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Microsoft’s yearly Build developer conference took place last Tuesday-Thursday, March 21-23 (as I write these words on Memorial Day), and was rife with AI-themed announcements spanning mobile-to-enterprise software and services.

Curiously, however, many of these announcements were derived from, and in general the most notable news (IMHO) came from, a media-only event held one day earlier, on Monday, March 20. There, Microsoft and its longstanding Arm-based silicon partner Qualcomm co-announced the long-telegraphed Snapdragon X Elite and Plus SoCs along with Surface Laptop and Pro systems based on them. Notably, too, Microsoft-branded computers weren’t the only ones on the stage this time; Acer, Asus, Dell, HP, Lenovo and Samsung unveiled ‘em, too.

To assess the importance of last week’s news, let’s begin with a few history lessons. First off, a personal one: as longtime readers may recall, I’ve long covered and owned Windows-on-Arm operating systems and computers, beginning with my NVIDIA Tegra 3 SoC-based Surface with Windows RT more than a decade back:

Three years ago, I acquired (and still regularly use, including upgrading it to Windows 11 Pro) a Surface Pro X powered by the Snapdragon 8cx SC8180X-based, Microsoft-branded SQ1 SoC:

More recently, I bought off eBay a gently used, modestly discounted “Project Volterra” system (officially: Windows Dev Kit 2023) running a Qualcomm Snapdragon 8cx Gen 3 (SQ3) SoC:

And even more recently, as you can read about in more detail from my just-published coverage, I generationally backstepped, snagging off Woot! (at substantial discount) a used example of Microsoft and Qualcomm’s first developer-tailored stab at Windows-on-Arm, the ECS LIVA Mini Box QC710 Desktop, based on a prior-generation Snapdragon 7c SC7180 SoC:

So, you could say that I’ve got no shortage of experience with Windows-on-Arm, complete with no shortage of scars, most caused by software shortcomings. Windows RT, for example, relied exclusively on Arm-compiled applications (further complicated by an exclusive Microsoft Store online distribution scheme); unsurprisingly, the available software suite garnered little adoption beyond Microsoft’s own titles.

With Windows 10 for Arm, as I complained about in detail at the time, while an emulation layer for x86-compiled content did exist, both its performance and inherent breadth and depth of functionality were subpar…so much so that Microsoft ended up pulling the plug on Windows 10 and focusing ongoing development on the Windows 11 for Arm successor, which has proven far more robust.

Here’s another personal narrative related to this post’s primary topic coverage: last fall, I mentioned that I’d acquired two generations’ successors to my long-used Surface Pro 5 hybrid:

A primary-plus-spare Surface Pro 7+:

 notably for backwards-compatibility with my Kensington docking station:

and the long-term transition destination, a pair of Surface Pro 8s:

What I didn’t buy instead, although it was already available at the time, was the Surface Pro 9. That’s because I wanted my successor systems to be cellular data-capable, and the only Surface 9 variants that supported this particular feature (albeit at a 5G cellular capability uptick compared to the LTE support in what I ended up getting instead) were Arm-based, with what I felt was insufficient upgrade differentiation from my existing Surface Pro X.

Flash forward to a bit more than two months ago, and Microsoft introduced the Surface Pro 10, along with the Surface Laptop 6. They’re both based on Intel Meteor Lake CPUs with integrated NPU (neural processing) cores, reflected in the dedicated Copilot key on each model’s keyboard. Copilot (introduced at last year’s Build), for those of you who don’t already know, is the OpenAi GPT-derived chatbot successor to Microsoft’s now-shuttered Cortana. But here’s an interesting thing, at least to me: the Surface Pro 10 and Surface Laptop 6 are both explicitly positioned as “For Business” devices, therefore sold exclusively to businesses and commercial customers, not available to consumers (at least through normal direct retail channels…note that I got my prior-generation SP7+ and SP8 “For Business” units via eBay resellers).

