for phones, tablets, watches, and the like…again, it’s OK, I guess. I’m not trying to minimize the value of periodic visual-experience refreshes, mind you; it’s the same underlying motivation behind re-painting houses and the rooms inside them. It just feels not only derivative, given the Vision Pro heritage, but also reactionary, considering that Google announced its own UI refresh less than a month ago (Android 16 is apropos downloading to my Pixels as I type these words, in fact), and Samsung had unveiled its own in January (six months later than originally promised, but I digress).

The iPad (finally?) grows up

There is, however, one aspect of Apple’s UI revamp that I’m very excited about, but which ironically has little (but not nothing) to do with Liquid Glass. For many years now, iPads (particularly the high-end Pro variants) have offered substantial hardware potential, largely untapped by the platform’s unrealized software capabilities. Specifically, I’m talking about Apple’s ham-fisted Split View and Slide Over schemes for (supposedly) unlocking multitasking. Frankly, the only times I ever used either of them were accidental, and my only reaction was to (struggle to figure out how to) undo whatever UI abominations I’d unintentionally activated.

Well, they’re both gone as of later this year. In their place is proper MacOS-like windowing, with menu bars, user customizable window locations and sizes, and the like. Hallelujah. Reiterating a point I’ve made before (although software imperfections blunted its at-the-time reality), Apple will need to be careful to not cannibalize its computer sales by tablet sales going forward. That said, as I’ve also previously noted, if you’re going to get cannibalized, it might as well be by yourself, not to mention that tablets offer Apple more competitive isolation than do computers.

Deep learning (local) model developer access

Apple also this week announced that it was opening up developer access to its devices’ locally housed deep learning inference models for use by third-party applications. Near term, I’d frankly be more enthusiastic about this move if the models themselves were better. That said, given that we’re talking about “walled garden” Apple here, they’re the only game in town, so I guess something’s better than nothing. And longer term, Apple now clearly realizes it’s behind its competitors in the AI race and is revamping its management and dev teams in response (not to mention dissing its competitors in the presumed hope of slowing down the overall market until it can catch up), so circumstances will likely improve tangibly here, in fairly short order.

Too much…too little…just right?

By the way, I’m sure many of you have already noticed the across-the-board naming revamp of the various operating systems to a consistent “dominant model year” approach…i.e. although the new versions will likely all roll out later this year, they’ll be majority-in-use in 2026. Whatever (in all seriousness, the numerical disparity between, for example, current-gen iOS 18, MacOS 15 and WatchOS 11 likely resulted in at least some amount of consumer confusion).

Broadly speaking, while I’m not trying to sound like Goldilocks with the header title of this concluding section of my 2025 WWDC coverage, I am feeling a bit of whiplash. Last year, Apple’s event was bloated with unrelenting AI hype (therefore my title “jab”), much of which still hasn’t achieved even a semblance of implementation reality even a year later (to developer and pundit dismay alike). This year, it felt like the pendulum swung (too far?) in the opposite direction, with excessive attention being drawn to minutia such as newly added gestures for AirPods earbuds and the Apple Watch (not that I can even remember the existing ones!), and no matter that the AI-powered real-time language translation facilities are welcome (albeit predictable).

Maybe next year (and, dare I hope, in future years as well) Apple will navigate to the “middle way” between these extremes. Until then, I welcome your thoughts on this year’s event and associated announcements in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Microsoft Build 2025: Arm (and AI, of course) thrive
• The 2025 Google I/O conference: A deft AI pivot sustains the company’s relevance
• The 2024 WWDC: AI stands for Apple Intelligence, you see…
• The Apple 2023 WWDC: One more thing? Let’s wait and see
• Apple’s 2022 WWDC: Generational evolution and dramatic obsolescence
• Apple’s WWDC 2021: Software and services updates dominate
• Workarounds (and their tradeoffs) for integrated storage constraints

The post The 2025 WWDC: From Intel, Apple’s Nearly Free, and the New Interfaces Are…More Shiny? appeared first on EDN.

