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На території КПІ повноцінно запрацювала мережа 5G! KPI4U-2 нд, 08/09/2026 - 23:00

This is the film speed selector resistor PCB used in the Canon New Ql17 and QL17 G-III cameras (manufactured from 1969-1982). The construction of these is not that different from modern SMT thin-film chip resistors, with the main difference being that the termination is one-sided rather than wrapped around the edge of the ceramic substrate as it usually is now. They are approximately 2.5x1.2mm (0.1x0.05 inch). Later-production units of the same camera that I've worked on use the exact same design, but the size, placement, and soldering of the resistors tends to be more consistent. This is the earliest use of surface-mount passive components that I have seen, in person or in photos, and it's likely among the first mass-produced consumer products to use surface-mount technology. The information available online about the history of surface-mount passive components is very spotty, but I was able to find what seems to be the first patent describing this style of thin-film resistor, from 1962 by an Italian inventor who apparently worked with Plessey in the UK. It's still unclear who was the first to actually commercialize surface-mount resistors - based on other patents from the time, thin-film resistor technology was well understood, but component manufacturers were largely focused on making through-hole parts, and patents for anything resembling modern surface-mount components would not start showing up until the 1970s. It would also be a while before SMT started appearing in more consumer products; even Canon's own A-series SLRs did not switch from through-hole to surface-mount passive components until the early 1980s. submitted by /u/jrw01 [link] [comments]

i did combine 2 pcbs into one stencil but im not falling for this jlc theyre probably gonna charge me extra or something submitted by /u/originalmicrousb [link] [comments]

Today, I had an issue where I checkled under the sink and noticed that the waste disposal had a very slow leak. After tightening the seal, I decided to implement a home made moisture sensor and warning system. It essetially detects water by passing electricity throught the water to the gate of a mosfet, and then using that mosfet to pull current through a dedicated LED flashing chip. A small test button is included, to test the battery works, though I do not anticipate the batteries draining very quickly. As such, only zinc cells were implemented. This has given me a good chance to put the dedicated LED flasher chip to good use. After checking online, I think it's been discontinued. I initially wanted to use a high brightness 5mm transparent red LED, but it wouldn't fit into place, so decided on a 3mm LED instead. The LED can be changed by inserting it into the female wire ends. As for the sensor itself, just a small square of stripboard with interleaved probe terminals. Simple, but gets the job done. All installed with tape and hot glue gun, for fast removal, if needed. All mounted on a small peirce of card, for a quick and dirty job. submitted by /u/One-Cardiologist-462 [link] [comments]

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This is my first post documenting my transistor binary clock project. The goal is, to only use through hole transistors, diodes and passive components to form RTL or DTL logic. These logic elements should then divide the 50Hz mains into minutes and hours. For this job, I designed T flip-flops, that can be reset. This would allow me to combine multiple T flip-flops and some logic, to count to any arbitrary number. The clock should then display this number using a few LEDs. Today I achieved the first Milestone of this project, by soldering up the first PCB design and testing it. To my surprise, this design worked immediately! Now I am very happy with this first Layout :3 If I am done with this and I have documented everything, I am planning to open source the board and other files. No one would probably want to build a massive discrete transistor binary clock, that constantly draws 8 Watts, but whatever. Now I can say: One PCB complete, 21 more to go... submitted by /u/TechniCraft [link] [comments]

Інструкція подачі документів онлайн в КПІ ім. Ігоря Сікорського через сервіс KPI Sign KPI4U-2 пт, 08/07/2026 - 17:57

Finland-based telecom equipment maker Nokia Corp says that, as part of its long-term plans for optical component manufacturing capacity expansion, it has entered into a definitive agreement to acquire the Chandler Semiconductor Fabrication campus in Arizona of NXP Semiconductors N.V. of Eindhoven, The Netherlands. Opened in September 2020, the fab has been focused on RF gallium nitride (GaN), but was scheduled to be closed by NXP in 2027...

Live wire power poles present obvious danger to wildlife, but emergency response plans for such events unfortunately seem to be inadequate.

The following screenshot image (Figure 1) shows a black bear that actually managed to climb to the top of a power utility pole. The location was along Route 56 in New Mexico. While the bear was alive at the moment this image was captured, it was later electrocuted by the power lines, which reportedly carried 7200 volts.

Figure 1 Trapped bear unfortunately ends up electrocuted and deceased.

There have been several stories about this event. A link to one of them can be found here.

The danger that live wire power poles can present to wildlife, to birds in particular, has been addressed before. Please see here.