What about next-generation consumer models? The answer to that question chronologically catches us up to last week’s news. Microsoft’s new Surface Pro 11 (complete with a redesigned keyboard that can be used standalone and an optional OLED screen) and Surface Laptop 7, along with the newly unveiled systems from other Microsoft-partner OEMs, are exclusively Qualcomm Snapdragon X-based, which I suspect you’ll agree represents quite a sizeable bet (and gamble). They’re also labeled as being Copilot+ systems (an upgrade to the earlier Copilot nomenclature), reflective of the fact that Snapdragon X SoCs’ NPUs tout 40 TOPS (trillions of, or “tera”, operations per second) performance. Intel’s Meteor Lake SoC, unveiled last September, is “only” capable of 10 TOPs, for example…which may explain why, last Monday, the very same day, Intel “coincidentally” released a sneak peek of its next-generation Lunar Lake architecture, also claimed Copilot+ NPU performance-capable and coming later this year.

Accompanying the new systems’ latest-generation Arm-based silicon foundations is a further evolution of their x86 code-on-Arm virtualization subsystem, which Microsoft has now branded Prism and is analogous to Apple’s Rosetta technology (the latter first used to run PowerPC binaries on Intel microprocessors, now for x86 binaries on Apple Silicon SoCs), along with other Arm-friendly Windows 11 replumbing. Stating the likely already obvious, Microsoft’s ramped-up Windows-on-Arm push is a seeming reaction to Apple’s systems’ notably improved power consumption/performance/form factor/etc. results subsequent to that company’s own earlier Arm-based embrace. To wit, Microsoft did an interesting half-step a bit more than a year ago when it officially sanctioned running Windows-for-Arm virtualized on Apple Silicon Macs.

Speaking of virtualization, I have no doubt, based both on track record and personal experience, that Prism is capable technology that will continue to improve going forward, since Microsoft has lengthy experience with numerous emulation and virtualization schemes such as:

• Virtual PC, which enabled running x86-based Windows on PowerPC Macs, and
• Windows Virtual PC (aka Windows XP Mode), for running Windows XP as a virtualized guest on a Windows 7 Host
• The more recent, conceptually similar Windows Subsystem for Linux
• And several generations’ worth of virtualization for prior-generation Xbox titles on newer-generation Xbox consoles, both based on instruction set-compatible and -incompatible CPUs.

To wit, I wonder how Prism is going to play out. Clearly, no matter how robust the emulation and virtualization support, its implementation will be inefficient in comparison to “native” applications. So, I’m assuming that Microsoft will encourage its developers to in-parallel code for both the x86 and Arm versions of Windows, perhaps via an Apple-reminiscent dual-mode “Universal” scheme (in combination with “destination-tailored” downloads from online stores). But, supplier embarrassment and sensationalist press hypothesizing aside, I seriously doubt that Microsoft intends to turn its back on x86 in any big (or even little) way any time soon (in contrast to Apple’s abrupt change in course, in no small part thereby explaining its success in motivating its developer community to rapidly embrace Apple Silicon). Developing for multiple CPU architectures and O/S version foundations requires incremental time, effort, and expense; if you’re an x86 Windows coder and Prism works passably, why expend the extra “lift”?

Further evidence of Apple being in Microsoft’s gunsights comes from the direct call-outs that company officials made last week , particularly against Apple’s MacBook Air. Such comparative assessments are a bit dubious, for at least a couple of reasons. First off, Microsoft neglected to openly reveal that both its and OEM partners’ systems contained fans, whereas the MacBook Air is fan-less; a comparison to the fan-inclusive and otherwise more thermally robust MacBook Pro would be more fair. Plus, although initial comparative benchmarks are seemingly impressive, even against the latest-generation Apple M4 SoC, there’s also anecdotal evidence that Snapdragon X system firmware may sense that a benchmark is being run and allow the CPU to briefly exceed normal thermal spec limits. Any reality behind the comparative hype, both in an absolute and relative sense, will come out once systems are in users’ hands, of course.

So why is Microsoft requiring a standalone NPU core, and specifically such a robust one, in processors that it allows to be branded as Copilot+? While CPUs and GPUs already in systems are alternatively capable of handling various deep learning inference operations, they’re less efficient in doing so in comparison to a focused-function NPU alternative, translating to both lower effective performance and higher energy consumption. Plus, running inference on a CPU or GPU steals away cycles from other applications and operations that could alternatively use them, particularly those for which a NPU isn’t a relevant alternative. One visibly touted example is “Recall”, a newly added Windows 11 feature which, quoting from Microsoft’s website:

…uses Copilot+ PC advanced processing capabilities to take images of your active screen every few seconds. The snapshots are encrypted and saved on your PC’s hard drive. You can use Recall to locate the content you have viewed on your PC using search or on a timeline bar that allows you to scroll through your snapshots. Once you find the snapshot that you were looking for in Recall, it will be analyzed and offer you options to interact with the content.

