Feed aggregator

У КПІ ім. Ігоря Сікорського працюють пункти незламності kpi пт, 01/23/2026 - 17:30

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has secured operating control of Italy-based Orbit S.r.l., a revenue-generating Software-as-a-Service (SaaS) company focused on digitalizing operational resilience, risk intelligence, and mission-critical decision support via its Orbit Open Platform. NUBURU says that the transaction strengthens its security offering capabilities and advances its multi-vertical growth strategy through the addition of a scalable, software-driven operating business...

Hey everyone, I’ve been working on a standalone ECU project for the last couple of years, and I’ve finally got the first proper PCB made and assembled. The ECU side of this is already proven, I’ve been running it on engines for a while using smaller boards hand wired setups (single-cylinder and a four-cylinder). This PCB isn’t me starting from scratch or hoping the logic works, it’s the next step: turning something that already works into a solid, repeatable platform that’s stable, easier to test properly, and easier to keep iterating. The whole idea is a practical ECU built around an ESP32 that I can keep improving without the usual expensive locked-down ecosystem. It’s aimed at bikes and small engines, and the firmware is already doing the real ECU stuff (fuel and ignition control, crank/cam sync, 16x16 maps, launch/ALS logic, telemetry, etc). This board is basically where it stops being a rats nest of wiring and starts becoming an actual unit. the board itself is pretty simple. There’s nothing exotic going on hardware wise, it’s mostly just a clean way to break out signals and do the boring but important bits like input conditioning, ADC, drivers, and power. Honestly 99% of the complexity in this project has been the code and the engine logic. The PCB is mainly about turning that proven setup into a proper platform. (Also for those wondering underside is ground fill between traces) Hardware-wise it’s an ESP32-S3 Mini, an external ADC (MCP3008) for the analog stuff like TPS/MAP/O2, a 74HC14 for cleaning up crank/cam inputs, low-side injector drivers (IRLB3034) with flyback diodes, and a TC4427 driving the ignition outputs. The spark outputs can be jumpered for 5V or 12V depending what you’re trying to trigger, and there’s basic 12V protection plus an onboard 5V rail for sensors/modules. Also, I know an ESP is kind of a cursed MCU choice for an ECU if you look at it purely from a “hardware timers everywhere” perspective. It’s not the obvious route. The sensible/normal choice (and what most platforms use) is STM / STM-based stuff because you’ve got a ridiculous amount of hardware timers and it makes a lot of ECU timing problems feel easy. With the ESP32 you end up having to get creative, sharing limited hardware timer resources with software layers and scheduling, and that’s where a lot of the complexity has come from on my side. But the reason I went ESP is the surrounding ecosystem: the dash connects wirelessly, the power distribution unit connects wirelessly, the tuning app is wireless, telemetry is easy, and it’s all stuff the ESP platform is just good at. So yeah, if anyone’s wondering why I chose the ESP route and made my life harder, that’s basically why. Long term I want this to be an open-source project where people can add whatever features they want, and the ESP ecosystem (and how widely supported it is) makes that way more realistic. This first revision is intentionally big and through hole heavy. That’s on purpose, it’s way easier to probe, rework, and debug when everything isn’t tiny and packed tight. Rev 1 is always where you find the dumb mistakes, and I’d rather find them on a board that’s friendly to work on before I shrink it down and move to SMD later. So far I’ve been going through it section by section and it’s been behaving way better than I expected for a first spin. Bench testing is still continuing though, mainly power stability, noise/EMI behavior, sensor scaling, crank/cam conditioning, and verifying injector and ignition outputs under more realistic conditions. Once I’ve shaken out whatever issues show up, I’ll do a revision 2 to clean up what I find, and after that the plan is to shrink it down and move to SMD so it becomes a smaller, cleaner “real ECU module” style board instead of a big debug-friendly prototype. submitted by /u/Budgetboost [link] [comments]

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has commented on the commercial progress, industry partnerships and solar PV efficiency improvements it achieved in 2025, as the leadership team looks ahead to continued corporate growth in 2026...

An AI-enabled electronic components procurement tool claims to boost OEM productivity by leveraging a software platform that negotiates prices, tracks spending, and monitors savings in real time. It takes your bill-of-materials (BOM) and uploads it to the system while leveraging AI agents to discover form-fit-function compatible parts and more.

