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Something for all handmade PCB lovers. It's a radio circuit built around TDA7000 chip, with transistor signal amplifier, signal strenght indicator and homemade 1W AB class amplifier with TIP29 and TIP30. It needs it's own casing, as the one in the photo is a prototype with slightly different internal working and messy wiring. There is an internal antenna underneath top cover, but this radio needs proper whip, or better a outdoor dipole to work best. I was able to receive a clear transmission from 150km afar with standard portable radio antenna, but I will make a balcony mounted dipole for maximum fun. I'm completing documentation for this project, so when it will be ready, I will publish it for free for everyone. submitted by /u/ZaznaczonyKK [link] [comments]

The PE42448 SP4T RF switch from pSemi spans 10 MHz to 6 GHz, handling peak power of 52 dBm with IIP3 linearity of 88.5 dBm. The UltraCMOS SOI switch also offers low insertion loss, with typical values of 0.6 dB at 2.6 GHz and 0.7 dB at 3.8 GHz. These characteristics make the PE42448 well-suited for hybrid analog beamforming and 5G massive MIMO systems.

Housed in a 20-lead, 4×4-mm LGA package, the PE42448 offers a compact monolithic alternative to complex RF switch assemblies. Features like single logic control for device pairing and straightforward power sequencing ease integration in beamforming systems, as well as in test, land mobile radio, and general-purpose applications. Additionally, the absence of DC bias on the RF ports eliminates the need for blocking capacitors—simplifying system design.

The PE42448 switch operates with a 5-V supply and 1.8-V control voltage across a temperature range of –40°C to +115°C. Pin-for-pin compatibility with the earlier PE42443 and PE42444 SP4T RF switches enables seamless integration.

PE42448 samples are available now with commercial availability in July 2025.

PE42448 product page 

pSemi

The post SP4T RF switch delivers strong linearity, low loss appeared first on EDN.

ST’s FlightSense 8×8 multizone ToF ranging sensor employs tailored AI algorithms for enhanced human presence detection (HPD) in laptops and PCs. The fifth-generation VL53L8CP reduces power consumption by over 20% with adaptive screen dimming, which tracks head orientation to dim the screen when the user isn’t looking. This also helps extend battery life by reducing unnecessary energy use.

In addition to HPD and multi-person detection, the VL53L8CP supports gesture and hand posture recognition, along with wellness monitoring through human posture analysis. Features such as walk-away lock and wake-on-approach enhance both security and convenience. Unlike webcam-based solutions, the sensor protects user privacy without capturing images or relying on the camera.

With AI-based, low-power algorithms, the VL53L8CP ToF ranging sensor integrates seamlessly into PC sensor hubs, offering a complete hardware and software solution. All FlightSense proximity and ranging sensors include comprehensive documentation, example source code, and software APIs compatible with a wide range of MCUs and processors.

FlightSense product page

STMicroelectronics

The post Smart ToF sensor tracks presence and gestures appeared first on EDN.

Qorvo offers two S-band switched filter bank (SFB) modules that enhance frequency agility and spectral control in defense and aerospace radar systems. The QPB1034 and QPB1036 integrate bulk acoustic wave (BAW) filters and fast-switching logic in a compact 6.0×6.0×0.78-mm surface-mount package.

Optimized for lower S-band frequencies, the QPB1034 provides two switches flanking four filters and a bypass path. The QPB1036 supports broader frequency coverage and higher channel density, incorporating six filters and a bypass. Both modules improve radar system performance with low insertion loss and BAW technology’s high out-of-band rejection.

“Qorvo’s switched filter bank modules enable radar designers to reduce size and complexity without sacrificing performance,” said Dean White, senior director of Defense and Aerospace Market Strategy at Qorvo. “Our BAW technology enables unmatched rejection and channel density in a fully integrated form factor—making these solutions ideal for agile radar front ends.”

Both the QPB1034 and QPB1036 SFB modules are now sampling.

QPB1034 product page 

QPB1036 product page 

Qorvo

The post S-band switched filters sharpen radar agility appeared first on EDN.

