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КПІ. Вулиця Михайла Брайчевського kpi ср, 11/26/2025 - 19:17

submitted by /u/BetimSec [link] [comments]

Just cleaned up and reorganized my small bench setup yesterday and thought I could get some critiques on what might be missing. not shown is a HP 8592 Spectrum analyzer and HP 54615B 500 MHz OScope. submitted by /u/maydayM2 [link] [comments]

The ST87M01-1301 NB-IoT wireless module from ST provides narrowband cellular connectivity along with both GNSS and Wi-Fi–based positioning for outdoor and indoor geolocation. Its integrated GNSS receiver enables precise location tracking using GPS constellations, while the Wi-Fi positioning engine delivers fast, low-power indoor location services by scanning nearby 802.11b access points and leveraging third-party geocoding providers.

As the latest member of the ST87M01 series of NB-IoT (LTE Cat NB2) industrial modules, this variant supports multi-frequency bands with extended multi-regional coverage. Its compact, low-power design makes it well suited for smart IoT applications such as asset tracking, environmental monitoring, smart metering, and remote healthcare. A 10.6×12.8-mm, 51-pin LGA package further enables miniaturization in space-constrained designs.

ST provides an evaluation kit that includes a ready-to-use Conexa IoT SIM card and two SMA antennas, helping developers quickly prototype and validate NB-IoT connectivity in real-world conditions. This is supported by an expanding ecosystem featuring the Easy-Connect software library and design examples.

ST87M01 series product page

STMicroelectronics

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A 60-V boost controller from Diodes, the AL3069Q packs four 80-V current-sink channels for driving LED backlights in automotive displays. Its adaptive boost-voltage control allows operation from a 4.5-V to 60-V input range—covering common automotive power rails at 12 V, 24 V, and 48 V—and its switching frequency is adjustable from 100 kHz to 1 MHz.

The AL3069Q’s four current-sink channels are set using an external resistor, providing typical ±0.5% current matching between channels and devices to ensure uniform brightness across the display. Each channel delivers 250 mA continuous or up to 400 mA pulsed, enabling support for a range of display sizes and LED panels up to 32-inch diagonal, such as those used in infotainment systems, instrument clusters, and head-up displays. PWM-to-analog dimming, with a minimum duty cycle of 1/5000 at 100 Hz, improves brightness control while minimizing LED color shift.

Diode’s AL3069Q offers robust protection and fault diagnostics, including cycle-by-cycle current limit, soft-start, UVLO, programmable OVP, OTP, and LED-open/-short detection. Additional safeguards cover sense resistor, Schottky diode, inductor, and VOUT faults, with a dedicated pin to signal any fault condition.

The automotive-compliant controller costs $0.54 each in 1000-unit quantities.

AL3069Q product page 

Diodes

The post Boost controller powers brighter automotive displays appeared first on EDN.

TDK’s G series integrates a metal oxide varistor and a gas discharge tube into a single device to provide enhanced surge protection. The two elements are connected in series, combining the strengths of both technologies to deliver greater protection than either component can offer on its own. This hybrid configuration also reduces leakage current to virtually zero, helping extend the overall lifetime of the device.

The G series comprises two leaded variants—the G14 and G20—with disk diameters of 14 mm and 20 mm, respectively. G14 models support AC operating voltages from 50 V to 680 V, while G20 versions extend this range to 750 V. They can handle maximum surge currents of 6,000 A (G14) and 10,000 A (G20) for a single 8/20-µs pulse, and absorb up to 200 J (G14) or 490 J (G20) of energy.

Operating over a temperature range of –40 °C to +105 °C, the G series is suitable for use in power supplies, chargers, appliances, smart metering, communication systems, and surge protection devices. Integrating both protection elements into a single, epoxy-coated 2-pin package simplifies design and reduces board space compared to using discrete components.

To access the datasheets for the G14 series (ordering code B72214G) and the G20 series (B72220G), click here.

