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It’s not uncommon for a midsection to become soft and distended with advancing age. That said, when it happens to a battery, it’s potentially quite problematic.

In last week’s part 1, I took apart a third-party BLX-1 battery which had come with my Olympus (now OM System) OM-1 digital camera and which the manufacturer’s own BCX-1 charger refused to recognize as a valid recharge partner. Also recently augmenting my burgeoning gear inventory are two enthusiast-prized Olympus PEN-F Micro Four Thirds bodies (once again digital, not the film-based precursor), one in each color option offered by the manufacturer a decade ago when they were new.

Each came with a third-party BLN-1 battery (7.6 V, 1220 mAh). Supplier names differed but their physical appearances were identical, therefore suggestive of a common manufacturing source. I’ll be taking them both apart today to test my hypothesis. But why am I dissecting them at all?

Unlike the BLX-1, they seemingly still work fine, but they both arrived slightly swollen, with further distension likely after additional use and recharge cycles. The last thing I want is for an inexpensive, replaceable cell to end up permanently lodged in the battery compartment of an expensive, irreplaceable camera, so retirement and replacement was a priority for both!

Trust me when I say that all the cameras showcased in this two-part series are Micro Four Thirds models, Olympus-now-OM System to boot, is only a coincidence. I’ve had no shortage of mixed-at-best success in the past with third-party batteries for other manufacturers’ cameras, too.

Some Wasabi with your sushi?

I randomly picked the one from Wasabi Power, a common “clone” cell supplier, to disassemble first. As usual, I’ll start with some overview shots, accompanied by a 0.75′′ (19.1 mm) diameter U.S. penny for size comparison purposes. Top.

Bottom.

Four of the BLN-1 contacts—”+”, “-“, “I” and “T”—are marked the same (albeit in different ordering) as with the BLX-1. As I mentioned last time, published specifications for batteries like these are hard-to-impossible to come by, given that for various reasons the camera manufacturer doesn’t want to encourage third-party cloning.

That said, once again the functions of “+” and “-“ are likely related to the applied voltage and current involved in the fundamental cell-charging and -discharging (for camera powering) functions. “I”, typically standing for “information” or “identification”, references the interrogation initially done by both charger and camera after battery insertion and power-on, and ongoing from that point on, presumably implemented by a bidirectional single-data-pin serial communications protocol of some sort.

“T” typically references “temperature”, with the contact connected to an embedded negative temperature coefficient (NTC) thermistor or other sensor that monitors the internal cell(s) and alerts the charger to potential overheating. And this time there’s a fifth electrical contact, “S”. User research suggests that it was added in response to Japanese standards body guideline revisions that mandated a fuller shut-off of the accompanying charger after the battery reported it was “full”, thereby minimizing subsequent “vampire” power draw.

The BLX-1 battery disassembled in part 1 of this series is significantly newer in generation than the BLN-1 and presumably integrates this function along with others already supported over the “I” interface, thereby negating the ongoing need for a dedicated “S” contact.

Onward, redux. Once again, the other end is much less exciting, as are the sides.

Ongoing unexciting-dissection aspirations

And once again, a Sirens-like tempting, albeit ultrasonic-welded, seam around the battery’s circumference seems to be the most feasible pathway inside, the potential for sparks, smoke, flame, and other calamities aside. Danger, Will Robinson!

Phew!

This time, the batteries’ form factors aren’t cylindrical and plastic-covered as before, but rectangular and metallic; niftily-named prismatic, to be exact. Once again throwing caution to the wind, I pressed forward determinedly (albeit cautiously) with the disassembly.

Rubber strips again, this time tape- and paper-accompanied, to insulate the mini-PCB from the batteries’ terminals both mechanically and electrically.

Enough with the teasing; I know this is what you’re most interested in seeing, right?

The design is much more elementary than with the BLX-1 circuit board we saw in part 1. The eight-lead IC PCB-labeled as U2 is stamped as follows on top, below a cryptic company logo.

8822
E6H01

It’s another dual N-channel MOSFET. And then there’s six-lead U1 to its right, marked as follows.

CGKU

As with the BLX-1, per an earlier-referenced discussion, I’m guessing it’s a rudimentary battery-protection IC. Apparently recharge-balancing the two cells isn’t of concern in this specific case.

Speaking of which, let’s take a closer look at the markings on the two cells’ prismatic cases, which you’ve already glimpsed in prior images.

They match each other, and I suspect the last eight characters of each reference a September 2016 manufacturing date. Nearing 10 years old, I’m willing to forgive a bit of old-age swelling, no matter that it obviates any further use (that I’m comfortable taking a chance on, at least). No voltage or capacity specs; that said, I suspect they’re the relatively common 4.2 V (3.7 V nominal) variant in a serial-interconnect topology.

Testing a common-sourcing hypothesis

Now for its Newmowa-branded counterpart (is that a clever company logo, or what?), complete with scribbling on top from its prior owner (who apparently, like me, is also blessed to own a diversity of camera hardware models from various manufacturers, and needs to keep his batteries straight).