Two digital humidity and temperature sensors from Sensirion come in compact DFN packages with removable protective covers for added durability during handling and deployment. With package dimensions of just 1.5×1.5×0.5 mm, the SHT40-AD1P-R2 and SHT41-AD1P-R2 provide accurate measurements in space-constrained applications.

The SHT40-AD1P-R2 delivers ±1.8% RH accuracy (maximum ±3.5%) across 0 to 100% RH, with a response time (τ63%) of 4 s. Temperature accuracy is ±0.2°C, with a response time of 2 s. The SHT41-AD1P-R2 offers the same temperature performance and a tighter maximum RH accuracy of ±2.5%.

Both sensors integrate easily into a wide range of devices and systems via an I²C interface with a fixed 0x45 address. They require a 1.08-V to 3.6-V supply, draw 0.4 µA on average, and operate across a -40°C to +125°C temperature range.

The SHT40-AD1P-R2 and SHT41-AD1P-R2 digital humidity and temperature sensors are now available through Sensirion’s global distribution network.

SHT40-AD1P-R2 product page 

SHT41-AD1P-R2 product page 

Sensirion

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Siemens Digital Industries Software expands Samsung Foundry collaboration, certifying more EDA tools for Samsung’s most advanced process technologies. The certifications cover Samsung’s FinFET and MCBFET processes, spanning 14-nm to 2-nm nodes (SF2/SF2P). Customers can use Siemens’ comprehensive Calibre, Solido, and Aprisa EDA software to design advanced semiconductor devices for manufacture at Samsung Foundry.

The two companies are also deepening their collaboration through joint research efforts and the development of several new solutions aimed at addressing some of the semiconductor industry’s most pressing challenges. As part of this partnership, the companies have introduced innovations that tackle critical design issues in areas such as power integrity, silicon photonics, analog mixed-signal reliability verification, and other essential domains.

Read Siemens’ full announcement about this expansion for more details.

Siemens Digital Industries Software 

The post Siemens certifies EDA tools for Samsung nodes appeared first on EDN.

Applications for using a single pushbutton to advance a circuit to its next logical state are legion. Typically, there are just “on” and “off” states, but there can be more. The heart of the circuit is a toggle flip-flop (or, for more states, a counter or shift register) which responds to a clock transition.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The successful circuit prevents the contact bounce of the mechanical pushbutton from generating more than one “clock” for every push and release of the button. It’s also desirable for the circuit to initialize upon power-up to a specific state and for the press of the pushbutton (from a human point of view) to immediately cause a state change. The basic circuit of Figure 1 has these features.

Figure 1 U1 is a Schottky inverter and U2 a D-type flip-flop. The diodes are small-signal Schottky types. The pushbutton is normally open. See the text for a discussion of resistor and capacitor values.

Upon loss and discharge of the VDD supply, the Schottky diodes discharge C1 and C2 to nearly zero volts. Time constant R1C1 should be at least 10 times larger than the supply turn-on time so that the power-up sequence starts and ends with U2’s Q being cleared.

Also, upon power up, U1’s output starts out as a logic high and transitions low after R2 charges C2. Since U2’s active clocking transition is low to high, this leaves Q initialized low. The R2C2 time constant should be on the order of 1 second.

R3 is optional and limits initial C2 discharge currents when the normally open pushbutton is pressed. If R3 is used, it should be chosen so that momentary contact bounce closures nearly completely discharge C2 in 10 ms or less.

C2 and R2, along with the Schottky inverter U1, work to prevent contact bounce from producing extra transitions, which would otherwise toggle flip-flop U2. After the pushbutton is released and R2 is starting to charge C2, additional button pushes will not toggle U2. This is because the output of U1 is still high and so cannot transition from low-to-high to toggle U2. This is an argument against making the R2C2 time constant too large.

Figure 2 shows how the circuit of Figure 1 can be extended into a multi-state 10-position switch with only one active high output at a time, or into a digital-to-analog converter (DAC).

Figure 2 A 10-position switch with only one active high output at a time, and a DAC are shown.

