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I took apart quite a few microwaves over a year or so and i never saw a plastic HV fuse in them yet so i thought it would be good to share. These HV fuses are esentially built using the same principles of operation: during overcurrent the thin thin wire melts and the spring retracts completely (like, totaly completely back) as soon as that wire melts enough. That quick spring retraction helps to quench the arc as fast as possible. Rated for fast blow 700 mA at 5 kV if you cant read it. submitted by /u/Lovrinjo1 [link] [comments]

Ripped of the trace when pulling out the transistor that was in there so had to get cteative using solder as the new trace.... ugly but it will do the work. submitted by /u/Whyjustwhydothat [link] [comments]

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I’ve been working on a modular IoT platform called Genesis, and wanted to share a fun offshoot of it — a single-port, battery-powered version I’m calling the “Pillar.” The port on top accepts various plug-in modules, since they all follow a mostly consistent pinout. The interface includes: 2x GPIO 1x ADC I2C, UART, and SPI It’s just one port, so it’s more of a fun side experiment — but it still supports a decent range of modules. Could be handy for throwing on a relay, sensor, or even a tiny display for field testing. Runs on a Li-Ion battery and has built-in charging via USB-C. submitted by /u/Polia31 [link] [comments]

Blue LED for ‘good’ (<600ppm), green LED for ‘average’ (<1000ppm) and red LED for ‘poor’ (>1000ppm). The board will also print the CO2 values, as they change, on the RTTViewer. submitted by /u/bleuio [link] [comments]

❤️ 3-місячний курс англійської для іноземців - це твій шанс опанувати мову! kpi пт, 04/18/2025 - 16:24

At the end of last year, the global software-defined vehicle (SDV) market size was valued at $49.3 billion. With a compound annual growth rate exceeding 25%, the industry is set to skyrocket over the next decade. But this anticipated growth hinges on automakers addressing fundamental architectural and organizational barriers. To me, 2025 will be a pivotal year for SDVs, provided the industry focuses on overcoming these challenges rather than chasing incremental enhancements.

Moving beyond the in-cabin experience

In recent years, innovations in the realm of SDVs have primarily focused on enhancing passenger experience with infotainment systems, high-resolution touchscreens, voice-controlled car assistance, and personalization features ranging from seat positions to climate control, and even customizable options based on individual profiles.

While enhancements of these sorts have elevated the in-cabin experience to essentially replicate that of a smartphone, the next frontier in the automotive revolution lies in reimagining the very architecture of vehicles.

To truly advance the future of SDVs, I believe OEMs must partner with technology companies to architect configurable systems that enable SDV features to be unlocked on demand, unified infrastructures that optimize efficiency, and the integration of software and hardware teams at organizations. Together, these changes signal a fundamental redefinition of what it means to build and operate a vehicle in the era of software-driven mobility.

1. Cost of sluggish software updates 

The entire transition to SDVs was built on the premise that OEMs could continuously improve their products, deploy new features, and offer better user experience throughout the vehicle’s lifecycle, all without having to upgrade the hardware. This has created a new business model of automakers depending on software as a service to drive revenue streams. Companies like Apple have shelved plans to build a car, instead opting to control digital content within vehicles with Apple CarPlay. As automakers rely on users purchasing software to generate revenue, the frequency of software updates has risen. However, these updates introduce a new set of challenges to both vehicles and their drivers.

When over-the-air updates are slow or poorly executed, it can cause delayed functionality in other areas of the vehicle by rendering certain features unavailable until the software update is complete. Lacking specific features can have significant implications for a user’s convenience but also surfaces safety concerns. In other instances, drivers could experience downtime where the vehicle is unusable while updates are installed, as the process may require the car to remain parked and powered off.

Rapid reconfiguration of SDV software

Modern users will soon ditch their car manufacturers who continue to deliver slow over-the-air updates that impair the use of their car, as seamless and convenient functionality remains a priority. To stay competitive, OEMs need to upgrade their vehicle architectures with configurable platforms to grant users access to features on the fly without friction.

Advanced semiconductor solutions will play a critical role in this transformation, by facilitating the seamless integration of sophisticated electronic systems like advanced driver-assistance systems (ADAS) and in-vehicle entertainment platforms. These technological advancements are essential for delivering enhanced functionality and connected experiences that define next-generation SDVs.

