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The US Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) and the Hydrocarbons and Geothermal Energy Office (HGEO) have announced a ‘Critical Minerals and Materials Accelerator’ Notice of Funding Opportunity (NOFO) of up to $69m for technologies that advance the domestic separation, processing, and refining of critical materials. Projects selected will address the greatest technical obstacles to a more secure, domestic critical materials supply chain...

Firmware over-the-air (FOTA) updates are essential for improving system quality, adding new features after initial release, fixing bugs and vulnerabilities, improving system performance, and reducing recall and service costs. As new features are added, the size and complexity of the firmware stored in flash memory typically increases, inevitably leading to increased FOTA completion times.

Most of this time is spent on erasing and reprogramming. Beyond optimizing the user experience through faster updates, the irreversible nature of these operations must also be considered.

Another important consideration is that FOTA operations should ideally be performed in a stable environment similar to flash programming in a production environment. However, field update environments are relatively harsh and unstable. To avoid lengthy, risky, or potentially critical FOTA operations, the time required should be minimized.

But field updates are also vulnerable to various security threats, so thorough preparation is essential. These threats can range from third-party attacks to arbitrary modifications attempted by the product owner. This article outlines key considerations for implementing FOTA.

FOTA basics

FOTA is a technology that remotely updates a device’s firmware via wireless networks such as Wi-Fi, 5G, LTE, or Bluetooth without a physical connection. The flash memory used in this process serves as a core hardware resource, either temporarily storing the update package or ultimately writing the new executable code.

Let’s first examine the classification of FOTA based on flash memory configuration. This classification is determined by whether the flash memory is located internally or externally.

• Dual-bank architecture, internal NOR flash memory method

The dual-bank flash memory space within the MCU is allocated as active and passive slots, respectively. Each partitioned slot provides a space for executing existing software while simultaneously downloading new updates. This configuration features simple hardware configuration, high security, and fast bank switching through address remapping. However, it requires twice the flash memory density compared to the software size, resulting in increased hardware costs.

• External NOR flash memory method

This method uses external NOR flash memory connected to the application processor (AP)/microcontroller (MCU) via the QSPI (Quad SPI) or OSPI (Octal SPI) interface. Its large flash memory density makes it ideal for large-scale software updates. The update file or binary image is stored in flash memory and then copied to the internal flash memory. This method overcomes internal memory limitations and facilitates the storage of multiple versions of backup binary images, including emergency recovery binary images.

Let’s look at the classification of FOTA based on its implementation mechanism. These mechanisms can be used independently or combined and reconfigured.

• A/B update (seamless update)

The active slot (bank) where the current software/firmware is running and the passive slot (bank) for update downloads are physically separated, and software is installed or disabled across the two banks. This physical separation ensures that even if power is cut or a malfunction occurs during an update, the bank where the current software is running is preserved, preventing bricking.

• Execute-in-place (XIP) and concurrency

FOTA relies entirely on external NOR flash memory, meaning that code is read directly from external NOR flash memory. This technique involves executing code in one flash memory area while simultaneously downloading new updates to another area. However, the large capacity NOR flash memory used for FOTA is logically configured as a single bank, even when using multi-chip packaging technology. Therefore, the use of XIP for FOTA is limited.

• Delta update

This update only receives the changed differences or patches, rather than the entire software update or binary image. By reducing the amount of data transmitted, it reduces the time required for FOTA and saves on flash memory writes (program/erase cycles). Currently, optimized compression algorithm solutions are being employed to enable delta updates even on MCUs with low hardware specifications.

Reliability and security enhancements

FOTA design goes beyond simply writing data. It focuses on maximizing uptime (zero downtime) by leveraging safety, efficiency, and continuity, and securely controlling flash memory within a Trusted Execution Environment (TEE).

• Integrity verification

To ensure that data written to flash memory has not been corrupted or altered, the digital signature of the downloaded data is verified using a hardware security module (HSM) or TrustZone. After writing to flash memory, a checksum or CRC check is performed on the entire area to check defects in the flash memory.

• Rollback

If a boot failure occurs with a new update or software, the system must have the ability to immediately revert to the previous version.

• Flash memory life management (wear leveling)

Maximize the hardware lifespan of flash memory by preventing flash writes from being concentrated on specific areas of flash memory.

• Secure boot integration

Root of Trust (RoT) verifies that the software written to flash memory is signed by a trusted manufacturer.

• Secure storage

In addition to securing communication between the host and flash memory, flash memory must provide secure storage. The latest secure flash memory features a built-in HSM, enabling real-time encryption and decryption without performance degradation and providing secure storage capabilities.

NOR in FOTA architecture

Among the explanations mentioned above, the FOTA architecture utilizing external NOR flash memory is a strategy that overcomes the physical limitations of embedded memory and maximizes system flexibility. As of 2026, the role of external NOR flash memory is becoming increasingly important due to the increasing size of firmware and strengthened security requirements.

FOTA utilizing external NOR flash memory offers overwhelming advantages over embedded methods in terms of safety, density, and flexibility, and is becoming the standard for industrial devices requiring high reliability and smart devices using large-capacity firmware. We will delve into the five key advantages of FOTA using external NOR flash memory.

1. Scalability and cost efficiency

• Large image accommodation: Firmware containing the latest operating systems (RTOS, Embedded Linux), graphics libraries, and AI models often exceed tens of MBs in size. Adding relatively inexpensive external NOR flash memory is more advantageous for reducing overall bill of materials (BOM) costs than increasing the internal flash capacity of expensive MCUs.
• Multi-image storage: Simultaneously storing multiple versions of firmware backups and user data images dramatically increases memory resource management flexibility.

