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Space Forge Inc (which, as a branch of Space Forge Ltd of Cardiff, Wales, UK, operates from Florida’s Space Coast, using space as a unique laboratory environment to manufacture semiconductor materials that cannot be made on Earth) has signed a master research agreement with The Texas A&M University System, which sets the framework for a research collaboration and marks a first step towards Space Forge establishing its initial semiconductor materials manufacturing and processing capability in the USA...

Space Forge Inc (which, as a branch of Space Forge Ltd of Cardiff, Wales, UK, operates from Florida’s Space Coast, using space as a unique laboratory environment to manufacture semiconductor materials that cannot be made on Earth) has signed a master research agreement with The Texas A&M University System, which sets the framework for a research collaboration and marks a first step towards Space Forge establishing its initial semiconductor materials manufacturing and processing capability in the USA...

SweGaN AB of Linköping, Sweden — which designs, develops and manufactures custom gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers, based on proprietary growth technology — has closed a US$14m Series B round of financing led by Swedish investor Thisbe AB (part of the Wallenberg Investments ecosystem), Copenhagen-based venture capital firm North Ventures and existing shareholders. This brings total funding to US$41m...

SweGaN AB of Linköping, Sweden — which designs, develops and manufactures custom gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers, based on proprietary growth technology — has closed a US$14m Series B round of financing led by Swedish investor Thisbe AB (part of the Wallenberg Investments ecosystem), Copenhagen-based venture capital firm North Ventures and existing shareholders. This brings total funding to US$41m...

💸 Державні гранти на навчання: як першокурсникам-контрактникам КПІ отримати фінансову підтримку KPI4U-2 пн, 08/17/2026 - 16:52

Reliance Industries and British aerospace and defence company Rolls-Royce have announced their strategic intent to partner on the design, development, manufacturing and delivery of a sovereign indigenous combat engine for India’s Advanced Medium Combat Aircraft (AMCA) programme. The announcement was made on August 14, 2026, marking a significant development in India’s efforts to build advanced aerospace and defence capabilities domestically.

Under the proposed collaboration Rolls-Royce’s expertise in Aerospace propulsion and gas-turbine technology would be teamed with Reliance’s industrial and manufacturing capabilities in India. In addition, the two parties propose to examine the feasibility of setting up a specialized Aerospace Gas Turbine Complex.

The combat engine is one of the most technically challenging elements of a modern fighter aircraft. Developing such an engine requires expertise in areas including high-temperature materials, compressors, turbines, combustion systems, cooling technologies, digital engine controls and advanced manufacturing.

Developing indigenous propulsion for the AMCA program can ease India’s future dependence on the international engine suppliers. It will strengthen the in-country capacity in India’s aerospace supply chain and contribute significantly to India’s long-term objectives of Atmanirbhar Bharat and defense-indigenization programs.

The partnership represents a potential shift from simply manufacturing or assembling imported propulsion systems toward co-development and indigenous technology creation. If successfully implemented, the initiative could strengthen India’s capabilities in high-thrust aircraft engines, create specialised aerospace manufacturing opportunities and support the development of domestic intellectual property.

The post Reliance and Rolls-Royce to Jointly Develop India’s Indigenous Combat Engine appeared first on ELE Times.

Bluetooth and Wi-Fi combine to untether smartphone-to-car connections…this time with a Google, versus Apple, angle.

Last month, I took apart a third-party adapter that aspires to augment Apple’s CarPlay interface with wireless connectivity between iPhone and vehicle.

This time, I’ll be disassembling the other adapter I’d mentioned at the end of late January’s initial conceptual coverage, in this case intended to wirelessly bridge between a car and an Android-based handset using Google’s Android Auto protocol.

But once again, the originally planned hardware target of my dissection attention isn’t what you’ll actually be seeing today. Initially, I’d planned on taking apart the v1 AAWireless unit, which I’d bought several years back in its original Indiegogo crowdfunding form.

But then I remembered that AAWireless had notably iterated the hardware (and associated software) design in-between that initial version and what ended up going into full production where it was sold and stocked not only by the manufacturer but also retailers like Amazon. AAWireless has already moved on to its second-generation product, in fact.

Supplier switcheroo, part 2

I didn’t want to further limit the project’s relevance by focusing on the rarer premier version of the first-generation offering (which put the company on the map, mind you, but still…). Instead, today you’ll be seeing the insides of this adapter (model BY969C).