Trust me when I say that had I decided to keep the battery in service, cleaning off those contacts would have been my very next step!

Once more unto the breach, dear friends.

This time, interestingly, both cells’ cases are completely marking-free on both sides.

Although the means by which the cells are adhesively bonded both to each other and to the surrounding halves of the enclosure differ, there’s visually obvious commonality with respect to the respective mini-PCB layouts.

That said, the components are seemingly divergent from a sourcing standpoint (albeit functionally identical, at least likely). Here’s what’s atop eight-lead U2 this time:

SNE
5N20V
7H09 (don’t quote me on the accuracy of this last line; it’s pretty fuzzy)

Once again, it’s a dual N-channel power MOSFET. And six-lead IC U1 to its right? Again, don’t quote me definitively, but here’s my best shot post-cleanup with rubbing alcohol.

20DD
L607

And with that, after wrapping up all four cells (two from each of the two batteries) in insulating masking tape to ensure safe storage until after my writeup is published.

I’ll also wrap up for today. Shout out with your thoughts in the comments, please!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• Dissecting third-party camera batteries, part 1: Misbehavior
• Engineering tradeoffs: a camera case study
• Single-battery failures in multi-battery arrangements: diagnosing selective cell derangements

The post Dissecting third-party camera batteries, part 2: Swelling appeared first on EDN.

India’s medical device industry is expected to emerge as a global powerhouse with a projected market size of $250 billion by 2047, according to FICCI-DUA Consulting White Paper on ‘Service and Maintenance of Medical Equipment in Indian Healthcare – Towards a Safe, Reliable and Sustainable Medical Device Maintenance Ecosystem’.

The White Paper released during the inaugural session of the 9th edition of ‘India Medical Device 2026’, organised by the Department of Pharmaceuticals in association with FICCI today says that India’s medical device sector, currently valued at around $14 billion, is projected to reach $30-50 billion within this decade, and likely to reach $250 billion by 2047. It says rising healthcare demand, increased adoption of advanced medical technologies, government support for indigenous manufacturing, and the country’s ambition to become a global MedTech hub likely to drive the rapid growth.

According to the White Paper, India has made significant progress through initiatives such as the Production Linked Incentive (PLI) Scheme and the Strengthening of Medical Devices Industry Scheme, which have enhanced domestic manufacturing capabilities and improved India’s global competitiveness. However, the report stresses that sustained growth of the sector will depend not only on manufacturing but also on creating a world-class ecosystem for servicing, maintenance, calibration and lifecycle management of medical equipment.

The report highlights that medical equipment today forms the backbone of modern healthcare, supporting timely diagnosis, emergency response, surgeries and advanced treatment. It argues that the value of these technologies extends well beyond procurement and depends on reliable servicing throughout their operational lifecycle. Proper maintenance, the report says, improves patient safety, enhances clinical effectiveness, reduces equipment downtime, extends equipment life and optimises healthcare investments.

To address these issues, the White Paper proposes a risk-tiered hybrid maintenance framework anchored in the Central Drugs Standard Control Organisation (CDSCO) device classification system. It recommends maintenance protocols based on device risk categories, creation of a national certification architecture for service engineers, strengthening technical training, encouraging commercial model innovation, and rationalising the fiscal framework to promote compliant maintenance practices. The report also advocates wider adoption of digital technologies, including predictive maintenance, digital monitoring and lifecycle management systems, to improve equipment reliability and minimise downtime.

The post India’s Medical Device Sector Projected to Reach $250 billion by 2047: FICCI-DUA Consulting Report appeared first on ELE Times.

For first-half 2026, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has reported revenue of €174.5m, down 30% on first-half 2025’s €249.9m...

The access control industry is rapidly moving to the cloud. The global Access Control as a Service (ACaaS) market is expected to nearly double in size from 2025 to 2029 1 , driven by organizations seeking simpler deployment, centralized management, and lower maintenance costs.

At the same time, they are managing more employees, visitors, and locations than ever before, making access control administration increasingly complex.

This is where cloud access control, also known as ACaaS, comes in.

What is cloud access control

Cloud access control connects devices directly to a cloud platform, allowing administrators to manage access permissions, attendance, and elevator control from a single interface.

Instead of maintaining servers and software infrastructure, organizations can manage users, doors, schedules, and permissions remotely while ensuring the right people access the right places at the right time.

Introducing Hik-Connect Team
Hik-Connect Team is Hikvision’s cloud-based platform, helping organizations have access control through a unified web and mobile experience. It brings the following core benefits.