2. Provides a stable backup and rollback environment

• Fail-safe mechanism: Even if a power failure or communication error occurs during an update, the existing executable code in the internal flash remains intact. The replacement process only begins after the new image has been fully downloaded and verified to prevent bricking.
• Factory recovery: Factory recovery firmware can be stored in external memory. If a critical bug is discovered in a new version, it can be immediately restored to a stable previous version or factory settings from external memory without a server connection.

3. Minimized downtime

• Non-intrusive background downloads: The internal flash memory focuses on running the current application, while the external flash memory receives data in the background via an independent bus. This facilitates zero-downtime implementation, ensuring device service is not interrupted even while receiving update packets.
• Bus separation: Using separate interfaces such as QSPI and OSPI prevents bus conflicts between internal memory access (command fetch) and external memory access (update write), minimizing system performance degradation.

4. Extended flash life and maintainability

• Internal flash memory protection: Flash memory has a limited number of write/erase cycles (P/E cycles). During development with frequent updates or when frequent firmware changes are required, a significant portion of write operations are handled by external memory, protecting the life of the MCU’s internal flash, which cannot be replaced.
• Modular capacity expansion: Even if firmware capacity increases due to added functionality in the product lineup, the burden of hardware redesign is reduced because only the external flash memory can be replaced with a larger capacity without replacing the MCU.

5. Security and data isolation

• Physical isolation: The executable code (internal) and the update standby image (external) can be physically separated and managed.
• Security update patch: By storing the firmware in an encrypted state in external memory and decrypting it only at boot time and uploading it to internal memory or RAM, an additional layer of defense against firmware theft attacks can be added.

FOTA implementation

The success of a FOTA solution hinges on the ability to provide secure and seamless updates. The implementation of the above architecture will be key to achieving this.

The automotive industry is already responding to the changes that make FOTA essential. As the transition to software-defined vehicles (SDVs) becomes more concrete, demand for software updates is skyrocketing. This is because it enables flexible changes or additions to vehicle functions even after mass production, enabling rapid response to errors and defects and continuous delivery of new services to customers.

As the frequency of software updates increases, their importance is also increasing. United Nations Economic Commission for Europe (UNECE) WP.29 enacted R156 in June 2020, which now covers not only passenger cars, commercial vehicles, and trailers with towing devices, but also agricultural machinery equipped with software update capabilities.

UNECE WP.29 R155 and R156 define the requirements OEMs must meet in the areas of cybersecurity and software updates. UNECE regulations R155 and R156 introduce framework conditions for cybersecurity and software update capabilities for all vehicles. They also require automakers to establish certified Cyber Security Management Systems (CSMS) and Software Update Management Systems (SUMS).

R155 requires the establishment of a cybersecurity risk identification and response system, consideration of security throughout the entire vehicle lifecycle, documentation and maintenance of a CSMS based on ISO/SAE 21434, and submission of documentation and evidence during the Vehicle Type Approval (VTA) audit.

R156 addresses the security assurance of OTA or wired updates, change impact analysis and verification systems, update history management, and auditability. It’s based on the ISO 24089 standard for software updates.

The introduction of FOTA is no longer an option. It’s essential for improving system quality, adding new features, fixing vulnerabilities, enhancing system performance, and reducing recall costs.

We have examined the important considerations before adopting these new solutions. In addition to providing safe and fast update methods for improved user experience, we have also briefly discussed the security regulations that must be considered.

Scott Heo is lead principal engineer at Infineon Technologies.

Related Content

• OTA Software Updates: Changes Ahead
• Addressing the challenge of automotive OTA update
• OTA: A Core Technology for Software-Defined Vehicles
• How PCM memory bolsters OTA firmware upgrades in vehicles
• The role of phase-change memory in automotive OTA firmware upgrades

The post Memory solutions for firmware OTA updates appeared first on EDN.

📰 Газета "Київський політехнік" № 13-14 за 2026 (.pdf) Інформація КП пт, 04/10/2026 - 16:12

Motor control integrated circuits (ICs) and motor drives are essential elements for implementing smart manufacturing within the framework of Industry 4.0. A common requirement in modern industrial applications is high-efficiency motor solutions. About 50% of global energy consumption is due to electric motors, and therefore, even a moderate improvement in efficiency can provide meaningful economic benefits, helping reduce the carbon footprint.

International efficiency standards for industrial motors, such as IE3 (Premium) and IE4 (Super Premium), have been introduced to reduce energy use. As of July 2023, European regulations mandate that three-phase induction motors between 75 kW and 200 kW adhere to the IE4 efficiency standard.

In addition to being more efficient, modern industrial motor solutions must be smart and connected. “Smart devices” are equipped with sophisticated capabilities. They can identify irregularities such as excessive heat or voltage surges and respond automatically. The introduction of AI technologies, such as machine learning, brings this function to the next level, allowing predictive maintenance and reducing factory downtime.

Connection is another key requirement for motor solutions deployed in the Industry 4.0 sector. This feature allows the devices to exchange data in real time, supporting predictive maintenance, energy efficiency improvements, and remote control. Using the industrial internet of things, electric motors can send operational data to cloud systems. This helps reduce downtime and allows for continuous improvement of production processes. Moreover, technicians can access performance data remotely, decreasing the need for on-site inspections and allowing faster troubleshooting.