To support this shift, cutting-edge semiconductor technologies such as fully-depleted silicon-on-insulator (FD-SOI) and Fin field-effect transistor (FinFET) with magnetoresistive random access memory (MRAM) are emerging as key enablers. These innovations enable the rapid reconfiguration of SDVs, significantly reducing update times and minimizing disruption for drivers. High-speed, low-power non-volatile memory (NVM) further accelerates this progress, facilitating feature updates in a fraction of the time required by traditional flash memory. Cars that evolve as fast as smartphones, giving users access to new features instantly and painlessly, will enhance customer loyalty and open up new revenue streams for automakers, Figure 1.

Figure 1 Cars that evolve as fast as smartphones using key semiconductor technologies such as FD-SOI, FinFET, and MRAM will give users access to new features instantly and painlessly. Source: Getty Images

2. Inefficiencies of distinct automotive domains

The present design of automotive architecture also lends itself to challenges, as today’s vehicles are built around a central architecture that is split into distinct domains: motion control, ADAS, and entertainment. These domains function independently, each with their own control unit.

This current domain-based system has led to inefficiencies across the board. With domains housed in separate infrastructures, there are increased costs, weight, and energy consumption associated with computing. Especially as OEMs increasingly integrate new software and AI into the systems of SDVs, the domain architecture of cars presents the following challenges:

• Different software modules must run on the same hardware without interference.
• Software portability across different hardware in automotive systems is often limited.
• AI is the least hardware-agnostic component in automotive applications, complicating integration without close collaboration between hardware and software systems.

The inefficiencies of domain-based systems will continue to be amplified as SDVs become more sophisticated, with an increasing reliance on AI, connectivity, and real-time data processing, highlighting the need for upgrades to the architecture.

Optimizing a centralized architecture

OEMs are already trending toward a more unified hardware structure by moving from distinct silos to an optimized central architecture under a single house, and I anticipate a stronger shift toward this trend in the coming years. By sharing infrastructure like cooling systems, power supplies, and communication networks, this shift is accompanied by greater efficiency, both lowering costs and improving performance.

As we look to the future, the next logical step in automotive innovation will be to merge domains into a single system-on-chip (SoC) to easily port software between engines, reducing R&D costs and driving further innovation. In addition, chiplet technology ensures the functional safety of automotive systems by maintaining freedom of interference, while also enabling the integration of various AI engines into SDVs, paving the way for more agile innovation without overhauling entire vehicles (Figure 2).

Figure 2 Merge multiple domains into a singular, central SoC is key to realizing SDVs. This architectural shift inherently relies upon chiplet technology to ensure the functional safety of automotive systems. Source: Getty Images

3. The reorganization companies must face

Many of these software and hardware architectural challenges stem from the current organization of companies in the industry. Historically, automotive companies have operated in silos, with hardware and software development functioning as distinct, and often disconnected entities. This legacy approach is increasingly incompatible with the demands of SDVs.

Bringing software to the forefront

Moving forward, automakers must shift their focus from being hardware-centric manufacturers to becoming software-first innovators. Similar to technology companies, automakers must adopt new business models that allow for continuous improvement and rapid iteration. This involves restructuring organizations to promote cross-functional collaboration, bringing traditionally isolated departments together to ensure seamless integration between hardware and software components.

While restructuring any business requires significant effort, this transformation will also reap meaningful benefits. By prioritizing software first, automakers will be able to deliver vehicles with scalable, future-proofed architectures while also keeping customers satisfied as seamless over-the-air updates remain a defining factor of the SDV experience.

Semiconductors: The future of SDV architecture

The SDV revolution stands at a crossroads; while the in-cabin experience has made leaps in advancements, the architecture of vehicles must evolve to meet future consumer demands. Semiconductors will play an essential role in the future of SDV architecture, enabling seamless software updates without disruption, centralizing domains to maximize efficiency, and driving synergy between software and hardware teams.

Sudipto Bose, Senior Director of Automotive Business Unit, GlobalFoundries.

Related Content

• CES 2025: Wirelessly upgrading SDVs
• CES 2025: Moving toward software-defined vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Will open-source software come to SDV rescue?

The post Architectural opportunities propel software-defined vehicles forward appeared first on EDN.

Соціально важливий проєкт ФММ та Познанської політехніки kpi пт, 04/18/2025 - 13:49

Machine vision systems are becoming increasingly common across multiple industries. Manufacturers use them to streamline quality control, self-driving vehicles implement them to navigate, and robots rely on them to work safely alongside humans. Amid these rising use cases, design engineers must focus on the importance of reliable and cost-effective optical technologies.