• No servers required: Connect devices to power and internet, and they’re online and fully operational within minutes. No server, no configuration, no high maintenance costs.
• Remote management: Administrators manage devices and users from wherever they are without relying on VPNs — whether they are at headquarters, a branch office, or working remotely.
• Stable performance: Network outages don’t cause downtime. Edge processing, local storage, and cross-device communication keep doors operational even when connectivity is interrupted.
• Scale as you need: From a single door to an unlimited number of access points, the system grows without friction.
• SMB-ready free capacity*: Hik-Connect Team includes free door and user capacity to meet the needs of SMBs.
• Always up to date: New features and capabilities are released through updates. There’s no extra on-site deployment or maintenance work.
• Unified management with open integration: All three functions — access, attendance, and elevator control — are managed in one place. For organizations that already use third-party payroll or HR platforms, open API support makes integration straightforward.
• Enterprise-grade security: Data privacy and security are not concerns. Hik-Connect Team is built on top-tier cybersecurity infrastructure to protect sensitive data.

Designed for diverse business scenarios

Cloud-based access control is suitable for SMB scenarios:

• Small offices and single-site businesses seeking simple and cost-effective management
• Multi-site offices and chain stores requiring centralized operations
• Residential communities looking for more convenient and secure access experiences

The shift to cloud service

The shift from on-premise to cloud isn’t just a technology trend. It’s a fundamental change in how organizations think about access, operations, and cost. Hik-Connect Team is designed for that shift — flexible enough for a startup, robust enough for a multi-site enterprise, and secure enough for environments where data protection is non-negotiable.

 

The post Why Businesses Are Choosing Cloud Access Control appeared first on ELE Times.

Over the last two months, we mapped out how USB-C, Power Delivery (PD), vehicle-to-load (V2L), and high common-mode transit immunity (CMTI) are reshaping the landscapes of test and measurement and electric vehicles (EVs). The next challenge is practical: how do you translate those high-level architectural requirements into a schematic that works and a PCB layout that passes?

This post delivers the essential design clues—the component choices, layout constraints, and rule-of-thumb practices—that bridge concept to copper. It’s about moving from theory to implementation, giving engineers the confidence to build USB-C and PD systems that meet compliance while surviving real-world stress.

Designing for high CMTI: Turning ratings into real layout rules

To maintain high CMTI on a real board, the isolation barrier is non-negotiable. Specialized digital isolators—either capacitive-based or magnetic-based—are engineered to withstand the brutal transient voltage spikes in the range of kV/𝜇s without corrupting USB data streams. These devices form the shield that keeps common-mode noise from bleeding across domains.

Placement is equally critical: the isolator must straddle a deliberate, wide physical gap on the PCB. That gap is a true keep-out zone; no copper traces, power planes, or ground planes are allowed to cross it. The isolator alone bridges the divide, ensuring that the high-speed USB signals remain intact even under aggressive switching events. This disciplined layout practice is what turns theoretical CMTI ratings into reliable, repeatable board-level immunity.

Figure 1 Application diagram of ISOUSB211 reveals how the isolation barrier prevents data corruption caused by ground loops and power-stage switching noise. Source: Texas Instruments

Implementing USB-C and PD controllers: The schematic clues

Moving from standard USB to USB-C with Power Delivery—and even V2L—requires dedicated silicon. At the simplest level, configuring a USB-C port hinges on the CC pins. If the design is a power sink, such as a basic test and measurement instrument, you must place 5.1 kΩ pull-down resistors (Rd) on both CC1 and CC2 pins.

Conversely, if the design is a source, pull-up resistors (Rp) are required to advertise available current. For higher-power PD or bidirectional V2L applications, engineers should resist the temptation to code the complex negotiation state machines inside a general MCU.

Instead, a standalone USB-PD controller IC is the right choice—it encapsulates the protocol logic, manages the timing, and ensures compliance, freeing the system MCU to focus on application-level tasks. This division of labor is what makes USB-C and PD designs robust and certifiable in practice.

Figure 2 This simplified block diagram of the MAX77958 IC details the USB Type-C CC detection and Power Delivery protocol implementation. Source: Analog Devices

The 90-Ω differential layout: The PCB clues

High-speed USB signaling in USB 3.x and USB4 behaves much more like RF than low-speed digital. If the layout is off, compliance failures are inevitable. The first design clue is impedance control: the D+/D– or TX/RX traces must be routed as a matched differential pair with a strict target of 90 Ω. Deviations here directly translate into eye-diagram collapse and failed certification.

The second clue is geometry for ESD protection. In harsh EV and lab environments, transient voltage suppressor (TVS) diodes must sit physically as close as possible to the USB-C connector pins. The ESD spike must be absorbed at the connector entry point—before it can travel down the trace and reach sensitive silicon. This placement discipline ensures that compliance isn’t just theoretical but survives the real-world surge events that USB-C designs inevitably face.