Motor driver architecture

Motor driver electronics is the power interface between digital control systems and electromechanical loads. This architecture is based on three components: control logic, gate drivers, and power stages.

Control logic typically resides within microcontrollers (MCUs), digital-signal processors, or dedicated motor control ICs, which are engineered to perform real-time control loops. Subsequently, gate drivers transform these logic-level signals into switching commands, which are then employed to regulate power transistors, encompassing MOSFETs and IGBTs. The power stage, frequently implemented via inverter or H-bridge configurations, supplies the desired current to the motor windings.

Furthermore, in Industry 4.0 contexts, motor drivers incorporate supplementary functionalities, encompassing fault monitoring, thermal sensing, communication interfaces, and energy management capabilities. Motor driver ICs also feature integrated protective measures, such as overcurrent, overvoltage, and thermal shutdown mechanisms. These protections improve system reliability and simplify the design process.

Microchip Technology Inc. recently introduced a lineup of 12 600-V gate drivers. These high-voltage drivers are designed to deliver output currents between 600 mA and 4.5 A. They are also available in a range of configurations, including half-bridge, three-phase driver, and high-side/low-side options.

These gate drivers facilitate rapid switching, thereby promoting efficient performance, and are particularly appropriate for industrial motor control applications. In addition, the logic inputs are compatible with standard TTL and CMOS levels, extending down to 3.3 V, which streamlines integration with conventional MCUs. The safe operation of the output power MOSFETs is ensured by Schmitt triggers on the inputs and an internal deadtime preset.

The MCP8062136, for instance, is a three-phase half-bridge with three high-side drivers operating in bootstrap operation up to 600 V and can provide a 200-mA source and 350-mA sink output current. The gate drivers also include several protection features, including shoot-through protection logic, undervoltage lockout for VCC, and overcurrent protection.

Figure 1: Microchip’s high-voltage (600 V) MOSFET and IGBT silicon gate drivers, designed for a range of applications, including stepper motors, compressors, pump motors, motor drives, industrial inverters, and renewable energy systems (Source: Microchip Technology Inc.)

To drive motor-controlled industrial applications such as sensorless three-phase fans and pumps up to 40 W, Melexis has introduced the MLX81339 motor control IC. The device is also suitable for driving brushless DC (BLDC) and bipolar stepper motor control for accurate positioning in applications such as automated valves, flaps, and small robotic motors.

The MLX81339 supports several types of communication interfaces with a host MCU, including the legacy PWM/FG, as well as the I2C, UART, and SPI interfaces. The motor control IC offers several protection and diagnostics features, including undervoltage, overvoltage, overcurrent, and overtemperature detection and protection, and integrates a programmable flash memory that can be used for application customization and IC configuration.

Connectivity in smart motor control

In Industry 4.0 applications, motor drivers often adopt communication protocols, such as EtherCAT, Profinet, and Ethernet/IP, to exchange real-time data with other drives, sensors, or systems supervising the industrial network. Typical data that can be exchanged includes torque, speed, temperature, and vibration. When processed at the edge or remotely on the cloud, this data allows predictive-maintenance models to provide valuable insights into motor operation, helping to detect potential faults before they occur.

Drive units mounted directly on motors or industrial machines are becoming very common. These devices, which include embedded controllers and communication interfaces, reduce the wiring complexity and allow machines to be reconfigured quickly for different production requirements.

For example, the RA8T2 MCU from Renesas Electronics Corp. is optimized for industrial motor control. Based on a 1-GHz Arm Cortex-M85 processor (with an optional 250-MHz Arm Cortex-M33 processor available in the dual-core version), the RA8T2 is designed for industrial motor control applications that require real-time performance and a high-speed communication interface.

These devices (Figure 2) integrate a 14-channel PWM timer for motor control, different types of memories (including a low-latency and high-speed TCM memory), and analog functions in a single chip. They also provide a dual-channel Gigabit Ethernet MAC with DMA and an optional EtherCAT slave controller that supports synchronous networks in industrial fields.

Figure 2: Renesas’s RA8T2 MCU supports high-speed connectivity in industrial motor control applications. (Source: Renesas Electronics Corp.) Wide-bandgap semiconductors

Wide-bandgap materials, such as silicon carbide (SiC) and gallium nitride (GaN), provide higher breakdown voltages, faster switching speeds, and lower on-resistance per unit area than silicon IGBTs and MOSFETs. From a designer’s perspective, this means that lower switching losses, improved thermal management, and higher operating frequencies can be achieved. These characteristics also lead to higher efficiency across the load range and a reduced footprint due to a reduced size of the passive components.

SiC is usually preferred in high-voltage and high-current applications above 600 V, such as high-power industrial drives and inverters. GaN, meanwhile, operates well in the 100- to 650-V range, with switching frequencies up to about 1 MHz. It is well-suited for mid-power motor drives in appliances, HVAC, pumps, small robots, and light industrial equipment.

Through a partnership, Qorvo Inc. and Cambridge GaN Devices (CGD) have developed the 400-W PAC5556AEVK2 and the 800-W PAC5556AEVK3 evaluation kits, suitable for developing motor control solutions in applications such as industrial fans, pumps, compressors, and white goods. The kits combine Qorvo’s PAC5556A mixed-signal system-on-chip with CGD’s ICeGaN HEMTs. The PAC5556A is a programmable 32-bit MCU that integrates a 600-V DC/DC buck controller and 600-V gate drivers.

