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Press release of GÖPEL electronic GmbH about one platform, one software
GÖPEL electronic introduces the new Multi Line product family, an innovative platform of inspection systems that supports the entire manufacturing process. The centerpiece of this solution is a modular base system with a uniform and powerful software interface. This reduces training requirements, enables flexible employee scheduling, and optimizes the exchange of knowledge between production staff. This can be especially important when there may be a shortage of skilled workers.
The all-rounder can be configured for all inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coat inspection (CCI). For THT printed circuit board assemblies (PCBA), Multi Line provides flexible transport options, with or without carriers, and all the necessary camera modules for this application. It also allows THT solder inspection, even during return on the optional lower transport conveyor. Thanks to 3D technology, solder joints can be inspected not only for soldering quality and for shorts, but also for solder volume and pin length, without flipping the PCBA.
The system’s configuration versatility also makes it suitable for use in the SMT process, where optional double-sided inspection offers the advantage of fully testing SMT assemblies without flipping the PCBA.
Furthermore, Multi Line is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset, and co-planarity. A closed-loop interface to the solder paste printer is available, and a link to PILOT Verify software makes fault analysis more efficient by displaying associated AOI, AXI, and SPI result data.
Multi Line CCI can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths. With telecentric optics and a color camera, the system delivers high-contrast images and enables fast programming using CAD data and coating plans. As a special feature, the PCBA can be simultaneously inspect both top and bottom without turning, and, if necessary, can also be transported back to the beginning of the line using a lower level return conveyor.
Thanks to the modular design of the Multi Line platform, camera modules can be flexibly combined and, if necessary, retrofitted later for new applications in the manufacturing process.
With this comprehensive solution, GÖPEL electronic is utilizing its many years of experience in quality assurance and setting new standards in inspection technology for the electronics manufacturing process.
GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. GÖPEL electronic is comprised of four business units:
- Automotive Test Solutions
- Embedded JTAG Solutions
- Inspection Solutions AOI-AXI-SPI-IVS
- Industrial Function Test
The company is a global supplier with its own subsidiaries as well as distribution, and generated sales of approximately 40 million Euros in 2023 with 240 employees.
Further information: www.goepel.com/en
Press Contact:
GÖPEL electronic GmbH Tel.: +49 (0)3641-6896-779
Bettina Richter Fax: +49 (0)3641-6896-944
Göschwitzer Straße 58/60 E-Mail: presse@goepel.com
07745 Jena, Germany. Web: www.goepel.com
The post Press release of GÖPEL electronic GmbH about one platform, one software appeared first on ELE Times.
Press release of Microchip Technology about how RTG4™ FPGAs with lead-free flip-chip bumps achieve the highest space qualification
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions
October 18, 2024 — Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products.
In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.
“This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zero-configuration-upset and low-power consumption FPGAs,” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.”
RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft. RTG4 FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation and thus requiring no mitigation, reducing engineering expenses and total system costs.
To achieve QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone extensive reliability testing, enduring up to 2,000 thermal cycles from −65°C to 150°C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria and exhibited no signs of tin whiskers. The flip-chip bump is inside the FPGA package, so there is no impact on the user’s design, reflow profile, thermal management or board assembly flow when converting to lead-free bump RTG4 FPGAs.
Microchip boasts one of the industry’s most comprehensive space product portfolios of radiation-hardened and RT solutions that include QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the gap between traditional Qualified Manufacturers List (QML) components and Commercial Off-The-Shelf (COTS) components. For a comprehensive listing of Microchip FPGA and mixed-signal part numbers alongside their corresponding Defense Logistics Agency (DLA) drawing numbers, please refer to the DLA Cross Reference Guide.
Development Tools
The RTG4 FPGAs are supported by development kits, mechanical samples and daisy chain packages for board validation and testing. Libero® SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits.
Availability
For additional information or to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.
Resources
High-res images available through Flickr (feel free to publish):
- Application Image: https://www.flickr.com/photos/microchiptechnology/54037604837/sizes/l/
About Microchip:
Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control and processing solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve approximately 123,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.
###
Note: The Microchip name and logo, the Microchip logo, Libero and PolarFire are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks are the property of their respective companies.
Editorial Contact:
Samheetha Ravi Bhat
samheetha@prhub.com
9731054124
The post Press release of Microchip Technology about how RTG4™ FPGAs with lead-free flip-chip bumps achieve the highest space qualification appeared first on ELE Times.
Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices, enabling SMS services
Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.
Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.
Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.
The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.
For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html
Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500
Press contacts:
Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)
North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)
Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)
Contact for readers:
Rohde & Schwarz
Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.
R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.
All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.
The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices, enabling SMS services appeared first on ELE Times.
Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices
Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.
Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.
Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.
The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.
For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html
Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500
Press contacts:
Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)
North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)
Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)
Contact for readers:
Rohde & Schwarz
Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.
R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.
All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.
The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices appeared first on ELE Times.