It came from a company named “Vnilrgle” (believe it or not, and despite the user manual variously alternatively mentioning “TERUNSOIU”, or maybe that’s “TERUNSOIL”, as the supplier) and cost me a whopping $9.99 plus tax (with free shipping) from Woot in late February (versus listing for $48.87 on Amazon as I write this). Here are more stock shots to whet your appetite.

As you may have already noticed from one of them, this adapter model was of particular interest to me because of its low price, its quality construction (belying the $10 I paid for it), and its integration of NFC functionality, which aspires to simplify the initial setup process.

I’ll start out with shrinkwrap-inclusive front and back shots, as-usual accompanied by a 0.75′′ (19.1 mm) diameter U.S. penny for size comparison purposes, and revealing additional labeling.

The shrinkwrap-clinging stickers are absent from the now-clear-plastic-less backside photo that follows.

Time to open ‘er up.

Some literature bits (here’s an online version of the user manual).

And an optional-use double-sided sticker for, as I also said last month, adhering the wireless adapter to the vehicle interior.

As with its Apple CarPlay-supportive predecessor, this one includes a USB-A-to-USB-C adapter.

And here is today’s patient standalone, viewed from top.

Bottom.

Cable-entry point.

And cable connector-end perspectives.

Sh-sh-sh-shattered

(Obligatory admittedly-obscure-to-at-least-some section header reference)

Now to get inside. You’ve likely already noticed the gap between the silver-color circumference of the device body and the clear flat regions, both of which I’d assumed were made of plastic (for NFC reception reasons). My attempts to insert a spudger were unsuccessful, however.

So, I stuck the device in my vise (see what I did there?) in preparation for an attempted hacksaw-cut of one side. Oops.

I guess that’s glass, not plastic. And I won’t be using this device post-teardown. Onward.

Now for the other side, with tap-assistance from a ball peen hammer.

See those four screws? Not anymore, you don’t.

And with them removed, we have achieved liftoff.

An “Ultra” foundation for the fortunate

Let’s look first at the PCB underside (based on a device orientation assumption that places the product logo on the NFC antenna “top” side, with the marking minutia on the “bottom” side).

At left in the three-area-dominant IC row is the system processor. I mentioned last month, generally speaking about the wireless Android Auto and/or CarPlay product category, that “these are commonly Arm-based”. Judging from the markings on top of this one, there’s no doubt as to whose CPU core(s) is/are inside.

I’d even go so far to guess Cortex-A7 in generation. But who makes it? A search on “BU2025021” brought up bupkis. And the only reference I found to an “A7 Ultra” was associated with this Vanzen dual Android Auto-plus-CarPlay wireless adapter.

Although…”Cotex”?

Anyhow, to its right is the presumed serial-interface (therefore eight-lead package) firmware storage NOR flash memory, from GigaDevice and marked as follows.

AP2133
5F1GQ5UEY1H
UG5131

“1G” is suggestive of a 1 Gbit capacity, but I can’t find a direct reference to the IC anywhere online; reader assistance is welcomed! GigaDevice also makes Arm-based SoCs, by the way, so the company also acting as the source for the “A7 Ultra” wouldn’t be a complete surprise to me.

If you’re wondering (assuming my guess is correct) why 128 Mbytes of storage is necessary to implement a seemingly elementary device like this, my answer is two-fold albeit related.

• It doesn’t just handle Android Audio protocol and USB-to-wireless bridge functions
• And that capacity isn’t solely devoted to code

Turns out there’s also a web server (and pages) running inside the device, used for firmware-update and broader technical support-outreach functions, as this user manual page documents.

In fairness, circling back for a moment, the CarPlay adapter I took apart last month offers similar capabilities. I finally dug up an online version of the user manual for it; here’s the relevant page.

What’s the frequency, Kenneth?

(Another obligatory admittedly-obscure-to-at-least-some section header reference)

Finally, at far right is the wireless communications subsystem, based on the AIC8800DC40 controller from AICSemi, a company previously unknown to me, and surrounded by embedded Wi-Fi and Bluetooth antennae. Once again referencing last month’s writeup, I’d written the following.

Two wireless broadcast links are necessary: 2.4 GHz Bluetooth for initial setup, and Wi-Fi for ongoing streaming. The latter is usually based on the 5 GHz band for higher transfer bandwidth, since range isn’t a concern in a diminutive vehicle interior.