Quite frankly, I never expected that such an animal could get itself into trouble like that, yet I recently watched a PBS nature program where a black bear was seen effortlessly climbing a tree while hunting prey.

There are stories online of similar prior incidents having taken place. Here, it was speculated that since the event happened adjacent to a roadway, the bear might have been spooked by a passing vehicle and sought refuge by climbing that pole.

Emergency response plans for such events seem to be inadequate. Since they are already known to occur, however regularly or sporadically, I would have expected proper emergency response plans to have long ago been put in place, to turn electric power off and to then safely rescue the endangered animal(s). Instead, I see very little sign of emergency preparedness.

The emergency response operator in this case gave a verbal recitation along the line of “there’s nothing they can do.” There’s nothing that bear can do either, at least not anymore.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• A wing and a wire
• Why do you never see birds on high-tension power lines?
• A tale about loose cables and power lines
• Misplaced insulator proves fatal
• Underground power line feasibility

The post Bear on a power pole appeared first on EDN.

Auto EV Bharat 2026 Announces Its 5th Signature Edition with Next-Gen Tech Focus and Global Pavilions

New Delhi – The countdown has officially begun for Auto EV Bharat 2026, South Asia’s defining exhibition on future mobility and electric vehicle technologies. Celebrating its monumental 5th Signature Edition, the event will be held from December 9 to 11, 2026, at the KTPO Convention Centre, Whitefield, Bengaluru.

Auto EV Bharat 2026 brings together the entire automotive technology ecosystem under one roof. The 2026 edition scales new heights by bringing together global stakeholders, automotive manufacturers, OEMs, Tier-1 suppliers, and R&D trailblazers from 9 participating countries. A prime highlight of this year’s international floor plan includes exclusive country pavilions from Italy and China. Engage in cross-border technological collaborations, joint ventures, and direct sourcing of world-class automotive solutions beyond boundaries!

Spotlight on 2026: Next-Gen Mobility & Core Technologies

Vehicles are transitioning rapidly from mechanical systems to smart, software-driven computing nodes. Keeping this paradigm shift in mind, Auto EV Bharat 2026 intends to put a sharp, engineering-first lens on the frontier pillars shaping the future of transportation:

• ADAS 2+ & Level 3 Systems: Showcasing advanced driver-assistance sensor fusion, LiDAR/radar modules, and autonomous driving architectures designed for complex real-world driving conditions.
• Software-Defined Vehicles (SDVs): Highlighting the shift toward centralized vehicle architectures, real-time operating systems, over-the-air (OTA) update frameworks, and advanced development tools.
• Automotive Semiconductors: Addressing the massive surge of chip integration in modern vehicles, focusing on power management ICs, microcontrollers, and localized semiconductor supply chains.
• Automotive AI: Exploring machine learning applications for predictive maintenance, cabin monitoring, intelligent energy management, and autonomous navigation algorithms.
• SiC & GaN Power Electronics: Featuring high-efficiency Silicon Carbide (SiC) and Gallium Nitride (GaN) devices that drive lighter, faster-charging, and thermally resilient inverters and on-board chargers.
• Battery Intelligence: Unveiling smart Battery Management Systems (BMS), cell-to-pack innovations, next-gen chemistry monitoring, and comprehensive end-to-end battery testing infrastructure.

Concurrent Event: Auto EV Tech-Vision Summit 2026

And there’s more! Running concurrently with the exhibition is the Auto EV Tech-Vision Summit, a power-packed two-day conference dedicated to solving critical R&D and design challenges. The summit will feature expert-led keynotes, panel discussions, and interactive technical sessions addressing vehicle architecture, charging ecosystems, and commercial scalability. It serves as a vital knowledge-sharing platform for working design and product engineers, embedded systems developers, and industry leaders.

Quick Event Facts:

• Event: Auto EV Bharat 2026 (5th Signature Edition)
• Dates: December 9–11, 2026
• Concurrent Conference: Auto EV Tech-Vision Summit (2 Days)
• Venue: KTPO Convention Centre, Whitefield, Bengaluru, India
• Official Website: www.autoevbharat.com, www.techvisionsummit.com

The post South Asia’s Premier Exhibition for Future Mobility Technologies appeared first on ELE Times.

Every embedded project eventually needs to address similar challenges around how much storage should be allocated to the operating system, how much should be reserved for applications, how much capacity should be allocated for system and diagnostic logs, and whether there is enough space for future software updates.