Press release of Vicor about the highest-density automotive-grade power modules
Media Alert
Vicor releases highest density automotive-grade power modules, enabling 48V power systems for electric vehicles
Andover, Mass., October 16, 2024 – Vicor has released three automotive-grade power modules for 48V EV systems which deliver industry-leading power density and support automotive OEM and tier one production in 2025. The BCM6135, DCM3735 and PRM3735 use AEC-Q100 certified Vicor-designed ICs and have completed the PPAP process with automotive customers.
“Vicor has set a new standard for power density in the automotive industry with these scalable and flexible miniature power modules,” said Patrick Wadden, VP of the Vicor Automotive business unit. “Our high-performance converters enable new possibilities for automotive manufacturers to reduce the size and weight of power systems throughout the vehicle.”
The BCM6135 is a 98% efficient 2.5kW BCM® bus converter which converts 800V from the traction battery to 48V to provide a safety extra-low voltage (SELV) power supply for the vehicle. The BCM6135 internally provides the isolation between high voltage and low voltage which creates a large reduction the space required for the DC-DC conversion. The BCM6135’s power density of 158kW/L allows EV system designers to reduce size of the primary DC-DC converter and reduce vehicle weight. The bidirectional rapid current transient response rate of 8 mega amps per second allows the BCM6135 to replace a 25lb 48V battery — by serving as a virtual 48V battery in the xEV vehicle and delivering additional cost and weight savings.
The DCM3735 2.0kW DCM DC-DC converter transforms an unregulated 48V input into a regulated 12V output. The DCM3735 has a wide input range that is compatible with a variety of automotive applications because the output can be trimmed within a range of 8 – 16V. The DCM3735 has a power density of 300kW/L making it an attractive choice for architectures bridging a 48V distribution to 12V subsystems in zonal ECU applications.
The PRM3735 is a 2.5kW PRM regulator for 48V power that is 99.2% efficient. Its small footprint and 260kW/L power density frees up packaging space and reduces the overall volume and weight of the DC-DC power supply. It is best suited to support regulated 48V loads that are implemented in new vehicle architectures.
The newly released Vicor modules can be arranged in over 300 configurations, offering extreme flexibility and scalability to support innovation for a variety of vehicle subsystems. Further, as the market shifts from 12V to 48V Zonal Architecture, these products are highly efficient in converting to and from 48V. All three modules can be arrayed easily to increase power supply levels, and they have automatic power sharing for optimum performance in an array. These modules solve complex challenges with 800V, 400V, 48V and 12V systems.
“Our power modules make it easy to convert from the primary battery (800V or 400V) to 48V and down to load,” said Wadden. “They are very versatile, and our customers are using the modules to improve efficiency while also removing size and weight from their power systems.”
Vicor power modules are improving power delivery networks throughout the vehicle in innovative ways:
- Active suspension comes of age in EVs
Power needs of active suspension system are too high to be met with 12V power. Switching to a 48V bus and converting down with the bidirectional BCM6135 is an efficient way to deliver high performance. This application also capitalizes on the BCM6135’s high slew rate as the active suspension is a regenerative power load, which requires immediate current flow reversal to pass regenerated power back to the battery. - Deleting or reducing the low-voltage battery
The industry-leading slew rate of the BCM6135 presents an opportunity to replace a 48V battery — with the BCM serving as a virtual 48V battery in the xEV vehicle, delivering cost and weight savings. Since the BCM6135 can switch from zero current to full current at 8.0MA/s, it can step down the traction battery’s 800 to 48V and power a load as fast as drawing the power from an auxiliary 48V battery. No other DC-DC converter can match this speed and enables customers to reduce vehicle weight by up to 25kg while reducing vehicle costs by up to $100.
- 48V zonal architecture adoption is on every roadmap
The new power modules can be easily configured to make this transition easier. The DCM3735 is used in conjunction with BCM3735 to create a regulated 12V power supply off the BCM6135 48V output. When used as a part of the 48V zonal architecture, the DCM3735 can be mounted remotely to create a local 12V supply in a vehicle zone, for example on the right hand side. This application method allows the PDN designer to effectively support 12V loads while achieving up to 90% of the cost and weight savings that come from transitioning to a 48V bus. - Precharging prevents current surges and saves weight
Precharging is a necessary step of the start-up process. It prevents current surges at battery engagement that will damage the loads (such as pumps and compressors). Currently this is done using high voltage contactors and resistors, which add 1kg and over $50 in cost. The alternative is to use BCM6135 and a PRM3735 as the main DC-DC converters and one of the low-voltage batteries installed in the vehicle. The BCM6135 can boost the low-voltage battery power up to high voltage and achieve the needed precharge, eliminating the legacy precharge contactor and power resistor.
The flexibility of the power modules enable a host of automotive applications to be powered. More importantly, they deliver on the promise of 48V adoption. Whether converting the high voltage traction battery to 48V, delivering point-of-load power from a 48V bus, or enabling legacy 12V sub-systems to live in new 48V zonal architectures, Vicor’s high performance, automotive grade power modules deliver the highest power density while reducing power loss and simplifying designs.
