Збирач потоків

Участь представників ФБТ у Літній академії в Німеччині: обмін досвідом та розвиток міжнародних відносин Інформація КП ср, 10/01/2025 - 14:10

The world of manufacturing is changing very fast with digital intelligence merging with the conventional industrial processes. Physical AI lies at the heart of this revolution, bringing together sophisticated algorithms and machinery such as robotic arms, autonomous guided vehicles (AGVs), and CNC machinery. For these systems based on AI to function optimally, they depend on real-time information from industrial sensors. Serving as the “eyes and ears” of machines, sensors today do much more than make measurements they allow AI systems to learn, adapt, and optimize processes to enhance productivity, safety, and efficiency.

The two-part series addresses how industrial sensors enable physical AI applications. The first part discusses sensor types and functions in smart factories, while the second part will discuss innovations and trends that will dominate next-generation physical AI-powered industrial systems.

How Industrial Sensors Enable Physical AI

Industrial sensors measure physical parameters like motion, distance, pressure, temperature, or flow into electrical signals that undergo parameterization. These signals find their way into PLCs, CNC machines, and edge AI devices that carry out real-time decision making.

A typical sensor has some or all of these components: sensing element, operational amplifier OpAmp, ADC, processor, interface, and power management. All these or some of them constitute the sensor acting as a bridge between AI algorithms and the physical world, much like the nervous system transmitting information to the brain.

With a modern smart factory, there is an increase in the deployment of AI at the edge, embedding algorithms in sensors, robots, and controllers themselves. This obviates decision making in real-time being made on cloud-based IT systems alone.

Key Industrial Sensor Types

Vision (Image) Sensors: Cameras used to capture product images for machine vision, inspection, and quality control. They recognize orientation, defects, and positioning in real time. Next-generation short-wave infrared (SWIR) and low-power image sensors provide high dynamic range and low-light capabilities in demanding industrial settings.

Position & Torque Sensors: Hall-effect, optical, and inductive sensors are used to detect motor position and torque. Latest inductive PCB-based sensors combine analog front-ends and controllers to make mechanical design easier while providing improved temperature tolerance and contamination resistance.

Ultrasonic Sensors: Detect distance by emitting ultrasonic waves. Suitable for detecting transparent objects, ultrasonic sensors are widely applied in autonomous robots for navigation and obstacle detection and in process automation for flow and level measurement.

Photoelectric Sensors: Capture objects using light-based technologies infrared or laser and come in through-beam, retroreflective, and diffuse-reflective configurations. They are non-contact, flexible, and accommodate long detection ranges.

Proximity Sensors: Sense metallic objects using electromagnetic induction without contact. They are durable in harsh environments and can be used in conjunction with ultrasonic or photoelectric sensors to detect non-metallic objects.

Pressure Sensors: Condition clean-room environments and pneumatic or hydraulic systems. They deliver accurate voltage readings that represent system pressure using strain gauges or force resistors.

Temperature Sensors: Monitor and control temperature in various industries. Thermocouples, RTDs, and semiconductor temperature sensors protect machinery and stabilize processes.

Environmental Sensors: Add gas, chemical, rain, and light sensors to measure environmental conditions and workplace safety. For example, electrochemical sensors can measure chemical currents at low power consumption, providing constant monitoring.

Selecting the Correct Sensors for Intelligent Manufacturing

When designing industrial systems with AI, engineers should keep in mind:

1. Application Response Speed & Accuracy: Response speed and accuracy should be suited to the job, from control of robots to quality inspection in real time.
2. Data Reliability: Sensors need to deliver high-quality data reliably to enable AI learning and analytics.
3. Integration & Interoperability: Sensors need to integrate seamlessly with PLCs, field buses, and other industrial automation.
4. Data Privacy & Cybersecurity: Preserving sensitive operating data is essential, particularly as sensors communicate data through networks.
5. Energy Efficiency: Sensors with low power consumption allow widespread deployment without exceeding power budgets.

Conclusion:

Industrial sensors are critical to enable physical AI in the smart factory spaces. By sensing the physical world accurately and interpreting it, these sensors enable AI systems to make quicker, wiser, and more secure decisions. With advancements in sensor technologies, they will further propel more intelligent, adaptive, and more sustainable industrial activities, leading the way to Industry 5.0.

With its extensive sensor portfolio and application know-how, Onsemi continues to be the leader in intelligent sensing, assisting manufacturers to unlock the full value of physical AI.

(This article has been adapted and modified from content on Onsemi.)

The post How Industrial Sensors are Powering the Age of Physical AI in Smart Manufacturing appeared first on ELE Times.

The US Department of Energy’s (DOE) Office of Fossil Energy and Carbon Management (FECM) has announced up to $6m in federal funding available for R&D projects to help establish a secure domestic supply chain for gallium...

Делегація кафедри МАтаТЙ ФМФ в Університеті Мелардален (Швеція) kpi ср, 10/01/2025 - 11:55

Photonic integration firm Photon Bridge of Eindhoven, The Netherlands has debuted its integrated tunable laser photonic integrated circuit (PIC), powered by its patented cantilever waveguide coupling technology (which combines III-V speed with silicon scale)...