Figure 3 Hand-drawn illustration of an eye diagram highlights the mask keep-out zone at the center. This stylized ‘open eye’ demonstrates the compliant signal quality expected in USB 2.0 links when the differential pair achieves routing near the 90-Ω target. Source: Author

Tips from the bench: What datasheets don’t mention

While mapping out your schematic and tracking your traces, keep these three notorious real-world layout traps in mind. They are the most common culprits behind first-revision PCB failures:

• Guard the CC pins against high-voltage shorts

Inside the microscopic geometry of a USB-C receptacle, the Configuration Channel (CC) pins sit directly adjacent to the high-voltage VBUS power pins. A slightly tilted cable insertion, a worn-out connector, or a bit of metallic debris can instantly short a 20-V VBUS line straight into a CC pin. Standard 3.3-V or 5 V-MCU inputs will instantly fry.

The fix: Always specify standalone USB-PD controllers featuring integrated 24 V short-to-VBUS protection on the CC lines.

• Tame the VBUS hot-plug voltage ringing

When a user hot-plugs a live Power Delivery adapter into your board, the parasitic inductance of the USB-C cable slams into the input capacitance of your PCB. This creates an LC circuit that can ring up to twice the nominal voltage, turning a standard 20-V PD profile into a destructive 40-V spike that easily ruptures downstream buck regulators.

The fix: Anchor the VBUS entry point with a heavy-duty, high-voltage TVS diode or an over-voltage protection (OVP) eFuse paired with a minimum of 10 uF of bulk ceramic capacitance to dampen the surge.

• Ban via stubs on your 90-Ω pairs

Achieving a strict 90 Ω target impedance requires flawless trace geometry. Every time a high-speed TX/RX or D+/D- pair hops between PCB layers through a via, it hits an impedance speed bump. Worse yet, if a trace transitions from the top layer to a middle layer, the remaining unused barrel of the via hangs off the signal path like an antenna. This “via stub” creates severe RF reflections that can collapse your eye diagram entirely.

The fix: Route high-speed USB lines on a single layer whenever possible. If layer transitions are absolutely non-negotiable, limit them to a maximum of two, place adjacent ground return vias right next to them to preserve the return path, and enforce back-drilling on multi-layer boards to eliminate the stubs.

This bench-level awareness is what keeps your first spin from becoming a costly lesson in overlooked physics.

Closing 3-month power and signal loop

Month 1 and month 2 set the destination, showing how USB-C, Power Delivery, V2L, and high CMTI are reshaping test and measurement and EV platforms. Month 3 provided the map: the schematic clues, resistor choices, isolation gaps, and PCB layout rules that turn concepts into copper.

The takeaway is clear: these design rules tie the journey together, moving from vision to verified hardware. By closing the loop with practical guidance, engineers are equipped not just to understand USB-C and PD, but to implement them with confidence in real boards and systems.

Carry these power and signal rules into your next design cycle; apply the resistor networks, enforce the isolation gaps, and route those 90-Ω pairs with precision. Share your own board-level lessons with peers and keep expanding the collective toolkit that transforms ambitious USB-C and PD concepts into reliable, compliant hardware.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• USB Keypad Reference Design
• USB Proves Ready for T&M Tasks
• Top 10 innovative USBs and peripherals
• Take off with Simplified USB Type-C Development
• The USB takeover: Why modern T&M is moving to your pocket
• A quick and practical view of USB Power Delivery (USB-PD) design

The post Component and layout rules for USB-C, PD, and CMTI appeared first on EDN.

thats the production file. they didnt care. for some reason you guys INSISTED they would charge me more and downvoted my replys (why??) but i tried it and it worked out fine maybe still draw on some traces between the designs but other than that you can indeed combine pcbs into one stencil in jlcpcb submitted by /u/originalmicrousb [link] [comments]

Across the world, schools are discovering that the path to sustainability runs straight through their classrooms. It’s transforming education in a very good way.

A classroom that saves thousands of sheets of paper each year, students who collaborate on virtual whiteboards, and teachers who share content digitally. Imagine a world of education where assignments flow seamlessly without wasting a single sheet of paper. No more overflowing recycling bins, and no more guilt about the impact on the environment. Welcome to the paperless classroom.

The paper trail problem: The hidden costs of traditional classrooms Traditional classrooms operate on a consumable intensive model, creating ongoing financial and environmental burdens. Research shows that classrooms consume massive quantities of paper, In the US, for example, schools use 32 billion sheets annually at a cost of $1.6 billion. In the UK, schools consume on average one million sheets per school every year. This consumption represents a major environmental challenge which contributes to deforestation and waste generation.

Beyond the cost of paper, consumable dependency extends to markers, chalk, and printing supplies, all of which require constant restocking. Teachers rely on projector systems which consume 150-800 watts each and adding to overall operating expenses. These recurring costs divert resources from core educational investments as schools struggle to balance quality education with fiscal responsibility and sustainable practices.

Going green with smart interactive solutions
Every morning in schools, teachers queue at copy machines as if they’re waiting for coffee. Students, meanwhile, manage stacks of worksheets that could rival a small forest, and recycling bins reach capacity by the end of the day.