If fewer than 10 states are desired for the switch, the U2a “D” input can be connected to a different U3 output. For the DAC, resolution can be extended to 12 bits with 12 resistors. Monotonicity will be somewhat less than that, and even with 0.1% resistors, accuracy will be even less than that. To avoid excessive loading of the outputs, no resistor should be less than 10 kΩ.

Christopher Paul has worked in various engineering positions in the communications industry for over 40 years.

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• Another simple flip ON flop OFF circuit

The post Elaborations of yet another Flip-On Flop-Off circuit appeared first on EDN.

📰 Газета "Київський політехнік" № 25-26 за 2025 (.pdf) kpi чт, 06/19/2025 - 16:23

Process equipment maker Applied Materials Inc of Santa Clara, CA, USA and micro/nanotechnology R&D center CEA-Leti of Grenoble, France have announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in AI data centers...

submitted by /u/MrNoName114 [link] [comments]

• New technology delivers more than 20% power consumption reduction per day in addition to improved security and privacy
• ST solution combines market leading Time-of-Flight (ToF) sensors and unique AI algorithms for a seamless user experience

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new Human Presence Detection (HPD) technology for laptops, PCs, monitors and accessories, delivering more than 20% power consumption reduction per day in addition to improved security and privacy. ST’s proprietary solution combines market-leading FlightSense Time-of-Flight (ToF) sensors with unique AI algorithms to deliver a hands-free fast Windows Hello authentication; and delivers a range of benefits such as longer battery lifetime, and user-privacy or wellness notifications.

“Building on the integration of ST FlightSense technology in more than 260 laptops and PC models launched in recent years, we are looking forward to see our new HPD solution contributing to make devices more energy-efficient, secure, and user-friendly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “As AI and sensor technology continue to advance, with greater integration of both hardware and software, we can expect to see even more sophisticated and intuitive ways of interacting with our devices, and ST is best positioned to continue to lead this market trend.”

“Since 2023, 3D sensing in consumer applications has gained new momentum, driven by the demand for better user experiences, safety, personal robotics, spatial computing, and enhanced photography and streaming. Time-of-Flight (ToF) technology is expanding beyond smartphones and tablets into drones, robots, AR/VR headsets, home projectors, and laptops. In 2024, ToF modules generated $2.2 billion in revenue, with projections reaching $3.8 billion by 2030 (9.5% CAGR). Compact and affordable, multizone dToF sensors are now emerging to enhance laptop experiences and enable new use cases,” said Florian Domengie, PhD Principal Analyst, Imaging at Yole Group.

The 5th generation turnkey ST solution
By integrating hardware and software components by design, the new ST solution is a readily deployable system based on FlightSense 8×8 multizones Time-of-Flight sensor (VL53L8CP) complemented by proprietary AI-based algorithms enabling functionalities such as human presence detection, multi-person detection, and head orientation tracking. This integration creates a unique ready-to-use solution for OEMs that requires no additional development for them.

This 5th generation of sensors also integrates advanced features such as gesture recognition, hand posture recognition, and wellness monitoring through human posture analysis

ST’s Human Presence Detection (HPD) solution enables enhanced features such as:

Adaptive Screen Dimming tracks head orientation to dim the screen when the user isn’t looking, reducing power consumption by more than 20%.

Walk-Away Lock & Wake-on-Attention automatically locks the device when the user leaves and wakes up upon return, improving security and convenience.

Multi-Person Detection alerts the user if someone is looking over their shoulder, enhancing privacy.

Tailored AI algorithm
STMicroelectronics has implemented a comprehensive AI-based development process that from data collection, labeling, cleaning, AI training and integration in a mass-market product. This effort relied on thousands of data-logs from diverse sources, including contributions from workers who uploaded personal seating and movement data over several months, enabling the continuous refinement of AI algorithms.

