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GPU IP powers scalable AI and cloud gaming

Vitality is VeriSilicon’s latest GPU IP architecture targeting cloud gaming, AI PCs, and both discrete and integrated graphics cards. According to the company, Vitality offers advancements in computation performance and scalability. With support for Microsoft DirectX 12 APIs and AI acceleration libraries, the GPU architecture suits performance-intensive applications and complex workloads.
Vitality integrates a configurable Tensor Core AI accelerator and 32 Mbytes to 64 Mbytes of Level 3 cache. Capable of handling up to 128 cloud gaming channels per core, it meets demands for high concurrency and image quality in cloud-based entertainment while enabling large-scale desktop gaming and Windows applications.
“The Vitality architecture GPU represents the next generation of high-performance and energy-efficient GPUs,” said Weijin Dai, chief strategy officer, executive VP and GM of VeriSilicon’s IP Division. “With over 20 years of GPU development experience across diverse market segments, the Vitality architecture is built to support the most advanced GPU APIs. Its scalability enables widespread deployment in fields such as automotive systems and mobile computing devices.”
A datasheet was not available at the time of this announcement.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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Metamaterial’s mechanical maximization enhances vibration-energy harvesting

The number of ways to harvest energy that would otherwise go unused and wasted is extraordinary. To cite a few of the many examples, there’s the heat given off during almost any physical or electronic process, ambient light which is “just there,” noise, and ever-present vibration. Each of these has different attributes along with pros and cons which are fluid with respect to consistency, reliability, and, of course, useful output power in a given situation.
For example, the harvesting of vibration-sourced energy is attractive (when available) as it is unaffected by weather or terrain conditions. However, most of the many manifestations of such energy are quite small. It requires attention to details and design to extract and squeeze out a useful amount in the energy chain from a raw source to the harvesting transducer.
Most vibrations in daily life are tiny and often not “focused” but spread across a wide area or volume. To overcome this significant issue, numerous conversion devices, typically piezoelectric elements, are often installed in multiple locations that are exposed to relatively large vibrations.
Addressing this issue, a research effort lead by a team at KRISS—the Korea Research Institute of Standards and Science in the Republic of Korea (South Korea) —has developed a metamaterial that traps and amplifies micro-vibrations into small areas. The behavior of the metamaterials enhances and localizes the mechanical-energy density level at a local spot in which a harvester is installed.
The metamaterial has a thin, flat structure roughly the size of an adult’s palm, allowing it to be easily attached to any surface where vibration occurs, Figure 1. The structure can be easily modified to fit the object to which it will be attached. They expect that the increase in the power output will accelerate its commercialization.
Figure 1 The metamaterial developed by the KRISS-led team is flat and easy to position. Source: KRISS
The metamaterial developed by KRISS traps and accumulates micro-vibrations within it and amplifies it. This allows the generation of large-scale electrical power relative to the small number of piezoelectric elements that are used. By applying vibration harvesting with the developed metamaterial, the research team has succeeded in generating more than four times more electricity per unit area than conventional technologies.
Their metasurface structure can be divided into three finite regions, each with a distinct role: metasurface, phase-matching, and attaching regions. Their design used what is called “trapping” physics with carefully designed defects in structure to simultaneously achieve the focusing and accumulation of wave energy.
They validated their metasurface using experiments, with results showing an amplification factor of the input flexural vibration amplitude by a factor of twenty. They achieved this significant amplification largely due to the intrinsic negligible damping characteristic of their metallic structure, Figure 2.
Figure 2 (right) Schematic of the proposed metasurface attachment and (left) a conceptual illustration of the attachment installed on a vibrating rigid structure for flexural wave energy amplification. Source: KRISS
Their phase-gradient metasurfaces (also called metagratings in the acoustic field) feature intrinsic wave-trapping behavior. (Here, the term “metasurfaces” refers to structures that diffract waves, primarily through spatially-varying phase accumulations within the constituent wave channels.)
Constructs, analysis, and modeling are one thing, but a proposal such as theirs requires and is very conducive to validation. Their experimental setup used a vibration shaker and a laser Doppler vibrometer (LDV) sensor to excite and then measure the flexural vibration inside the specimen, Figure 3. For convenience, the specimen was firmly clamped to the shaker instead of being directly attached onto the shaker using a jig and a bolted joint.
Figure 3 (a) Schematic illustration and (b) photographs to demonstrate the experimental setup in order to validate the flexural-vibration amplifying performance of the fabricated metasurface attachment. Using a specially-configured jig and a bolted joint, the metasurface structure is firmly clamped to a vibration shaker. The surface region covering a unit supercell (denoted as M1) and the interfacial line (M2) between the metasurface strips and phase-matching plate are measured using laser Doppler vibrometer equipment. Source: KRISS
The shaker was set to constantly vibrate at frequencies between 3 kHz and 5 kHz at arbitrary weak amplitudes set by a function generator and an RF power amplifier. The phase-matching plate (somewhat analogous to impedance-matching circuit) was another essential component in the structure. It dramatically improved the amplifying performance by assisting coherent phases of scattering wave fields to constantly develop within the metasurface strips in the steady state.
