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Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced the first production-released 650V bi-directional GaNFast ICs and high-speed isolated gate-drivers, creating a paradigm shift in power with single-stage BDS converters, which enables the transition from two-stage to single-stage topologies. Targeted applications range widely and opens up multi-billion dollar market opportunities across electric vehicle (EV) charging (on-board chargers (OBC) and roadside), solar inverters, energy storage and motor drives...

Many industrial applications are transitioning to higher power levels with minimized power losses, which can be achieved by increasing the DC link voltage. Infineon Technologies AG of Munich, Germany is hence addressing this market trend with the CoolSiC Schottky diode 2000V G5 product family, which are claimed to be the first discrete silicon carbide diodes with a breakdown voltage of 2000V, introduced in September 2024...

As network demands grow more complex, Optical Internetworking Forum (OIF) is to showcase interoperability breakthroughs with live demonstrations and expert discussions at the Optical Fiber Communication Conference & Exposition (OFC 2025) in San Francisco, CA, USA (1–3 April)...

Зустріч представників КПІ ім. Ігоря Сікорського з Нобелевськими лауреатами kpi пт, 03/14/2025 - 11:07

the frequency of this garage door remote. Thanks! submitted by /u/Zealous_Zeus1996 [link] [comments]

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Printed circuit boards (PCBs) have come a long way over the years. Electronics design engineers must stay aware of the latest developments to understand how they might soon incorporate them into their work.

For instance, as more products require PCBs and the demand continues rising, so have concerns about reducing e-waste. Fortunately, promising ideas have recently emerged, showing the exciting possibilities.

Biodegradable substrates

Some people take inspiration from nature when figuring out how to reduce waste. That was the case for a university team that uses leaves’ natural structure to create biodegradable substrates that could change PCB designs.

Conventional PCB substrates contain glass fiber-reinforced epoxy resin. They are typically not recyclable, making people eager to find a more sustainable solution. These researchers discovered it through quasi-fractal lignocellulose structures, which act as scaffolds for leaves’ living cells. The group realized they could also bind solution-processable polymers. Tests showed this alternative can tolerate soldered circuitry manufacturing and supports innovative thin-film devices.

Additionally, once the PCB substrate is no longer usable, users can sustainably dispose it by allowing it to break down in soil or processing the component in biogas plants to recover some of its precious metals for reuse.

In another effort to tackle e-waste, researchers developed a PCB that people can recycle several times with virtually no material loss. Their experiment showed it performed as well as those made from traditional materials.

The group developed a solvent that turns a class of sustainable polymers into a jelly-like substance without harming the solid components left behind. Users can then pick them out for recycling. This approach allows them to recover 98% of the polymers, 91% of the recycling solvent, and all the glass fiber.

Moving ahead with flexible PCBs

Electronics designers and others are also interested in moving away from rigid PCBs and prioritizing flexible ones when possible. This improvement enables better application versatility and helps users produce smaller, more complex devices.

Next, mechanical engineers have developed a pioneering way to create the circuits necessary for electronic connections inside devices from wearable health trackers to robots. Those working on this project believe progress with soft circuits could revolutionize how engineers use and create electronic devices. Additionally, currently available flexible PCBs require few or no wires, reducing connection failures.

This team created a production process that uses liquid-metal microdroplets to make a stair-like structure when adding vias and planar interconnects. The method allows them to enable electrical connections across layers without physically drilling into the material, as previous options required.

Experiments suggested engineers could use the microdroplet application technique on several materials or build multiple layers to suit individual device specifications. This method is also efficient; researchers were able to make several vias in less than a minute. In one case, they made a dual-layer soft circuit with nine LEDs on the top and nine connected sensors on the bottom. This component had 21 liquid-metal connectors and was only as thick as a sheet of paper.

PCBs will continue evolving

These are some of the many examples of engineers’ ongoing efforts to make PCBs more aligned with today’s devices and the industry’s priorities. Electronics design engineers should remain aware of these innovations and continually explore how they might implement these possibilities into future projects.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

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The post The evolution of PCBs and the demands of modern electronics appeared first on EDN.