One significant achievement is the transformation of a Proof-Of-Concept (PoC) into a mature solution capable of detecting a laptop user’s head orientation using only 8×8 pixels of distance data. This success was driven through a meticulous development process that included four global data capture campaigns, 25 solution releases over the course of a year, and rigorous quality control of AI training data. The approach also involved a tailored pre-processing method for VL53L8CP ranging data, and the design of four specialized AI networks: Presence AI, HOR (Head Orientation) AI, Posture AI, and Hand Posture AI. Central to this accomplishment was the VL53L8CP ToF sensor, engineered to optimize the Signal-To-Noise ratio (SNR) per zone, which played a critical role in advancing these achievements.

Enhanced user experience & privacy protection
The ToF sensor ensures complete user privacy without capturing images or relying on the camera, unlike previous versions of webcam-based solutions.

Adaptive Screen Dimming:

• Uses AI algorithms to analyze the user’s head orientation. If the user is not looking at the screen, the system gradually dims the display to conserve power.
• Extends battery life by minimizing energy consumption.
• Optimizes for low power consumption with AI algorithms and can be seamlessly integrated into existing PC sensor hubs.

Walk-Away Lock (WAL) & Wake-on-Approach (WOA):

• The ToF sensor automatically locks the PC when the user moves away and wakes it upon their return, eliminating the need for manual interaction.
• This feature enhances security, safeguards sensitive data, and offers a seamless, hands-free user experience.
• Advanced filtering algorithms help prevent false triggers, ensuring the system remains unaffected by casual passerby.

Multi-Person Detection (MPD):

• The system detects multiple people in front of the screen and alerts the user if someone is looking over their shoulder.
• Enhances privacy by preventing unauthorized viewing of sensitive information.
• Advanced algorithms enable the system to differentiate between the primary user and other nearby individuals.

Technical highlights: VL53L8CP: ST FlightSense 8×8 multizones ToF sensor. https://www.st.com/en/imaging-and-photonics-solutions/time-of-flight-sensors.html

• AI-based: compact, low-power algorithms suitable for integration into PC sensor hubs.
• A complete ready-to-use solution includes hardware (ToF sensor) and software (AI algorithms).

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Using the Fiji G2 plasma-enhanced atomic layer deposition (PEALD) system of epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA, the University of Michigan has reported the ALD of molybdenum disulfide (MoS2) using di-tert-butyl disulfide (TBDS) as a replacement for hydrogen sulfide (H2S) (Chemistry of Materials vol 37, issue 4, 11 February 2025)...

The latest DSC devices with specialized peripherals for efficient power conversion target data center power supplies and other complex real-time systems

Evolving security and functional safety demands, coupled with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance with industry standards. To address these challenges, Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller (DSC) families to its dsPIC33A DSC product line. The devices enable the implementation of computation-intensive control algorithms for improved energy efficiency in motor control, AI server power supplies, energy storage systems and complex sensor signal processing with Machine Learning (ML)-based inferencing.

“As AI servers and data centers continue to grow, the need for more efficient power conversion is essential. With specialized peripherals and the high-performance core in the dsPIC33AK512MPS family, developers can now achieve significant energy savings and shrink their power supply footprints,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit. “The new dsPIC33A DSC families are packed with advanced features that enable efficient and reliable designs for modern power conversion, motor control and sensing applications.”

The dsPIC33AK512MPS family delivers precise, high-speed control through industry-leading 78 ps high-resolution Pulse Width Modulations (PWMs) and low-latency 40 Msps ADCs, enabling fast and accurate control loops essential for optimizing the performance of Silicon Carbide (SiC) and Gallium Nitride (GaN)-based DC-DC converters. Additionally, dsPIC33AK512MPS devices include advanced security features, an integrated touch controller and a high pin count of up to 128 pins. The dsPIC33AK512MC family is designed to offer low-latency, 40 Msps ADCs and 1.25 ns PWM resolution, providing a feature- and cost-optimized solution for multi-motor control and complex embedded applications.

The dsPIC33A DSC families, with up to 512 KB Flash and a rich peripheral set, integrate a double precision floating-point unit to accelerate mathematical computations and leverage a 32-bit architecture for seamless adoption of model-based design code. Their enhanced instruction set and Digital Signal Processing (DSP) capabilities, including single-cycle MAC operations and a 200 MHz core speed, make these devices highly efficient for low-latency, real-time control applications. Supported by MPLAB Machine Learning Development Suite, dsPIC33A devices streamline the ML workflow by automating data preparation, feature extraction, training, validation and firmware conversion of optimized models.