ChipHub, founded in 2023, is a components procurement tool that aims to optimize operations and savings for OEMs by addressing the supply chain issues at the system level.

Figure 1 A lack of control on component pricing, availability, and spending matrices makes the supply chain operations challenging. Source: ChipHub

A standard components procurement tool

Envision a procurement platform empowering OEMs to directly engage with suppliers, enhancing control over annual expenditures ranging from millions to billions of dollars. Such a platform streamlines interactions with suppliers, fostering efficient negotiations and monitoring of cost-saving metrics.

A tool that, at a very high level, enables OEMs to negotiate commercial terms directly with suppliers, all on the platform with no emails and spreadsheets. It can support millions of SKUs and thousands of suppliers with four fundamental procurement premises.

1. A scalable platform that facilitates supplier negotiations.
2. It offers risk reduction because the component supplier knows who the end customer is.
3. It employs generative AI to allow technical teams to evaluate devices or specs while extracting information from the datasheet and performing cross-part analysis.
4. It provides record-keeping features to monitor savings for procurement staff.

Enter ChipHub, an AI-driven procurement tool tailored for hardware OEMs. Its agentic system leverages Model Context Protocol (MCP) to enable collaboration between multiple AI agents and humans to deliver the information supply chain professionals need. Features like this help reform component sourcing by offering time and cost efficiencies irrespective of the OEM’s scale.

Next, ChipHub offers the unified marketplace framework (UMF), which helps procurement teams across diverse sectors such as data centers, computing, networking, storage, power, consumer goods, industrial, and automotive. Users can implement UMF in a single day and start monitoring their spending and savings in real time.

Figure 2 The procurement tool enables OEMs to negotiate commercial terms directly with component suppliers and do it right on the platform. Source: ChipHub

Users such as procurement managers use the platform to search specific parts, and the system conducts cross-part analysis to find compatible options, including real-time pricing and inventory data from various ecosystem partners. So, they don’t have to spend hours manually searching for data and building comparison matrices.

The platform uses a system of multiple AI agents, with human oversight, to navigate the supply chain and provide insights into part availability and sourcing options. “We don’t house any parts; we are just enabling supply-based management,” said Aftab Farooqi, founder and CEO of ChipHub.

Do I really know my supply chain? According to Farooqi, that’s the fundamental question for procurement managers. “If they don’t have control and visibility of their supply chain, they could be vulnerable,” he added. He also acknowledged that ChipHub isn’t a solution for all OEMs.

“They could keep doing things the way they are doing,” Farooqi said. “But they can still subscribe to this platform and have it as a validation tool.” For example, OEMs can cross-check the signal integrity analysis of a particular component.

Farooqi added that the platform can also be used by contract manufacturers (CMs) as a key tool for risk reduction because it enables spend tracking and collaboration features on the platform.

Related Content

• Three steps to better procurement
• Software tools manage selection of components
• Semiconductor Supply Chain: The Role of Lean & Muda
• E-Commerce Is the Future of Components Procurement
• Europe’s Semiconductor Supply Chain Unleashes the Power of Diamond

The post Procurement tool aims to bolster semiconductor supply chain appeared first on EDN.

So I got one of those reflex games for Christmas the toy ones, and it was really fun but way too easy. So decided to make my own after seeing the real ones were over $1000!! Almost all the parts used was shit i had laying around like a old Amazon basics fan base and some scrap pvc so don't judge how it looks or my shitty choice to use a small j box. Also id of done almost everything different if I did it over it was just a prototype but this thing sure is fun as shit and I had a decent time figuring out how to make it all work!! submitted by /u/badtxv [link] [comments]

submitted by /u/MetallSimon [link] [comments]

КПІ — серед провідних університетів світу в предметних рейтингах Times Higher Education 2026 kpi чт, 01/22/2026 - 20:19

submitted by /u/Careful-Rich9823 [link] [comments]

Investment in scale up, manufacturing and supply chains, could lead to significant growth and acceleration for UK companies developing photonic integrated circuits (PICs), according to a new report ‘Unlocking the Future with Photonic Integrated Circuits’ by the UK’s Compound Semiconductor Applications (CSA) Catapult (a not-for-profit center of excellence established by Innovate UK in 2018, specializing in the measurement, characterization, integration and validation of compound semiconductor technology spanning power electronics, advanced packaging, radio frequency and microwave, and photonics applications)...