The Renesas RZ/V2N quad-core MPU integrates an AI accelerator, achieving up to 15 TOPS of AI inference using pruning technology. Pruning reduces memory usage and increases computing efficiency by removing parts of the AI inference process. The MPU also includes an image signal processor and two MIPI CSI-2 camera interfaces for enabling endpoint vision AI.

With the RZ/V2N, the RZ/V series expands to cover markets from the low-end RZ/V2L (0.5 TOPS) to the high-end RZ/V2H (up to 80 TOPS). At just 15 mm², the RZ/V2N is significantly smaller than the high-end RZ/V2H, reducing the mounting area by 38%. It also delivers a power efficiency of 10 TOPS/W.

Along with the DRP-AI3 accelerator, the RZ/V2N features four Arm Cortex-A55 cores, a Cortex-M33 core, and an Arm Mali-C55 image signal processor (ISP). Its dual MIPI CSI-2 interfaces support two cameras, enabling double-angle image capture for improved spatial recognition, precise human motion analysis, and fall detection. A dual-camera setup can also capture images from different locations, allowing a single chip to count cars in a parking lot and recognize license plates.

The RZ/V2N microprocessor will be available from Renesas and its authorized distributors starting March 19, 2025.

RZ/V2N product page

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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An indirect time-of-flight sensor, the AF0130 from onsemi offers long-distance measurements and 3D imaging of fast-moving objects. It features a depth processing ASIC beneath its pixel area, which rapidly calculates depth, confidence, and intensity maps from laser modulated exposures.

The AF0130, part of the Hyperlux ID sensor family, combines global shutter and iToF technology for precise, high-speed depth sensing. It measures phase shifts in reflected VCSEL light, capturing four light phases in one exposure for enhanced accuracy. A global shutter reduces ambient IR noise, while onboard depth processing and memory enable real-time results without external memory or a high-performance processor.

onsemi states that the AF0130 enables depth sensing up to 30 meters—four times the range of standard iToF sensors. The 1.2-Mpixel CMOS sensor features 3.5-µm BSI pixels in a 1/3.2-in. optical format. A variant, the AF0131, delivers the same performance but excludes on-chip depth processing for manufacturers preferring off-chip depth calculation.

Availability for the AF0130 and AF0131 sensors was not provided at the time of this announcement.

AF013X product page

onsemi

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Kinetic’s KTB4800 2.4-MHz, 3-A buck regulator delivers fast transient response with precise switching frequency. Its OptiComp adaptive on-time PWM control scheme maintains a nearly constant switching frequency despite input and output voltage variations.

Compared to typical current-mode PWM schemes, OptiComp enables quick response to line and load transients while ensuring excellent stability and wide bandwidth. This reduces output voltage droop and overshoot for dynamic loads, even with minimal output capacitance.

The KTB4800 buck regulator supports a range of applications, including CPU and GPU cores, DSPs, DDR memory, I/O power, and sensor/analog supplies. Its output voltage is I²C-programmable from 0.6 V to 3.345 V. The regulator features soft-start and dynamic voltage scaling (DVS) with multiple programmable ramp rates, along with selectable forced-PWM and auto-skip modes for light-load efficiency.

The KTB8400 OptiComp switching regulator is available now for order from Mouser Electronics and other distributors.

KTB8400 product page

Kinetic Technologies

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Housed in a small SO8L package, Toshiba’s TLP5814H gate driver photocoupler provides an active Miller clamp for driving SiC MOSFETs. Its built-in clamp circuit directs Miller current from the gate to ground, preventing short circuits without requiring a negative voltage. This enhances system safety while reducing external circuitry for a more compact design.

The TLP5814H delivers a peak output current of +6.8 A/-4.8 A, with the Miller clamp providing a typical channel resistance of 0.69 Ω and a peak sinking current of +6.8 A. Its -40°C to +125°C operating range is achieved by enhancing the infrared LED’s optical output and optimizing the photodetector design for better optical coupling efficiency. This makes the device well-suited for industrial equipment with strict thermal requirements, such as PV inverters and uninterruptible power supplies.

Key specifications for the TLP5814H include:

The TLP5814H’s compact 5.85×10×2.1-mm package enhances layout flexibility while providing an 8.0-mm creepage distance for high-insulation applications.

Toshiba has begun volume shipments.