“dsPIC33A DSCs from Microchip provide high performance and reliability for complex automotive Electronic Control Units (ECUs),” said Norbert Weiss, managing director at Lauterbach GmbH. “Combined with the support of our latest TRACE32 solutions, we help dsPIC33A DSC customers accelerate their time-to-market using our leading debug and trace tools from the start of the development process.”

With a range of hardware safety features, dsPIC33AK512MPS/MC DSCs are compliant with functional safety standards and are developed in accordance with International Organization for Standardization (ISO) 26262 and International Electrotechnical Commission (IEC) 61508 processes, making them suitable for safety-critical automotive and industrial applications. To further enhance system-level security, the dsPIC33AK512MPS DSC family includes integrated crypto accelerators and a Flash security module, enabling immutable root of trust, secure boot, secure firmware upgrades and secure debug capabilities.

“The combination of dsPIC33A DSCs and our pre-certified safety-critical real-time operating system, SAFERTOS, simplifies the development of safety-critical applications,” said Andrew Longhurst, managing director of WITTENSTEIN high integrity systems (WHIS). “This system level solution empowers our clients to deliver reliable and efficient solutions that meet automotive and industrial safety standards.”

The post Microchip Enhances Digital Signal Controller Lineup with Industry-Leading PWM Resolution and ADC Speed appeared first on ELE Times.

Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has signed a three-year collaborative partnership with the Denmark-based Novo Nordisk Foundation Quantum Computing Programme (NQCP), a research initiative launched by the Novo Nordisk Foundation in collaboration with the Niels Bohr Institute at the University of Copenhagen...

Marktech Optoelectronics Inc of Latham, NY, USA, a vertically integrated designer and manufacturer of optoelectronics components and assemblies, has released its new high-efficiency 25µm-diameter resonant-cavity light-emitting diodes (RCLEDs) with a peak emission at 650nm, which it claims set a new benchmark for performance in precision optical targeting applications...

Hong Kong-based UGREEN (which provides charging accessories) has unveiled the Nexode 500W 6-Port GaN Desktop Fast Charger, which is claimed to be the first 500W gallium nitride (GaN) charger engineered to simultaneously charge six devices with unprecedented power. Combining groundbreaking charging power, intelligent safety systems, and near-universal compatibility, it is built to handle the high-performance demands of professionals, gaming setups, and tech-heavy households...

The R&S FSWP phase noise analyzer and VCO tester from Rohde & Schwarz, the industry standard for phase noise testing, has just received a major performance update. It is the optimal test solution for radar applications and when developing and manufacturing synthesizers, OCXOs, DROs and VCOs. With the new option R&S FSWP-B56G, Rohde & Schwarz has extended the frequency range for absolute phase noise measurements from 50 GHz up to 56 GHz. Done simply by pushing a button, no external converter is needed. These frequencies are needed for satellite communication and for jitter measurements in high-speed digital applications such as ultra-fast LAN IEEE 802.3dj or CEI-224G (Common Electrical I/O).

Speeding up measurements with external high-end signal sources

In addition, the updated R&S FSWP now supports external signal sources as local oscillators for absolute phase noise measurements up to 56 GHz. Using a high-end signal source enables users to get their results much faster, because only a few cross correlations are needed to measure the phase noise of the DUT, such as another high-end oscillator. Depending on the quality of the source, users can measure up to 1000 times faster compared to the internal source. The R&S FSWP provides tuning outputs to lock the signal source frequencies used as local oscillators to the DUT frequency. In this mode, users can measure with one or two external oscillators to get the full advantage using cross-correlation techniques. Alternatively, they can use this mode to measure two identical sources against each other (2 DUT method) and correct the results by 3 dB.