Recall will also enable you to open the snapshot in the original application in which it was created, and, as Recall is refined over time, it will open the actual source document, website, or email in a screenshot. This functionality will be improved during Recall’s preview phase.

Copilot+ PC storage size determines the number of snapshots that Recall can take and store. The minimum hard drive space needed to run Recall is 256 GB, and 50 GB of space must be available. The default allocation for Recall on a device with 256 GB will be 25 GB, which can store approximately 3 months of snapshots. You can increase the storage allocation for Recall in your PC Settings. Old snapshots will be deleted once you use your allocated storage, allowing new ones to be stored.

Creepy? Seemingly, yes. But at least it runs completely (according to Microsoft, at least) on the edge computing device, with no “cloud” storage or other involvement, thus addressing privacy.

Here’s another example, admittedly a bit more “niche” but more compelling (IMHO) in exemplifying my earlier conceptual explanation. As I most recently discussed in my CES 2024 coverage, upscaling can decrease the “horsepower” of a system’s GPU required in order to render a given-resolution scene to the screen. Such an approach only works credibly, however, only if it comes with no frame rate reduction, image artifacts, or other quality degradations. AI-based upscalers are particularly robust in this regard. And, as discussed and demonstrated at Build, Microsoft’s Automatic Super Resolution (ASR) algorithm runs on the Snapdragon X Elite NPU, leaving the (integrated!) GPU free to focus on its primary polygon and pixel rendering tasks.

That all said, at least one looming storm cloud threatens to rain on this Windows-on-Arm parade. A quick history lesson: NUVIA was a small startup founded in 2019 by ex-Apple and Google employees, in the former case coming from the team that developed the A-series SoCs used in Apple’s smartphones and other devices (and with a direct lineage to the M-series SoCs subsequently included in Apple Silicon-based Macs). Apple predictably sued NUVIA that same year for breach of contract and claimed poaching of employees, only to withdraw the lawsuit in early 2023…but that’s an aside, and anyway, I’m getting chronologically ahead of myself.

NUVIA used part of its investment funding to acquire an architecture license from Arm. A quote from a decade-plus-back writeup at SemiAccurate (along with additional reporting from AnandTech), that as far as I can tell remains accurate, explains (with fixed typos by yours truly):

On top of the pyramid is both the highest cost and lowest licensee count option…This one is called an architectural license, and you don’t actually get a core; instead, you get a set of specs for a core and a compatibility test suite. With all of the license tiers below it, you get you a complete core or other product that you can plug-in to your design with varying degrees of effort, but you cannot change the design itself. If you license a Cortex-A15 you get exactly the same Cortex-A15 that the other licensees get. It may be built with very different surroundings and built on a different process, but the logic is the same. Architectural licensees conversely receive a set of specs and a testing suite that they have to pass; the rest is up to them. If they want to make a processor that is faster, slower, more efficient, smaller, or anything else than the one Arm supplies, this is the license they need to get.

Said more concisely, architecture licensed cores need to fully support a given Arm instruction set generation, but how they implement that instruction set support is completely up to the developer. Cores like those now found in Snapdragon X were already under development under NUVIA’s architecture license when Qualcomm acquired the company for $1.4B in early 2021. And ironically, at the time of the NUVIA acquisition, Qualcomm already had its own Arm architecture license, which it was using to develop its own Kryo-branded cores.

Nevertheless, Arm filed a lawsuit against Qualcomm in late summer 2022. Per coverage at the time from The Register (here’s a more recent follow-up writeup from the same source):

Arm has accused Qualcomm of being in breach of its licenses, and wants the American giant to fulfill its obligations under those agreements, such as destroying its Nuvia CPU designs, plus cough up compensation…

According to Arm…the licenses it granted Nuvia could not be transferred to and used by its new parent Qualcomm without Arm’s permission. Arm says Qualcomm did not, even after months of negotiations, obtain this consent, and that Qualcomm appeared to be focused on putting Nuvia’s custom CPU designs into its own line of chips without permission.