But in that teardown, I’d only found one antenna, suggestive of Bluetooth-plus-Wi-Fi shared usage, therefore 2.4 GHz-only system functionality. And this time, a datasheet I found online for the AIC8800DC40 suggests that it has 2.4 GHz-only Wi-Fi capabilities, even though the device documentation makes the following claims.

Wi-Fi Bluetooth module frequency:
Bluetooth 2.4 GHz, Wi-Fi 2.4-5.8 GHz

So… In search of clarity, I went looking for an FCC ID, which I hoped would lead me to definitive certification documentation. Believe it or not, nowhere related to last month’s patient—packaging, literature, or device itself—had I been able to find an FCC ID reference, or even a product name that might indirectly point me to my desired certification-data prize. Here’s what Google AI Assistant rightly said in response to my search query on “WOLIOS carplay adapter FCC ID”.

The WOLIOS wireless CarPlay adapter does not have an official, dedicated FCC ID registration tied directly to the “WOLIOS” brand name. Budget-friendly online resellers like WOLIOS often rebrand generic white-label factory units (such as common smart dongles) that may display general CE/FCC compliance claims or use an unverified label rather than maintaining an authentic, searchable filing in the FCC ID Database.

Alrighty, then. This time I at last had a valid model code, BY969C. With it, I tracked down the FCC ID (2A5XO-BY969D), which as it turned out covered a variety of products with different model numbers, physical appearances and both Android Auto and CarPlay support, suggestive of common hardware differentiated via firmware. And yes, both 2.4 and 5.8 GHz beacon support.

Speaking of antennae, and in closing, let’s now flip the PCB over to its topside and more closely check out that NFC subsystem.

Sequentially detaching the antenna from the PCB, both from connector and adhesive perspectives, and then peeling off its accoutrements, results in the following image sequence.

Note the LED that shines through the NFC antenna center “hole” and out the top of the device.

And now to dispense with the foam (at least most of it) between the double-sided sticker and antenna itself.

A Google search on the “BY969-LS-V01-NFC-HXW” product code stamped on top of the NFC antenna was of no help whatsoever. Alas. Unless, that is, I’m mistaken and it’s actually a Textured Johnny Collar Sweater Polo from Original Penguin by Munsingwear, sold by (but sold out at, as I type this) J. Crew Factory stores.

With that final bit of silliness out of the way, I’ll wrap up for today. Sound off in the comments with your thoughts on Rolling Stones or R.E.M. songs, men’s sweaters or anything else discussed in this piece!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• Adapter makes Apple CarPlay connectivity wireless
• Apple CarPlay and Google Android Auto: Usage impressions and manufacturer tensions
• Spotify’s Car Thing: “Why does it exist” is the crux of the questioning
• Amazon’s Echo Auto Assistant: Legacy vehicle retrofit-relevant

The post Adapter makes Google’s wireless Android Auto a reality appeared first on EDN.

What’s New?

Ather Energy, one of India’s leading electric two-wheeler manufacturers, announced the introduction of its new Ather 450X Overtones Series in Nepal, expanding its product portfolio in the company’s earliest international market. Alongside the new 450X Overtones, Ather is also taking its latest technology and ride experiences to the market, with Magic Twist, Infinite Cruise and Voice on Ather, now available on the 450 Series in Nepal.

What Senior Employee of Ather Company said?

Speaking on the occasion, Ravneet Singh Phokela, Chief Business Officer, Ather Energy Limited, said: “Since we entered Nepal in 2023, we’ve seen a strong response to Ather, and that’s translated into incredible growth for us in the market. We’ve significantly expanded our footprint, built out our retail, service and charging network, and grown the portfolio from the 450 to include Rizta. The 450X Overtones Series further strengthens that portfolio, bringing a fresh take on the 450, giving customers more choice while carrying forward some of the latest technologies shaping the Ather experience today. We’re looking to build on that momentum, and Nepal remains a market we’re committed to growing steadily over the long term.”

Ather entered Nepal in November 2023 with the 450 Series, marking its first international market. Since then, the company has built out its presence across the country through 14 experience centres and 31 fast charging points via its national distributor, Vaidya Energy Pvt. Ltd. In 2025, Ather added the Rizta to its portfolio in Nepal, bringing a family-focused offering centred around comfort and convenience. The introduction of the 450X Overtones now further expands the 450 Series offering in the market.

