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Aehr Test Systems of Fremont, CA, USA has received an initial production order from a top-tier automotive semiconductor supplier for a FOX-XP wafer-level test and burn-in system with fully integrated FOX WaferPak Aligner for production test of its gallium nitride (GaN) power semiconductor devices. The system was scheduled to ship immediately...

Keysight Technologies announces the expansion of its Novus portfolio with the Novus mini automotive, a quiet small form-factor pluggable (SFP) network test platform that addresses the needs of automotive network engineers as they deploy software defined vehicles (SDV). Keysight is expanding the capability of the Novus platform by offering a next generation vehicle interface that includes 10BASE-T1S, and multi-gigabyte BASE-T1 support for 100 megabytes per second, 2.5 gigabits per second (Gbit/s), 5Gbit/s, and 10Gbit/s. Keysight’s SFP architecture provides a flexible platform to mix and match speeds for each port with modules plugging into existing cards rather than requiring a separate card, as many current test solutions necessitate.

As vehicles move to zonal architectures, connected devices are a critical operational component.  As a result, any system failures caused by connectivity and network issues can impact safety and potentially create life-threatening situations. To mitigate this risk, engineers must thoroughly test the conformance and performance of every system element before deploying them.

Key benefits of the Novus mini automotive platform include:

• Streamlines testing – The combined solution offers both traffic generation and protocol testing on one platform. With both functions on a single platform, engineers can optimize the testing process, save time, and simplify workflows without requiring multiple tools. It also accelerates troubleshooting and facilitates efficient remediation of issues.
• Helps lower costs and simplify wiring – Supports native automotive interfaces BASE-T1 and BASE-T1S that help lower costs and simplify wiring for automotive manufacturers, reducing the amount of required cabling and connectors. BASE-T1 and BASE-T1S offer a scalable and flexible single-pair Ethernet solution that can adapt to different vehicle models and configurations. These interfaces support higher data rates compared to traditional automotive communication protocols for faster, more efficient data transmission as vehicles become more connected.
• Compact, quiet, and affordable – Features the smallest footprint in the industry with outstanding cost per port, and ultra-quiet, fan-less operation.
• Validates layers 2-7 in complex automotive networks– Provides comprehensive performance and conformance testing that covers everything from data link and network protocols to transport, session, presentation, and application layers. Validating the interoperability of disparate components across layers is necessary in complex automotive networks where multiple systems must seamlessly work together.

• Protects networks from unauthorized access – Supports full line rate and automated conformance testing for TSN 802.1AS 2011/2020, 802.1Qbv, 802.1Qav, 802.1CB, and 802.1Qci. The platform tests critical timing standards for automotive networking, as precise timing and synchronization are crucial for the reliable and safe operation of ADAS and autonomous vehicle technologies. Standards like 802.1Qci help protect networks from unauthorized access and faulty or unsecure devices.

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “The Novus mini automotive provides real-world validation and automated conformance testing for the next generation of software defined vehicles. Our customers must trust that their products consistently meet quality standards and comply with regulatory requirements to avoid costly fines and penalties. The Novus mini allows us to deliver this confident assurance with a compact, integrated network test solution that can keep pace with constant innovation.”

Keysight will demonstrate its portfolio of test solutions for automotive networks, including the Novus mini automotive, at the Consumer Technology Show (CES), January 7-10th in Las Vegas, NV, West Hall, booth 4664 (Inside the Intrepid Controls booth).

The post Keysight Expands Novus Portfolio with Compact Automotive Software Defined Vehicle Test Solution appeared first on ELE Times.

Soft soldering is a popular technique in metal joining, known for its simplicity and versatility. It involves the use of a low-melting-point alloy to bond two or more metal surfaces. The process is widely used in electronics, plumbing, and crafting due to its ease of application and the reliability of the joints it produces.

What is Soft Soldering?