Tokyo-based Mitsubishi Electric Corporation says it has developed a compact 7GHz band gallium nitride (GaN) power amplifier module (PAM) with record-breaking power efficiency of 41%. The performance was verified in a demonstration using 5G-Advanced communication signals...

Global smartphone production reached 289 million units in Q1 2025, says market research firm TrendForce. Compared to Q1 2024, the figures represent a 3% decline. However, in China, sales in Q1 were boosted by an ongoing consumer subsidy program...

Факультет інформатики та обчислювальної техніки відкриває дистанційну форму навчання: нові можливості для сучасних студентів kpi чт, 06/12/2025 - 13:19

Imec of Leuven, Belgium has unveiled a gallium nitride (GaN) MOSHEMT (metal-oxide-semiconductor high-electron-mobility transistor) on silicon (Si) that achieves both record efficiency and output power for an enhancement-mode (E-mode) device operating at low supply voltage. In parallel, the firm also demonstrated a record-low contact resistance of 0.024Ω·mm, which is essential to further boost output power in future designs. Imec says that the results mark a crucial step toward integrating GaN technology into next-gen mobile devices, particularly those targeting the 6G FR3 band between 7 and 24GHz. The results are being presented at the 2025 Symposium on VLSI Technology and Circuits in Kyoto, Japan, June 8-12...

Відкрита наука для ЗВО: КПІ ім. Ігоря Сікорського презентував інституційний інструментарій на семінарі в Любляні kpi чт, 06/12/2025 - 12:23

Anritsu expands its signal generator product line with the introduction of the EcoSyn Lite Microwave Synthesizer Module that delivers outstanding phase noise, ultra-fast switching speed and compact size. EcoSyn Lite compliments Anritsu’s high performance RubidiumTM bench top signal generators to address a wide range of signal generator applications.

EcoSyn Lite covers 10 MHz to 20 GHz frequency range and delivers +18 dBm output power. Housed in a portable, compact 4 inch x 4 inch x 0.8 inch form factor ideal for use in space constrained applications which require instrumentation grade CW signal source.

Instrument Class Phase Noise in Module Form Factor

EcoSyn Lite features best in class phase noise performance of -126 dBc/Hz (typical) at 10 GHz and 10 kHz offset, that compares favorably with some of the bench top signal generators in the market today. With its robust output power of up to +18 dBm it is ideal as LO for up/down converters in RF/Microwave transceivers. These transceivers increasingly use complex and high order modulation signals which require LOs with low phase noise for up/down conversion. EcoSyn Lite’s superior non-harmonic spurious of -60 dBc delivers very low jitter and can be used as a clock source for Gbit ADC/DAC testing and in high-speed optical systems.

Ultra-fast Frequency Switching Speed

EcoSyn Lite has ultra-fast frequency switching time of less than 50 µs in Triggered list mode. In ATE (Automatic Test Equipment) application, fast frequency switching speed saves testing time. Shorter test times translate to higher test throughput thus achieving less test cost. Ultra-fast switching time and small form factor makes EcoSyn Lite ideal in ATE rack applications.

Switching speed can also be critical in radar cross section (RCS) measurements necessary to establish radar signatures for known targets, such as aircraft, ships, and missiles. These signatures are created through measurements at thousands of frequencies. Because of the total numbers of measurements that must be made, EcoSyn’s ultra fast switching time can save considerable measurement time. Testing an antenna also requires large amounts of data at multiple frequencies. EcoSyn Lite’s ultra-fast switching speed can save a lot of testing time.

Efficient, compact and Easy to Automate

EcoSyn Lite synthesizer modules are housed in portable, compact 4 in x 4 in x 0.8 in form factor which enables them to be used in space constrained applications which require instrumentation grade CW signal source. It supports USB and SPI interfaces for remote control and is powered using a +12 VDC source.

EcoSyn Lite supports standard SCPI and QuickSyn native commands which make developing scripts to remotely control and automate very easy and user friendly.