The new 450X Overtones brings a fresh design treatment to the 450, with a tone-on-tone finish across three colourways: Still White, Space Grey and Lunar Grey. Different textures and finishes across the scooter accentuate its form while retaining the distinctive design and performance-focused character of the 450 Series.

Alongside the new design, the 450 Series in Nepal now features technologies such as Magic Twist, Infinite Cruise, as well as Voice on Ather, which was recently rolled out in India. Magic Twist allows riders to decelerate by twisting the throttle backwards, using regenerative braking to slow the scooter while recovering energy. Infinite Cruise helps maintain a consistent speed with reduced throttle input, while Voice on Ather, powered by AtherStack 7.0, enables riders using a compatible Bluetooth headset or smart helmet to use voice commands for functions such as navigation, locating charging stations, and controlling supported scooter settings.

Ather has continued to build out its presence in international markets. In Sri Lanka, the company now operates 42 experience centres. This sits alongside a network of 715 experience centres in India, as the company continues to scale its presence market by market.

The post Ather Expands its Product Portfolio in Nepal with the New 450X Overtones Series appeared first on ELE Times.

India’s electric vehicle industry is rapidly emerging as a significant force in the global automotive market, with electric car exports reportedly reaching approximately $369 million in Q1 2026. This development signals a new phase for India’s EV sector, positioning domestic manufacturing increasingly for international markets.

Sharing his optimism regarding the e-mobility segment in India, Dr. Rajeev Mishra, President, IFEVA (International Federation of Electric Vehicle Association), said, “Make in India is now evolving into Made in India, made for the World.” He highlighted the growing potential of India as a global electric mobility manufacturing and export hub.

India as a Global EV Powerhouse

Dr. Mishra emphasised that India’s EV ambition should go far beyond increasing domestic EV sales. “India must transition from being an EV-consuming market to becoming a Global EV Manufacturing, Technology, Innovation and Export Hub. Our objective should be to build Indian EVs not only for India, but for the world.”

India’s next phase of growth, according to him, must focus on EV manufacturing, batteries, power electronics, components, charging infrastructure, testing and certification, R&D, software, skill development and global supply-chain integration. He further stressed the importance of collaboration between government, industry, MSMEs, startups, academia, research institutions, investors and international technology partners to build a globally competitive EV ecosystem.

“$1 billion quarterly EV exports should be the next milestone,” Dr. Mishra averred, calling for a clear national ambition of taking India’s quarterly electric vehicle exports towards $1 billion. He said achieving this target would require stronger localisation, world-class quality standards, technology innovation, competitive financing, robust testing infrastructure, global certifications and strategic international partnerships.

Europe Emerging as a Key Opportunity

Europe is becoming an important destination for Indian electric vehicles, driven by stringent emission regulations, the transition towards clean mobility and increasing demand for cost-effective and technologically capable EVs. India’s expanding manufacturing ecosystem, competitive production capabilities and growing localisation of EV components are strengthening its position in the international market.

Three Forces Driving India’s EV Export Momentum

Government Manufacturing Support: Policy initiatives and manufacturing incentives are helping strengthen India’s EV and advanced battery ecosystem while encouraging investment and localisation.

Atmanirbhar Bharat: Expanding domestic manufacturing and supply chains creates a stronger foundation for Indian and global automotive companies to manufacture in India and serve international markets.

Global EV Transition: As countries accelerate the shift towards electric mobility and diversify global supply chains, India has an opportunity to emerge as a major “China+1” manufacturing destination.

EVs Can Become a New Engine of India’s Growth

The growth of electric mobility can generate opportunities across manufacturing, engineering, electronics, batteries, software, charging infrastructure, logistics and associated services, while strengthening India’s foreign-exchange earnings and global industrial footprint. Dr. Mishra said the EV revolution can become an important pillar of India’s broader journey towards Viksit Bharat 2047, strengthening both economic and energy security.

Dr. Mishra reiterated IFEVA’s commitment to creating stronger platforms for industry collaboration, policy dialogue, technology exchange, skill development, investment facilitation and global partnerships in electric mobility. “The opportunity before India is not merely to manufacture more electric vehicles. The real opportunity is to make India one of the world’s most trusted destinations for electric mobility innovation, manufacturing and exports.”

The post India Must Target $1 Billion in Quarterly EV Exports: IFEVA President appeared first on ELE Times.