It would be nice to have a summary of before-and-after performance using their design. Unfortunately, their published paper is too much of a good thing: it has a large number of such graphs and tables under different conditions, but no overall summary other than a semi-quantitative image, Figure 4 (top right).
Figure 4 This conceptual illustration graphically demonstrates the nature of the vibration amplification performance of the metamaterial developed by the KRISS-lead team. Source: KRISS
If you want to see more, check out their paper “Finite elastic metasurface attachment for flexural vibration amplification” published in Elsevier’s Mechanical Systems and Signal Processing. But I’ll warn you that at 32 pages, the full paper (main part, appendix, and references) is the longest I have seen by far in an academic journal!
Have you had any personal experience with vibration-based energy harvesting? Was the requisite modeling difficult and valid? Did it meet or exceed your expectations? What sort of real-work problems or issues did you encounter?
Bill Schweber is an EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features.
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- What’s that?…A fuel cell that harvests energy from…dirt?
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Silicon Carbide: Overview, Discovery, Properties, Process & Uses
Silicon carbide (SiC) is a highly durable crystalline material formed through the combination of silicon (Si) and carbon (C), renowned for its exceptional hardness and resilience. First utilized in the late 19th century, SiC has become a critical material for abrasive tools like sandpapers, grinding wheels, and cutting tools. In modern industries, it is used in refractory linings, heating elements, wear-resistant components, and as a semiconductor substrate in electronic devices like light-emitting diodes (LEDs).
Discovery of Silicon Carbide
Silicon carbide was discovered in 1891 by Edward G. Acheson while attempting to produce artificial diamonds. Acheson utilized an electric arc to heat a combination of clay and powdered coke, producing green crystals that formed on the carbon electrode. Initially mistaken as a compound of carbon and alumina, the material was named “Carborundum” because natural alumina is known as corundum. Recognizing its diamond-like hardness, Acheson patented the compound, which soon became a widely used industrial abrasive due to its cost-effectiveness and availability.
Around the same period, Henri Moissan in France created a similar material using quartz and carbon but recognized Acheson’s prior discovery in 1903. Naturally occurring silicon carbide, known as moissanite, has been found in the Canyon Diablo meteorite in Arizona.
Modern Manufacture of Silicon Carbide
The current manufacturing method for industrial SiC remains largely similar to the Acheson process:
- Raw Materials: A blend of high-purity silica sand and finely powdered coke is carefully prepared.
- Furnace Operation: The materials are arranged around a carbon conductor in an electric resistance furnace.
- Chemical Reaction: Electric current heats the core to 2,200–2,700°C, facilitating the reaction: SiO2+3C→SiC+2CO\text{SiO}_2 + 3\text{C} \rightarrow \text{SiC} + 2\text{CO}
- Post-Processing: After several days, the furnace produces a central core of SiC crystals surrounded by unreacted material. The output is crushed, ground, and screened for various applications.
For specialized uses, advanced processes like reaction bonding, chemical vapor deposition (CVD), and single-crystal growth are employed to create high-purity SiC suitable for electronic or structural applications.
Properties of Silicon Carbide (SiC)
Silicon carbide (SiC) is a unique material that combines exceptional mechanical, thermal, electrical, and chemical properties, making it indispensable in a variety of high-performance applications.
- Mechanical Properties
- Hardness: SiC possesses a Mohs hardness of approximately 9 to 9.5, making it one of the hardest synthetic substances, surpassed only by diamond and boron carbide.
- Strength: It exhibits high strength and remarkable resistance to deformation, making it suitable for applications requiring wear resistance and durability.
- Thermal Properties
- High Thermal Conductivity: SiC boasts excellent thermal conductivity, ranging from ~120 to 270 W/mK, allowing efficient heat dissipation in high-power systems.
- Low Thermal Expansion: The material has a low coefficient of thermal expansion, reducing thermal stress during temperature fluctuations.
- Thermal Stability: SiC maintains exceptional structural integrity and strength at elevated temperatures, with a melting point of approximately 2730°C. This makes it ideal for high-temperature environments such as heating furnaces and molten metal processing.
- Electrical Properties
- Wide Bandgap: With a bandgap ranging from ~2.3 to 3.3 eV (depending on the polytype), SiC is classified as a wide-bandgap semiconductor This characteristic allows for efficient performance in high-temperature and high-voltage applications.
- High Breakdown Voltage: SiC can withstand high electric fields, making it suitable for high-power applications.
- Low Leakage Current: Its electrical properties ensure minimal energy loss, critical for power electronic devices.
- High-Frequency Performance: SiC’s characteristics support high-frequency switching, benefiting applications such as motor drives, inverters, and RF systems.