Interactive displays, however, eliminate this entire workflow. Students collaborate directly on digital surfaces, assignments distribute instantly across devices, and lesson materials reside in cloud-based systems. The outcome: classrooms operate seamlessly with zero paper consumption. Rather than distributing physical handouts to 20-30 students, educators present interactive content that enables simultaneous manipulation by all participants. Students annotate directly on displays, engage in collaborative problem-solving, and submit assignments digitally. Identical lesson materials serve multiple classes without reprints. Processes that previously demanded hundreds of paper copies can now be executed through touch interactions.

Beyond paper reduction, these displays provide energy efficiency that makes traditional projectors look like energy-hungry dinosaurs. Intelligent algorithms dynamically adjust brightness according to content requirements, while kicks in whenever the screen is idle.  Engineered for extended lifecycles, they function for years without the frequent lamp replacements that send projector components to landfills. A single display can serve multiple classes, multiple subjects, and multiple years of sustainable e-learning.

From paper stacks to digital success: Paperless education improves sustainability
Spring Dale Senior School in Punjab, India, exemplifies successful sustainable classroom transformation through their comprehensive ‘Going Paperless’ initiative. The school faced escalating costs from continuous restocking of markers and paper supplies. To address these challenges, they implemented Hikvision’s  WonderHub  interactive displays across 80 classrooms and conference rooms.

The results speak for themselves. Teachers now assign homework through integrated quiz applications while students participate via personal devices, eliminating printed worksheets entirely. Digital content gets instantly updated and shared across eco-friendly classrooms, completely removing the dependency on physical teaching materials.

More than that, the displays incorporate advanced green technologies, including  PixMaster  intelligent energy management, which identifies content types and adjusts image parameters such as brightness and contrast. Echo Mode further improves energy efficiency by reducing power consumption during periods of low activity. Together, these features ensure strong environmental performance without compromising visual quality.

The transformation didn’t just reduce environmental impact—it enhanced educational outcomes through increased student engagement and improved curriculum responsiveness. The school now positions itself as an innovative, environmentally conscious, educational leader. One investment delivered multiple benefits: cost savings, environmental protection, and better learning experiences.

The success at Spring Dale Senior School illustrates a broader global shift toward greener education. Schools worldwide are embracing interactive displays to cut paper waste while enhancing learning outcomes. Each digital classroom is a meaningful step toward sustainable, carbon-neutral education.

 

The post The Paperless Classroom: How Interactive Displays Drive Sustainable Education appeared first on ELE Times.

Hikrobot India participated in the Automation Expo to introduce its latest range of Mobile Robots and Machine Vision Products. The Automation Expo was organised from 22nd to 25th July, 2026, at BEC, Mumbai. Hikrobot India’s display- and demonstration-oriented booth was the epicentre of attraction at Automation Expo. Hikrobot India introduced Hikpad AMR in the robotics segment; the Machine Vision segment had CI Series Infrared LWIR cameras, CT Series Industrial Area Scan Cameras and MV-ID800 Series Compact Industrial Barcode Readers at the Automation Expo.

In the Mobile Robot segment, Hikrobot showcased its Autonomous Mobile Robot and Forklift Mobile Robot variants with key success stories.  The Hikrobot India booth displayed the latest machine vision products, including Longwave and Shortwave infrared Cameras, Area Scan Cameras, Smart Cameras, Smart Code Readers, and Handheld Readers, along with other key vision components. The Hikrobot booth showcased Machine Vision’s innovative product line-up, including SC2000X/SC3000X SMART CAMERA, Line Scan Camera, 3D Laser Profile Sensor: MV-DP Series, Smart Code Readers ( ID813 + ID2023XM), HDMI Microscope System, CT SERIES 3rd generation Industrial camera with liquid lens & up to IP67, Static DWS System: MV-DB500 Series, Machine Vision Products and Accessories.

Commenting on the Automation Expo experience, Ashish P. Dhakan, MD & CEO, Prama Hikvision India, said, “Hikrobot’s latest products and solutions are demonstrating how AI and robotics are redefining factory operations. We introduced HIKPAD Autonomous Mobile Robot (AMR) for the first time in India, which is highly useful for smart logistics. In the CI Series. We had launched infrared LWIR cameras, which are well-suited for precise temperature measurement and thermal-based defect detection. We also displayed the CT Series Industrial Area Scan Cameras with Liquid Lens for flexible machine vision. The MV ID800 Series Compact Industrial Barcode Readers are part of our latest portfolio; they are built to drive higher efficiency, accuracy, and safety in Indian manufacturing. We are committed to enabling world-class automation technologies tailored for our industries.”

He further added, “The Industrial Automation innovations are shaping the future of smart manufacturing and other smart application scenarios. These solutions will help Indian factories become more productive, safer, and data-driven. The theme of Industry 4.0 is all about intelligence on the shop floor. Hirobot is here to offer Indian industry to build smarter, safer, and more efficient factories with innovative robotics and machine vision solutions.”