Following a “reality check” in 2024–2025, when sales of hybrid electric vehicles gained ground and battery-electric vehicles growth slowed temporarily, the xEV industry is regaining momentum, notes Yole Group in its report ‘Automotive Powertrain and Electrification 2026 – Focus on Power Electronics’. The market research firm estimates that xEV production is growing at a double-digit compound annual growth rate (CAGR) during 2025–2031 to about 70% of global light vehicle production, with battery-electric vehicles (BEVs) alone accounting for 33 million units. In turn, the xEV power device market is growing at a 14% CAGR to $14.5bn by 2031...

A pilot project has been planned at NTPC Simhadri Thermal Power Station to evaluate an indigenous Iron-Air Battery technology for Long-Duration Energy Storage (LDES) applications. The project will be implemented by Atal Incubation Centre – Anna University (AIC-AU) at NTPC Simhadri through its technology partner, Meine Electric, with the objective of assessing the technology under utility operating conditions.

Role of Pilot Project

The pilot project will evaluate the technical performance, operational reliability and operational characteristics of the indigenous Iron-Air Battery system under real world conditions. The study is expected to generate valuable operational data and insights into the suitability of the technology for long-duration energy storage applications, enabling reliable 24×7 clean energy, enhancing grid flexibility and supporting future applications that require enhanced operational flexibility.

What Makes Meine Electric’s Iron-Air LDES Technology Different?

Meine Electric is the first company in APAC and the third globally to pioneer Iron-Air Long-Duration Energy Storage (LDES) technology. Its proprietary Fast Charge Long Discharge (FCLD) technology, which enables a six-hour charge and 18-hour discharge, has also been independently validated by Customized Energy Solutions (CES), the parent company of the India Energy Storage Alliance (IESA). CES Battery Laboratory testing assessed the technology’s electrochemical performance, capacity retention and operational stability under a 6-hour charging and 18-hour discharging cycle, providing third-party validation as Meine Electric advances towards larger scale demonstrations and commercial deployment.

As India continues to expand its renewable energy capacity, long-duration energy storage is expected to play an increasingly important role in improving grid reliability, managing renewable energy variability and supporting a more flexible and resilient power system. The pilot project is expected to contribute towards the development and evaluation of indigenous energy storage technologies while generating valuable learnings for future applications.

Through the AIC-Anna University initiative, Meine Electric will be responsible for the development, system integration and performance monitoring of the Iron-Air Battery system. The operational data and technical insights generated during the pilot will provide an important benchmark for further technology development and future commercial-scale deployment.

Speaking on the collaboration, Mr. Priyansh Mohan, Co-Founder & CEO, Meine Electric, said:

“We are honoured that our indigenous Iron-Air Battery technology has been selected for implementation under this pilot project planned at NTPC Simhadri Thermal Power Station. The project provides an important opportunity to demonstrate the technology under utility operating conditions and generate valuable performance data that will help accelerate the development of cost-effective long-duration energy storage solutions for India’s evolving power system.”

Speaking on the partnership, Shri Kishore Kumar.S, CEO, AIC – Anna Incubator, said:

“Our mission is to catalyze high-impact innovations that solve critical national challenges. Supporting Meine Electric in deploying India’s indigenous Iron-Air Battery technology at NTPC Simhadri is a major step toward achieving scalable, long duration energy storage. This collaboration highlights how academia, startups, and public sector leaders can work together to strengthen India’s clean energy ecosystem and accelerate our transition to a resilient, sustainable grid.”

The initiative reflects the growing emphasis on indigenous innovation, advanced energy storage technologies and collaborative research aimed at supporting India’s clean energy transition and strengthening long-term energy security.

The post Meine Electric’s ‘Made in India’ Iron-Air battery for Long Duration Energy Storage Enters Utility-Scale Pilot Evaluation appeared first on ELE Times.

Every engineer’s confidence in measurement rests on more than the instrument—it depends on the interface that ties instruments together into a working system. Standards like GPIB, USB, LXI, PXI, and VXI are not just acronyms; they are the lifelines that enable communication, synchronization, and scalability across labs and production floors.

Understanding these interfaces equips engineers to unlock the full potential of their tools, ensuring precision today while building readiness for tomorrow’s challenges. This fundamentals guide maps the evolution and role of these connections, showing how mastery of interfaces translates directly into mastery of measurement.