These decisions are usually made early in development, long before the first product reaches the field.

For years, that approach served the embedded industry well. Software changed relatively slowly after deployment, applications performed clearly defined functions, and storage requirements were stable enough that engineers could make sensible decisions upfront and rarely revisit them.

Today, many teams are discovering those decisions don’t last nearly as long as they used to. Products that once received only occasional firmware updates now continue evolving throughout operational lifetimes that often exceed 15 years. The hardware stays the same, but the software keeps changing.

Moving beyond static partitions

Static storage partitioning solved an important engineering problem. Applications were isolated from one another, storage behaviour was predictable, and engineers knew exactly where critical software and data would reside. In embedded systems, that level of determinism remains valuable. Today, the challenge is that software-defined systems rarely evolve evenly.

One application may barely change throughout the life of a product. Another may double in size over several software releases. At the same time, logging requirements increase, configuration data expands, and new AI models arrive years after the original storage layout was designed.

Eventually, the symptoms become familiar. One partition starts running out of space while another still has capacity that will probably never be used. Software teams spend time optimizing storage layouts instead of developing new functionality. Hardware that still has usable flash becomes constrained because it cannot be used where it’s needed most.

Why overprovisioning isn’t a long-term answer

One obvious response is to reserve more storage during development. Many embedded platforms already include generous safety margins for exactly this reason. If engineers don’t know which applications are likely to grow over the next decade, the safest option is often to allocate additional storage to all of them. That approach reduces immediate risk, but it also leaves flash capacity permanently tied to assumptions that may never prove correct.

As software-defined products become more complex, and flash prices continue to rise, this strategy becomes increasingly difficult to justify. Industry analysts have reported significant increases in NAND and NOR flash prices over the past year, meaning every additional gigabyte contributes to higher hardware costs. As a result, overprovisioning has become a bill-of-materials (BoM) consideration.

The impact of software updates

Over-the-air (OTA) updates illustrate the problem particularly well. Reliable update strategies require storage for downloading, validating, and, if necessary, rolling back software when something goes wrong. Traditional A/B partitioning addresses this by maintaining duplicate software images so that the previous version remains available until the update has been verified. This means significant amounts of flash remain reserved for situations that occur only during the update process.

A/B partitioning remains a proven and widely adopted approach because it provides a straightforward and reliable rollback mechanism if an update fails. The trade-off is that maintaining two complete software images requires a significant amount of flash to remain reserved for the update process.

As software-defined systems become more capable, that approach can increase storage requirements, enlarge software downloads, and add to the cost and complexity of deploying updates across connected devices. With flash prices continuing to rise, many engineering teams are beginning to question whether permanently reserving that capacity remains the right trade-off for every platform.

Looking at storage differently

Rather than treating storage as a collection of permanently assigned partitions, more engineers are beginning to view it as a managed system resource. This is where the concept of a dynamic data layer becomes useful.

One of the challenges it addresses is static storage allocation. Instead of permanently assigning flash to individual applications, storage can be managed as a shared resource. Applications remain isolated through mechanisms such as subvolumes, while quotas define how much storage individual workloads may consume and reservations ensure critical functions always retain guaranteed capacity.

This allows storage to adapt as software evolves. Capacity that would otherwise remain stranded in one partition can be made available elsewhere, improving utilization without sacrificing isolation or predictability.

Rethinking OTA architectures

The data layer also creates opportunities to rethink how over-the-air updates are managed. Traditional A/B partitioning remains a robust and widely adopted approach because it provides a straightforward rollback mechanism if an update fails. However, maintaining duplicate software images permanently reserves a significant amount of flash capacity.

Snapshot-based approaches provide an alternative. Rather than storing two complete software images, the file system tracks changes at the block level so only modified data needs to be written during an update.

The pre-update snapshot provides a reliable rollback point while reducing storage overhead, download size, and update effort. As flash prices continue rising, more engineering teams are evaluating these techniques as another way to improve storage efficiency without compromising reliability.

Flexibility still requires discipline

Dynamic storage management doesn’t remove the engineering constraints embedded systems have always depended on. Deterministic behavior remains essential as critical applications still require guaranteed resources. Functional safety, reliability, and predictable recovery mechanisms continue driving architectural decisions.

The objective isn’t to make storage dynamic for its own sake but to recognize that software is no longer static in the way it was when many of today’s storage architectures were originally conceived. As systems continue to evolve throughout their operational lifetime, storage management must evolve with it.