TLP5814H product page

Toshiba Electronic Devices & Storage

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Microchip’s PIC32A 32-bit MCUs feature an FPU coprocessor that performs both 32-bit and 64-bit operations for math-intensive tasks. Operating at 200 MHz, they also integrate high-speed analog peripherals to minimize external component requirements.

Two 12-bit ADCs, with conversion rates up to 40 Msamples/s, are complemented by three 5-ns analog comparators and 12-bit pulse density modulation DACs. The MCUs also include three rail-to-rail 100-MHz op amps with a slew rate of 100 V/µs. These features enable cost-effective edge sensing and control, making the PIC32A series well-suited for automotive, industrial, consumer, AI/ML, and medical applications.

To ensure safe software execution in embedded control systems, the PIC32A MCUs offer a range of hardware safety and security features. These include ECC on flash and RAM, Memory Built-In Self-Test (MBIST), I/O integrity monitors, fail-safe clock monitor, immutable secure boot, and flash access control.

Prices for the PIC32A microcontrollers start at less than $1 each in volume quantities.

PIC32A product page

Microchip Technology

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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In booth 2039 at the IEEE Applied Power Electronics Conference & Exposition (APEC 2025) in the Georgia World Congress Center, Atlanta, GA, USA (16–20 March), fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — is demonstrating that its ICeGaN gallium nitride ICs can now satisfy a broad range of applications with higher power requirements, such as servers, data centers, inverters, industrial power supplies and, very soon, automotive electric vehicles (EVs) to over 100kW...

Софія Жолтайли: "Я не можу жити без творчості" Інформація КП чт, 03/13/2025 - 17:00

An international collaboration linking the US and European water industries is helping to accelerate the use of UV-C LED technology for municipal-scale water disinfection....

Володимир Хільчевський: від "чорнопіхотинця" до професора kpi чт, 03/13/2025 - 16:23

Imagine that you have a voltage source in series with some source resistance feeding power to a variable load. The relationship between load voltage, load current, and cell current can be drawn as follows in Figure 1.

Figure 1 The load voltage versus cell and load current for a circuit where the voltage source is in series with some source resistance feeding power to a variable load.

If by multiplying load voltage times load current, we examine power delivery to the load versus load resistance where the result is a curve that looks like an upside-down soup bowl (Figure 2).

Figure 2 Power to the load (load voltage*load current) versus cell and load current.

For some specific source resistance value, we can plot a horizontal line on our graph (Figure 3).

Figure 3 Adding a specific numerical value for the source resistance.

If we next add a curve to plot the varying load resistance value (Figure 4), we find that the point of maximum power delivery to the load corresponds to equality between the load resistance to the source resistance. Of course, this is expected to be so, but we should also note that the equality of interest is really between the load resistance and the dynamic value of the source resistance as opposed to that part’s value of static resistance.

Figure 4 Discovery of the peak power point by finding the equality between the load resistance to the source resistance.

This last remark may seem trivial, but as we shall now show, it is NOT trivial at all.

From Linear Technology (a name of fond memory today) at this now inoperative URL, we had the following sketch of a photovoltaic (PV) assembly’s characteristics shown in Figure 5.

Figure 5 Solec S-70C PV panel power curve while facing the sun.

Graphically extracting some numbers from the current versus voltage curve and fitting a descriptive equation to those numbers, we find the following in Figure 6.

Figure 6 A numerical representation of the PV device shown in Figure 5.

Again, we multiply the load voltage times the cell and load current to see the curve of the power delivery to the load and we also draw the dynamic resistance of the photovoltaic device (Figure 7).

Figure 7 Current, power and dynamic resistance curves for the Solec S-70C PV device, the dynamic resistance of the PV here is no longer the static horizontal line we saw in Figure 3.

Note now that the dynamic resistance of the photovoltaic device is not a horizontal line. The dynamic resistance of the photovoltaic device is now a variable. We also note that the power curve is no longer symmetrical but has instead taken a lean over to the viewer’s right.

Identifying the point of maximum power to the load or identifying the peak power point, we see the following in Figure 8.

Figure 8 Discovery of the peak power point for the Solec S-70C PV device.

We find that the peak power point is located where the load resistance equals the dynamic source resistance of the PV device.

If you want to get as much power delivery as possible out of a PV device, the load resistance needs to match the dynamic source impedance of that device.