TDK Electronics 

The post Hybrid device elevates high-energy surge protection appeared first on EDN.

R&S has launched the NGT3600 series of DC power supplies, delivering up to 3.6 kW for a wide range of test and measurement applications. This versatile line provides clean, stable power with low voltage and current ripple and noise. With a resolution of 100 µA for current and 1 mV for voltage, as well as adjustable output voltages up to 80 V, the supplies offer both precision and flexibility.

The dual-channel NGT3622 combines two fully independent 1800-W outputs in a single compact instrument. Its channels can be connected in series or parallel, allowing either the voltage or the current to be doubled. For applications requiring even more power, up to three units can be linked to provide as much as 480 V or 300 A across six channels. The NGT3622 supports current and voltage testing under load, efficiency measurements, and thermal characterization of components such as DC/DC converters, power supplies, motors, and semiconductors.

Engineers can use the NGT3600 series to test high-current prototypes such as base stations, validate MPPT algorithms for solar inverters, and evaluate charging-station designs. In the automotive sector, the series supports the transition to 48-V on-board networks by simulating these networks and powering communication systems, sensors, and control units during testing.

All models in the NGT3600 series are directly rack-mountable with no adapter required. They will be available beginning January 13, 2026, from R&S and selected distribution partners. For more information, click here.

Rohde & Schwarz 

The post Power supplies enable precise DC testing appeared first on EDN.

Microchip’s two radiation-tolerant Ethernet PHY transceivers are the company’s first devices to earn QML Class P/ESCC 9000P qualification. The single-port VSC8541RT and quad-port VSC8574RT support data rates up to 1 Gbps, enabling dependable data links in mission-critical space applications.

Achieving QML Class P/ESCC 9000P certification involves rigorous testing—such as Total Ionizing Dose (TID) and Single Event Effects (SEE) assessments—to verify that devices tolerate the harsh radiation conditions of space. The certification also ensures long-term availability, traceability, and consistent performance.

The VSC8541RT and VSC8574RT withstand 100 krad(Si) TID and show no single-event latch-up at LET levels below 78 MeV·cm²/mg at 125 °C. The VSC8541RT integrates a single Ethernet copper port supporting MII, RMII, RGMII, and GMII MAC interfaces, while the VSC8574RT includes four dual-media copper/fiber ports with SGMII and QSGMII MAC interfaces. Their low power consumption and wide operating temperature ranges make them well-suited for missions where thermal constraints and power efficiency are key design considerations.

VSC8541RT product page  

VSC8574RT product page 

Microchip Technology 

The post Space-ready Ethernet PHYs achieve QML Class P appeared first on EDN.

NcodiN of Palaiseau, Paris, France (which was founded in 2023 to pioneer optical interposer technology with integrated nanolasers for next-generation computing) has secured €16m in an oversubscribed seed financing round...

Current mirrors are a commonly useful circuit function, and sometimes high precision is essential. The challenge of getting current mirrors to be precise has created a long list of tricks and techniques. The list includes matched transistors, monolithic transistor multiples, emitter degeneration, fancy topologies with extra transistors, e.g., Wilson, cascode, etc.

But when all else fails and precision just can’t suffer any compromise, Figure 1 shows the nuclear option. Just add a rail-to-rail I/O (RRIO) op-amp!

Figure 1 An active current sink mirror. Assuming resistor equality and negligible A1 offset error, A1 feedback forces Q1 to maintain accurate current sink I/O equality I2 = I1.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The theory of operation of the ACM couldn’t be more straightforward. Vr , which is equal to I1*R, is wired to A1’s noninverting input, forcing it to drive Q1 to conduct I2 such that I2R = I1R.

Therefore, if the resistors are equal, A1’s accuracy limiting parameters, like offset voltage, gain-bandwidth, bias and offset currents, etc., are adequate, and Q1 doesn’t saturate, I1 can be equal to I2 just as precisely as you like.