A different role for the data layer

Storage has traditionally been viewed as supporting infrastructure. Once the partition layout was complete, attention naturally shifted to processors, applications, and communications.

Software-defined systems are changing that perspective. The data layer is becoming a more active part of system architecture because it influences how efficiently software can evolve throughout the life of a product. It affects update strategies, application growth, storage utilization, and long-term maintainability just as much as raw flash capacity.

Instead of asking whether today’s applications fit into today’s partition layout, engineers are beginning to ask whether the storage architecture itself is capable of supporting software that hasn’t yet been written. While the answer will differ from one platform to another, what seems increasingly clear is that storage can no longer be designed around the assumption that software remains static after deployment.

Embedded systems have entered an era of continuous software evolution, and the architectures beneath them need to evolve for the same reality.

Sami Kassimäki is product manager at Tuxera.

Related Content

• Embedded Basics
• 8 pillars of embedded software
• 7 tips for optimizing embedded software
• Embedded systems: The marketplace in 2028
• Can Agentic AI Solve the Embedded Software Problem?

The post Why software-defined systems require a dynamic data layer appeared first on EDN.

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company) says that the Italian Government has authorized the proposed acquisition by NUBURU Defense LLC of a 70% controlling interest in Tekne S.p.A. under Italy’s Golden Power framework...

Uviquity of Raleigh, NC, USA – a venture-backed start-up founded in 2022 that is pioneering integrated photonics, developing photonic integrated circuits (PICs) on a proprietary aluminium nitride (AlN) platform for quantum and ultraviolet applications – says that Dr Vincent D. (Chuck) Mattera Jr, founder & CEO of Avalanche Thinking Inc and former chair & CEO of Coherent Corp, has joined it as a strategic advisor as it scales its AlN photonics platform and accelerates commercialization...

PRAMA showcased innovative Defence Security Solutions at 15th Strategic Electronics Summit (SES), an exhibition and conference on Defence, Aerospace, Drones and Security, held from 23rd -24th July 2026. It was Organized by the Electronic Industries Association of India (ELCINA), the premier defense and aerospace event took place at the Bangalore International Exhibition Centre (BIEC) in Bengaluru. The event brought together innovators, manufacturers, system integrators and startups on the same platform.

PRAMA management representative said, “The Indian security market is growing to a mature level to address the key requirements of Defence and Aerospace sectors. We find SES-2026 event, a highly valuable exhibition platform to connect with the key stakeholders and ecosystem partners. We showcased the latest products and solutions in this expo. We appreciate ELCINA’s proactive role in organizing ‘SES-2026’ to spur innovation and engagement with key industry stakeholders.”

He further elaborated, “PRAMA, being India’s premier indigenous security brand holds, great significance. The spectacular growth that India security industry has achieved, PRAMA’s evolution as a leading security brand is the manifestation of Indian spirit and ingenuity. We are taking indigenous manufacturing to the next level. We are here to offer best-in-class products with cutting edge technologies that can deliver solutions as per the Defence requirements.”

The beautifully designed spacious PRAMA booth was center of attraction for the industry specific visitors. PRAMA booth showcased the latest products and defence sector’s solutions, including Ai based Perimeter Defence Solutions, Access control and attendance monitoring solutions, Advanced Driver Assistant System (ADAS) & Driver Behaviour Ananlysis (DBA) Solutions, Mobile Security System and many more.

PRAMA booth displayed the latest video security products, including Ai Solution. PRAMA’s AiSense technology, powered by advanced AI Algorithms, takes surveillance to the next level. This technology intelligently distinguishes people and vehicles from other moving objects, reducing false alarm caused by animals or environmental factors. With AiSense Technology one can focus on the real threats, optimize resources and build on an intelligent security system. The Strategic Electronics Summit (SES)-2026 is a unique event platform created by the ELCINA). The two-day event helped to create awareness about the latest IT and Security trends. The event was attended by the key defence and aerospace professionals, Government officials and key stakeholders from the electronics Industry.

 

 

The post PRAMA Showcases Innovative Defence Security Solutions at Strategic Electronics Summit (SES) appeared first on ELE Times.

As generative AI and high-performance computing (HPC) continue to drive the evolution of cloud infrastructure, data centers are rapidly adopting more efficient and scalable architectures. At OCP APAC Summit 2026, Nuvoton Technology will showcase its advanced silicon solutions for the next-generation cloud, featuring innovations in high-speed connectivity, system management, power management, and environmental monitoring.