Microchip Technology has expanded its PolarFire FPGA–based smart embedded video ecosystem to enable low-power, high-bandwidth video connectivity. The offering consists of integrated development stacks that combine hardware evaluation kits, development tools, IP cores, and reference designs to deliver complete video pipelines for medical, industrial, and robotic vision applications. The latest additions include Serial Digital Interface (SDI) receive and transmit IP cores and a quad CoaXPress (CXP) bridge kit.

The ecosystem supports SMPTE-compliant SDI video transport at 1.5G, 3G, 6G, and 12G, along with HDMI-to-SDI and SDI-to-HDMI bridging for 4K and 8K video formats. PolarFire FPGAs enable direct SLVS-EC (up to 5 Gbps per lane) and CoaXPress 2.0 (up to 12.5 Gbps per lane) bridging without third-party IP. The nonvolatile, low-power architecture supports compact, fanless system designs with integrated hardware-based security features.

Native support for Sony SLVS-EC sensors provides an upgrade path for designs impacted by component discontinuations. Development is supported through Microchip’s Libero Design Suite and SmartHLS tools to simplify design workflows and reduce development time.

The following links provide additional information on PolarFire smart embedded vision, the CoaXPress bridge kit, and FPGA solution stacks.

Microchip Technology 

The post PolarFire FPGA ecosystem targets embedded imaging appeared first on EDN.

Infineon’s EZ-USB FX2G3 USB 2.0 peripheral controllers provide DMA data transfers from LVCMOS inputs to USB outputs at speeds of up to 480 Mbps. Designed for USB Hi-Speed host systems, the devices also support Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps) operation.

Built on the company’s MXS40-LP platform, EZ-USB FX2G3 controllers integrate up to six serial communication blocks (SCBs), a crypto accelerator supporting AES, DES, SHA, and RSA algorithms for enhanced security, and a high-bandwidth data subsystem with up to 1024 KB of SRAM for USB data buffering. Additional on-chip memory includes up to 512 KB of flash, 128 KB of SRAM, and 128 KB of ROM.

The family includes four variants, ranging from basic to advanced, all featuring a 100-MHz Arm Cortex-M0+ CPU, while the top-end device adds a 150-MHz Cortex-M4F. The peripheral I/O subsystem accommodates QSPI configurable in single, dual, quad, dual-quad, and octal modes. SCBs can be configured as I2C, UART, or SPI interfaces. The devices provide up to 32 configurable USB endpoints, making them suitable for a wide range of consumer, industrial, and healthcare applications.

EZ-USB FX2G3 controllers are now available in 104-pin, 8×8-mm LGA packages.

EZ-USB FX2G3 product page

Infineon Technologies  

The post Controllers accelerate USB 2.0 throughput appeared first on EDN.

Diodes’ API772x RobustISO series of dual-channel digital isolators protects sensitive components in high-voltage systems. The devices provide reliable, robust isolation for digital control and communication signals in industrial automation, power systems, and data center power supplies.

Comprising six variants, the API772x series meets reinforced and basic isolation requirements across various standards, including VDE, UL, and CQC. The parts have a 5-kVRMS isolation rating for 1 minute per UL 1577 and an 8-kVPK rating per DIN EN IEC 60747-17 (VDE 0884-17). Maximum surge isolation voltage is 12.8 kVPK. According to Diodes’ isolation reliability calculations, the devices achieve a predicted operational lifetime exceeding 40 years, based on a capacitive isolation barrier more than 25 µm thick.

RobustISO digital isolators support a range of transmission protocols at data rates up to 100 Mbps. They feature a minimum common-mode transient immunity of 150 kV/µs, ensuring reliable signal transmission in noisy environments. Operating from a 2.5-V to 5.5-V supply, the devices typically draw 2.1 mA per channel at 100 Mbps. The series offers flexible digital channel-direction configurations and default output levels to accommodate diverse design requirements.

