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Anritsu Corporation is pleased to announce the release of enhanced software functions for its Signal Analyzers MS2830A/MS2840A/MS2850A. These enhancements enable the analyzers to extend the spectrum measurement frequency range to encompass the millimeter-wave band by connecting VDI or Eravant external mixers.

Millimeter-wave sensing device can detect subtle changes in human body surfaces caused by breathing and heartbeat, as well as identify the position of people and objects. These advancements open up new applications in diverse fields, such as medical care, automotive, and facial-recognition security systems. Anritsu contributes to the development of a safer and more secure society by providing solutions to evaluate millimeter-waveband signals and enhancing of millimeter-wave device quality.

The growing demand for sensing technologies using millimeter-wave radar, particularly in the 60 GHz band, has driven advancements in medical applications. This technology is also employed in facial-recognition security systems. Furthermore, automotive radar technology is undergoing advancements with the development of wideband 79 GHz band radar capable of detecting small targets such as pedestrians and bicycles at high resolution.

To accurately evaluate sensors designed for detecting mobile objects and automotive radars using ultra-wideband millimeter-wave signals, simple solutions are required to measure transmission signal characteristics.

Anritsu’s mid-range benchtop MS2830A, MS2840A, and MS2850A signal analyzers provide high-performance capabilities and comprehensive options for wireless signal measurements across diverse applications. These models span the RF to microwave/millimeter-wave frequency bands and accommodate narrow- to wide-band signals.

For spectrum, signal, and phase-noise measurements, the measurement frequency range can be extended by installing Anritsu’s External Mixer Connection Function MX284090A. This function supports connection of a recommended external mixer from Eravant or VDI to the signal analyzer’s 1st Local Output port.

● Image-Response-Free Spectrum Measurement up to 7.5 GHz

An image response can occur when measuring with external mixers lacking preselectors to eliminate unwanted signals, causing erroneous reception of signals at different frequencies from the intended signal. Anritsu’s signal analyzers boast industry-leading* intermediate frequencies (IF) of 1.875 GHz (MS2830A) and 1.8755 GHz (MS2840A/MS2850A), facilitating conversion of received high-frequency signals to manageable frequencies for processing. This enables suppression of image-response effects up to 7.5 GHz using Anritsu’s proprietary PS (Preselector Simulation) function, facilitating measurement of hard-to-distinguish variable signals.

*At December 2024

● Simple Measurement Setup

The single coaxial-cable connection between the signal analyzer and recommended external mixers enhances flexibility in positioning the signal analyzer and allows the external mixer to be placed close to the device under test.

The MS2830A offers exceptional cost-effectiveness and is suitable for a broad range of applications, including R&D, manufacturing, and maintenance.

The MS2840A stands out with its exceptional phase noise performance and provides a comprehensive suite of options to support higher-performance measurements. These options include 2dB attenuator resolution and noise floor suppression.

The MS2850A signal analyzer function supports signal analysis at bandwidths up to 1 GHz.

The post Anritsu Extend Spectrum Measurement Frequency to Millimeter-wave Band with External Mixer from VDI or Eravant appeared first on ELE Times.

LED soldering is the process of joining electronic components of light-emitting diodes (LEDs) to a printed circuit board (PCB) or other substrates using a soldering material, typically a tin-lead alloy or lead-free solder. The process ensures proper electrical and mechanical connections between the LED terminals and the PCB.

1. Preparation:
   • Ensure that the PCB and LED components are clean and free from debris or oxidation.
   • Apply solder paste to the PCB pads where the LED will be placed.
2. Placement:
   • Position the LED on the solder-pasted area using precision tools like tweezers or pick-and-place machines.
3. Soldering Process:
   • Hand Soldering:
     • Use a soldering iron to heat the LED terminals and solder pads.
     • Apply solder wire to create a strong electrical connection.
   • Reflow Soldering (for mass production):
     • The PCB with the LED is placed in a reflow oven, where heat melts the solder paste, creating a secure connection.
   • Wave Soldering:
     • For through-hole LEDs, the PCB is passed over a molten solder wave to attach the components.
4. Inspection:
   • Verify the connections using visual inspection, automated optical inspection (AOI), or X-ray inspection.
5. Testing:
   • Test the soldered LED for functionality, ensuring it emits light and operates as intended.

1. Manual Soldering:
   • Used for prototypes or small batches.
   • Involves a soldering iron and manual placement.
2. Automated Soldering:
   • Uses pick-and-place machines and reflow ovens for large-scale production.
3. Soldering Techniques:
   • Surface-Mount Technology (SMT): Common for LEDs mounted on flat PCBs.
   • Through-Hole Technology (THT): Used for LEDs requiring a stronger mechanical bond.
4. Cooling:
   • Allow the soldered assembly to cool, solidifying the solder joints.

