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Вартість навчання здобувачів вищої освіти - громадян України (контракт) kpi чт, 05/15/2025 - 23:59

High-reliability power semiconductor solutions provider CISSOID of Mont-Saint-Guibert, Belgium and EDAG Group of Wiesbaden, Germany (an independent engineering services provider for the mobility industry) have announced a strategic partnership to accelerate the development of next-generation silicon carbide (SiC) traction inverters for electric mobility applications...

What function does a capacitor auto-discharger perform in a power supply circuit, and how does it work? What are its fundamental building blocks, and can engineers develop a capacitor auto-discharge module on their own? What are basic considerations for component selection? T. K. Hareendran provides answers to these questions in his profile story for this design circuit.

Read the full article at EDN’s sister publication, Planet Analog.

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The post A closer look at capacitor auto-discharge circuit appeared first on EDN.

My first encounter several decades ago with a pillar of modern technology yielded more than just one lesson.

NEREM 1967 was the IEEE Northeast Electronics and Engineering Meeting held at the Sheraton-Boston Hotel and the War Memorial Auditorium in Boston, MA, from November 1 to 3, 1967. I was there, although most of the engineering population in the Northeastern United States could probably have shared that claim back then; it was perhaps the busiest mass of human activity I’ve ever encountered in one common environment.

The display booths were extremely elaborate, but the one thing I couldn’t help noticing was that all these demonstrations of test equipment sported a constellation of these strange but intense little red lights that, in many cases, formed numbers, but some of which had to be viewed from pretty much straight on or the light would vanish.

Of course, they were early versions of LEDs.

Shortly afterward, having learned what an LED was, I obtained a sample. It was a Monsanto type MV-50 (Figure 1), which, when I wired it up, I saw its little red light. At the same time, a separate light of realization went off in my head as I finally understood what it was that I’d been seeing all over the place at the NEREM show.

Figure 1 My very first LED obtained soon after attending NEREM 1967. Source: eBay

Next, I began studying some LED datasheets.

One parameter that kept appearing at the forefront of many datasheets was light output rated in candelas. The candela is a unit of luminous intensity or luminous power per unit of solid angle, and the numbers for that parameter rivaled each other from product to product.

However!!

The physical dimensions of some LEDs of that era were really quite small and some of them had very directional and limited light output patterns. Even though the candela ratings could be “impressive”, the total light output from some of them was, if you’ll forgive me for being judgmental, puny.

The stress that was placed on the high intensity rating seemed like an exercise in specmanship. Still, if you want to know how far LED technology has come in the ensuing fifty-odd years, take a late-night walk-through Times Square in Manhattan and don’t forget your sunglasses.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post My very first LED appeared first on EDN.

In January, InnoScience (Suzhou) Technology Holding Co Ltd — which manufactures gallium nitride (GaN) power chips on 8” silicon wafers — and its subsidiary Innoscience (Suzhou) Semiconductor Co Ltd filed complaints (2024) Su 05 Minchu No. 1430 and (2024) Su 05 Minchu No. 1431 (regarding patent numbers 202311774650.7s and 202211387983.X) to the Intermediate People’s Court of Suzhou City in Jiangsu Province against Infineon Technologies (China) Co Ltd, its subsidiary Infineon Technologies (Wuxi) Co Ltd, and Suzhou Chipswork Electronics Technologies Co Ltd...

UK-based Space Forge Ltd, which is pioneering space-based advanced materials manufacturing and return technology, has completed its £22.6m (about $30m) Series A funding round (the largest Series A in UK space tech history)...

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has appointed Cristiano Amoruso to its board of directors...

Vacuum solution provider Busch Group of Maulburg, Baden-Württemberg, Germany says that its brand centrotherm clean solutions of Blaubeuren, Baden-Württemberg will become part of Busch Group company Pfeiffer Vacuum+Fab Solutions of Aßlar, Germany. Effective September, the gas abatement systems previously offered under the centrotherm brand will be integrated into the Pfeiffer portfolio and be available under this name in the future, uniting the two members of the global Busch Group...

Semiconductors are the crucial parts of electric vehicles (EVs) because they allow for advanced interactive features, efficiency battery management, powertrain enhancements and safety measures. The EV revolution is not only coming; it is currently happening. Semiconductors, a sometimes disregarded yet crucial building element, are the key element of this revolution. These microscopic semiconducting chips are the brain and nervous system of EVs, driving everything from power conversion and battery management to safety systems and intelligent infotainment systems. As EV adoption increases worldwide, demand for high-performance semiconductors is also on the rise making the EV semiconductor market one the most vibrant parts of the tech-led economy.