A breakthrough in wearable technology is redefining what smart glasses can do: generative AI running entirely on the device, without the need for a phone or cloud connection. Powered by the new Snapdragon AR1+ Gen 1 platform, the glasses allow an AI to interact seamlessly in every day scenarios-from shopping or any home tasks.

AI Fitting Inside Glasses

In a live demonstration, a generative AI assistant operated directly on smart glasses using a compact language model (SLM). During a simulated grocery trip, the assistant helped with a recipe, delivering audio guidance and text directly on the lenses all without any external device. This is a strong demonstration of what is going on with smart glasses from mere accessories to full-blown, standalone AI tools.

Snapdragon AR1+ Gen 1

The Snapdragon AR1+ Gen 1 processor, 26% smaller than previous generations, brings enhanced power efficiency, improved image quality, and the ability to run small language models directly on the glasses. These improvements are crucial for thinner, lighter frames that don’t compromise performance or functionality.

Flexible XR Ecosystem

Next-generation smart glasses will be available in various form factors. Some will be standalone, and others will be linked to nearby devices like smartphones, tablets, or portable computing “pucks.” This modular system provides flexible, high-performance experiences across various configurations while keeping AI interactions speedy, private, and responsive.

Improved Vision and Multimodal Inputs

Sophisticated camera features enable glasses to record and perceive the world in rich detail, enabling proactive suggestion and context-sensitive help. Even when not connected to other devices, these glasses can be paired with other wearables like smartwatches or rings, enabling new forms of interaction and input.

Conclusion

This demonstration represents the beginning of a new era in wearable AI, in which intelligent glasses have the capability to provide tailored, real-time support on the move. Powered by the Snapdragon AR1+ platform, Qualcomm is making some of the thinnest, cleverest, and most powerful glasses possible that might change the way we engage with technology in our everyday lives.

(This article has been adapted and modified from content on Qualcomm Technologies.)

The post On-Glass Generative AI: The Next Era of Standalone Smart Glasses appeared first on ELE Times.

The hardware, software and  Intelligent Factory concept presented by market and technology leader ASMPT drew strong interest from trade visitors at this year’s productronica India.

At the joint booth with long-standing distribution partner Maxim SMT, the spotlight was on the fast, precise, and process-stable DEK TQ solder paste printer platform and the SIPLACE TX high-speed placement solution. The SIPLACE CP20 and SIPLACE CPP placement heads on display also proved particularly well suited to the high-volume production that characterizes the Indian market, offering manufacturers maximum flexibility and productivity in demanding high-volume production.

Integrative concepts for high-volume production

Many visitors took the opportunity to gain a detailed understanding of a complete ASMPT production line in personal technical discussions. Of particular interest was the integrated concept of the intelligent factory, where standardized interfaces across all ASMPT machines continuously collect and process data, making it available where it can be used to enhance quality, prevent errors, and eliminate production bottlenecks.

Comprehensive software portfolio

ASMPT’s extensive software portfolio attracted strong interest from the expert audience. At the core is the WORKS Software Suite, which supports all line-related processes, complemented by the Factory Solutions for holistic optimization across the entire manufacturing environment – including critical areas such as material intralogistics. Live demonstrations featured WORKS Optimization, the intelligent inline expert system for end-to-end process improvement; the Factory Equipment Center, an integrated asset and maintenance management system; the Material Flow Optimizer, ensuring efficient intralogistics and smooth material supply; and SMT Analytics, providing in-depth analysis of the entire SMT production process across all lines.

“We were very pleased with the strong interest shown in our insights and the solutions we showcased for state-of-the-art electronics manufacturing,” summarized Neeraj Bhardwaj, General Manager for India at ASMPT SMT Solutions. “The lively response confirms that we are on the right track in this important growth market.”

The post ASMPT at productronica India: Transform your SMT production with ASMPT appeared first on ELE Times.

New digital micromirror device with real-time correction enables equipment manufacturers to achieve high-resolution printing at scale, maximizing throughput and yield

What’s new

Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date. With 8.9 million pixels, sub-micron resolution capabilities and a data rate of 110 gigapixels per second, the device eliminates the need for expensive mask technology while delivering the scalability, cost-effectiveness and precision needed for increasingly complex packaging.

Why it matters

Maskless digital lithography machines – which project light for etching circuit designs on materials without a photomask or high-end stencil – are becoming increasingly popular for the manufacturing of advanced packaging. Advanced packaging combines multiple chips and technologies into a single package, enabling high-computing applications, such as data centers and 5G, to have systems that are smaller, faster, and more power-efficient.

With TI DLP technology, system assembly equipment manufacturers can leverage maskless digital lithography to achieve the high-resolution printing at scale necessary for advanced packaging. The new DLP991UUV acts as a programmable photomask, offering precise pixel control with reliable high-speed performance.

“Just as we redefined cinema by enabling the transition from film to digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI. “We’re enabling the creation of maskless digital lithography systems that empower engineers around the world to breakthrough the current limits of advanced packaging and bring powerful computing solutions to market.”

The post TI DLP technology delivers high-precision digital lithography for advanced packaging appeared first on ELE Times.