That led to Arm terminating its licenses with Nuvia in early 2022, requiring Qualcomm to destroy and stop using Nuvia’s designs derived from those agreements. It’s claimed that Qualcomm’s top lawyer wrote to Arm confirming it would abide by the termination.

However, says Arm, it appeared from subsequent press reports that Qualcomm may not have destroyed the core designs and still intended to use the blueprints and technology it acquired with Nuvia for its personal device and server chips, allegedly in a breach of contract with Arm…

Arm says individual licenses are specific to individual licensees and their use cases and situations, and can’t be automatically transferred without Arm’s consent.

According to people familiar with the matter, Nuvia was on a higher royalty rate to Arm than Qualcomm, and that Qualcomm hoped to use Nuvia’s technology on its lower rate rather than pay the higher rate. It’s said that Arm wasn’t happy about that, and wanted Qualcomm to pay more to use those blueprints it helped Nuvia develop.

Qualcomm should have negotiated a royalty rate with Arm for the Nuvia tech, and obtained permission to use Nuvia’s CPU core designs in its range of chips, and failed to do so, it is alleged, and is now being sued.

As I write these words, the lawsuit is still active. When will it be resolved, and how? Who knows? All I can say with some degree of certainty, likely stating the obvious in the process, is:

• Qualcomm is highly motivated for Snapdragon X to succeed, for a variety of reasons
• Arm is equally motivated for not only Snapdragon X but also other rumored under-development Windows-on-Arm SoCs to succeed (NVIDIA, for example, is one obvious rumored candidate, given both its past history in this particular space and its existing Arm-based SoCs for servers, as is its public partner MediaTek)
• And their common partner Microsoft is also equally motivated for Arm-based Copilot+ systems (with Qualcomm the lead example) to succeed.

In closing, a couple of other silicon-related comments:

• Qualcomm has also announced a Project Volterra-successor developer kit based on Snapdragon X Elite (which, yes, is already on my Christmas present wish list) and has added Snapdragon X support to its AI Hub for developers.
• Microsoft released new Arm-based chips (named Cobalt 100) of its own, specifically expanded public access to them, and for “cloud” implementations.

And with that, and closing in on 3,000 words, I’m going to wrap up for today. Let me know your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Windows on Arm: All of Apple’s challenges with none of its charm
• Intel’s next-generation CPUs hide chiplets inside*
• Power vs energy: SSD and HDD case studies
• The 2024 CES: It’s “AI everywhere”, if you hadn’t already guessed
• Resurrecting a diminutive, elementary Arm-based PC

The post Microsoft’s Build 2024: Silicon and associated systems come to the fore appeared first on EDN.

Infineon Technologies AG today announces two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalization and decarbonization. These two product families are manufactured on high performance 8-inch in-house foundry processes in Kulim (Malaysia) and Villach (Austria). With this, Infineon expands its CoolGaN advantages and capacity to ensure a robust supply chain in the GaN devices market, which is estimated to grow with an average annual growth rate (CAGR) of 46 percent over the next five years according to Yole Group.

“Today’s announcement builds nicely on our acquisition of GaN Systems last year and brings to market a whole new level of efficiency and performance for our customers,” said Adam White, Division President of Power & Sensor Systems at Infineon. “The new generations of our Infineon CoolGaN family in high and medium voltage demonstrate our product advantages and are manufactured entirely on 8 inch, demonstrating the fast scalability of GaN to larger wafer diameters. I am excited to see all of the disruptive applications our customers unleash with these new generations of GaN.”

The new 650 V G5 family addresses applications in consumer, data center, industrial and solar. These products are the next generation of GIT-based high voltage products from Infineon. The second new family manufactured on the 8-inch process is the medium voltage G3 devices which include CoolGaN Transistor voltage classes 60 V, 80 V, 100 V and 120 V; and 40 V bidirectional switch (BDS) devices. The medium voltage G3 products are targeted at motor drive, telecom, data center, solar and consumer applications.

Availability

The CoolGaN 650 V G5 will be available in Q4 2024 and the medium voltage CoolGaN G3 will be available in Q3 2024. Samples are available now. More information is available here.

Infineon at the PCIM Europe 2024

PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2024 show highlights is available at www.infineon.com/pcim.

The post Infineon announces next generation CoolGaN Transistor families built on 8-inch foundry processes appeared first on ELE Times.