Obviously, Vr must be >> Voffset, and A1’s output span must be >> Q1’s threshold even after subtracting Vr.

Substitute a PFET for Figure 1’s NFET, and a current-sourcing mirror results, as shown in Figure 2.

Figure 2 An active current source mirror. This is identical to Figure 1, except this Q1 is a PFET and the polarities are swapped.

Active current mirror (ACM) precision can be better than that of easily available sense resistors. So, a bit of post-assembly trimming, as illustrated in Figure 3, might be useful.

Figure 3 If adequately accurate resistors aren’t handy, a trimmer pot might be useful for post-assembly trimming.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• A current mirror reduces Early effect
• A two-way mirror—current mirror that is
• A two-way Wilson current mirror
• Current mirror improves PWM regulator’s performance

The post Active current mirror appeared first on EDN.

submitted by /u/Life_Ad_708 [link] [comments]

The world is witnessing an artificial intelligence (AI) tsunami. While the initial waves of this technological shift focused heavily on the cloud, a powerful new surge is now building at the edge. This rapid infusion of AI is set to redefine Internet of Things (IoT) devices and applications, from sophisticated smart homes to highly efficient industrial environments.

This evolution, however, has created significant fragmentation in the market. Many existing silicon providers have adopted a strategy of bolting on AI capabilities to legacy hardware originally designed for their primary end markets. This piecemeal approach has resulted in inconsistent performance, incompatible toolchains, and a confusing landscape for developers trying to deploy edge AI solutions.

To unlock the transformative potential of edge AI, industry must pivot. We must move beyond retrofitted solutions and embrace a purpose-built, AI-native approach that integrates hardware and software right from the foundational design.

 

The AI-native mandate

“AI-native” is more than a marketing term; it’s a fundamental architectural commitment where AI is the central consideration, not an afterthought. Here’s what it looks like.

• The hardware foundation: Purpose-built silicon

As IoT workloads evolve to handle data across multiple modalities, from vision and voice to audio and time series, the underlying silicon must present itself as a flexible, secure platform capable of efficient processing. Core to such design considerations include NPU architectures that can scale, and are supported by highly integrated vision, voice, video and display pipelines.

• The software ecosystem: Openness and portability

To accelerate innovation and combat fragmentation for IoT AI, the industry needs to embrace open standards. While the ‘language’ of model formats and frameworks is becoming more industry-standard, the ecosystem of edge AI compilers is largely being built from vendor-specific and proprietary offerings. Efficient execution of AI workloads is heavily dependent on optimized data movement and processing across scalar, vector, and matrix accelerator domains.

By open-sourcing compilers, companies encourage faster innovation through broader community adoption, providing flexibility to developers and ultimately facilitating more robust device-to-cloud developer journeys. Synaptics is encouraging broader adoption from the community by open-sourcing edge AI tooling and software, including Synaptics’ Torq edge AI platform, developed in partnership with Google Research.

• The dawn of a new device landscape

AI-native silicon will fuel the creation of entirely new device categories. We are currently seeing the emergence of a new class of devices truly geared around AI, such as wearables—smart glasses, smartwatches, and wristbands. Crucially, many of these devices are designed to operate without being constantly tethered to a smartphone.

Instead, they soon might connect to a small, dedicated computing element, perhaps carried in a pocket like a puck, providing intelligence and outcomes without requiring the user to look at a traditional phone display. This marks the beginning of a more distributed intelligence ecosystem.

The need for integrated solutions

This evolving landscape is complex, demanding a holistic approach. Intelligent processing capabilities must be tightly coupled with secure, reliable connectivity to deliver a seamless end-user experience. Connected IoT devices need to leverage a broad range of technologies from the latest Wi-Fi and Bluetooth standards to Thread and ZigBee.

Chip, device and system-level security are also vital, especially considering multi-tenant deployments of sensitive AI models. For intelligent IoT devices, particularly those that are battery-powered or wearable, security must be maintained consistently as the device transitions in and out of different power states. The combination of processing, security, and power must all work together effectively.