1. Consumer Electronics:
   • LED displays, backlights, and indicators in devices.
2. Automotive:
   • Headlights, tail lights, and dashboard indicators.
3. Industrial:
   • Machine vision lighting and control panels.
4. Residential and Commercial Lighting:
   • LED bulbs, tube lights, and architectural lighting.
5. Signage and Displays:
   • Advertising boards, billboards, and traffic signals.

1. Durability:
   • Provides a robust mechanical and electrical connection.
2. Scalability:
   • Suitable for mass production using automated techniques.
3. Efficiency:
   • Reflow soldering ensures uniform heat distribution and reliable connections.
4. Versatility:
   • Applicable to various LED sizes and designs.
5. Energy Efficiency:
   • LED soldering supports energy-efficient lighting technologies.

1. Heat Sensitivity:
   • LEDs are sensitive to high temperatures, which can damage components if not controlled.
2. Complexity:
   • Requires precision in placement and temperature control during soldering.
3. Material Costs:
   • Lead-free solders and automated equipment can increase production costs.
4. Risk of Cold Solder Joints:
   • Improper soldering can result in weak or intermittent connections.
5. Environmental Concerns:
   • Lead-based solder can pose environmental and health risks if not disposed of properly.

The post LED Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

While semiconductors remain in high demand, electronics engineers must stay abreast of associated developments that could eventually affect their work. Case in point: significant advancements in transition metal dichalcogenides (TMDs).

These two-dimensional materials are of particular interest to electronics engineers due to their structural phase and chemical composition; they possess numerous properties advantageous to electronic devices.

The 2D materials like TDM are prominent in the future semiconductor manufacturing landscape. Source: Nature

The ongoing semiconductor shortage has caused some engineers to delay projects or alter plans to acquire readily available supplies rather than those that are challenging to source. However, physical resource concentrations are more significant contributors to the shortage than actual scarcity.

When most of the critical raw materials used in semiconductor production come from only a few countries or regions, supply chain constraints happen frequently.

TDM learning curve

If it was possible to make the materials locally rather than relying on outside sources, electronics engineers and managers would enjoy fewer workflow hiccups. So, researchers are focusing on that possibility while exploring TMD capabilities. They are learning how to grow these materials in a lab while overcoming notable challenges.

One concern was making the growth occur without the thickness irregularities that often negatively affect other 2D materials. Therefore, this research team designed a shaped structure that controls the TMD’s kinetic activities during growth.

Additionally, they demonstrated an option to facilitate layer-by-layer growth by creating physical barriers from chemical compound substrates, forcing the materials to grow vertically. The researchers believe this approach could commercialize the production of these 2D materials. Their problem-solving efforts could also encourage others to follow their lead as they consider exploring how to produce and work with TMDs.

Semiconductor manufacturing is a precise process requiring many specific steps. For example, fluorinated gases support everything from surface-etching activities to process consistency. Although many production specifics will remain constant for the foreseeable future, some researchers are interested in finding feasible alternatives.

So, while much of their work centers around furthering the development of next-generation computer chips, succeeding in that aim may require prioritizing different materials, including TMDs. People have used silicon for decades. Although it’s still the best choice for some projects, electronics engineers and other industrial experts see the value in exploring other options.

Learning more about TMDs will enable researchers to determine when and why the materials could replace silicon.

TDM’s research phase

In one recent case, a team explored TMD defects and how these materials could impact semiconductor performance. Interestingly, the outcomes were not always adverse because some imperfections made the material more electrically conductive.

Another research phase used photoluminescence to verify the light frequencies emitted by the TMDs. One finding was that specific frequencies would characterize five TMDs with defects called chalcogen vacancies.

An increased understanding of common TMD defects and their impacts will allow engineers to determine the best use cases more confidently. Similarly, knowing effective and efficient ways to detect those flaws will support production output and improve quality control.

These examples illustrate why electronics engineers and managers are keenly interested in TDMs and their role in future semiconductors. Even if some efforts are not commercially viable, those involved will undoubtedly learn valuable details that shape their future progress.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

Related Content

• 2D Material Beats Graphene
• Chip Makers Must Learn New Ways to Play ‘D’
• 2D TMD Materials Enabling Future Electronics
• Imec’s Van den hove: Moving to Chiplets to Extend Moore’s Law
• Semiconductor Manufacturers Must Adapt to Shifting Landscape

The post How TMDs can transform semiconductor manufacturing appeared first on EDN.