Additive and residual phase noise measurements up to 56 GHz

Equipped with R&S FSWP-B56G option, the instrument is also useful for additive and residual phase noise measurements up to 56 GHz with a frequency offset of 40 MHz on amplifiers or other components. The frequency range of the internal source for this application is now extended to 50 GHz, or up to 54 GHz with the R&S FSWP-B56G option. With external sources users can measure up to 56 GHz.

In addition, the R&S FSWP features a new marker function “NOISE FIGURE MARKER”. Users can measure the noise figure of an amplifier easily, just connecting it between the output of the signal source and input of the R&S FSWP. This easy new method for measuring the small signal noise figure of amplifiers is based just on the phase demodulation same as the phase noise measurement. As the R&S FSWP is equipped with a signal and spectrum analyzer, it delivers both the Y-factor measurement based on noise sources with a calibrated ENR in the spectrum analyzer as well as the new noise figure measurement based on demodulation in the phase noise tester.

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• Exceeds industry and safety standards so engineers can safeguard the integrity of designs
• Built-in graphical charting tools, intuitive interfaces, and standardized menus for quickly uncovering critical insights

Keysight Technologies, Inc. introduces its Smart Bench Essentials Plus, a next-generation portfolio of core bench instruments designed to deliver improved precision and reliability. The new portfolio includes Keysight’s power supply, waveform generator, digital multimeter, and oscilloscope, advanced instruments that are comprehensively tested to meet and exceed industry and safety standards, such as ISO/IEC17025, IEC61010, and CSA.

Electronic designs are increasingly complex, with additional input and output variables, strict interoperability requirements, and rigorous conformance standards. This complexity means basic bench instruments must deliver improved power, expanded channel capacity, and enhanced precision. Development engineers rely on tools to deliver this, in order to perform numerous daily measurements that will enable them to quickly draw meaningful insights and make decisions based on precise measurements.

The new Keysight Smart Bench Essentials Plus meets this challenge with accurate and precise digital multimeters, high signal integrity waveform generators, reliable and responsive DC power supplies, and a very low noise floor oscilloscope. The solutions are designed for lower noise performance, suitable for development engineers who need to design, test, troubleshoot, and qualify electronics designs.

Key benefits of Smart Bench Essential Plus include:

• Minimized measurement errors and precise results: Powered by Keysight Truevolt technology, the new solutions reduce errors from real world factors, delivering improved insights. In addition, the custom ASIC and 14-bit ADC deliver precision and low-noise performance measurements.
• Ensure product quality and compliance: The test instruments are designed and rigorously tested to meet ISO/IEC 17025, IEC61010, and CSA international standards to ensure engineers can develop quality products with precision and reliability.
• Improved productivity: Features visually intuitive, color-coordinated interfaces and standardized menus for ease of use. Built-in graphical charting tools simplify visualization and analysis of test results, while including software streamlines configuration, control, and automation to improve validation time.

Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence at Keysight, said: “R&D engineers face increasing complexity, requiring not only more accurate insights, but tools which can streamline workflows. At Keysight we have thoughtfully designed an integrated solution that can meet this demand, with automation at the core, providing ease of use and shorter time to value. This elevated set of instruments, equipped with proven pro-level measurement technologies, delivers precision and reliability, helping our customers to develop quality products faster.”

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Infineon Technologies AG provides its EZ-USB FX10 and FX5 controllers to CIS Corporation for its new USB 5 Gbit/s and 10 Gbit/s camera. These next-generation devices build on the EZ-USB FX3, a widely adopted USB peripheral controller, by adding support for high-speed USB 10 Gbit/s and LVDS interfaces. This advancement increases total data bandwidth by up to 275 percent compared to the previous generation, enabling significantly faster data transfer and improved system performance.

“We are proud to support CIS in bringing next-generation products to the market with our EZ-USB controllers,” says Ganesh Subramaniam, Senior Vice President of Wired Connectivity Solutions at Infineon. “By combining high data throughput, low power consumption, and flexible connectivity, our solutions enable customers to develop advanced USB 3.2 products with shorter time-to-market and compact form factors. The collaboration with CIS is an excellent example of how our technology is driving innovation in emerging data-intensive applications across various industries.”