Soft soldering refers to the process of joining metals using a filler material, known as solder, that melts and flows at temperatures below 450°C (842°F). Unlike brazing or welding, the base metals are not melted during this process. The bond is achieved by the solder adhering to the surface of the base metals, which must be clean and properly prepared to ensure a strong joint.

The solder typically consists of tin-lead alloys, although lead-free alternatives are now common due to health and environmental concerns. Flux is often used alongside solder to remove oxides from the metal surfaces, promoting better adhesion and preventing oxidation during heating.

How Soft Soldering Works

Soft soldering is a straightforward process that follows these basic steps:

1. Preparation:
   • Clean the surfaces to be joined by removing dirt, grease, and oxidation. This can be done using sandpaper, a wire brush, or chemical cleaners.
   • Apply flux to the cleaned surfaces to prevent oxidation during heating and enhance solder flow.
2. Heating:
   • Utilize a soldering iron, soldering gun, or any appropriate heat source to warm the joint. Make sure the temperature is adequate to liquefy the solder while keeping the base metals intact.
3. Application of Solder:
   • After heating the joint, introduce the solder to the targeted area. The solder will melt and flow into the joint by capillary action, creating a strong bond upon cooling.
4. Cooling:
   • Let the joint cool down gradually without being disturbed. This ensures the integrity of the bond and prevents the formation of weak spots.

Soft Soldering Process 1. Tools and Materials

The essential tools and materials for soft soldering include:

• Soldering iron or gun
• Solder (tin-lead or lead-free)
• Flux
• Cleaning tools (e.g., sandpaper, wire brush)
• Heat-resistant work surface

2. Detailed Steps

1. Surface Preparation: Clean the metal surfaces thoroughly. Apply flux to prevent oxidation and enhance solder adherence.
2. Preheating: Warm the area to ensure uniform heating and improve solder flow.
3. Solder Application: Melt the solder onto the heated joint, ensuring it flows evenly.
4. Inspection: Examine the joint for uniformity and proper adhesion.
5. Cleanup: Remove excess flux residue to prevent corrosion.

Uses and Applications

Soft soldering is widely employed in various industries and applications, including:

1. Electronics:
   • Circuit board assembly
   • Wire connections
   • Repair of electrical components
2. Plumbing:
   • Joining copper pipes
   • Creating watertight seals in plumbing joints for water supply systems
3. Jewellery Making:
   • Crafting and repairing delicate metal items
4. Arts and Crafts:
   • Creating stained glass
   • Assembling small metal models
5. Automotive Repairs:
   • Fixing radiators and other small components

Advantages of Soft Soldering

1. Ease of Use: The process is simple and does not require extensive training.
2. Low Temperature: Operates at lower temperatures, reducing the risk of damaging components.
3. Versatility: Capable of accommodating diverse materials and a variety of applications..
4. Cost-Effective: Requires minimal equipment and materials.
5. Repairability: Joints can be easily reworked or repaired.

Disadvantages of Soft Soldering

1. Weak Joint Strength: The bond is not as strong as those produced by welding or brazing.
2. Temperature Limitations: Joints may fail under high temperatures.
3. Toxicity: Lead-based solders pose health risks, necessitating the use of proper ventilation and safety measures.
4. Corrosion Risk: Residual flux can lead to corrosion if not cleaned properly.
5. Limited Material Compatibility: Not suitable for all types of metals, especially those with high melting points.

Conclusion

Soft soldering remains a valuable technique for joining metals in numerous applications, particularly where ease of use and low-temperature operation are essential. Its advantages make it ideal for delicate tasks in electronics, plumbing, and crafting, while its limitations must be considered when high strength or temperature resistance is required. With advancements in soldering materials and techniques, soft soldering continues to be a reliable and accessible method for metal joining.

The post Soft Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

Neural implants contain integrated circuits (ICs) — commonly called chips — built on silicon. These implants need to be small and flexible to mimic circumstances inside the human body.