Recyclekaro, a leading e-waste and lithium-ion battery recycling company, is proud to announce its registration on the government’s Extended Producer Responsibility (EPR) portal for e-waste recycling. As a lithium-ion battery recycling industry leader, Recyclekaro joins Lohum Cleantech, Attero, and LICO Materials as one of the four registered lithium-ion battery recyclers, reinforcing its commitment to sustainable e-waste management. Based on its existing recycling capacity, Recyclekaro will help lithium-ion battery and electronics product manufacturers, producers, and importers in India meet their EPR targets. These targets include 4,200 MT for lithium-ion battery recycling and 15,000 MT for e-waste recycling, ensuring comprehensive support for sustainability goals.

India is the third-largest e-waste producer globally, generating 1.71 million metric tons annually, with only approximately 40% of e-waste recycled in the last financial year. To address this challenge, the EPR portal, an initiative by the Central Pollution Control Board (CPCB), provides a transparent and accountable framework for electronic waste management in India. It centralizes the tracking of e-waste from production to disposal, connecting manufacturers with registered recyclers like Recyclekaro and streamlining collection and recycling processes. The system offers financial incentives through EPR credits, making recycling economically viable and supporting companies in meeting sustainability targets. Additionally, the platform ensures regulatory compliance, improves data collection and reporting, and encourages innovation in recycling technologies, fostering a more sustainable approach to e-waste management in India.

The Battery Waste Management (BWM) Rules, 2022, notified by the Ministry of Environment, Forest and Climate Change, apply to all types of batteries. These rules mandate that producers (manufacturers, importers) meet collection and recycling targets to fulfil Extended Producer Responsibility (EPR) obligations. Producers, recyclers, and refurbishers must register through the online portal developed by the CPCB, which enhances accountability, traceability, and transparency in meeting EPR obligations.

Rajesh Gupta, Founder & Director of Recyclekaro, commented, “Registering on the government’s EPR portal not only allows us to connect directly with manufacturers, fulfilling their waste management responsibilities, but also significantly enhances our business opportunities. Being among the four registered recyclers for lithium-ion battery end to end recycling is a major milestone and a recognition that showcases our credibility. This registration strengthens our position in the industry and supports our mission to promote sustainable and responsible recycling practices.”

Recyclekaro has established a strong presence in the Indian recycling industry, achieving 90% metal extraction efficiency with purity levels exceeding 99% from scrap batteries. The company plans to double its recycling capacity by the second quarter of FY 2024-25.

Rajesh Gupta_Founder & Director_Recyclekaro_

The post Recyclekaro becomes one of the 4 Lithium-ion Battery Recyclers Registered on India’s EPR Portal appeared first on ELE Times.

Development board combination with 50W transmitter and receiver simplifies fast charging utilizing ST Super Charge protocol

STMicroelectronics has introduced a 50W, Qi-compatible transmitter and receiver combination to accelerate the development of wireless charging for high-power applications such as medical and industrial equipment, home appliances, and computer peripherals.

Using ST’s new wireless charging solution, innovators can leverage the convenience and speed of wireless charging in applications that demand a higher power and shorter charging interval. These applications include vacuum cleaners, cordless power tools, drones and other mobile robots, medical drug delivery devices, portable ultrasound systems, stage lighting and mobile lighting, printers, and scanners. Free from cables, connectors, and complex docking arrangements, these products can become simpler, more affordable, and more robust.

The STEVAL-WBC2TX50 transmitter board is capable of delivering up to 50W of output power using the ST Super Charge (STSC) protocol. STSC is ST’s proprietary protocol for wireless charging at a faster rate than the standard protocols used with smartphones and similar devices, allowing quicker recharging of larger batteries. The board also supports the Qi 1.3 5W Baseline Power Profile (BPP) and 15W Extended Power Profile (EPP). The main component on board is ST’s STWBC2-HP transmitter system-in-package, which combines an STM32G071 Arm Cortex-M0 microcontroller and an application-specific front end. The front end provides signal conditioning and frequency control, a high-resolution PWM generator to drive the transmitter, and operates with any DC voltage from 4.1V to 24V. It also contains MOSFET gate drivers and a D+/D- interface for USB Power Delivery. In addition, the STWBC2-HP SiP can work with ST’s STSAFE-A110 secure element to provide Qi authentication.