Please note that in order to make these sketches more viewable, the vertical axis presentation of resistance is not linear in Ohms but has been made proportional to log (1+Ohms).

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Peak power point  appeared first on EDN.

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The evolution of embedded SIM (eSIM) technology has significantly transformed the telecommunications landscape, offering enhanced flexibility and efficiency in device connectivity. India, with its burgeoning tech industry, has seen the emergence of several key players in the eSIM domain. Here’s an overview of the top eSIM manufacturers and providers operating in India:

1. Cavli Wireless

Founded in 2017, Cavli Wireless is an American technology company with a significant presence in India. The company specializes in developing cellular IoT modules integrated with eSIM technology, catering to various sectors, including industrial applications and automotive industries. Cavli’s product lineup features the C-Series for industrial use and the A-Series tailored for automotive applications. Their commitment to innovation is evident with the introduction of products like the CQS315 LTE Cat 4 Smart Module and the CQM220 5G RedCap Module. Cavli’s strategic collaborations, such as with Orange Business Services for LTE-M connectivity, underscore their dedication to advancing IoT solutions globally.

2. TRASNA Solutions

Established in 2018, TRASNA Solutions is a global entity specializing in semiconductor technologies, including SIM, eSIM, System on Chip (SoC), and integrated SIM (iSIM) solutions for IoT and mobile-connected devices. The company has a notable presence in India, contributing to the local eSIM ecosystem. TRASNA’s portfolio encompasses secure microcontrollers, embedded modules, and a cloud-based eSIM platform, addressing challenges in the IoT sector by offering cost-effective and efficient solutions. Their recent acquisition of Workz, a cloud eSIM technology company, highlights their commitment to expanding eSIM services.

3. Zetexa

Zetexa, founded in 2023 in Bangalore, focuses on providing mobile internet connection services for tourists and international travellers through their international eSIM offerings. By simplifying connectivity for travellers, Zetexa addresses the growing demand for seamless mobile internet access without the need for physical SIM cards.

4. Kigen

Kigen plays a pivotal role in empowering India’s secure eSIM ecosystem. Their eSIM Secure OS is optimized for efficiency and is certified on various leading chipsets and modules, facilitating easier manufacturing and adoption of eSIM technology. Kigen’s focus on security and efficiency positions them as a key contributor to India’s eSIM landscape.

5. Airtel

Bharti Airtel, one of India’s leading telecommunications providers, offers eSIM services to its customers. Airtel’s eSIM provisioning allows users to activate cellular plans without physical SIM cards, enhancing user convenience and supporting the adoption of modern, SIM-less devices.

6. Reliance Jio

Reliance Jio, a major telecom operator in India, provides eSIM services, enabling users to activate Jio plans on eSIM-compatible devices. This service aligns with Jio’s vision of promoting digital connectivity and catering to the evolving needs of tech-savvy consumers.

7. Vodafone Idea (Vi)

Vodafone Idea, operating as Vi, offers eSIM services to its subscribers. By facilitating eSIM activation, Vi ensures that customers with compatible devices can enjoy seamless connectivity without relying on physical SIM cards.

8. Sim Local

Sim Local provides eSIM solutions tailored for travellers in India. Their services ensure that tourists and international visitors can access reliable mobile connectivity without the hassle of obtaining physical SIM cards upon arrival. Sim Local’s focus on convenience makes them a notable player in the eSIM market for travellers.

9. Airalo

Airalo offers eSIM solutions that cater to global travellers, including those visiting India. Their platform allows users to download eSIMs for various countries, providing affordable data plans and eliminating the need for physical SIM cards. Airalo’s user-friendly approach has made it a popular choice among international travellers seeking connectivity in India.

10. Holafly

Holafly specializes in providing eSIM services for travellers, offering data plans for numerous destinations, including India. Their eSIM solutions are designed for easy activation and provide reliable internet access, catering to the needs of tourists and business travellers alike.

 

In conclusion, India’s eSIM landscape is shaped by a diverse array of manufacturers and service providers, ranging from global technology firms to local telecom operators. This diversity ensures that consumers and businesses have access to a wide spectrum of eSIM solutions, fostering enhanced connectivity and supporting the country’s digital transformation.

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