Learn more about the three new automotive-grade Vicor power modules
About Vicor
Vicor is the leader in high-performance power modules, enabling customer innovation with easy-to-deploy modular power system solutions for power delivery networks that provide the highest density and efficiency from source to point-of-load. We continuously advance the density, efficiency and power delivery capabilities of our power modules by staying on the forefront of distribution architectures, conversion topologies and packaging technology. Vicor serves customers in high-performance computing, industrial equipment, automotive and aerospace and defense markets. With over 40 years of experience in designing, developing and manufacturing power modules for demanding markets, the Vicor patented, high-frequency DC-DC power conversion technology is ideally suited for the automotive market.
Vicor is a registered trademark of Vicor Corporation.
For more information contact:
Stephen Germino,
978 749-8243
The post Press release of Vicor about the highest-density automotive-grade power modules appeared first on ELE Times.
As a 230V Electrician apprentice, and IT enthusiast, I wish my apprenticeship has gone differently. I found charm in electronics only now. 10 years too late.
I remember nothing but mumbo jumbo from my school days. Slides upon slides of worthless diagrams with no meaning and teacher who was eager to finish his last couple years befoe retirement.
I am rediscovering electronics now thanks to mechanical keyboards as my hobby. I've built Trackpad with a friend, now working on an electronic candle.
Things from school, long forgotten but pieces of the puzzle fall into place as logic plays a role. Apps like Everycircuit are nice to visualize the current and see simulations. Seeing what people can do with MCU's and using them is fun. And it feels so limitless. Well... almost.
Limit is my skill and inability to comprehend programming (for now).
My point is that electronics should be taught differently. First comes project or a goal, then research of knowledge needed to achieve that goal.
Another fine thing about this hobby is that I don't get painful zaps I got from our testing 230V circuits hah. I have yet to burn myself with the iron though.
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Few pertinent facts about Auto EV India Expo 2024
The answers to the following questions shall bring forth few pertinent facts about Auto EV India Expo 2024:
- With EV sales surging by 35% in 2023, how does Auto EV India 2024 plan to showcase the latest trends driving this rapid market growth?
Answer: Auto EV India 2024 shall bring to fore all companies dealing with latest innovations and advancements in the field of electric vehicle and automotive technology. All of them shall be brought under one roof. They shall exhibit all their latest advancements and products in the exhibition hall of our event. There shall be a free flow of information. This shall enable an un-interrupted exchange of ideas. It shall be a great opportunity to liaison with many industry stalwarts.
- As fast-charging infrastructure becomes more widespread, what solutions and collaborations do you expect to be highlighted at the 3rdedition of the Expo?
Answer: All major companies dealing with fast-charging solutions shall exhibit their products and services at Auto EV India 2024. For instance, companies installing charging stations and using over-the-air technology for charging electric vehicles.
- How is the Expo promoting collaboration among OEMs, Tier 1 suppliers, and tech innovators to enhance India’s global EV position?
Answer: In collaboration, the original equipment manufacturers and Tier 1 suppliers develop core software solutions. Such as operating systems, middleware, and applications. Besides, Tier 1 suppliers develop specific software solutions. For instance, connectivity, ADAS, in-vehicle experiences, and offering software-as-a-service (SaaS) solutions. Their partnership is based on a shift from hardware-centric partnerships to joint software development.
The Auto EV Expo 2024 is leveraging this domain by bringing together concerned companies on one forum for discussion during the conference and exhibition of their products and services to the concerned stakeholders during the exhibition.
- How is the expo positioning itself in the realm of advancing hydrogen fuel cell technology as a key alternative in the automotive sector?
Answer: Traditionally, the automotive industry used to use internal combustion engine. Now, it is being replaced by hydrogen fuel cell. The benefit of using the latter is that it is based completely on renewable source of energy. Besides, it is highly efficient in generating energy. Also, it can be recharged in a very short span of time.
Auto EV Expo 2024 shall endeavour to bring forth all latest advancements in the field of utilising hydrogen fuel cells for a discussion during the conference. And later, for exhibition by all concerned companies during the exhibition. It would be an excellent opportunity to liaison with the technical, marketing, and sales team of concerned companies.
- How is the government initiatives like the PLI Scheme and ACC Battery Storage impacting India’s EV future, and how will Auto EV India 2024 contribute in this scenario?
Answer: The Government of India’s Production Linked Incentive (PLI) scheme for Advanced Chemistry Cell (ACC) Battery Storage aims to scale up the production of electric vehicle’s batteries to the tune of 95 GWh. It was approved with an outlay of ₹ 18, 000 crore. It would convert India into a global manufacturing hub. This would lead to reduction in India’s import dependence.
Auto EV India 2024 will bring together all major firms driving benefit under the aforesaid scheme for their display in the exhibition. This would enable them to interact with various industry stakeholders and prospective clients.
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Lynred completes biggest space contract
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