The post Anritsu Introduces EcoSyn Lite MG36021A Microwave Synthesizer Module Outstanding Phase Noise, Ultra-fast Switching Speed and Compact Size appeared first on ELE Times.

The Central government has introduced major reforms to Special Economic Zone (SEZ) Rules to push India’s aspirations in semiconductor and electronics manufacturing, with the aim of drawing global investments and minimizing procedural bottlenecks for high-tech sectors. The Ministry of Commerce & Industry said that these measures are going to change India’s industrial policy scenario where SEZs shall henceforth be more accessible and investment-friendly.

Major Policy Changes to SEZ Norms

Amendment on Rule 5 of the SEZ Rules, 2006, is among the landmark reforms, which includes the minimum land size to be established for a semiconductor or electronic component-specific SEZ being curtailed from 50 hectares to just 10. This is expected to benefit the smaller yet highly potential players and thus fast-track building advanced manufacturing hubs.

Another important change is Rule 7, which gives more latitude in acquiring and using land. There will no longer be an encumbrance-free clause attached to mortgaging or leasing land to federal or state government agencies. This will ease a significant regulatory hurdle faced by developers and investors.

In Rule 53, a new method to compute Net Foreign Exchange (NFE) has been introduced so as to include goods being received or supplied free of cost, if such valuation is carried out as per the customs valuation norms. This will align India’s SEZ policy with global best practices and allow easier trade reporting by SEZ units.

On the other hand, Rule 18 has been amended to enable the sale of goods from SEZs into the Domestic Tariff Area (DTA) on payment of the applicable duties. This upgrade will offer enhanced flexibility to the SEZ manufacturers, as well as improve viability of commercial operations by extending market access across the country.

Focus on Capital-Intensive, Long-Gestation Sectors

These strategic reforms notified by the Department of Commerce on June 3, 2025, will be targeted toward industries with higher capital investment needs and long development time frames-such as semiconductor fabrication and advanced electronics.

By minimizing the compliance cover and raising operational flexibility, the government would like to induce global majors and homegrown innovators to invest in the evolving high-tech landscape in India.

The policy shift would also aid job creation, particularly in areas, that are highly skilled. Amongst the jobs created would be those requiring skills in chip design, fabrication engineering and electronics system manufacturing.

Early Gains: Two Major SEZ Projects Approved

In a speedy follow-up to the announcement, the Board of Approval for SEZs has cleared two proposals of major import intended to create the desired impact of the reform:

• Micron Semiconductor Technology India Pvt Ltd would construct a semiconductor LRD of SEZ at Sanand, Gujarat, 37.64 hectares in extent, with an investment commitment of ₹13,000 crore. This unit would become one of the biggest nodes in the Indian-chip making landscape.
• The Hubballi Durable Goods Cluster Pvt Ltd, promoted by Aequs Group, would set up an electronics components SEZ at Dharwad, Karnataka, spread over an area of 11.55 hectares, with an investment of about ₹100 crore.

Such approvals speak of the desire of the government to swiftly translate the policy into action and brand India as reliable partner in the global semiconductor value chain.

Strengthening India’s Global Competitiveness

Due to the soaring worldwide demand for semiconductors and electronics as digital transformation and geopolitical realignments take place, India positions itself, almost by way of strategy, as an option for manufacturing. The new SEZ framework enhances ease of doing business and gives credence to India’s claim to become a self-reliant, technology-driven economy.

These are the steps towards building a strong semiconductor ecosystem, one offering innovativeness, resilience and global relevance.

The post Centre Unveils SEZ Reforms to Boost Semiconductor and Electronics Manufacturing appeared first on ELE Times.

Pick and Place Friendly Lead Bending Option Allows Devices to Be Used as SMD Components to Reduce Assembly Costs

Vishay Intertechnology, Inc. announced that its AC03-CS series of axial cemented, leaded wirewound safety resistors is now available with a pick and place friendly lead bending option, the WSZ lead form, which allows the devices to be used as surface-mount components to reduce assembly time and lower costs.