While artificial intelligence (AI) algorithms may take most of the spotlight in machine vision, optical systems providing the data these models analyze are crucial, too. Therefore, by designing better camera and sensor arrays, design engineers can foster optimal machine vision on several fronts.

Optical systems are central to machine vision accuracy before the underlying AI model starts working. These algorithms are only effective when they have sufficient relevant data for training, and this data requires cameras to capture it.

Some organizations have turned to using AI-generated synthetic data in training, but this is not a perfect solution. These images may contain errors and hallucinations, hindering the model’s accuracy. Consequently, they often require real-world information to complement them, which must come from high-quality sources.

Developing high-resolution camera technologies with large dynamic ranges gives AI teams the tools necessary to capture detailed images of real-world objects. As a result, it becomes easier to train more reliable machine vision models.

Expanding machine vision applications

Machine vision algorithms need high-definition visual inputs during deployment. Even the most accurate model can produce inconsistent results if the images it analyzes aren’t clear or consistent enough.

External factors like lighting can limit measurement accuracy, so designers must pay attention to these considerations in their optical systems, not just the cameras themselves. Sufficient light from the right angles to minimize shadows and sensors to adjust the focus accordingly can impact reliability.

Next, video data and still images are not the only optical inputs to consider in a machine vision system. Design engineers can also explore a variety of technologies to complement conventional visual data.

For instance, lidar is an increasingly popular choice. More than half of all new cars today come with at least one radar sensor to enable functions like lane departure warnings. So, lidar is following a similar trajectory as self-driving features grow.

Complementing a camera with lidar sensors can provide these machine vision systems with a broader range of data. More input diversity makes errors less likely, especially when operating conditions may vary. Laser measurements and infrared cameras could likewise expand the roles machine vision serves.

The demand for high-quality inputs means the optical technologies in a machine vision system are often some of its most expensive components. By focusing on developing lower-cost solutions that maintain acceptable quality levels, designers can make them more accessible.

It’s worth noting that advances in camera technology have already brought the cost of such a solution from $1 million to $100,000 on the high end. Further innovation could have a similar effect.

Machine vision needs reliable optical technologies

AI is only as accurate as its input data. So, machine vision needs advanced optical technologies to reach its full potential. Design engineers hoping to capitalize on this field should focus on optical components to push the industry forward.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

Related Content

• What Is Machine Vision All About?
• Know Your Machine Vision Components
• Video Cameras and Machine Vision: A Technology Overview
• How Advancements in Machine Vision Propel Factory Revolution
• Machine Vision Approach Addresses Limitations of Standard 3D Sensing Technologies

The post Why optical technologies matter in machine vision systems appeared first on EDN.

President Donald Trump’s administration has dramatically escalated trade tensions by imposing heavy new tariffs on Chinese goods, some of which are as high as 245%. The rising economic and geopolitical competition between the United States and China is the driving force behind this audacious move, which marks a new chapter in Trump’s “America First Trade Policy.”

Late Tuesday, the White House released a fact sheet outlining how these penalties are a direct response to China’s recent actions. By imposing export restrictions on crucial raw minerals like gallium, germanium, and antimony as well as rare earth magnets and six heavy rare earth elements—items essential to the semiconductor, aerospace, and defense industries—Beijing has been showing off its power.

This strong reaction is a result of the U.S.’s perception that China is using its supply chain dominance as a weapon. “China now faces up to a 245% tariff on imports to the United States because of its retaliatory actions,” the White House stated.

Karoline Leavitt, the press secretary for the White House, added that although President Trump is amenable to a trade agreement with China, he is waiting for Beijing to initiate this increasingly heated tariff spat.

What’s Hard Hit: A More Detailed Look at Tariffs

Needles and syringes: 245%

Lithium-ion batteries: 173%

Seafood: 170%

Wool sweaters: 169%

Plastic dishes: 159%

Toasters: 150%.

Electric vehicles: 148%

Toys, dolls, and puzzles: 145%

Vitamin C: 145%

Car wheels: 73%

Semiconductors: 70%

Metal furniture: 70%

Car door hinges: 67%

Laptops: 20%

Children’s books: 0%

These tariffs have enormous knock-on effects that affect everything from clothing to electronics and medical equipment.