The PAC5556AEVK2 evaluation kit features CGD’s 240-mΩ ICeGaN power devices, achieving up to 400-W peak performance without requiring a heat sink. The PAC5556AEVK3 integrates CGD’s 55-mΩ ICeGaN switches and provides a peak output power of 800 W, requiring minimal airflow cooling. The usage of GaN transistors improves the overall efficiency due to reduced power loss, reduces heat dissipation, and allows for smaller and more reliable motor control solutions.

Efficient Power Conversion (EPC), a company focused on e-mode GaN solutions, introduced the EPC91202 evaluation board for motor drive applications. It integrates a three-phase BLDC motor drive inverter built on the EPC2361 100-V eGaN FET and can provide an output current up to 70 A peak (50 ARMS), with a switching frequency up to 150 kHz.

The EPC91202 is designed to handle sensorless and encoder-based motor control, boasting a low-voltage change rate, specifically a dV/dt rate of under 10 V/ns. This low voltage change rate reduces electromagnetic interference and acoustic noise. This board is well-suited for developing motor drive applications in various sectors. These include industrial automation, e-mobility, robotics, drones, and battery-powered devices.

AI and ML integration

Integrating AI/ML in motor control systems offers a valuable solution to investigate the behavior of motors during normal operation, helping to prevent anomalies or possible faults in advance. An example of a hardware and software integrated solution is the STSPIN32G4-ACT reference design and the FP-IND-MCAI1 STM32Cube function pack from STMicroelectronics.

The STSPIN32G4 is an advanced system-in-package that combines an STM32G431 MCU (based on an Arm Cortex-M4 core with CORDIC mathematical accelerator) with a three-phase gate driver. This architecture is specifically designed for controlling BLDC/permanent-magnet synchronous motors and provides the computing power needed to handle field-oriented control (FOC) algorithms, as well as local data analysis tasks (edge AI).

The FP-IND-MCAI1 software provides an implementation example for condition monitoring and predictive maintenance. This package collects data from internal sensors (current and voltage) and from external sensors (vibration and temperature), using it to feed pre-trained ML models.

Using ST’s NanoEdge AI Studio tool, optimized libraries can be generated that run directly on the chip, enabling the drive to “learn” the motor’s normal behavior and detect anomalies (such as mechanical imbalances or bearing failures) in real time.

Software tools

Several vendors offer software toolchains that cover the full development workflow from motor parameter identification through algorithm configuration, real-time debugging, and production code generation.

Infineon Technologies AG recently expanded its ModusToolbox Motor Suite to include a hardware-abstracted motor control core library covering advanced algorithms such as FOC and trapezoidal control, multiple startup methods including rotor alignment and six-pulse injection for initial position detection, and SVPWM modulation schemes. The integrated graphical user interface (GUI) provides a configurator and testbench that auto-detects connected evaluation boards; a digital oscilloscope monitoring up to eight firmware variables simultaneously; a motor profiler for automated extraction of resistance, inductance, and inertia parameters; and a PID tuner for closed-loop optimization.

Power Integrations released its MotorXpert v3.0 last year, a suite developed for its BridgeSwitch motor driver ICs (Figure 3). It adds shuntless and sensorless FOC support, a two-phase modulation scheme that cuts inverter switching losses by 33% in high-temperature environments, and a five-fold improvement to its waveform visualization tool. The codebase is written in MISRA-C and is MCU-agnostic, covering applications from 30 W to 750 W.

Figure 3: Power Integrations’ MotorXpert v3.0 offers an easy-to-use control interface and GUI. (Source: Power Integrations)

Other development tools available from leading semiconductor manufacturers include ST’s STM32 Motor Control SDK (X-CUBE-MCSDK) and Texas Instruments Inc.’s MotorControl SDK.

The post Designer’s guide: Motor control and drivers appeared first on EDN.

For full-year 2025, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €40.3m, down 2.1% on 2024’s €41.2m...

We once looked at how conducted emissions testing could be affected by the negative input impedance of a switch-mode power supply. Please see: “Conducted Emissions testing.”

Digital data signals that a client’s electric power company was putting on the power lines were being amplified by the negative input impedance of the power supply being tested, which made it look like the power supply itself was generating conducted emissions, which, in fact, it was not.

I have since been asked by someone, “How can a negative impedance result in amplification?” The sketch below will illustrate how that can come about.

Figure 1 Negative resistance amplification.

Let our “impedance” in question be a resistance. In our sketch, voltages E2 and E4 are derived by voltage dividers from identical “Esig” sources for which standard voltage division equations apply. What is NOT standard here is that we are going to set R4 to negative numerical values.

My SPICE simulator will not let me assign a negative number to any resistance value (I think of that as picky, picky, picky!), but given that as the case, the voltage divider equations can be set up in GWBASIC. Line 150 of that code is where that happens.

With R1 and R3 arbitrarily set to 1K each and held there, we vary R2 and R4 together as shown to look at the effects on outputs E2 and E4, where we find the following.

E2 is always a lesser voltage than Esig. E2 varies versus the choices of value of R2, but it is always smaller than Esig.

On the other hand, E4 is always a greater voltage than Esig. E4 varies versus the negative value of R4, but it is always larger than Esig.

This effect on E4 is the amplification effect referred to in the earlier essay.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• Conducted Emissions testing
• Vacuum tube negative resistance
• Diode classifications
• Coaxial Z—breaking down the impedance of a coaxial transmission line

The post Negative resistance amplification appeared first on EDN.