Interfaces as the backbone of measurement

Instrument interfaces are the quiet enablers of every test setup, defining how equipment communicates, synchronizes, and scales. From the legacy reliability of GPIB to the plug-and-play familiarity of USB, and from the networked flexibility of LXI to the modular power of PXI and VXI, these standards form the connective tissue of modern measurement.

Mastering them isn’t just about knowing acronyms; it’s about gaining the confidence to build systems that are precise, adaptable, and future-ready. By understanding the fundamentals of these interfaces, engineers equip themselves to unlock the full potential of their instruments and drive measurement forward with clarity and control.

Legacy heavyweights: GPIB and serial

Before “plug and play” became the industry standard, test and measurement benches relied on a rugged era of “plug and screw-in” connectivity, dominated by GPIB (IEEE-488) and serial interfaces. GPIB is instantly recognizable by its massive, 24-pin Centronics-style connector and notoriously stiff, heavily shielded cabling.

Despite its bulk, GPIB offered a unique, ingenious hardware feature: stackability. Because the cables featured a male connector on one side and a female on the other, engineers could literally stack five or six connectors directly on top of a single instrument port to daisy-chain devices together, keeping complex automated test systems organized.

Figure 1 The GPIB interface in the B2901B source/measurement unit (SMU) incorporates the device into automated test systems, enabling seamless communication with legacy controllers and peripheral hardware. Source: Keysight

Parallel to GPIB, traditional RS-232 and RS-485 serial communication typically relied on robust DB9 or DB25 D-Sub connectors to lock down data links. While these legacy ports were a staple of early automated test setups, modern instrument backplanes have largely phased out the bulky D-Sub form factor.

Today, you are much more likely to find an RJ-45 or USB-B port that “emulates” serial communication. Transitioning to these modern setups often requires specific adapter cables—such as the ubiquitous “Cisco blue cable”—bridging the gap between classic serial protocols and modern benchtop connectivity.

The modern bench: USB and Ethernet

If you have bought a piece of test equipment in the last 15 years, there is a 90% chance your back panel is dominated by USB and Ethernet connectivity. Unlike the fragile Type-A ports found on modern consumer electronics, most instruments standardize on the chunkier USB Type-B port (the classic “printer cable” connection).

It’s a deliberate choice by instrument designers; the Type-B architecture is physically much more robust, providing the mechanical stability needed to survive the constant plugging, unplugging, and cable-tugging common in a busy lab environment. However, navigating instrument USB ports requires a bit of spatial awareness.

While the Type-B port on the back is meant for raw PC control, many instruments feature a standard USB-A port right on the front panel. It’s crucial to remember that this is a “Host” port. It is there to let the instrument control peripheral devices—like saving screenshots to a thumb drive or hooking up a mouse for easier UI navigation—and cannot be used to interface the equipment directly with a computer.

That mechanical status quo is finally shifting, however, with the slow but steady arrival of USB-C on the test bench. While engineers initially feared its tiny footprint would be too fragile for heavy lab use, its massive data bandwidth and high power-delivery capabilities are proving too good to ignore.

Modern compact USB oscilloscopes and smart, battery-powered field instruments are increasingly adopting USB-C, allowing them to simultaneously stream high-speed sample data to a PC and pull operational power over a single, reversible cable.

LXI/Ethernet (RJ-45)

If USB is the king of close-range bench automation, Ethernet is the undisputed champion for remote testing, distributed systems, and distributed lab networks. Utilizing the standard 8P8C (RJ-45) jack, modern Ethernet-enabled instruments generally conform to the LAN eXtensions for Instruments (LXI) standard, transforming a simple local network into a highly synchronized, long-distance test environment.

But Ethernet brings an even bigger hardware advantage to the bench: galvanic isolation. Unlike USB connections, which share a common DC ground between the instrument and your PC, Ethernet architecture is inherently transformer-coupled. This creates a physical, magnetic barrier for electrical DC currents.

If you are working with high-power systems or floating measurements where your instrument’s chassis sits at a different electrical potential than your PC, Ethernet eliminates the risk of “ground loops.” It ensures that a sudden voltage spike or ground fault will not travel down the communication line and catastrophically blow up your PC’s motherboard.