Market Overview:

Over the last few years, the EV semiconductor industry has seen enormous growth. Based on industry reports, global market size stood at approximately $11.19 billion as of 2023 and is expected to boom to nearly $57.1 billion by 2029 with a CAGR of more than 31%. The boom is being fueled by a combination of factors: tighter environmental controls, government subsidies, growing EV infrastructure and advances in automotive electronics technology.

EVs need significantly more semiconductor devices compared to conventional internal combustion engine (ICE) cars. From motor control units and battery management units (BMUs) to infotainment systems and advanced driver-assistance systems (ADAS), semiconductors make these features functional.

Key Technologies Driving Growth

Among the most prominent trends driving the market is the trend towards wide-bandgap semiconductors, specifically Silicon Carbide (SiC) and Gallium Nitride (GaN) materials. These materials are superior to conventional silicon for high-temperature and high-voltage applications and hence, they are suited for EV powertrains as well as rapid-charging infrastructure.

SiC chips, for instance, have the potential to make inverters more efficient, thus extending driving ranges and cutting energy loss. Players such as STMicroelectronics, Infineon, Wolfspeed and ON Semiconductor are investing heavily in SiC lines to address this increasing demand.

Since they allow producers to integrate several functions into a single chip and reduce the size and weight of their parts, system on chip (SoC) solutions are gaining popularity as well. This enhances overall car performance and design versatility.

Uses:

• In EVs, semiconductors are crucial to the vehicle’s battery management system (BMS). They assist in keeping an eye on the battery pack’s temperature, health and charge level. Onboarding charging systems also use semiconductors to help convert and control voltage, which improves charging speed and efficiency.
• Advanced driver assistance systems (ADAS) based primarily on semiconductor processors are adaptive cruise control, lane-keeping assist, and collision avoidance systems. These circuits make decisions in real time using data from multiple sensors, cameras, and radar.
• Infotainment systems are driven by semiconductor chips, incorporating features such as touchscreen display, GPS navigation, car audio, and connectivity features of the smartphone.
• As the largest, with more than half of the market, is the powertrain segment. Power semiconductors control battery power so that the electric motor can operate efficiently.

Regional Perspectives: Asia-Pacific Leads

Geographically, South Korea, Japan and China dominate the Asia-Pacific EV semiconductor market.

With schemes such as “Make in India” and the FAME II scheme (Faster Adoption and Manufacturing of Hybrid and Electric Vehicles) encouraging domestic EV and semiconductor manufacturing, India is also becoming a key player.

In addition to that, Europe is also deeply investing in environmental-friendly transport as well as in semiconductor technology. With the CHIPS and Science Act, America is also strengthening its domestic production of semiconductors to try to meet its demand less on foreign chipmakers and foster a stronger EV ecosystem.

Challenges and Supply Chain Constraints

Though there is a strong growth prognosis, the market does not lack its challenges. The most critical of these is the semiconductor supply chain crisis that commenced with the onset of the COVID-19 pandemic and has since impacted industries across the globe. The highly concentrated nature of chip production—dominated by just a handful of foundries such as TSMC (Taiwan) and Samsung (South Korea)—creates vulnerabilities.

Furthermore, geopolitical tensions, most notably between the U.S. and China, are recasting global trade patterns. China’s dominance of the supply chain of rare earth minerals like gallium and germanium, critical to semiconductor manufacturing, constitutes a strategic risk for the West and has fueled demands for diversification of sources.

Market volatility is also a problem. For example, firms such as Mersen and STMicroelectronics have recently pushed back their semiconductor revenue targets owing to volatile EV demand and postponed ramp-up of new plants. Analysts now estimate that key financial milestones will be achieved by 2029–2030, rather than previous estimates of 2026–2027.

Conclusion:

The EV Semiconductor industry sits at the confluence of mobility digitalization and transport electrification, with the demand growing at an unprecedented level. Recent data indicates that the sales of EVs worldwide will surpass 20 million units by 2025, representing one in four automobiles sold globally. The growth is fueled by heightened affordability, decreased operating expenses and government support.

Further, the market for compound semiconductor materials, comprising Silicon carbide (SiC) and Gallium Nitride (GaN) is estimated to increase from $29.97 billion in 2025 to $91.03 billion in 2025, driven by the growth of 5G and EV adoption. The overall semiconductor market is estimated to be $ 697 billion in 2025, representing an 11% year-over year growth rate.

Despite supply chain risks and market instability, improvements in production, materials and system integration will continue to advance the field. Technology specialists, investors, and manufacturers view this industry as having a high rate of return and playing a key role in shaping the direction of mobility in the future.