Nuvoton’s comprehensive portfolio helps customers enhance system performance, reliability, and energy efficiency, accelerating the development of next-generation cloud and AI infrastructure within the OCP ecosystem.

Enabling the Next-Generation Cloud with Integrated and Secure Server Management

Nuvoton’s Arbel NPCM8mnx SiP integrates the BMC subsystem into a single package, reducing board space by up to 70% and simplifying and accelerating AI server system design and cloud platform deployment. With post-quantum cryptography (PQC) support and an open architecture, it delivers high performance, security, and scalability for the OCP ecosystem.

Advancing the OCP Ecosystem: Building a Secure and Efficient Management Architecture for Next-Generation Platforms

The NPCM5mnx Satellite Management Controller (SMC) is designed for AI servers, GPU accelerators, and Open Compute platforms. Featuring an ARM Cortex-M7 core, Caliptra 2.1 Root of Trust, and post-quantum cryptography (PQC), it supports multi-node servers and OCP Streaming Boot to enhance platform security, management efficiency, and scalability.

Enabling High-Voltage Battery Backup Units (BBUs) for Mission-Critical AI Servers

Designed for AI server BBUs and large-scale energy storage systems, Nuvoton’s battery monitoring ICs support daisy-chain communication with up to 55 devices, simplifying 400V/800V BBU designs. By reducing component count and minimizing board space, they enhance system efficiency and reliability in high-voltage environments. In addition, A dedicated transportation and storage mode with ultra-low shutdown current helps extend battery storage duration and reduce operational costs.

Strengthening Platform Trust with Device Authentication, Firmware Management, and Quantum-Ready Security

The NuMicro M2354 microcontroller integrates TrustZone, Secure Boot, and DICE architecture to establish a device-unique trusted identity. With SPDM responder, PLDM Firmware Device, and post-quantum cryptography (PQC) implementation, the M2354 helps enable trusted device verification, standardized firmware management, and long-term security resilience for next generation server and IoT platforms.

Intelligent System Management for Efficient and Reliable Cloud Infrastructure

Nuvoton’s system management portfolio combines ultra-low-power temperature sensing, smart fan control, and I²C connectivity management to optimize data center operations. These solutions improve system reliability, energy efficiency, and thermal management while simplifying platform design for next-generation cloud infrastructure.

The post Innovating the Next-Gen Cloud: Nuvoton’s Advanced Silicon for OCP Ecosystem appeared first on ELE Times.

Infineon Technologies is partnering with MediaTek to enable an advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1. This turns the Infineon device into an approved and easily adoptable memory option for automotive OEMs, Tier-1 suppliers, and design partners developing the next generation of smart cockpit systems.

“Automotive memory is a strategic enabler of innovation as software-defined vehicles depend on high-performance Systems on-Chip (SoCs), increasingly complex firmware, and large data stores,” said Rainer Hoehler, Senior Vice President Memory Solutions at Infineon Technologies. “Cutting-edge digital cockpits and over-the-air update capabilities are driving the demand for higher density NOR flash. With the qualification by MediaTek, customers can now easily integrate Infineon’s 512 Mb NOR Flash as a future‐ready memory solution for smart cockpits.”

“Infineon’s automotive-grade NOR Flash delivers the performance, reliability, and functional safety features required for our premium and high-end Dimensity Auto Cockpit platform C-X1,” said Mike Chang, MediaTek Vice President and Auto Business General Manager. “Its high-density design enables the advanced AI and user-experience capabilities that will be essential in next-generation software-defined vehicles. Building on our long-standing collaboration, we leverage Infineon’s industry leadership to deliver a reliable backbone for the evolving software-defined ecosystem.”

Infineon’s 512 Mb QSPI NOR Flash memory stores the firmware and boot code required to facilitate AI-driven features at the SoC level, such as voice assistants, driver monitoring, travel vlog generation, environmental perception, and personalized audio-visual recommendations. By supporting Safe and Secure Boot, it also provides critical redundancy for enhanced safety. Built on Infineon’s MirrorBit technology, it offers a robust interface, broad compatibility with leading Automotive SoCs, AEC Q100 qualification, and operating temperature support up to +125 °C.

 

 

The post Infineon Collaborates with MediaTek to Enable Future Automotive Smart Cockpit Solutions appeared first on ELE Times.

Bridge Data Centres (BDC), a Singapore-headquartered hyperscale data centre provider, and Morong Electric, an electrical manufacturing specialist, have launched PowerCore 5.0, the world’s first fully prefabricated power module designed for high density AI data centres.