Prices for the API772x devices start at $0.46 each in lots of 1000 units.

RobustISO API772x product page

Diodes

The post Digital isolators enhance signal integrity appeared first on EDN.

A 100-V, 200-A MOSFET from Rohm, the RS7P200BM achieves a wide safe operating area (SOA) in a compact DFN5060-8S (5×6-mm) package. The device safely handles inrush current and overload conditions, ensuring stable operation in hot-swap circuits for AI servers using 48-V power supplies.

The RS7P200BM features RDS(on) of 4.0 mΩ (VGS = 10 V, Ta = 25 °C) while maintaining a wide SOA—7.5 A for a 10‑ms pulse width and 25 A for 1 ms at VDS = 48 V. This combination of low on-resistance and wide SOA, typically a trade-off, helps suppress heat generation. As a result, server power supply efficiency improves, while cooling requirements and overall electricity costs are reduced.

Housed in a DFN5060-8S package, the RS7P200BM enables higher-density mounting than the previous DFN8080-8S design. It is now available in production quantities through online distributors including DigiKey and Mouser.

RS7P200BM product page 

Rohm Semiconductor 

The post MOSFET ensures reliable AI server power appeared first on EDN.

The Tronics AXO315T1 MEMS accelerometer from TDK is designed for oil and gas downhole navigation in extreme environments. It features a ±14‑g input range and a 24‑bit digital SPI interface for measurement-while-drilling (MWD) applications exposed to temperatures up to 175°C.

Powered by a unique closed-loop architecture, this single-axis device achieves a tenfold improvement in vibration rejection compared with conventional open-loop MEMS accelerometers. It offers vibration rejection of 20 µg/g², noise density of 10 µg/√Hz, and a bias residual error of 1.7 mg over a temperature range of –30 °C to +175 °C.

The AXO315T1 provides a cost-effective, digital, and low-SWaP alternative to quartz accelerometers for inclination measurement in directional drilling tools. It is rated for more than 1000 hours of operation at 175°C and is housed in a hermetically sealed, ceramic surface-mount package.

AXO315T1 sensors and evaluation boards are available for sampling and customer trials.

AXO315T1 product page

TDK Tronics 

The post Sensor drives accurate downhole drilling appeared first on EDN.

How does a wiggling groove on a rotating record transform into two-channel sonic excellence? It all starts with the turntable cartridge, mated to one of several possible needle types.

Mid-last year, I confessed that I’d headed back down the analog “vinyl” record rabbit hole after several decades of sole dedication to various digital audio media sources (physical, download and streamed). All three turntables now in my possession employ moving magnet cartridge technology; here’s what I wrote back in July in comparing it against the moving coil alternative:

Two main cartridge options exist: moving magnet and higher-end moving coil. They work similarly, at least in concept: in conjunction with the paired stylus, they transform physical info encoded onto a record via groove variations into electrical signals for eventual reproduction over headphones or a set of speakers. Differences between the two types reflect construction sequence variance of the cartridge’s two primary subsystems—the magnets and coils—and are reflected (additionally influenced by other factors such as cantilever constituent material and design) not only in perceived output quality but also in other cartridge characteristics such as output signal strength and ruggedness.

Miny-but-mighty magnets

And here’s more on moving magnet cartridges from Audio-Technica’s website:

Audio-Technica brand moving magnet-type cartridges carry a pair of small, permanent magnets on their stylus assembly’s cantilever. The cantilever is the tiny suspended “arm” that extends at an angle away from the cartridge body. The cantilever holds the diamond tip that traces the record groove on one end and transfers the vibrations from the tip to the other end where the magnets are located. These tiny magnets are positioned between two sets of fixed coils of wire located inside the cartridge body via pole pieces that extend outward from the coils. This arrangement forms the electromagnetic generator.

The magnets are the heaviest part of the moving assembly, but by mounting the magnets near the fulcrum, or pivot point, of the assembly the amount of mass the stylus is required to move is minimized, allowing it to respond quickly and accurately to the motion created by the record groove. In addition to enhancing response, the low effective tip mass reduces the force applied to the delicate record groove, reducing the possibility of groove wall wear and damage. The moving magnet-type cartridge produces moderate to high output levels, works easily into standard phono inputs on a stereo amplifier or receiver and has a user-replaceable stylus assembly. These cartridges have a robust design, making them an excellent choice for demanding applications such as live DJ, radio broadcasts and archiving.