The STEVAL-WLC98RX receiver board is built to handle up to 50W charging power, to safely accommodate the full STSC capability as well as BPP and EPP charging. Features include support for Adaptive Rectifier Configuration (ARC), which extends charging distance by up to 50% to allow lower-cost coils and more flexible configurations. Accurate voltage and current measurements for Foreign Object Detection (FOD), thermal management, and system protection are also provided. This board uses ST’s STWLC98 wireless power receiver IC, which contains a Cortex-M3 core and an integrated high-efficiency synchronous-rectifier power stage with programmable output voltage of up to 20V.

Dedicated software tools, ST’s STSW-WPSTUDIO for the STEVAL-WLC98RX and STSW-WBC2STUDIO for the STEVAL-WBC2TX50 are available to modify the configuration parameters, tailoring the operation of the device to the needs of customized applications. A comprehensive set of design documents is also available to assist development.

The boards come with a Declaration of Conformity to the EU Radio Equipment Directive (RED) and are available from the ST eStore and from distributors. Pricing starts at $113.93 for the STEVAL-WLC98RX receiver and $109.03 for the STEVAL-WBC2TX50 transmitter.

For further information please visit www.st.com/wirelesspower.

The post New wireless-charging boards from STMicroelectronics for industrial, medical, and smart-home applications appeared first on ELE Times.

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Україномовні видання 1920–30-х рр. у фондах НТБ Інформація КП вт, 05/28/2024 - 23:24

It can be more desirable to buy a second-hand PS4 for many players, and for good reasons, it appears. Evidently, one advantage is that you can play more using the pre-owned Console since these consoles are cheaper than new ones in the market. Also, a used PS4 set likely comes with other accessories or games, sometimes in a bundle, or may contain an extra controller, all of which add to the increase in worth. It has been suggested that you consider using Gadgetpickup since they offer well-documented, well-used, second-hand products. If you are looking for a particular model, there would be no confusion about what you are actually getting. It may be entertaining to purchase the first online released PS4 models, the discontinued models, or today’s new PS4 Pro model as they might be endowed with certain unique features or looks.

Assessing the Condition of a Used PS4

That being said, here are some ways or places that you may consider going to find a good deal and buy a used PS4. Online retail companies such as eBay and Amazon exist, offering various services from different merchants. Most of these platforms admit buyer protection measures, meaning that you are shielded when making a purchase. The gaming stores in local markets are also ideal, with common features of the factor being that they resell pre-owned consoles that they evaluate and restore. Other sources that can be of use are open online communities such as special boards on forums and social networks where people who, for example, want to buy or sell my PS4 console can be found.

Understanding Pricing

When buying a second-hand PS4, it is recommended to pay attention to a few critical characteristics to get the most out of the purchasing decision:

• Consider the exterior of the Console to check for scratches and other signs of imperfections, such as dents or pressing. Examining each of the ports and connectors to ensure that they are fully connected and functional can easily prevent some common threats.
• The overall performance can be checked by powering up the PS4 to check how different sections work without lag or hitch. Be alert to any squeaking or squealing sounds, engine heat, or blower motor.
• Check on the controllers and other accessories and determine if they have any signs of wear or damage.

By doing this, you are likely in a better position to make a better decision and minimize the possibility of having to deal with some negatives later on.

Ensuring a Safe Purchase

When ensuring a safe purchase of a used PlayStation 4, taking several steps to protect yourself is crucial. Here’s how you can make your buying experience secure:

• Use Reputable Platforms: Always prioritize safety by choosing well-known online platforms that offer buyer protection policies. This reduces the risk of fraud and provides a safer transaction environment.
• Meet in Public Places: When meeting a seller in person, choose a public place such as a café or shopping mall. If possible, bring a friend along to further secure the transaction.
• Inspect and Test the Console: Before finalizing the purchase, thoroughly inspect and test the Console on-site. Check for any signs of wear and tear and ensure that all functions are working properly.
• Keep Records of Communications and Transactions: Maintain documentation of all interactions, from messages and emails to receipts and any agreements made with the seller. These records can prove invaluable if any issues arise later.

Checking for Game Compatibility and Accessory Inclusions

One must confirm that the second-hand PS4 has all the proper add-ons to avoid any issues later. This may include at least a single controller, tremendous copper cables, and high-definition multimedia interface (HDMI) cables. To simplify this process, consider using Gadgetpickup, which can streamline your purchase and ensure all necessary components are included.