Figure 2 Arrow points to the LXI port on the RIGOL DS1202Z-E rear panel. Source: Rigol

The unsung hero of automation: Digital I/O interface

While analog channels get all the glory for capturing waves and signals, the digital input/output (digital I/O) interface is the quiet workhorse that turns standalone Test & Measurement (T&M) instruments into fully automated systems. Think of it as the instrument’s binary nervous system. It uses simple high/low voltage signals (typically TTL or CMOS levels) to communicate with the outside world.

Through digital inputs, an instrument can listen for external triggers—like a sensor detecting that a device under test (DUT) is properly in place, or a companion machine signaling is ready. Conversely, digital outputs allow the instrument to command its environment, such as triggering an external laser, switching a relay, or flashing a red warning light if a test fails.

For engineering students and hobbyists transitioning from manual bench testing to automated production lines, mastering digital I/O is the crucial first step toward building smart, synchronized, and hands-free test environments.

Figure 3 The digital I/O interface is on the rear panel of the Keithley 2602B SMU. Source: dataTec

High-speed backbone: PXI, PXIe, and VXI

When benchtop space is at a premium and a handful of standalone instruments can no longer keep up with massive channel counts or ultra-high throughput demands, the “instrument” undergoes a physical evolution. While VXI served as the rugged, VMEbus-based grandfather of this movement in the late 1980s, modern high-density testing has largely migrated to PXI and PXI Express (PXIe).

In these automated test equipment (ATE) environments, traditional boxes give way to modular instrumentation systems like PCI eXtensions for Instrumentation (PXI) and PXI Express (PXIe). In these systems, instruments lose their front panels, screens, and individual power supplies, transforming into compact, modular cards that slide into a shared industrial rack.

These card-edge modules do not work alone; they require a dedicated chassis to provide the necessary power, cooling, and communication pathways, alongside a dedicated controller card that serves as the system’s “brain.” What truly separates PXI/PXIe from consumer-grade PC chassis, however, is its high-density “hard metric” backplane connector packed with hundreds of pins.

This backplane doesn’t just route high-speed PCIe data lanes; it features hardwired, dedicated hardware lines for precision triggering and 10 MHz/100 MHz reference clocks. By baking synchronization directly into the physical backplane copper, engineers can synchronize multiple instrument cards—such as digitizers and RF signal generators—with absolute precision, dropping timing skew down to the picosecond level.

Specialty and high-frequency sync

When you are pushing the boundaries of high-speed measurement, a fast data interface like USB or Ethernet simply isn’t enough; the inherent software latencies are far too unpredictable. For true phase alignment and precise event matching, you need physical, hardware-level timing synchronization. This is where dedicated coaxial connections on the back panel come into play, stripping away communication protocols in favor of raw, speed-of-light electrical pulses.

The most common tool for this job is the ubiquitous BNC (Trigger In/Out) connector—the classic, 50-Ω “push and twist” interface found on almost every piece of serious bench gear. These ports carry simple TTL voltage steps to command multiple instruments to start capturing data at the exact same microsecond, eliminating any jitter caused by PC software.

Right alongside the trigger ports, you will almost always find the 10-MHz reference In/Out BNC ports. These are used to completely override an instrument’s internal crystal oscillator. By daisy-chaining these reference lines, you can “lock” the internal timebases of every instrument on your bench to a single master clock—whether that is a high-end oscilloscope or an ultra-stable external rubidium or GPS disciplined clock—ensuring your entire test system drifts as one.

Here is a side note on why 10 MHz. Ten megahertz (10 MHz) became the universal reference frequency because it strikes the right balance between practicality and precision. It’s low enough to distribute cleanly over coaxial cables without distortion, yet high enough to be multiplied or divided into the ranges needed for synthesizers and RF systems.

Its adoption was reinforced by national time services, rubidium and cesium atomic clocks, and GPS-disciplined oscillators, all of which commonly output 10 MHz. As a result, nearly every serious instrument supports it, making 10 MHz the common language for locking multiple devices to a single master clock.

Engineering trade-off: Speed, distance, and ruggedness

Ultimately, choosing the right hardware interface is an exercise in balancing speed, distance, and ruggedness against the specific needs of your test setup. If you are building a permanent, high-throughput automated rack that requires absolute clock synchronization, scaling up to PXIe or building out an LXI-compliant Ethernet network is the gold standard.

Conversely, if you are just pulling a quick measurement at your desk or running a temporary validation test, the simplicity of USB remains king. There is no single “best” interface—only the right tool for the specific measurement topology at hand.