Examining the Specifics:

Devices and Cell Phones

According to the U.S. Commerce Department, electronics, including TVs and mechanical appliances, account for 46.4% of all imports from China in 2022, including smartphones and accessories. More over 80% of the $52 billion worth of cellphones imported into the United States in 2024 came from China. These were initially subject to 145% taxes, but new customs regulations exempted phones and laptops from a reciprocal 125% levy. They are nevertheless forced to pay a 20% total tariff, which builds up over time (0% base + 20% fentanyl-related penalty).

Furniture, Clothes, and Toys

China is a major supplier of consumer products, furniture, and textiles, accounting for more than 50% of toys, furniture, and almost 30% of U.S. textile imports. Up until now, items like tricycles and plush animals were duty-free, which kept costs down. Toys are no longer a deal, though, because to a new 145% tax (0% base + 20% fentanyl penalty + 125% reciprocal). Wool sweaters and other clothing are now subject to a staggering 168.5% total tax (16% base + 7.5% pre-2025 + 20% penalty + 125% reciprocal), which significantly raises the cost of wardrobes.

Conclusion: Companies will have to assess their supply chains to ascertain the damage as these tariffs are not universal; they vary by product, material, and exclusions. EV makers, electronic companies, and energy storage companies that rely on Chinese suppliers will suffer from the 173% tariff on lithium-ion batteries. What about the 70% semiconductor duty? For American computer companies already dealing with chip shortages, that presents even another challenge.

It’s a complicated problem, and if businesses pass it on, the true cost may end up on customers. The United States and China are currently engaged in a high-stake game of chess.

The post Trump’s Trade Bombshell: Tariffs on China Hit 245% appeared first on ELE Times.

Цифрова освіта як спільний вектор kpi пт, 04/18/2025 - 11:51

🌸 Святкові дні під час воєнного стану kpi пт, 04/18/2025 - 10:10

📹 Візит віцепрем'єр-міністра Чеської Республіки до КПІ ім. Ігоря Сікорського Інформація КП пт, 04/18/2025 - 10:07

IPEC eyes market expansion of its EV Charging Products and Solutions business with new funding and aims to diversify into wider power electronics domain

Bengaluru-based IPEC, a first-mover and innovator in the EV charging space, has secured an investment of $3 million from Nikhil Kamath and Abhijeet Pai’s Gruhas. This investment from Gruhas in IPEC’s journey strengthens IPEC’s mission to consolidate its leadership status in the EV Charging sector and accelerate its growth in the broader power electronics domain. Having successfully delivered over 1 million EV charging products to the top EV OEMs in India, IPEC is now gearing up to expand its manufacturing capacities to 50,000 units per month. IPEC offers a range of EV charging products that include private, portable, and public chargers as well as EV Connectors and Vehicle Charging Inlets. These products are fully compliant with various national and international standards and the latest localisation regulations, including the PM E-Drive and PLI Scheme. Beyond hardware, IPEC also offers Cloud-based Charging Management Systems (CMS) and a user-friendly mobile app for real-time control and insights. IPEC is an approved supplier to leading EV OEMs like Ather Energy, Bajaj Auto, Greaves (Ampere), and more. Recognising the emerging need for power electronics in the EV Sector and in the energy transition, IPEC was created in 2017 by the MEHER Group, together with DEKI Electronics & Sungho Electronics, with Zohra Khan as its CEO. At the core of energy transition is Power Electronics – the technology that facilitates efficient power conversion in EVs, charging infrastructure, renewable energy, energy storage systems and green hydrogen. IPEC is driving this energy transition in e-mobility with intelligent, reliable and cost-effective charging solutions at scale that address India’s specific needs and the rising demand for locally manufactured alternatives. Among its strengths is IPEC’s highly evolved design and manufacturing expertise combined with the ability to seamlessly integrate sophisticated hardware, advanced software and AI.

Zohra Khan, CEO of IPEC, remarked, “Traditionally, India’s reliance on imports for power electronics has been high. At IPEC, we are changing that by designing and manufacturing power electronic products in India – for India and the world. This investment by Gruhas shall further propel our contributions to the ‘Make In India’ mission and enhance India’s EV ecosystem. IPEC has witnessed a 40% growth in revenue in FY25 and anticipates doubling its revenue in FY26.