The event had an exciting line up of live product demos, innovative technologies on display, and several knowledge-sharing and insightful networking sessions. The Hikrobot’s booth at Automation Expo got an overwhelming response from visitors. The event offered a unique opportunity to stay up-to-date with the latest trends and insights. The event turned out to be a convergence point for the entire ecosystem of Automation industry.

The post Hikrobot India Introduces Hikpad AMR Along with Three New Innovative Machine Vision Products at Automation Expo appeared first on ELE Times.

submitted by /u/pkoirnp
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This is the film speed selector resistor PCB used in the Canon New Ql17 and QL17 G-III cameras (manufactured from 1969-1982). The construction of these is not that different from modern SMT thin-film chip resistors, with the main difference being that the termination is one-sided rather than wrapped around the edge of the ceramic substrate as it usually is now. They are approximately 2.5x1.2mm (0.1x0.05 inch). Later-production units of the same camera that I've worked on use the exact same design, but the size, placement, and soldering of the resistors tends to be more consistent. This is the earliest use of surface-mount passive components that I have seen, in person or in photos, and it's likely among the first mass-produced consumer products to use surface-mount technology. The information available online about the history of surface-mount passive components is very spotty, but I was able to find what seems to be the first patent describing this style of thin-film resistor, from 1962 by an Italian inventor who apparently worked with Plessey in the UK. It's still unclear who was the first to actually commercialize surface-mount resistors - based on other patents from the time, thin-film resistor technology was well understood, but component manufacturers were largely focused on making through-hole parts, and patents for anything resembling modern surface-mount components would not start showing up until the 1970s. It would also be a while before SMT started appearing in more consumer products; even Canon's own A-series SLRs did not switch from through-hole to surface-mount passive components until the early 1980s. submitted by /u/jrw01 [link] [comments]

i did combine 2 pcbs into one stencil but im not falling for this jlc theyre probably gonna charge me extra or something submitted by /u/originalmicrousb [link] [comments]

Today, I had an issue where I checkled under the sink and noticed that the waste disposal had a very slow leak. After tightening the seal, I decided to implement a home made moisture sensor and warning system. It essetially detects water by passing electricity throught the water to the gate of a mosfet, and then using that mosfet to pull current through a dedicated LED flashing chip. A small test button is included, to test the battery works, though I do not anticipate the batteries draining very quickly. As such, only zinc cells were implemented. This has given me a good chance to put the dedicated LED flasher chip to good use. After checking online, I think it's been discontinued. I initially wanted to use a high brightness 5mm transparent red LED, but it wouldn't fit into place, so decided on a 3mm LED instead. The LED can be changed by inserting it into the female wire ends. As for the sensor itself, just a small square of stripboard with interleaved probe terminals. Simple, but gets the job done. All installed with tape and hot glue gun, for fast removal, if needed. All mounted on a small peirce of card, for a quick and dirty job. submitted by /u/One-Cardiologist-462 [link] [comments]

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This is my first post documenting my transistor binary clock project. The goal is, to only use through hole transistors, diodes and passive components to form RTL or DTL logic. These logic elements should then divide the 50Hz mains into minutes and hours. For this job, I designed T flip-flops, that can be reset. This would allow me to combine multiple T flip-flops and some logic, to count to any arbitrary number. The clock should then display this number using a few LEDs. Today I achieved the first Milestone of this project, by soldering up the first PCB design and testing it. To my surprise, this design worked immediately! Now I am very happy with this first Layout :3 If I am done with this and I have documented everything, I am planning to open source the board and other files. No one would probably want to build a massive discrete transistor binary clock, that constantly draws 8 Watts, but whatever. Now I can say: One PCB complete, 21 more to go... submitted by /u/TechniCraft [link] [comments]

Інструкція подачі документів онлайн в КПІ ім. Ігоря Сікорського через сервіс KPI Sign KPI4U-2 пт, 08/07/2026 - 17:57

Finland-based telecom equipment maker Nokia Corp says that, as part of its long-term plans for optical component manufacturing capacity expansion, it has entered into a definitive agreement to acquire the Chandler Semiconductor Fabrication campus in Arizona of NXP Semiconductors N.V. of Eindhoven, The Netherlands. Opened in September 2020, the fab has been focused on RF gallium nitride (GaN), but was scheduled to be closed by NXP in 2027...

Live wire power poles present obvious danger to wildlife, but emergency response plans for such events unfortunately seem to be inadequate.

The following screenshot image (Figure 1) shows a black bear that actually managed to climb to the top of a power utility pole. The location was along Route 56 in New Mexico. While the bear was alive at the moment this image was captured, it was later electrocuted by the power lines, which reportedly carried 7200 volts.

Figure 1 Trapped bear unfortunately ends up electrocuted and deceased.

There have been several stories about this event. A link to one of them can be found here.

The danger that live wire power poles can present to wildlife, to birds in particular, has been addressed before. Please see here.