The associated photo is unfortunately low-res and otherwise blurry:

Here’s a larger, clearer one, which I’d found within a tutorial published by retailer Crutchfield:

Inexpensively assuaging curiosity

Ever since I started dabbling with vinyl again, I’d been curious to take a moving magnet cartridge apart and see what was inside. I got my chance when I found a brand new one, complete with a conical stylus, on sale for $18.04 on eBay. It’s the AT3600L, the standalone version of the cartridge that comes pre-integrated with my Audio-Technica AT-LP60XBT turntable’s tonearm:

Here are some “stock” images of the AT3600L mated to the standard ATN3600LC conical stylus (with the protective plastic sleeve still over the needle):

This next set of shots accompanied the eBay post which had caught my eye (and wallet):

And, last but not least, here are some snaps of our dissection patient, first bagged as initially received:

then unbagged but still encased, and as usual (as well as with photos that follow) accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

along with mounting hardware at the bottom:

and finally, free from plastic captivity:

Conical closups and elliptical unpredictability

Next, let’s pop off the stylus and take a gander at its conical needle tip:

along with the cantilever and pivot assembly:

If you’ve already read my July coverage, you know that I’d also picked up an easily swappable:

elliptical stylus, the Pfanstiehl 4211-DE, which promised enhanced sonic quality:

but ended up being notably less tolerant than its conical sibling of any groove defects. Some of this functional variance, I noted back in July, is inherent to the needles’ structural deviations:

Because conical styli only ride partway down in the record groove, they supposedly don’t capture all the available fidelity potential with pristine records. But that same characteristic turns out to be a good thing with non-pristine records, for which all manner of gunk has accumulated over time in the bottom of the groove. By riding above the dross, the conical needle head doesn’t suffer from its deleterious effects.

But, as it turns out, the Pfanstiehl 4211-DE itself was also partly to “blame”. It reportedly works best with turntables based on the standalone AT3600L cartridge, whose tracking force and antiskating settings are both user-adjustable and lighter than those needed (non-adjustable, as well) with the fully integrated AT-LP60XBT turntable.

I resold the barely used Pfanstiehl 4211-DE on eBay and went with Audio-Technica’s (modestly) more pricey ATN3600LE elliptical stylus instead, which explicitly documented its compatibility with the AT-LP60 turntable series and indeed worked notably better with my setup:

Back to the ATN3600LC conical stylus. Two interior views showcase the magnets called out in the earlier concept image:

And here’s where they mate with the cartridge itself (with associated coils presumably inside, to be seen shortly):

Cartridge dissection

Next, let’s remove the screw that holds the top black plastic mounting assembly in place:

One more look at the connections at the back, with markings now visible:

And now, let’s peel away the metal casing, focusing attention on the top-side seam:

With that, the insides come right out:

That was a fun and informative, not to mention inexpensive, project that satisfied my curiosity. I hope it did the same for you. Sounds off with your thoughts in the comments, please!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

Related Content

• Hardware alterations: Unintended, apparent advantageous adaptations
• Mega-cool USB-based turntable
• Assessing vinyl’s resurrection: Differentiation, optimization, and demand maximization

The post Peeking inside a moving magnet phono cartridge and stylii appeared first on EDN.

The post Microchip Introduces 600V Gate Driver Family for High-Voltage Power Management Applications appeared first on ELE Times.

⛩️ Запрошуємо на відкритий турнір Кубка Посла Японії з шьоґі 2026! kpi чт, 01/22/2026 - 11:36

У КПІ відбувся фінал V Всеукраїнського інженерного хакатону SmaRTF kpi чт, 01/22/2026 - 10:24

As India approaches Union Budget 2026–27, multiple industrial sectors—from power and automation to digital infrastructure and electric mobility—find themselves at a critical inflexion point. With the country balancing rapid industrialisation alongside sustainability and energy-transition goals, industry leaders are calling for continued capital expenditure, targeted incentives, and policy stability to strengthen infrastructure depth and global competitiveness.