The post Why the Future of Mobility Depends on Smarter, Smaller Semiconductors appeared first on ELE Times.

Офіційне повідомлення kpi чт, 05/15/2025 - 10:55

The industry’s first agentic AI, multi-block, multi-user SoC design platform.

Cadence has launched Cadence Cerebrus AI Studio. It is the industry’s first agentic AI multi-block multi-user design platform, significantly accelerating an entire system-on-chip’s (SoC) time to market by 5X.

Recent technological advancements have led to semiconductor chips with intricate functionalities requiring trillions of transistors. These chips must support high-performance computing and be designed using advanced process nodes. Cadence Cerebrus AI Studio is a state-of-the-art SoC agentic AI design implementation tool that can help achieve ambitious power, performance, and area (PPA) goals and reduce turnaround time for highly sophisticated chips.

Cadence Cerebrus AI Studio is aligned with Cadence’s Intelligent System Design strategy. For block-level AI-driven optimization, Cadence Cerebrus Intelligent Chip Explorer was released in 2021 and has successfully been used in hundreds of production designs. Cadence Cerebrus AI Studio is the next generation of AI-driven digital implementation products using the most advanced agentic AI technology for implementing an entire SoC or subsystem, enabling a generational shift from multiple designers optimizing a single block to multiple blocks being designed by a single engineer.

Utilizing the latest agentic AI system that features autonomous AI agents capable of making decisions and taking multi-step actions based on high-level objectives, Cadence Cerebrus AI Studio can orchestrate the complete chip implementation flow delivering engineering productivity benefits. The Innovus integrated RTL synthesis and implementation platform, including Python scripting and a large language model (LLM) AI assistant, provides completely automated design realization.

Key features of Cadence Cerebrus AI Studio include:

• Intelligent Agentic AI Workflows: Employs AI agents that manage design optimization methodologies, resulting in unparalleled PPA and accelerated design closure.
• Multi-Block, Multi-User Design Infrastructure: A central design platform empowers a single engineer to design multiple blocks, allowing for more µm2 of SoC implementation per engineer.
• Hierarchical Design Optimization: Top-block co-optimization using AI greatly reduces manual work and enables faster design closure.
• Advanced Data Analytics: AI-driven data platform facilitates smarter and faster design debug by quickly identifying bottlenecks and critical paths.
• Customizable Live Dashboard: Facilitates collaboration and knowledge sharing across designs and projects, resulting in exponential productivity benefits.

“We are thrilled to launch Cadence Cerebrus AI Studio, the industry’s first agentic AI SoC design platform, built on the solid foundation of established Cadence digital implementation tools. This tool extends the AI technology to hierarchical SoC design implementation, exponentially multiplying the PPA and productivity gains while addressing the engineering workforce shortage,” says Chin-Chi Teng, senior vice president and general manager, Digital & Signoff Group at Cadence. “Cadence Cerebrus AI studio, which leverages the latest agentic AI technology, is very well equipped to achieve unparalleled PPA, fastest time to design targets, and game-changing engineering efficiency.”

The post Transforming Chip Design with Agentic AI: Introducing Cadence Cerebrus AI Studio appeared first on ELE Times.

• Provides access to strategic sovereign European programs with EU-designed, EU-built systems
• Enables locally developed solutions that are trusted, modular, and interoperable
• Integrates critical modular technology that enables next-generation measurement capabilities

Keysight Technologies, Inc. has collaborated with SPHEREA to offer customers improved testing capabilities in the aerospace and defense (A&D) sector. By joining forces, Keysight will combine its expertise in high-performance electronics tests and measuring systems with SPHEREA’s design and integration capabilities, to support the shifting requirements in the A&D space.

As European nations increasingly prioritize defense independence and aim to remain compliant with stringent export control regulations, this collaboration offers a timely and strategic response to these needs. The deployment of next-generation measurement technologies is critical to national security, but it is also essential to align with the need for EU-designed solutions to support self-sufficient and strategic autonomy.

Keysight and SPHEREA are working together to address this challenge, providing customers with local solutions that are built on trusted technology. As part of the agreement, the deployment includes the delivery of Keysight’s Radar Target Generator and Electronic Warfare testing solutions, featuring frequency expansion from 18 GHz to 40 GHz, which led to a successful tender for a leading military alliance. The solution consists of Keysight’s AXIe-based high-performance embedded controller with low latency and signal processing, arbitrary waveform generation, and its latest low phase-noise synthesizers.

“Our partnership with SPHEREA enables us to deliver an innovative, scalable solution. The accurate radar test solution is designed with our European R&D expertise, and delivery capabilities to provide future-ready tests that meet the evolving needs of our defense customers,” said Thierry Locquette, EMEA VP and GM at Keysight.