Vishay Draloric AC03-CS series resistors act as inrush current limiting resistors during normal operation and serve as pre-charge, discharge, and snubber resistors. The devices are designed to ensure safe and silent fusing in automotive electronics, energy meters, and power supplies for industrial drives and consumer appliances when high DC voltage overload or accidental AC mains voltage of 120 VRMS / 240 VRMS is applied.

For challenging operating conditions, the devices operate over a wide temperature range from -40 °C to +200 °C and feature a robust, non-flammable silicone cement coating that conforms to UL 94 V-0. This coating allows the resistors to safeguard the PCB and other components by minimizing the risk of fire due to extreme electrical overloads, without the need for additional fuses in series.

The AEC-Q200 qualified AC03-CS series features a high surge voltage capability up to 4 kV (1.2/50 µs pulse per IEC 61000-4-5) and a power rating of 3 W at an ambient temperature of 40 °C. The devices offer resistance from 1 Ω to 100 Ω, resistance tolerance of ± 5 %, and temperature coefficient (TCR) of ± 200 ppm/K. RoHS-compliant, halogen-free, and Vishay Green, the resistors feature tin-plated terminations for compatibility with lead (Pb)-free and lead (Pb)-containing soldering processes.

The post Vishay Intertechnology AC03-CS Series Axial Cemented, Leaded Wirewound Safety Resistors Now Available With WSZ Lead Form appeared first on ELE Times.

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🎥 Міжнародний форум «Інновації у медичній інженерії» і конкурс стартапів kpi ср, 06/11/2025 - 18:06

Recently (5/21/25), I published a Design Idea (DI) describing a bidirectional current mirror using just two transistors and a diode, “A two-way mirror—current mirror that is.”

That circuit works well in some applications, like the one shown in the DI itself, but it nevertheless has limitations due to various error-introducing effects, some of which are described in this reference.

One of the more important factors of these is the “Early effect”, that kicks in to cause significant current imbalance when the voltage drop across the mirror becomes more than a couple of volts. Happily, a fix for the Early effect was devised back in 1967 by George R. Wilson, an IC design engineer at Tektronix. Wilson’s simple yet ingenious fix consisted of adding a third transistor to the basic current mirror, Q3 in Figure 1.

Figure 1 The Wilson mirror improves accuracy despite Early-effect by adding Q3.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Due to Q3, the difference in voltage drop across the active mirror transistors Q1 and Q2 never differs by more than one Vbe, which reduces Early effect error to less than 1%. Figure 2 shows a variation of the basic two-sided current mirror incorporating Wilson’s accuracy-enhancing extra transistor.

Figure 2 A two-way current mirror with Wilson enhancement.

This advantage is exploited in the Figure 3 triangle-wave oscillator to achieve good T-wave symmetry despite as much as 10v being applied across the mirror.

Figure 3 D1, Q3, Q4, and Q5 comprise the two-way Wilson current mirror. It passively conducts Q2’s collector current to C1 via Q3’s base-collecter when OUT versus Vc1 is negative, but becomes an active inverting unity-gain current source when OUT goes positive and reverses the polarity. Keep variable Vin < 4v so Q2 won’t saturate on negative output peaks.

The Wilson mirror is the better choice for Figure 3, but it isn’t always the superior option. That’s because the extra transistor adds an extra Vbe to the minimum voltage drop when the mirror is active. This is no problem for Figure 3 because of its operation from 15v, but would be a deal breaker in the previous DI with its 5v-powered oscillator. Luckily, for the same reason, Early already wasn’t much of an issue there.

Courses for horses?

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• A two-way mirror—current mirror that is
• Use a current mirror to control a power supply
• A comparison between mirrors and Hall-effect current sensing
• Current Mirrors with a DCP offer precision and current gain control
• LED strings driven by current source/mirror
• Current mirror drives multiple LEDs from a low supply voltage

The post A two-way Wilson current mirror appeared first on EDN.

submitted by /u/Separate-Choice [link] [comments]