Navigating this new era of the AI edge requires a fundamental shift in mindset, a change from retrofitting existing technology to building products with a clear, AI-first mission. Take the case of Synaptics SL2610 processor, one of the industry’s first AI-native, transformer-capable processors designed specifically for the edge. It embodies the core hardware and software principles needed for the future of intelligent devices, running on a Linux platform.

By embracing purpose-built hardware, rallying around open software frameworks, and maintaining a strategy of self-reliance and strategic partnerships, the industry can move past the current market noise and begin building the next generation of truly intelligent, powerful, and secure devices.

Mehul Mehta is a Senior Director of Product Marketing at Synaptics Inc., where he is responsible for defining the Edge AI IoT SoC roadmap and collaborating with lead customers. Before joining Synaptics, Mehul held leadership roles at DSP Group spanning product marketing, software development, and worldwide customer support.

Related Content

• Edge AI: Bringing Intelligence Closer to the Source
• An edge AI processor’s pivot to the open-source world
• Edge AI powers the next wave of industrial intelligence
• Synaptics, Google partnership targets edge AI for the IoT
• How Advanced Packaging is Unleashing Possibilities for Edge AI

The post Charting the course for a truly multi-modal device edge appeared first on EDN.

During the CxO Executive Summit at SEMICON Europa 2025 in Munich, Germany (18–21 November), Professor Owen Guy (head of Chemistry at Swansea University) has been honoured with the SEMI Academia Impact Award, recognizing his “outstanding contributions to semiconductor research, innovation and industry-academia collaboration in Europe”...

Тренінг «Security first: як не стати жертвою фінансових афер» для студентів КПІ ім. Ігоря Сікорського kpi ср, 11/26/2025 - 11:36

КПІ ім. Ігоря Сікорського співпрацюватиме з GSC Game World KPI4U-2 ср, 11/26/2025 - 11:33

Four researchers at the University of Waterloo have been awarded $3.95m in funding to support their research as part of the Canada Research Chairs (CRC) program...

The National Physical Laboratory (NPL) in Teddington, UK has been appointed by the Department for Science, Innovation and Technology (DSIT) to lead a £1.2m Government-funded project to establish new metrology capabilities that will strengthen the UK’s semiconductor innovation infrastructure. The strategic investment aims to accelerate the UK’s role in developing next-generation semiconductor materials and processes, helping to attract private investment and boost economic growth in the sector...

 Keysight Technologies, Inc. announced the AI Thought Leadership Conclave, a premier forum bringing together technology leaders, researchers, and industry experts to discuss the transformative role of artificial intelligence (AI) is shaping digital infrastructure, wireless technologies, and connectivity.

Taking place on December 9, 2025, in Bengaluru, the conclave will showcase how AI is redefining the way networks, cloud, and edge systems are designed, optimized, and scaled for a hyperconnected world. Through keynote sessions, expert panels, and interactive discussions, participants will gain insights into:

• The role of AI in shaping data center architecture, orchestration, and resource optimization
• Emerging use cases across industries, from healthcare and manufacturing to mobility and entertainment
• Ethical, regulatory, and security considerations in large-scale AI infrastructure
• Collaborative innovation models and global standardization efforts

Additional sessions will focus on AI-driven debugging and optimization, data ingestion and software integration for scalable AI, and building secure digital foundations across cloud and edge environments.

“AI is rapidly becoming the backbone of digital transformation, and the ability to integrate intelligence into every layer of infrastructure will define the next decade of innovation,” said Sudhir Singh, Country Manager, Keysight India. “Through the AI Thought Leadership Conclave, Keysight is facilitating an exchange of ideas, showcasing AI-centered advancements, and shaping the connected future.”

In addition to focused discussions and technology presentations, the conclave will host an AI Technology Application Demo Fair, featuring live demonstrations of advanced solutions developed by Keysight and its technology partners. Attendees will also have ample opportunities to connect with industry leaders, participate in business and customer meetings, and engage in discussions with representatives from industry standard bodies.