The EZ-USB FX10 features dual Arm Cortex-M4 and M0+ cores, 512 KB of flash memory, 128 KB of SRAM, 128 KB of ROM, and seven serial communication blocks (SCBs). It includes a cryptography accelerator and a high-bandwidth data subsystem that enables direct memory access (DMA) transfers between LVDS/LVCMOS interfaces and USB ports at speeds of up to 10 Gbit/s. An additional 1 MB of SRAM supports USB data buffering. The controller also offers USB-C connection detection and flip-mux functionality, removing the need for external logic components. This combination of processing power, interface flexibility, and integrated features supports a wide range of high-speed USB applications.

With the introduction of its new USB 3.2 cameras, CIS aims to expand beyond the industrial image processing market into sectors such as logistics, robotics, medical technology, and life sciences – areas where connectivity, speed, image quality, and compact design are critical. Product samples are already finalized, and mass production is scheduled to begin in July. In addition, CIS is expanding its portfolio with new camera models across multiple resolutions.

“We are developing models with 3M, 5M, 4K/8M, and 20M pixel sensors based on EZ-USB FX5 and FX10,” says Yusuke Muraoka, President of CIS Corporation. “Thanks to Infineon’s support, we expect to complete development in a relatively short time – despite having no prior experience with USB 3.2 technology, which makes this achievement particularly noteworthy.”

The upcoming 4K version of the camera integrates CIS’s proprietary Clairivu image signal processor (ISP). Despite this added complexity, the low power dissipation of EZ-USB FX5 and FX10 allows the device to fit into a compact 29 mm cubic housing – reducing the volume by approximately 50 percent compared to CIS’s previous 4K model. Combined with plug-and-play USB connectivity, this compact design greatly enhances the camera’s versatility and ease of integration.

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Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is excited to announce the launch the 6th edition of its India IoT Technical Roadshow across India. The 2025 edition of this eagerly anticipated event series will begin in Pune on June 20, followed by Ahmedabad on June 27, Chennai on July 11, and Bengaluru on July 17.

The roadshow will bring together design engineers, technology leaders, practitioners, FAEs, EMS, OEMs, and ecosystem enablers to explore the latest advancements in IoT with live demos, technical sessions, and networking opportunities. Our esteemed technology partners – Analog Devices, Littelfuse, Molex, Phoenix Contact, Samtec, Silicon Labs, Taiyo Yuden, Bel Fuse and Würth Elektronik will be on hand to showcase their latest products and solutions.

Daphne Tien, Vice President of Marketing and Business Development for Mouser APAC, shared, “Mouser’s flagship India IoT Technical Roadshow is more than just an event. It is a reflection of our deep belief in India’s dynamic tech landscape that presents immense opportunities for innovation in IoT applications. We are excited to continue this journey, helping engineers innovate, collaborate and bring cutting-edge solutions to life. This year we have curated knowledge-based events in 4 technological hubs of India, with unique themes in each city, to ensure that participants get relevant and actionable insights.”

The event in Pune is being held at Four Points by Sheraton, Viman Nagar, and the theme is Pioneering Automotive Electronics Innovations. In Ahmedabad we will be at the Hyatt with the theme Connecting the Future: Advances in RF, Wireless & Wired Technologies.  The Chennai Roadshow will be held at Hyatt Regency on the theme Building the Future with Efficient Manufacturing. Resilience in Extremes with Rugged Electronics is our theme for Bangalore and the event will be held at The Taj, MG Road.

The roadshow will feature live demonstrations, technical sessions, and interactive discussions focusing on key sectors such as smart manufacturing, automotive and smart cities at every event. Attendees will also have the opportunity to engage with Mouser’s manufacturer partners to gain insights into the latest products and solutions shaping the future of IoT.

Mouser Electronics provides comprehensive design support through its vast technical resource library on engineering topics that will shape the future. You can access exclusive technical information through  Empowering Innovation Together series, eBooks, newsletters and new product emails, and online tools to accelerate your project.

Prior registration for the event is mandatory as seats are limited. Interested participants are encouraged to register for free and secure their spot at https://mouseriotroadshow.electronicsforu.com/

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