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Cockpit Computers: 10 million units delivered

• High-performance solutions: Bosch and Qualcomm aim to make ADAS solutions for enhanced safety and comfort available to everyone
• Continued Business Momentum: Collaboration has secured significant new business wins for both next-generation ADAS and cockpit solutions
• Proven Global Success: Bosch delivers over 10 million cockpit computers powered by Snapdragon Cockpit Platforms
• Global Market Penetration: Deliveries span all vehicle segments from entry to premium, serving both regional and global automakers

Stuttgart, Germany / San Diego, USA – Bosch and Qualcomm Technologies, Inc. announced today that they are expanding their strategic partnership, which has focused on vehicle computers for cockpit solutions, to also include ADAS solutions. Together, Bosch and Qualcomm Technologies are helping address one of the industry’s most pressing needs – scaling intelligent vehicle technology to meet growing consumer demand for vehicles that are automated, connected, and highly personalized. The companies also highlighted a significant milestone in their longstanding collaboration: Bosch has developed and delivered more than 10 million vehicle computers based on Qualcomm Technologies’ Snapdragon Cockpit Platforms for the global automotive market.

“By combining leading-edge compute technology with our system integration expertise – hardware, software, and safety – we enable automakers to meet the rising demand for personalized, safe, and comfortable driving experiences,” said Christoph Hartung, Member of the Bosch Mobility business sector board, Chief Technology Officer for Systems, Software, and Services, and President of the division Cross-Domain Computing Solutions.

“The growing success of our collaboration with Qualcomm Technologies underlines a central value Bosch brings to the industry: we provide the robust, high-performance computing platforms that form the backbone of today’s software-defined vehicle“, said Christoph Hartung, Member of the Bosch Mobility business sector board, Chief Technology Officer for Systems, Software, and Services, and President of the division Cross-Domain Computing Solutions.

“Our collaboration with Bosch spans the full spectrum of vehicle compute – from high‑performance cockpit systems to scalable automated driving solutions and emerging centralized vehicle architectures – all powered by Snapdragon Digital Chassis automotive platforms,” said Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm Technologies, Inc.

“ADAS is where performance and safety must scale in the real world. By expanding our work with Bosch into production-ready ADAS platforms, we’re helping automakers bring advanced driver assistance across vehicle lines more efficiently, with a clear path to centralized compute“, said Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm Technologies, Inc.

Building on this momentum, the companies are extending their collaboration through new ADAS production programs. These programs leverage Bosch’s cost-optimized vehicle computer architecture, powered by Qualcomm Technologies’ Snapdragon Ride platform, to support practical and scalable ADAS deployments. The collaboration also includes purpose-built combined cockpit and ADAS platforms supporting mixed criticality applications delivered on a single system-on-chip, unique to Snapdragon Ride Flex SoCs, aligning with automakers’ software-defined vehicle strategic initiatives. At the core of these programs is the Bosch ADAS integration platform – a scalable, modular vehicle computer designed for ADAS functions. With high bandwidth, computing power, and memory management, it meets strict safety and security standards, fuses multiple sensor technologies for a precise 360° environment model, and runs complex algorithms to deliver safe, dynamic vehicle behavior—even at high speeds.

The Next Frontier: Jointly Engineering the Future of ADAS
Bosch and Qualcomm Technologies’ joint approach is delivering scalable, cost-optimized vehicle computers with ADAS solutions that have secured multiple global customer design wins in the East Asian market. These joint efforts provide automakers with critical flexibility and a clear migration path to centralized computing architectures featuring a small number of highly powerful vehicle computers instead of many individual control units. Powered by the scalable Snapdragon Ride Platform from Qualcomm Technologies, Bosch´s vehicle computers support a broad range of configurations – from entry-level ADAS, such as speed and distance regulation or lane keeping, to advanced automated driving systems. The first vehicles from these new business wins are expected on the road in 2028.

In addition, ADAS and cockpit solutions can also be consolidated onto a single platform to give automakers even greater flexibility and reduce architectural complexity. To this end, Bosch and Qualcomm Technologies are also working on solutions using existing products: Snapdragon Ride Flex builds on this foundation by enabling the consolidation of cockpit and ADAS functions onto a single, safety-certifiable SoC, reducing system complexity, power consumption, and cost while giving automakers a path toward centralized compute architectures. Bosch’s cockpit and ADAS integration platform combines the system functions for assisted and automated driving and infotainment, like personalized navigation and voice assistance functions, in one high-performance computer.

Both the ADAS and cross-domain computing solutions are designed to meet stringent safety requirements (up to ASIL-D) while reducing complexity and cost. For drivers, this means greater access to advanced Level 2 driving features like lane keeping, hands-free driving, and intelligent automated parking.

A story of successful collaboration: defining the modern digital cockpit
The collaboration between Bosch and Qualcomm Technologies is redefining the modern digital cockpit by serving the full spectrum of both the regional and global automotive market across North America, Asia, and Europe. This approach has driven exponential growth since first deliveries began in 2021, scaling from one million units in 2023 to ten million in less than three years, fueled by successful program awards with vehicle manufacturers worldwide. The delivery milestone underscores the companies’ shared ability to industrialize advanced automotive technologies at a global scale for the software-defined vehicle era, spanning entry-level to premium vehicles. The success is rooted in Bosch’s flexible and scalable approach, leveraging Snapdragon Cockpit Platforms. The Bosch cockpit integration platform can drive an increasing number of in-vehicle displays and camera inputs. Qualcomm Technologies’ Snapdragon Cockpit Platforms combine high-performance compute with power-efficient design to enable a wide range of vehicle experiences. That includes crisp, essential displays in cost-optimized systems up to premium systems featuring ultra-low-latency HMI responsiveness, multi-display configurations, immersive multimedia, AI-powered conversational voice assistance, and higher levels of personalization – while maintaining efficiency across vehicle segments.