At the core of these recommendations is the need to reinforce India’s power and grid ecosystem. According to Meenu Singhal, Regional Managing Director, Socomec Group, Greater India, sustained capex allocation, grid modernisation, and deeper indigenisation of critical power equipment will be essential to support rising industrial and digital demand. Industry stakeholders are urging the government to prioritise scalable manufacturing clusters, digitally enabled grid infrastructure, and structural reforms that improve reliability and execution efficiency.

Strategic schemes such as capex support mechanisms, fiscal incentives for local manufacturing, and policies favouring large-scale infrastructure implementation are seen as vital to closing capability gaps across transmission and distribution networks. Equally important, experts stress, is policy consistency and an enabling tax framework that continues to attract both domestic and global capital into the power sector, reinforcing India’s long-term vision of energy security and sustainable growth.

Automation as a Manufacturing Multiplier

Beyond core infrastructure, industrial automation has emerged as a key lever for enhancing India’s manufacturing competitiveness as the economy advances towards the $5-trillion milestone. Sanjeev Srivastava, Business Head – Industrial Automation SBP at Delta Electronics India, highlights that smart factories, AI-driven automation, and closer human–machine collaboration will define the next phase of industrial transformation.

Industry players believe that stronger Budget support in the form of smart manufacturing incentives, R&D-linked tax benefits, and skill-development programmes can significantly accelerate the adoption of next-generation automation technologies. Such measures would help manufacturers improve productivity, reduce operating costs, and strengthen India’s position on the global manufacturing and automation curve.

Also read industry’s recommendations on the Union Budget 2026 at: PCB Duty Cuts to Manufacturing Zones: Top Industry Recommendations for Budget 2026

Digital Infrastructure and Data Centres

As India moves deeper into the 5G, cloud, and AI era, mission-critical digital infrastructure is increasingly being viewed as the backbone of every industry. Pankaj Singh, Head – Data Centre & Telecom Business Solutions at Delta Electronics India, notes that the upcoming Budget presents an opportunity to prioritise energy-efficient and resilient data-centre ecosystems.

Industry recommendations include stronger incentives for modular and containerised data-centre deployments to enable faster rollout of scalable core and edge facilities. There is also a growing emphasis on supporting advanced cooling technologies—such as liquid-to-liquid and liquid-to-air coolant distribution systems—to manage the high thermal loads associated with AI-driven workloads. When complemented with sustainability-linked benefits and Make-in-India incentives for locally manufactured power, cooling, and automation equipment, these measures could encourage OEMs to invest with greater confidence in building a future-ready, low-carbon digital backbone.

Strengthening the EV Manufacturing Base

Meanwhile, India’s electric mobility ecosystem is entering a decisive phase, where long-term resilience and supply-chain stability are becoming as critical as adoption numbers. Bhaktha Keshavachar, Co-Founder & CEO of Chara Technologies, points out that while policy efforts have successfully focused on vehicle adoption and battery localisation, recent global disruptions have exposed vulnerabilities stemming from India’s dependence on imported rare-earth magnet motors.

As Budget 2026 approaches, industry voices are calling for formal recognition and fiscal support for magnet-free motor technologies within existing incentive frameworks. These solutions offer predictable costs, reduced supply-chain risk, and the development of indigenous intellectual property—particularly for high-volume segments such as two-wheelers, three-wheelers, and commercial fleets.

Targeted incentives for rare-earth-free motor manufacturing, stakeholders argue, would not only de-risk India’s EV ambitions but also position the country as a global hub for affordable, resilient, and export-ready EV powertrain solutions.

The Road Ahead

Taken together, these pre-Budget recommendations underline a shared industry priority: building resilient, scalable, and future-ready industrial ecosystems through focused policy support. Whether in power infrastructure, automation, digital systems, or electric mobility, Budget 2026 is widely seen as a pivotal opportunity to reinforce India’s transition towards sustainable growth, technological leadership, and global manufacturing competitiveness.

The post From Power Grids to EV Motors: Industry Flags Key Budget 2026 Priorities for India’s Next Growth Phase appeared first on ELE Times.