This investment also enables IPEC to expand our avenues and capabilities to launch IPEC into global markets. We are excited to have Gruhas as part of the team and look forward to a great journey ahead.” Abhijeet Pai, Co-Founder of Gruhas, adds, “IPEC is fast emerging as a changemaker in India’s EV charging ecosystem. As the country accelerates toward an electric future, reliable and scalable charging infrastructure built on quality components, sub-assemblies, and smart chargers becomes mission-critical. Together, Zohra and IPEC have led the way in this space. By already serving four of India’s top OEMs, they’ve set benchmarks in manufacturing chargers, especially for the two-wheeler segment. Their deep ecosystem understanding and technical capabilities position them to expand beyond two-wheelers, into broader applications. At Gruhas, we are committed to backing companies that scale in tandem with OEMs — building the long-term future of the industry together.”

The post Powering India’s EV revolution and Energy Transition: IPEC secures investment from Gruhas for next-gen charging solutions appeared first on ELE Times.

As India accelerates its journey toward a digitally empowered, sustainable energy future, Advanced Metering Infrastructure (AMI) has emerged as a linchpin for modernizing the nation’s power grid. With rising energy demands, expanding renewable integration, and bold policy initiatives like the Revamped Distribution Sector Scheme (RDSS), the role of smart metering has never been more critical.

Ashish Sahay, Country Manager and Sales Director at Wirepas

In this exclusive interview with ELE Times, Ashish Sahay, Country Manager and Sales Director at Wirepas, shares insights into the transformative role of AMI and RF mesh technology in India’s smart grid evolution. With Wirepas leading the charge in next-gen, infrastructure-free connectivity, Sahay outlines how the company is enabling scalable, cost-effective solutions tailored to India’s unique power distribution landscape.

Excerpt:

ELE Times: India is undergoing a massive transformation in its power sector. How do you see Advanced Metering Infrastructure (AMI) playing a critical role in this journey toward a smarter, more resilient grid?

India’s energy landscape is evolving rapidly, and Advanced Metering Infrastructure (AMI) is emerging as a foundational pillar in building a smarter, more resilient power grid. With rising energy demand and a growing share of renewables, utilities need real-time visibility and control to ensure grid stability. Smart meters provide exactly that – enabling accurate consumption data, reducing non-commercial losses, and helping utilities become financially viable. The loss-making governmental electricity distribution companies, which already have implemented smart meters, have become profitable. This, in turn, allows them to reinvest in modernizing the grid. For consumers, AMI brings transparency, accurate billing, and better control over energy usage. It’s a critical enabler in India’s journey toward sustainable and equitable energy access.

ELE Times: Wirepas has introduced a unique 5G RF Mesh technology to the Indian market. Can you explain how this solution differs from traditional communication networks and how it improves scalability, cost-efficiency, and performance for smart metering?

Ashish Sahay: Wirepas’ RF mesh technology is fundamentally different from traditional communication networks used in smart metering. Instead of relying on costly and complex infrastructure like cellular base stations, Wirepas turns each smart meter into part of a decentralized, self-healing mesh network. This means meters connect directly with their neighbors, forming a resilient and scalable system with no single point of failure.

The real game-changer is cost and scalability. We have removed the need for network infrastructure. RF Mesh requires a point collecting data to be sent to the cloud. Wirepas has enabled in-meter gateway where,  one smart meter having a cellular connection can support up to 300 Wirepas RF mesh meters, dramatically reducing communication costs. With built-in wireless modules running Wirepas software, utilities can deploy at scale without compromising on performance – achieving proven 99.9% reliability even in challenging environments. It’s a flexible, high-performance solution designed from the ground up to meet the unique demands of India’s smart metering rollout.

Current regulatory setup in India, has not yet adapted to the European harmonized standard for 5G mesh. India has 1880-1900 MHz spectrum available, but not yet allocated for NR+ 5G standard, like in Europe. For this reason Wirepas has adapted 5G technology to be used on 865-868 MHz spectrum with less performance. Going further, the Indian government should enable NR+ 5G technology to be used on the 1880-1900 MHz band which is currently allocated to legacy DECT devices.

ELE Times: Despite government mandates, large-scale smart grid adoption still faces hurdles. From your experience, what are the key challenges utilities face when implementing AMI solutions, and how can they be addressed?

Ashish Sahay: Despite strong government support, large-scale smart grid adoption in India still faces several key hurdles. One major challenge is the industry’s limited experience with smart metering – especially early on, when the local ecosystem was still developing under the Make in India initiative. Many utilities and contractors are still climbing the learning curve, which has led to delays and uneven rollouts.