Also, look for any extra buttons the seller might throw in, like more controllers, games, or docking stations, which are good to be part of a package deal. It will help you avoid spending extra money, which is needlessly spent when parts of the package are missing, and also give a better gaming experience from the get-go.

Setting Up Your Purchased PS4

Once you get your hands on a fairly good deal with a used PS4 console, the next thing you will be looking for is how to start using it. The first step will entail you to connect the Console to a relevant television using relevant cables. Sex: sudo power on the Console and read the instructions on the displayed screen to set up the user account. Computers tend to retain data from the previous owner; if the Console is tainted in the same manner, then a wipe should be performed to clear the entire item, which reconditions the device to its manufacturing state.

Connecting to the Internet and PlayStation Network

Continue to step four on how to connect PS4 to the internet by using Wi-Fi or an Ethernet cable connection. This connection is required to connect the system to the latest version to improve features such as memory use, control, access, and security.

After that, download any needed updates, follow them, and connect to the PlayStation Network or PSN. If you are already registered, you may proceed to login; if not, you may register for a membership. Membership is used to play games in multiplayer mode, purchase and download various items from the PlayStation store, and for other purposes available using the PSN service.

Last but not the least, it is always better to set up the Console in a way that the gamer finds convenient. This ranges from how to install the parental controls, change resolution display settings and other features that could be customized to serve the purpose of effectively playing the games.

Final Thoughts on Securing a Used PS4

To secure the best deal on a used PS4, consider the following tips: used consoles can be much cheaper and come with extra bonuses. Another way to get your Console is to purchase it from eBay, Amazon, local game stores, or through classifieds like craigslist, but you should be careful. However, the physical state of the Console, the functionalities involved, and the availability of necessary accessories should be critically assessed.

It is always advisable to perform any transaction in areas that are not secluded and ensure you use safe means of paying to avoid being con and protect your details. While shopping online, note the legalities involved, ensure the owner before buying goods and note that returns policies may differ from those of the physical stores.

The buying experience can be improved by configuring the following account settings, updating the Console, and tweaking different options. Another factor that can be considered is using convenient and secure services such as Gadgetpickup. Adhering to these guidelines will not only assist in making the right purchase but also help in maximizing the usability of your PS4.

The post Buyer’s Advantage: How to Scoring a Great Deal on a Used PS4 appeared first on Electronics Lovers ~ Technology We Love.

Протокол засідання ректорату від 27 травня 2024 року kpi вт, 05/28/2024 - 22:00

Як навчитись управляти капіталом? Інформація КП вт, 05/28/2024 - 21:32

Оксана Вовк: гуманітарне розмінування України, куполи для захисту критичної інфраструктури, безпека підземних обʼєктів medialab вт, 05/28/2024 - 20:59

I’ve always been interested in simple-looking components which solve well-defined, clear, bounded problems. One carpentry example I encountered and used many years ago is formally known as a hanger bolt, Figure 1.

Figure 1 (left) The schematic of the hanger bolt shows it interfaces a wood-screw thread with a machine-screw thread; (right) the hanger bolt allows a wooden furniture element to be connected to a metal fitting. Source: Plaster and Disaster

One end has a wood-screw thread and other has a machine screw for a nut or threaded fitting. It’s the mechanical “interface” between a wooden element such as a table leg and a metal mounting bracket.

There’s even a specialized version that features a reversed (left-hand) thread on the machine-screw side, used for suspending construction wiring or metal assemblies from wood. These reverse-thread hanger bolts solve a subtle problem, where the continuous rotation of an assembly would cause a standard right-hand threaded fastener to unscrew, while a left-hand fastener would remain securely in place.

There are also clever electrical components, of course. Given the number of years I’ve been “hanging around” electronic comments, circuits, and systems, I thought I was somewhat familiar with, or at least aware of, just about all of these, especially those related to management and removal of heat. I’ve had a long affinity for heat sinks, Figure 2, as well as heat pipes (yes, I know that sounds weird). They do one thing, they do it well, they’re reliable, they don’t push back, and they don’t need software, initialization, attention, or periodic upgrades.