Navigating the “hidden” hardware premium

As you map out your test system, it’s worth keeping an eye on the budget for the often-overlooked physical layer accessories. While it’s easy to assume that hooking up an older, high-end GPIB-equipped spectrum analyzer to a modern PC is just a matter of a simple cable change, the “hidden” hardware costs can catch you off guard.

Because GPIB is a complex parallel bus, standard GPIB-to-USB controller adapters from reputable T&M vendors require dedicated, specialized chipsets inside the cable housing. Consequently, these controller cables can easily run anywhere from $500 to over $1,000 each.

Figure 4. NI GPIB-USB-HS interface translates legacy GPIB signals into a USB-compatible format to enable remote instrument control and data logging. Source: National Instruments

Don’t let these price tags discourage you from utilizing legacy gear, though. These rugged adapters are highly reliable, built to last for decades, and frequently retain their value on the secondary market. Alternatively, if you are working on a tighter budget, there are excellent open-source or lower-cost third-party controller alternatives available, ensuring you can still breathe modern life into classic, high-performance bench instruments without breaking the bank.

From bench to bus: Your turn to build

At the end of the day, every piece of iconic technology—from the Mars rovers to the smartphone in your pocket—started as a cluster of instruments connected to a test bench. Whether you are a seasoned automation engineer managing a massive PXIe chassis rack, or a curious maker setting up your very first USB oscilloscope at a home workbench, the interfaces you choose are the quiet enablers that bring your designs to life.

Don’t let the complex acronyms or the price tags of high-end adapters intimidate you; the fundamentals of data, grounding, and synchronization remain exactly the same. So, here is our challenge to you: look at the back panel of your gear, grab a cable, and push your bench a little further this week.

If you are a novice, try writing a basic script to pull a single voltage reading over USB. If you are a veteran, see if you can optimize your automated test cycle times by swapping a legacy serial link for LXI Ethernet. Every great piece of hardware engineering is built on the back of rigorous measurement. Go wire up your bench, automate your data, and show us what you are building.

What does your current test setup look like? Are you still rocking legacy GPIB gear via adapters, or have you fully migrated to an Ethernet-driven LXI bench? Drop a comment below and share your worst ground-loop horror stories or your slickest automated test setups!

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

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• Software-Defined Radio in Test & Measurement Markets
• What IEEE 1588 means for your next T&M system design
• Why you should use LXI instruments in your next T&M system
• The USB takeover: Why modern T&M is moving to your pocket

The post Measurement basics: A field guide to instrument interfaces appeared first on EDN.

Pixus Technologies, a provider of embedded computing and chassis solutions, has announced a MIL Ruggedized NI software defined radio (SDR) with extended temperature options. Now a part of Emerson, the NI SDR is based on the family of Ettus brand Universal Software Radio Peripherals (USRPs).

Pixus ruggedizes various versions of NI SDRs in IP67 outdoor and full MIL rugged qualified versions.  The new RN310 version has options for an external MIL grade fan that pulls air over the conduction-cooled fins on the enclosure as well as an internal heater board.  This allows the units to meet -40C to +71C applications.

Pixus offers MIL rugged and commercial enclosure solutions in VITA based architectures such as OpenVPX, as well as specialty customized solutions like the rugged NI SDRs.   The company has also developed two-in-one dual USRP versions in a 1U format with superior front to rear cooling.

 

The post New MIL Rugged N310 Software Defined Radio With Extended Temperature Options appeared first on ELE Times.

Testing a .001 uf 6000v door knob capactor for leackage, both passed at least up to the 600v this IT-28 Capactor tester can run. Not the 2000 to 3000 volts that are possible in a SB-220 but it should be close enough if the "eye" does not close at 600v they should be good. submitted by /u/RefrigeratorLess9786 [link] [comments]

The old paper wound caps were replaced with new metal electrolitic caps, and bleed resister array which bleeds voltage off caps when unit is turned off. New metering board on the front of the power pack to feed readout meters on front panel. Older chokes and caps were removed from botyom grid circuit and the grid was grounded to chasis for better stability. A soft-key was built and added to the amp key up circuit to ne compatable with modern radios. Old coax and wiring replaced to higher temp and voltage rated material. submitted by /u/RefrigeratorLess9786 [link] [comments]

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Rf choke replacement submitted by /u/RefrigeratorLess9786 [link] [comments]

Dreading placing those SMDs… I need a PnP 😭 submitted by /u/aq1018 [link] [comments]