The post Bosch and Qualcomm expand collaboration to strategic ADAS solutions appeared first on ELE Times.

ULTRARAM compound semiconductor memory technology developer QuInAs Technology Ltd of London, UK (which was spun off from Lancaster University in early 2023) has reported work that links device-level physics — including resonant tunnelling and floating-gate dynamics — directly to AI system performance through compact modelling and hardware-aware benchmarking, addressing a key limitation in how emerging memory technologies are typically evaluated. Published in Journal of Applied Physics, the paper ‘Artificial synapse based on ULTRARAM memory device for neuromorphic applications’ demonstrates how ULTRARAM can be modelled and evaluated as a synaptic memory element for next-generation AI hardware...

UK–UA Visiting Professors Programme kpi пт, 04/10/2026 - 11:14

• Semiconductor Revenue to Grow 64% in 2026
• DRAM Prices to Increase by 125% in 2026 and Storage Crisis to Extend into 2027

STAMFORD, Conn., April 8, 2026 — Global semiconductor revenue is projected to exceed $1.3 trillion in 2026, exhibiting the highest growth in the last two decades, according to Gartner, Inc., a business and technology insights company.

“Amid high demand for AI processing, data center networking and power, and memory price inflation (memflation), the semiconductor industry is projected to achieve a third consecutive year of double-digit growth in 2026 – a milestone that underscores the sector’s pivotal role in the AI technology stack,” said Rajeev Rajput, Senior Principal Analyst at Gartner.

Gartner forecasts semiconductor revenue will grow 64% in 2026, with memory revenue expected to increase threefold amid memflation (see Table 1). Gartner analysts said that memflation is profound, but it is not perennial. Gartner estimates DRAM and NAND flash annual prices in 2026 will increase by 125% and 234%, respectively, and any meaningful pricing relief is not expected until late 2027.

 

Table 1. Semiconductor Revenue Forecast, Worldwide, 2025-2027 (Billions in U.S. Dollars)

	2025	2026	2027
Memory	216.3	633.3	748.1
Nonmemory	589.0	686.9	806.4
Total Market	805.3	1,320.2	1,554.5

Source: Gartner (April 2026)

AI Semiconductors Will Represent 30% of Total Semiconductor Revenue in 2026

AI semiconductors are expected to account for approximately 30% of total semiconductor revenue in 2026 and will remain the driving force behind the overall industry growth. Hyperscaler investment in AI infrastructure buildouts remains strong, with spending expected to increase by more than 50% in 2026, driving demand for AI accelerators, including GPUs and custom non‑GPU chips.

“Memflation will destroy, or at least delay, non-AI demand into 2028, to varying degrees depending on the application,” said Rajput. “Technology suppliers should prepare for higher prices during the first half of 2026, followed by persistent but moderating price increases throughout the rest of the year. CIOs and IT leaders should be cautious about signing supply agreements with unfavourable pricing terms that extend beyond 2027.”

Gartner clients can read more in Forecast: Semiconductors and Electronics, Worldwide, 2024-2030, 1Q26 and How Long Will AI Demand Sustain Memory Prices.

A complimentary webinar on 1Q26 Semiconductor Reset: Who Wins in a Constrained Market? will take place on April 22 at 11:00 AM ET and registrations are available here.

Gartner Is the World Authority on AI

Gartner is the indispensable partner to C-Level executives and technology providers as they implement AI strategies to achieve their mission-critical priorities. The independence and objectivity of Gartner insights provide clients with the confidence to make informed decisions and unlock the full potential of AI. Clients across the C-Level are using Gartner’s proprietary AskGartner AI tool to determine how to leverage AI in their business. With more than 2,500 business and technology experts, 6,000 written insights, as well as more than 1,000 AI use cases and case studies, Gartner is the world authority on AI. More information can be found here.

The post Gartner Forecasts Worldwide Semiconductor Revenue to Exceed $1.3 Trillion in 2026 appeared first on ELE Times.

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• STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density
• Increased performance with cost efficiency
• Comprehensive ecosystem to enhance end-device capabilities and accelerate time to market

 

India, April 9, 2026: STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new generation of entry-level microcontrollers (MCUs) to boost the performance of billions of tiny smart devices throughout factories, homes, cities, and infrastructures while meeting extreme cost, size, and power limitations.

The new STM32C5 series is aimed at consumer and professional devices like smart thermostats, electronic door locks, industrial smart sensors, robotic actuators, wearable electronics, and computer peripherals.

“The new STM32C5 elevates the precision, speed, and reliability of competitively priced MCUs to realize the potential in these opportunities. It builds on two decades of STM32 heritage and is part of our ambition to deliver the broadest, most scalable and secure portfolio from entry-level devices to advanced MCUs that redefine the application reach of embedded systems,” said Patrick Aidoune, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics.

Thanks to an improved design based on ST’s proprietary 40nm manufacturing process, the STM32C5 MCUs can run tasks noticeably faster than many entry-level chips used today. This gives products more room to include modern features such as improved sensing, smoother control, and enhanced user experiences—all while keeping dynamic power consumption low.