Figure 2 Three of the heat sinks I have collected over the years: (left) slip-on “wings” for a TO-5 can transistor; (middle) heat sink designed for the Intel Pentium II from the late 1990s; (right) a large heat sink for a power-converter module. Source: Bill Schweber

Imagine my surprise when I saw a press release (“TMJ Thermal Jumpers Help Lower Temperatures for High Power Supplies”) from Stackpole Electronics, Inc. (SEI) for a component whose name and function were new to me: the “surface-mount thermal jumper resistor”, or simply “thermal jumper”, Figure 3. The word “resistor” definitely had me confused there, so I clicked over to the data sheet (“TMJ Series Surface Mount Thermal Jumper Chip Resistor”) but found that it had all the facts related to ratings, size, and so on, but did not have the “story” on applications.

Figure 3 The thermal jumper is very plain and gives no hint as to its function. Source: Stackpole Electronics, Inc.

Next step was a quick Google search and, not surprisingly, saw several pages of links to clothing outerwear thermal jumpers designed to keep you warm in cool but not cold weather. Eventually, I reached a page of technical links when I saw this entry from another component vendor (Vishay), which stated it clearly: “a thermal jumper allows the connecting of high-power devices to heat sinks without grounding or otherwise electrically connecting the devices.”

OK, now it made sense, or at least started to do so.

The thermal jumper uses an aluminum-nitride (AIN) substrate with high thermal conductivity to provide a low (not zero) path for thermal energy (heat) to get away from its source to a nearby heat sink of some type. At the same time, it offers a high insulation resistance between its electrical terminals.

This jumper is the thermal analog to a zero-ohm resistor. As that name indicates, the zero-ohm device looks like a conventional resistor but is actually a short circuit. It’s used as a machine-insertable jumper to work around PC board-layout challenges (especially on single-sided boards), as a placeholder when a board has multiple configurations, or to obscure circuit specifics by camouflaging some details.

I still wasn’t sure about how to actually use this component, but an application video (“ThermaWick® Thermal Jumper Demo”) from Vishay showed how it functions as a tiny bridge from a resistor as heat source to a nearby PCB copper area functioning as a heat sink, Figure 4.

Figure 4 The test arrangement has a one-watt resistor without heat sinking on the left side, and an identical resistor but with thermal jumper and PC-board copper as heat sink on the right side. Source: Vishay Intertechnology

Using a Fluke thermal imager, the video showed the resistor without thermal jumper was at about 140°C while the one with the jumper and the modest heat-sink area was at 100°C, a significant 40°C difference (of course, the difference is also a function of the size the associated PCB copper acting as a heat sink).

Figure 5 The left-right temperature differential between resistor was about 40°C. Source: Vishay Intertechnology

This thermal jumper is an effective way to solve a specific class of problems). Of course, although it is simple in appearance and function, it is not. It takes engineers, production specialists, material experts, and people skilled in many other disciplines to make it happen and do so in volume production.

Have you even found a small, unassuming passive or active electrical or mechanical component that is simple and clever, and at same time solves a pesky problem? Did it “save the day” and resolve a problem that was causing you to lose sleep, to use a cliché?

Bill Schweber is an EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features.

 Related Content

• My long-running affection for heat sinks
• Goodbye, thermal grease; hello, integral heat sink?
• Misconception revealed: Can a heat sink be too big?
• Call on mechanical engineers to solve your tough thermal problems
• “Thin is in” as RF-module shrinkage also enhances thermal performance
• The Zero-Ohm Resistor: A “Simple” Passive Component

 References

• Stackpole Electronics, “Using Thermal Jumpers to Solve Temperature Issues for Power Supplies, Amplifiers and Servers” (app note)
• Stackpole Electronics, “TMJ Thermal Jumpers Help Lower Temperatures for High Power Supplies” (press release)
• Stackpole Electronics, “TMJ Series Surface Mount Thermal Jumper Chip Resistor” (data sheet)
• Vishay Intertechnology, “ThermaWick® Thermal Jumper Electrically Isolated Thermal Conductor” (application brief)
• Vishay Intertechnology, “ThermaWick® Thermal Jumper Capability” (application brief)
• Vishay Intertechnology, “ThermaWick® Thermal Jumper Demo” (comparative video)

The post What’s a “thermal jumper” do, anyway? appeared first on EDN.

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