The post Keysight Hosts AI Thought Leadership Conclave in Bengaluru appeared first on ELE Times.

I used the TL431 reference programmable zenner with an emitter follower for extra stability. This takes my ±38V and makes a ±15V helprail to power op amps etc. Think i hould be able to draw 500mA-1A current on the help rail!. One more step closer to finish my linear dual rail build ±0-35v, 2.2A per rail total 4.4A. submitted by /u/Whyjustwhydothat [link] [comments]

A year ago, I worked at a workshop that specialized in rewinding electric motors and transformers. We frequently received motors and transformers for maintenance and rewinding, but sometimes we received DC motors that typically operated with a 400 V DC stator and a 200 V DC armature. To run and test those motors, our power setup was quite cumbersome. We would connect 400 V AC to a large motor-generator set, and the output from that would power the DC motor's stator. For the armature, we took a single-phase 220 V AC line, passed it through a bridge rectifier, and then controlled the voltage using a Variac before finally feeding it to the armature. This entire process was bulky. It inspired me to design a power circuit capable of electronically controlling the armature voltage, which is essential for modulating the motor's speed. Unfortunately, I never got the opportunity to implement the circuit. The owner of the shop, who was also my electrical machines professor at university, was an elderly gentleman who passed away, and the project get stalled. Recently, I've been experimenting with the circuit in simulation and found it can be used for several interesting applications: High-Voltage (HV) Switch Linear Regulator Step-Down (Buck) Converter Step-Up (Boost) Converter (A topic from a previous post) I'm also confident it could be used to build a audio driven signal modulation ( weird but possible ). My biggest worry was the power that the IGBTs would have to sustain. If we assume the voltage drop across the IGBT (VCE​) is around 100V (the point of maximum power dissipation), the IGBT would need to dissipate about 450W of power. I was highly concerned about whether a single IGBT could handle this continuous load without failing. I was planning to mount the transistors onto a large aluminum heat sink block and place several IGBTs in parallel to distribute the power load among them. Anyway, I wanted to share this project with you. here The diagram for circuitJS. $ 1 0.000005 10.20027730826997 49 5 43 5e-11 t 320 192 320 144 1 -1 195.0523838167561 -0.7316787632313719 100 default f 336 240 336 192 40 1.5 0.02 w 176 144 304 144 0 R 176 144 96 144 0 0 40 200 0 0 0.5 t 256 416 176 416 0 1 0 0.47551466520158947 100 default t 256 416 336 416 0 1 -5.6784882330384585 0.47551466464471304 100 default w 256 416 256 384 0 w 176 384 256 384 0 w 176 400 176 384 0 r 336 432 336 512 0 100 w 336 512 176 512 0 g 176 512 112 512 0 0 w 336 144 352 144 0 r 432 432 432 512 0 100 w 432 512 336 512 0 w 432 432 432 336 0 w 432 144 560 144 0 r 560 144 560 512 0 22 w 560 512 432 512 0 p 688 144 688 512 3 0 0 0 w 560 144 688 144 0 w 688 512 560 512 0 r 432 144 432 240 0 1000 r 176 432 176 512 0 100 r 176 240 176 144 0 10000000 w 176 288 176 240 0 w 176 320 176 384 0 w 176 240 336 240 0 w 336 240 336 400 0 w 352 192 352 144 0 w 432 240 432 272 0 w 432 144 352 144 0 w 432 272 384 272 0 w 432 336 432 320 0 t 384 304 432 304 0 1 0 0.6259000454766762 100 default w 432 272 432 288 0 w 384 272 384 304 0 t 384 304 176 304 0 1 -5.2027187673209605 0.47576946571749795 100 default o 19 32 0 4098 320 0.1 0 1 38 22 F1 0 1000 100000 -1 Resistance submitted by /u/Inevitable-Round9995 [link] [comments]