Reliable communication is another critical issue. AMI depends on consistent, high-quality connectivity, yet cellular coverage in India can be patchy – especially in rural or densely built-up areas. In some cases, only 70% of cellular smart meters maintain a connection, and even when coverage exists, the quality may fall short of AMI service requirements. Workarounds like BLE-based smartphone reconnections are not scalable solutions. While lower cost RF Mesh can deliver better coverage and SLA. Typically each smart meter using Wirepas Mesh communication technology is able to communicate via 50 or more meters, providing seamless network coverage and strong network signal.

Additionally, utilities must navigate the massive scale of deployment and the hidden costs tied to cellular technologies, such as SEP (Standard Essential Patent) fees and long-term subscription costs, which can significantly impact margins.

To overcome these challenges, solutions like Wirepas Mesh offer a compelling alternative. By turning each smart meter into a node in a self-healing, decentralized mesh network, Wirepas eliminates dependency on cellular coverage. It also reduces cost and risk by avoiding SEP-related liabilities. This approach not only ensures reliable connectivity across urban and rural environments but also supports fast, large-scale rollouts, making it a strong fit for India’s ambitious AMI goals.

ELE Times: India’s power sector is guided by ambitious digitalization goals under initiatives like RDSS. How aligned is Wirepas with these national programs, and what role does policy play in accelerating smart metering deployment?

Ashish Sahay: Wirepas is fully aligned with India’s digitalization goals under initiatives like the Revamped Distribution Sector Scheme (RDSS). These policy-driven programs have been instrumental in accelerating smart metering adoption by providing clear targets, financial support, and standardized requirements that create a level playing field for all stakeholders. Without such initiatives, large-scale rollouts would be fragmented and far slower. For Wirepas, this policy alignment means we can offer scalable, infrastructure-free connectivity that meets national standards, helping utilities deploy faster, more efficiently, and at lower cost. Policy has truly been the catalyst turning smart metering from a tech upgrade into a national imperative.

India government RDSS is becoming a worldwide role model of well executed national smart metering programs. Defining the standard at the right level enables the free competition and helps utilities to reach their roll-out targets in time.

ELE Times: You’ve worked across global markets—what lessons from international smart grid rollouts are particularly relevant to India’s unique power distribution landscape

Ashish Sahay: The lifetime of AMI systems is increasingly reaching 15 years or more. This places significant demands on the selected technologies to ensure they do not become obsolete during their operational lifespan.

India tends to focus on short-term goals, such as the upfront cost of hardware, while in reality, maintenance costs (OPEX) play a major role in the overall business case. For instance, parts of Southern Europe widely adopted PLC technology, which, despite the low cost of smart meters, led to high system maintenance costs.

In Europe, in-meter RF mesh gateways have proven to be by far the most economical solution for deploying RF connectivity, effectively covering both rural and densely populated urban areas. India has the opportunity to replicate this success.

ELE Times: With rapid innovation in IoT and connectivity, where do you see the future of connected utilities heading in India over the next five years—and how is Wirepas positioning itself to lead that future?

Ashish Sahay: Over the next five years, India’s connected utilities will evolve into highly data-driven, responsive systems, powered by real-time insights and seamless IoT connectivity. At Wirepas, we see this transformation as a huge opportunity, and we’re positioning ourselves to lead it. Today, our RF mesh technology is already used in around 25% of new smart meter deployments in India, and we’re committed to expanding that footprint by partnering with local players and licensing our technology to Indian manufacturers.

Our solution is built for scale, performance, and future demands, supporting granular data collection intervals and ultra-resilient communication, all with the lowest total cost of ownership. We’re not just keeping pace with innovation; we’re setting the standard for what AMI connectivity should look like in India’s next phase of digital utility transformation.

Wirepas based systems enable utilities to also benefit from load balancing use cases to utilize the same RF communication with the electricity loads connected to the grid.

The post Rewiring the Future of India’s Power Grid with Wirepas appeared first on ELE Times.

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has released its latest SiCPAK power modules with epoxy-resin potting technology, powered by proprietary trench-assisted planar SiC MOSFET technology, that have been rigorously designed and validated for the most demanding high-power environments, prioritizing reliability and high-temperature performance. Target markets include electric vehicle (EV) DC fast chargers (DCFC), industrial motor drives, interruptible power supplies (UPS), solar inverters and power optimizers, energy storage systems (ESS), industrial welding, and induction heating...

At booth 304 (hall 9) at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025) Expo & Conference in Nuremberg, Germany (6–8 May), ROHM is showcasing reference projects with partners and presenting the evolution of its package designs and evaluation boards. Highlights include the following...