Built for high-density AI workloads on accelerated deployment timelines, the module complies with the technical standards of BDC’s proprietary i-Power Cube, its power system designed for high-performance computing. It integrates seamlessly with the Bridge Omni Platform, BDC’s modular intelligent infrastructure platform for the AI era. PowerCore 5.0 combines BDC’s global hyperscale delivery experience with Morong Electric’s end-to-end electrical manufacturing expertise.

Rapid AI advancement has driven rack power densities from 10kW to more than 100kW, placing stringent new demands on mission-critical power infrastructure. Traditional delivery models, which rely on fragmented procurement and on-site system integration, struggle to cater to the rigorous requirements of AI-optimised data centres. Drawing on BDC’s global campus delivery footprint and Morong Electric’s electrical engineering expertise, PowerCore 5.0 addresses these challenges through four core design attributes: factory pre-integration, standardised global transport, parallel construction and maintenance without downtime.

Factory pre-integration

Each unit integrates transformers, power distribution, uninterruptible power supply (UPS), cooling, fire suppression and monitoring systems into a single module, fully assembled and tested off-site. Site teams need only complete the final cable connections on delivery, removing the quality inconsistencies that accompany conventional field construction.

Standardised global transport

Built on a standard 40ft ISO container frame, the module integrates seamlessly with global shipping networks, eliminating oversized freight premiums, dedicated transport and protracted customs delays that hinder cross-border deployments. Purpose-engineered for BDC’s core markets, it complies with local climatic benchmarks and industrial standards to enable dependable global rollout.

Shortened delivery timelines by more than 50%

On-site civil works and factory prefabrication proceed simultaneously, shortening total delivery timelines by more than 50% compared with conventional build methods. Large campuses can deploy units on a bi-weekly cadence, matching the rapid scaling and flexible capacity expansion that AI demands.

Maintenance without downtime

In an industry first, core components including UPS units, transformers and precision cooling are mounted on slide-out rails. Technicians can withdraw and service individual units without interrupting power to the data centre, keeping high-density compute clusters running around the clock.

Mr Zhang Binghua, Chief Technology Officer of BDC, said, “The AI infrastructure sector is scaling at an unprecedented rate, and operators now require higher power density, faster hardware refreshes and maximum uptime. This shift requires us to rethink how power systems are designed and deployed. PowerCore 5.0 raises the bar on system integration, cross-climate operation, delivery speed and intelligent operations and maintenance. It will enable standardised, low-carbon compute deployments across the globe and provide the stable power foundation to support the continued growth of the global AI ecosystem.”

Mr Zhang Kai, Chairman of Morong Electric, said, “AI hardware now evolves on a monthly cycle, and traditional on-site system integration can no longer keep pace with the operational needs of modern AI data centres. Prefabricated power modules clear the delivery bottlenecks holding back compute infrastructure expansion. This launch marks a critical milestone in our strategic partnership, and we will continue to co-develop high-performance, integrated power solutions that meet global market standards and regional compliance requirements.”

BDC and Morong Electric will continue to develop prefabricated power modules engineered for ultra-high-density compute and cross-border regulatory alignment. Both companies aim to advance industry-wide technical standardisation and the collaborative development of compute infrastructure. Their low-carbon, modular power solutions will support the sustainable and scalable growth of AI operations across international markets.

The post Bridge Data Centres and Morong Electric Jointly Launch the World’s First Fully Prefabricated Power Module for AI Data Centres appeared first on ELE Times.

The shelf is a 24 V tunable white strip driven by an off the shelf controller. At full brightness it made a high pitched wine. Dimmed to a usable level, it got even worse! Scoping the original controller’s output showed it drives the LEDs with a 2 kHz H-bridge waveform, and dimming inserts 0 V dwell that pumps energy into the harmonics right where your ear is most sensitive. A mic 5 cm away confirmed it, a harmonic comb spaced at 1999 Hz, with the 4 kHz member 16 dB louder when dimmed. The replacement is an STM32 driving a three level H-bridge at 25 kHz through a proper gate driver, BLE control, on a 4 layer board sized to drop into the original enclosure. Every harmonic now lands above the audible band. Current draw came out the same as the original, so the silence was basically free. It also remembers brightness and colour through power cuts, the F303 has no EEPROM so state gets debounced into a flash page. Full writeup with the scope captures, audio FFTs and design files: https://github.com/AShadyPCB/led-shelf-controller submitted by /u/ek_spoon [link] [comments]