The STM32C5 MCUs integrate built-in protections that help safeguard products against tampering and cyber risks. These security features support safer connected devices, a growing priority across consumer and industrial markets.

Users of the new STM32C5 series can enjoy an upgraded STM32Cube environment, now with size-optimized, production-grade drivers to leverage the many hardware features. The modernized ecosystem also introduces enhanced code generation and development tools as well as extended production-ready software examples. Benefiting from continuous updates, the STM32Cube environment is all about helping developers code faster and more efficiently, while maximizing the end-product capabilities.

“At SIT, we work in safety-critical gas and HVAC environments where reliability is essential. For our new generation of Burner Integrated Control platform, choosing the STM32C5 was a natural decision as it provides strong and predictable real-time performance, enabling us to manage combustion, flame detection, and safety interlocks with accuracy, even within a compact footprint. We were able to reuse a large part of our validated firmware, speeding up development, simplifying certification, and the result is a robust and scalable control platform designed for long-term reliability and compliance,” explained Dennis Agnello, Electronics Business Line Director, Heating & Ventilation, SIT Group.

“The STM32C5 provides the performance and feature set enabling us to develop a cost-efficient next-generation AC charger for both public and private use, fully aligned with the latest security, encryption, and interface requirements for metering and EV charging solutions. Throughout the project, ST provided the flexibility and comprehensive ecosystem support we needed to reduce development time and solve key functional and cost challenges to bring our product faster to the market,” said Enrique Osorio, R&D Director, Circontrol (Grupo Circutor).

STM32C5 MCUs are entering production now, targeting packages from 3mm x 3mm UFQFPN20 to 20mm x 20mm LQFP144. STM32 Nucleo evaluation boards, and a display extension board from Riverdi with TouchGFX development software for building entry-level graphical user interfaces, are ready to assist development.

Prices start at $0.64 for orders of 10,000 units.

Technical information

The new STM32C5 MCUs leverage an innovative implementation of the advanced Arm® Cortex®-M33 embedded processor. While ARM’s core delivers advanced performance and efficiency, ST’s proprietary 40 nm manufacturing process is cost-efficient, supports higher clock speeds, and enables memory above 512Kbyte, where lower-density technologies are uncompetitive. STM32C5 MCUs feature on-chip Flash ranging from 128Kbytes, making Cortex-M33 performance accessible at an attractive price for entry-level applications that were previously limited to lower-performing Cortex-M0 and Cortex-M23 devices. Devices are available with up to 1Mbyte, providing generous code and data storage for product designers to create sophisticated new features.

Implementing the Arm Cortex-M33 core at the 40 nm node brings improved arithmetic performance to entry-level devices at a competitive cost and low power. This accelerates computations such as embedded digital filters in sensor signal conditioning, noise suppression, and debouncing. In addition, the power supply scheme, comprising a single low-dropout (LDO) regulator, permits extra user I/O pins. There is also direct memory access (DMA), which helps save power, sharpen system responses, and simplify software. Moreover, with two instances, each having at least four channels to permit two fetches in parallel, DMA on the STM32C5 is a valuable tool for developers to boost application performance.

The MCUs target SESIP3 and PSA Level 3 security certifications, with memory protection, tamper protection, cryptographic engines (symmetrical encryption with AES and hashing algorithm), and temporal isolation (HDP) to protect processes such as secure boot and firmware update. The STM32C59x and STM32C5A3 variants have additional security, including hardware unique key support (HUK), secure key storage, and hardware cryptographic accelerators for symmetric and asymmetric operations with protection against side-channel attacks.

Designed for demanding industrial environments, the device delivers robust performance even in harsh networking conditions. It supports a wide ambient temperature range from -40°C to 125°C, with a junction temperature up to 140°C. Even at the maximum operating temperature, the device can run at its maximum rated frequency, ensuring consistent performance across the full temperature range. STM32C5 enables compliance with industrial safety standards, including IEC 61508 SIL-2 and IEC 60335-1/60730-1 Class-B, by integrating essential hardware and software features.

Enhancements to the development ecosystem include a new STM32CubeMX flavor, STM32CubeMX2, which introduces a preview feature that allows faster access to reference code, thereby accelerating development and easing code reuse. Also new in the STM32CubeC5 embedded software offer, the latest code-size optimized hardware abstraction layer (HAL2) gives access to all MCU features and allows more of the MCU’s memory to be used for application code.

Alex Fabre, Embedded Software Expert at ST Authorized Partner RTONE, has experienced the new tools, commenting: “STM32 HAL2 makes developing with the STM32C5 and other family members faster and more efficient. It is much lighter, closer to hardware functions, and porting our code to other STM32 MCUs is extremely easy.”

The comprehensive ecosystem also gives developers:

• STM32C5 hardware evaluation tools enabling faster prototyping and offering reference hardware design guidelines
  • A new examples library offering faster access to a large number of STM32C5 production-ready code examples, simplifying the use of the STM32C5 features and accelerating development
  • A choice of two free integrated development environments (STM32CubeIDEand STM32CubeIDE for VSCODE) for faster development and debug
  • STM32Cube ecosystem with optimized porting of popular middleware including FreeRTOS, LwIP, USBX, and FileX

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com

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Поет Максим Рильський: "У щастя людського два рівних є крила… красиве і корисне" Інформація КП пт, 04/10/2026 - 10:00

Four 100-V GaN power-stage ICs from EPC are optimized for motor drives in humanoid robots, drones, and battery-powered platforms. The EPC23108, EPC23109, EPC23110, and EPC23111 integrate a gate driver, high- and low-side eGaN FETs, and level-shifting circuitry in a half-bridge configuration. They support operation up to 100 V with load currents of 35 A (EPC23108, EPC23109) and 20 A (EPC23110, EPC23111).