Quite frankly, I never expected that such an animal could get itself into trouble like that, yet I recently watched a PBS nature program where a black bear was seen effortlessly climbing a tree while hunting prey.

There are stories online of similar prior incidents having taken place. Here, it was speculated that since the event happened adjacent to a roadway, the bear might have been spooked by a passing vehicle and sought refuge by climbing that pole.

Emergency response plans for such events seem to be inadequate. Since they are already known to occur, however regularly or sporadically, I would have expected proper emergency response plans to have long ago been put in place, to turn electric power off and to then safely rescue the endangered animal(s). Instead, I see very little sign of emergency preparedness.

The emergency response operator in this case gave a verbal recitation along the line of “there’s nothing they can do.” There’s nothing that bear can do either, at least not anymore.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• A wing and a wire
• Why do you never see birds on high-tension power lines?
• A tale about loose cables and power lines
• Misplaced insulator proves fatal
• Underground power line feasibility

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Auto EV Bharat 2026 Announces Its 5th Signature Edition with Next-Gen Tech Focus and Global Pavilions

New Delhi – The countdown has officially begun for Auto EV Bharat 2026, South Asia’s defining exhibition on future mobility and electric vehicle technologies. Celebrating its monumental 5th Signature Edition, the event will be held from December 9 to 11, 2026, at the KTPO Convention Centre, Whitefield, Bengaluru.

Auto EV Bharat 2026 brings together the entire automotive technology ecosystem under one roof. The 2026 edition scales new heights by bringing together global stakeholders, automotive manufacturers, OEMs, Tier-1 suppliers, and R&D trailblazers from 9 participating countries. A prime highlight of this year’s international floor plan includes exclusive country pavilions from Italy and China. Engage in cross-border technological collaborations, joint ventures, and direct sourcing of world-class automotive solutions beyond boundaries!

Spotlight on 2026: Next-Gen Mobility & Core Technologies

Vehicles are transitioning rapidly from mechanical systems to smart, software-driven computing nodes. Keeping this paradigm shift in mind, Auto EV Bharat 2026 intends to put a sharp, engineering-first lens on the frontier pillars shaping the future of transportation:

• ADAS 2+ & Level 3 Systems: Showcasing advanced driver-assistance sensor fusion, LiDAR/radar modules, and autonomous driving architectures designed for complex real-world driving conditions.
• Software-Defined Vehicles (SDVs): Highlighting the shift toward centralized vehicle architectures, real-time operating systems, over-the-air (OTA) update frameworks, and advanced development tools.
• Automotive Semiconductors: Addressing the massive surge of chip integration in modern vehicles, focusing on power management ICs, microcontrollers, and localized semiconductor supply chains.
• Automotive AI: Exploring machine learning applications for predictive maintenance, cabin monitoring, intelligent energy management, and autonomous navigation algorithms.
• SiC & GaN Power Electronics: Featuring high-efficiency Silicon Carbide (SiC) and Gallium Nitride (GaN) devices that drive lighter, faster-charging, and thermally resilient inverters and on-board chargers.
• Battery Intelligence: Unveiling smart Battery Management Systems (BMS), cell-to-pack innovations, next-gen chemistry monitoring, and comprehensive end-to-end battery testing infrastructure.

Concurrent Event: Auto EV Tech-Vision Summit 2026

And there’s more! Running concurrently with the exhibition is the Auto EV Tech-Vision Summit, a power-packed two-day conference dedicated to solving critical R&D and design challenges. The summit will feature expert-led keynotes, panel discussions, and interactive technical sessions addressing vehicle architecture, charging ecosystems, and commercial scalability. It serves as a vital knowledge-sharing platform for working design and product engineers, embedded systems developers, and industry leaders.

Quick Event Facts:

• Event: Auto EV Bharat 2026 (5th Signature Edition)
• Dates: December 9–11, 2026
• Concurrent Conference: Auto EV Tech-Vision Summit (2 Days)
• Venue: KTPO Convention Centre, Whitefield, Bengaluru, India
• Official Website: www.autoevbharat.com, www.techvisionsummit.com

The post South Asia’s Premier Exhibition for Future Mobility Technologies appeared first on ELE Times.

Every embedded project eventually needs to address similar challenges around how much storage should be allocated to the operating system, how much should be reserved for applications, how much capacity should be allocated for system and diagnostic logs, and whether there is enough space for future software updates.

These decisions are usually made early in development, long before the first product reaches the field.

For years, that approach served the embedded industry well. Software changed relatively slowly after deployment, applications performed clearly defined functions, and storage requirements were stable enough that engineers could make sensible decisions upfront and rarely revisit them.

Today, many teams are discovering those decisions don’t last nearly as long as they used to. Products that once received only occasional firmware updates now continue evolving throughout operational lifetimes that often exceed 15 years. The hardware stays the same, but the software keeps changing.