“We are proud to cooperate with Keysight using our deep RF expertise to develop the commercial off the shelf (COTS) Up and Down Converter with 1 GHz bandwidth in a short time frame. Together, we fulfilled the customer’s needs for advanced capability within a condensed timeline,” said Julien Pulice, Group CTO Deputy at SPHEREA.

The post Keysight and SPHEREA Join Forces to Strengthen European Aerospace and Defense Testing Capabilities appeared first on ELE Times.

Where do MRAM and ReRAM technologies stand after years of promise to replace incumbent memories? Gary Hilson speaks to MRAM and ReRAM makers as well as an industry analyst to find the truth about their market standing. While these memory technologies offer endurance, they don’t seem to compete on price. As a result, they are eying specialized markets like automotive and aerospace to remain relevant.

Read the full story at EDN’s sister publication, EE Times.

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The post MRAM and ReRAM: The quest for automotive, aerospace niches appeared first on EDN.

Практикум-тренінг для викладачів закладів професійної освіти kpi ср, 05/14/2025 - 23:07

На війні загинув випускник нашого університету Олег Аксьоненко kpi ср, 05/14/2025 - 22:59

Finwave Semiconductor Inc of Waltham, MA, USA has announced a new $8.2m bridge investment round, led by Fine Structure Ventures, Engine Ventures, and Safar Partners, with strategic participation from technology partner GlobalFoundries. Finwave reckons that the new funding signals strong conviction from investors and industry leaders in the market potential of its unique GaN-on-Si technology as it transitions from a technology-centric innovator to a product-driven company...

I have made a schematic of analog FM receiver!! submitted by /u/Calm_Ground2578 [link] [comments]

submitted by /u/Kotsaros [link] [comments]

Frequent contributor Nick Cornford recently shared design ideas incorporating cool circuits for linear-in-pitch voltage-controlled oscillators (LPVCOs): 

• Revealing the infrasonic underworld cheaply: Part 1 and Part 2
• A pitch-linear VCO: Part 1 and Part 2

Wow the engineering world with your unique design: Design Ideas Submission Guide

The linear in pitch function, which makes output frequency proportional to the antilog of voltage, is interesting because it provides a better perceptual interface to the inherently logarithmic human ear than a linear frequency. 

One measure of the performance of an LPVCO is its octave range. That’s the ratio of highest to lowest frequency that its output spans, expressed as the binary (base 2) logarithm of the ratio. Two octaves (22 = 4:1) is good. Three octaves (23 = 8:1) is better. The LPVCO in Figure 1 does seven (27 = 128:1). 

Figure 1 A seven-octave LPVCO comprises Q1 Q2 antilog pair that converts the 0 V to 5 V Vin, to a 1 µA to 128 µA Ic2, for a proportional 27 = 128:1 change in C1 ramp rate and U1 oscillation frequency. Counter U2 then scales the U1 oscillation frequency by 4 and converts to a three-level, very vaguely “sine-ish,” output waveform.

Here’s how it works.

Control voltage Vin is scaled by a voltage divider (R1/R2 + 1) = 34:1 and applied to the Q1 Q2 exponential-gain current mirror. There, it is level-shifted and temperature-compensated by Q1, then anti-logged by Q2 to produce

Ic2 = 2(1.4Vin) µA. The resulting C1 timing ramp spans from 5 ms (for Vin = 0) to 40 µs (for Vin = 5 V). The ramp ends when it crosses analog timer U1’s 1.67-V trigger level and is reset via R5 and D1 to U1’s threshold level of 3.33 V, starting another oscillation cycle. The resulting sawtooth will therefore repeat at F = Ic2/(1.67C2) = 2(1.4Vin) µA / 5nCb = 200 (2(1.4Vin) ) Hz.

Nick’s lovely designs show that short pulses such as U1’s output spikes require conversion to a waveshape with a less intense harmonic content if we want to hear a listenable audio output. Therefore, U2’s switch-tail counter divides U1’s oscillation frequency by 4. This produces a hardly sinusoidal, but at least somewhat less annoying, tri-level 50 Hz to 6400 Hz final output.

Thanks go to Nick for a fun and well-conceived design topic, and of course to editor Aalyia for her friendly Design Idea department format that makes such enjoyable collaboration possible!

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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• Revealing the infrasonic underworld cheaply, Part 2
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• Can a free running LMC555 VCO discharge its timing cap to zero?

The post Seven-octave linear-in-pitch VCO appeared first on EDN.

Казковий і предметний світи Като Лукач Інформація КП ср, 05/14/2025 - 14:57