The control interface includes an active-low fast-shutdown and standby input with a 65-kΩ pull-up. It meets industrial logic standards, letting designers connect directly to standard controllers. This simplifies designs and ensures consistent operation across platforms. Safety is enhanced through deterministic shutdown. 

The series supports continuous 100% duty-cycle operation, enabling full-torque and uninterrupted conduction in motion control, robotics, and precision regulation systems. The EPC23109 and EPC23111 offer a single-pin PWM input with enable logic and fixed dead time, simplifying multi-axis designs. The EPC23108 and EPC23110 feature dual PWM inputs for adaptive dead-time modulation.

Engineering samples are available for qualified designs. The EPC23108, EPC23109, EPC23110, and EPC23111 can be ordered through EPC’s distributor partners.

Efficient Power Conversion 

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Built with low-distortion ferrite material, TDK’s MAF0603GWY series of filters attenuates noise on audio lines in the 5-GHz band. The filters fit in a compact 0.6×0.3×0.3-mm package for use in small consumer devices like smartphones and wearables with Bluetooth and Wi-Fi audio lines.

Electromagnetic noise radiated from audio lines in electronic devices can interfere with the internal antenna and reduce receiver sensitivity. While chip beads are commonly used to suppress noise, they can degrade sound quality.

TDK reports its newly developed ferrite material minimally affects audio-line characteristics while reducing distortion. The filters provide high attenuation at 5 GHz (impedance up to 3220 Ω) to suppress noise. They also limit attenuation of audio signals with lower resistance than conventional products, enabling a wide dynamic range.

Mass production of the MAF0603GWY series is set to begin in April 2026.

TDK

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A photovoltaic MOSFET driver from Vishay, the VODA1275 increases safety and reliability in high-voltage automotive applications. The device provides a typical open-circuit voltage of 20 V, short-circuit current of 20 µA, and turn-on time of 80 µs—said to be three times faster than competing devices.

The AEC-Q102-qualified device targets pre-charge circuits, wall chargers, and battery management systems for EVs and HEVs. Its high open-circuit output voltage allows a single driver to be used, removing the need for two devices in series to generate higher voltages. The VODA1275 also enables custom solid-state relays to replace electromechanical relays in next-generation vehicles. 

A working isolation voltage of 1260 Vpeak and isolation test voltage of 5300 VRMS make the driver well-suited for 800-V+ battery systems. The device comes in a compact SMD-4 package with an 8-mm creepage distance and a mold compound with a CTI of 600.

Samples and production quantities of the VODA1275 are available now, with lead times of eight weeks.

VODA1275 product page 

Vishay Intertechnology 

The post Photovoltaic driver streamlines EV power designs appeared first on EDN.

Bourns’ SRP2008DP series of shielded power inductors provides the saturation current needed for dense DC/DC converter designs and miniature electronic devices. These low-profile devices, with dimensions of just 2.0×1.6×0.8 mm, enable use in compact circuits with minimal routing changes.

The eight inductors in the SRP2008DP series cover inductances from 0.24 µH to 4.70 µH, heating current (IRMS) from 1.10 A to 3.50 A, and saturation current (ISAT) from 1.60 A to 5.50 A. DC resistance ranges from 36 mΩ to 468 mΩ, and operating temperature spans -40°C to +125°C.

In crowded layouts, radiated emissions and magnetic coupling can compromise signal integrity and complicate EMC compliance. The SRP2008DP series addresses these issues with a small, shielded package and a metal-alloy powder core. The shielded design contains magnetic flux, reducing emissions to nearby circuitry, while the high-resistivity core suppresses eddy currents and limits core losses at high switching frequencies. Contained flux also minimizes coupling to adjacent traces, lowering interference in densely populated layouts.

The SRP2008DP series is available through Bourns’ authorized distributors. Request samples here.

SRP2008DP product page

Bourns

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Espressif Systems is sampling its ESP32-S31 dual-core RISC-V SoC with Wi-Fi 6, Bluetooth 5.4, Thread, Zigbee, and Ethernet. Rich HMI and security features make it well-suited for IoT applications such as consumer and industrial appliances, voice-controlled devices, and automation systems.

Running at 320 MHz, the ESP32-S31’s 32-bit RISC-V microcontroller achieves 6.86 CoreMark/MHz and integrates a memory management unit and 60 GPIOs for design flexibility. One of its two cores features a 128-bit-wide SIMD data path for fast parallel processing. Memory resources comprise 512 KB SRAM and support for 250-MHz, 8-bit DDR PSRAM, with concurrent flash and PSRAM access. External memory expansion (up to octal SPI) further supports memory-intensive multimedia and AI/ML workloads at the edge.

The ESP32-S31’s HMI capabilities include a DVP camera interface, LCD support, and up to 14 capacitive touch channels. Security features span secure key management, secure boot, flash and PSRAM encryption, cryptographic hardware acceleration, and a trusted execution environment. Supported by Espressif’s open-source IoT Development Framework, the device works with common LLMs to build voice-enabled client devices that run or interact with AI agents.

To request samples of the ESP32-S31 SoC, contact Espressif’s customer support team.

ESP32-S31 product page 

Espressif Systems 

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