Moving beyond static partitions

Static storage partitioning solved an important engineering problem. Applications were isolated from one another, storage behaviour was predictable, and engineers knew exactly where critical software and data would reside. In embedded systems, that level of determinism remains valuable. Today, the challenge is that software-defined systems rarely evolve evenly.

One application may barely change throughout the life of a product. Another may double in size over several software releases. At the same time, logging requirements increase, configuration data expands, and new AI models arrive years after the original storage layout was designed.

Eventually, the symptoms become familiar. One partition starts running out of space while another still has capacity that will probably never be used. Software teams spend time optimizing storage layouts instead of developing new functionality. Hardware that still has usable flash becomes constrained because it cannot be used where it’s needed most.

Why overprovisioning isn’t a long-term answer

One obvious response is to reserve more storage during development. Many embedded platforms already include generous safety margins for exactly this reason. If engineers don’t know which applications are likely to grow over the next decade, the safest option is often to allocate additional storage to all of them. That approach reduces immediate risk, but it also leaves flash capacity permanently tied to assumptions that may never prove correct.

As software-defined products become more complex, and flash prices continue to rise, this strategy becomes increasingly difficult to justify. Industry analysts have reported significant increases in NAND and NOR flash prices over the past year, meaning every additional gigabyte contributes to higher hardware costs. As a result, overprovisioning has become a bill-of-materials (BoM) consideration.

The impact of software updates

Over-the-air (OTA) updates illustrate the problem particularly well. Reliable update strategies require storage for downloading, validating, and, if necessary, rolling back software when something goes wrong. Traditional A/B partitioning addresses this by maintaining duplicate software images so that the previous version remains available until the update has been verified. This means significant amounts of flash remain reserved for situations that occur only during the update process.

A/B partitioning remains a proven and widely adopted approach because it provides a straightforward and reliable rollback mechanism if an update fails. The trade-off is that maintaining two complete software images requires a significant amount of flash to remain reserved for the update process.

As software-defined systems become more capable, that approach can increase storage requirements, enlarge software downloads, and add to the cost and complexity of deploying updates across connected devices. With flash prices continuing to rise, many engineering teams are beginning to question whether permanently reserving that capacity remains the right trade-off for every platform.

Looking at storage differently

Rather than treating storage as a collection of permanently assigned partitions, more engineers are beginning to view it as a managed system resource. This is where the concept of a dynamic data layer becomes useful.

One of the challenges it addresses is static storage allocation. Instead of permanently assigning flash to individual applications, storage can be managed as a shared resource. Applications remain isolated through mechanisms such as subvolumes, while quotas define how much storage individual workloads may consume and reservations ensure critical functions always retain guaranteed capacity.

This allows storage to adapt as software evolves. Capacity that would otherwise remain stranded in one partition can be made available elsewhere, improving utilization without sacrificing isolation or predictability.

Rethinking OTA architectures

The data layer also creates opportunities to rethink how over-the-air updates are managed. Traditional A/B partitioning remains a robust and widely adopted approach because it provides a straightforward rollback mechanism if an update fails. However, maintaining duplicate software images permanently reserves a significant amount of flash capacity.

Snapshot-based approaches provide an alternative. Rather than storing two complete software images, the file system tracks changes at the block level so only modified data needs to be written during an update.

The pre-update snapshot provides a reliable rollback point while reducing storage overhead, download size, and update effort. As flash prices continue rising, more engineering teams are evaluating these techniques as another way to improve storage efficiency without compromising reliability.

Flexibility still requires discipline

Dynamic storage management doesn’t remove the engineering constraints embedded systems have always depended on. Deterministic behavior remains essential as critical applications still require guaranteed resources. Functional safety, reliability, and predictable recovery mechanisms continue driving architectural decisions.

The objective isn’t to make storage dynamic for its own sake but to recognize that software is no longer static in the way it was when many of today’s storage architectures were originally conceived. As systems continue to evolve throughout their operational lifetime, storage management must evolve with it.

A different role for the data layer

Storage has traditionally been viewed as supporting infrastructure. Once the partition layout was complete, attention naturally shifted to processors, applications, and communications.

Software-defined systems are changing that perspective. The data layer is becoming a more active part of system architecture because it influences how efficiently software can evolve throughout the life of a product. It affects update strategies, application growth, storage utilization, and long-term maintainability just as much as raw flash capacity.

Instead of asking whether today’s applications fit into today’s partition layout, engineers are beginning to ask whether the storage architecture itself is capable of supporting software that hasn’t yet been written. While the answer will differ from one platform to another, what seems increasingly clear is that storage can no longer be designed around the assumption that software remains static after deployment.

Embedded systems have entered an era of continuous software evolution, and the architectures beneath them need to evolve for the same reality.

Sami Kassimäki is product manager at Tuxera.

Related Content

• Embedded Basics
• 8 pillars of embedded software
• 7 tips for optimizing embedded software
• Embedded systems: The marketplace in 2028
• Can Agentic AI Solve the Embedded Software Problem?

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