- Chemical Properties
- Chemical Inertness: SiC is highly resistant to chemical reactions, maintaining stability in harsh environments.
- Corrosion Resistance: It resists oxidation and corrosion from acids, alkalis, and other aggressive chemicals.
- Wear Resistance: The material’s hardness and chemical inertness provide excellent resistance to abrasion and wear.
Applications of Silicon Carbide (SiC)
- Electronics:
- SiC is utilized in power semiconductors such as MOSFETs and diodes, enabling high-efficiency energy conversion.
- It is integral to applications in electric vehicles (EVs), renewable energy systems, and aerospace, thanks to its ability to handle high temperatures and voltages.
- Serves as a substrate for LEDs and other photonic devices.
- Abrasives:
- Due to its exceptional hardness, SiC is used in grinding wheels, sandpapers, and cutting tools, making it ideal for precision machining and polishing.
- Refractories:
- Its thermal stability makes it suitable for lining furnaces, kilns, and high-temperature bricks, ensuring durability in extreme environments.
- Ceramics:
- Plays a key role in producing advanced ceramics for high-performance industrial applications, offering superior mechanical and thermal properties.
- Wear-Resistant Components:
- SiC is used to manufacture pump parts, rocket engine components, and other wear-resistant items, enhancing longevity and reliability.
- Advanced Materials:
- Reinforces composites and ceramics, providing enhanced strength, stiffness, and resistance to thermal degradation.
- LEDs and Photonics:
- A critical substrate material for light-emitting diodes (LEDs) and other photonics applications, enabling improved energy efficiency.
- Nuclear Applications:
- SiC’s high radiation resistance makes it suitable for use in nuclear reactors, where it contributes to safety and efficiency in extreme conditions.
Silicon Carbide Structure
- Crystal Structure:
- SiC exists in multiple crystalline forms called polytypes.
- Common polytypes include 3C-SiC (Cubic), 4H-SiC (Hexagonal), and 6H-SiC (Hexagonal).
- Atomic Arrangement:
- Silicon and carbon atoms are bonded covalently, forming a strong tetrahedral lattice structure.
- This structure contributes to SiC’s extreme hardness and stability.
Silicon Carbide Processing
- Raw Material Preparation:
- Silicon dioxide (SiO₂) and carbon sources like coke or graphite are combined.
- Carbothermal Reduction:
- SiO₂ reacts with carbon at high temperatures (~2000°C) in an electric furnace to form SiC: SiO₂+3C→SiC+2CO\text{SiO₂} + 3\text{C} \rightarrow \text{SiC} + 2\text{CO}
- Crystallization:
- Polytypes are grown using techniques like chemical vapor deposition (CVD) or physical vapor transport (PVT).
- Processing:
- SiC is cut, shaped, or doped for specific applications (e.g., semiconductors).
Advantages of Silicon Carbide (SiC) in Power Electronics and High-Performance Applications
Silicon carbide (SiC), as a wide-bandgap semiconductor material, offers several advantages over traditional silicon (Si) devices, particularly in applications such as inverters, motor drives, and battery chargers. Its unique properties enable superior performance, particularly at higher voltages, making it an attractive choice for new system designs. Below is a comprehensive summary of SiC’s advantages:
- Higher Efficiency
- Reduced Energy Loss: SiC devices exhibit dramatically lower energy losses during switching. The reverse recovery energy loss is approximately 1% of that of silicon counterparts, significantly improving efficiency.
- Faster Turn-Off: SiC’s near absence of tail current allows for faster switching transitions, reducing power dissipation.
- Low Conduction Losses: As a wide-bandgap material, SiC has a low gate charge, requiring less energy for device operation.
- Enhanced Performance at High Temperatures
- Thermal Stability: SiC maintains stable electrical characteristics at elevated temperatures, unlike silicon, which requires over-specification at room temperature to account for performance degradation at high temperatures.
- High Melting Point: With a melting point of approximately 2700°C, SiC retains structural stability in extreme environments, suitable for molten metal processing and high-temperature heating furnaces.
- Smaller, Lightweight Designs
- Higher Switching Frequencies: SiC’s ability to switch at higher frequencies reduces the size and weight of passive components such as transformers and filters, enabling more compact system designs.
- Lower Cooling Requirements: SiC’s efficiency reduces heat generation, minimizing the need for bulky cooling systems.
- Higher Voltage Ratings
- SiC devices can operate at significantly higher voltages, with commercially available devices rated at 1,200V and 1,700V. SiC has demonstrated the potential to operate beyond 10kV, far surpassing silicon capabilities.
- Durability and Longevity
- Higher Reliability: SiC devices offer approximately 10 times the mean time to failure (MTTF) compared to silicon.
- Radiation Resistance: SiC is about 30 times less sensitive to radiation, making it suitable for space and high-radiation environments.
- Corrosion and Wear Resistance
- Chemical Stability: SiC’s strong resistance to acids, alkalis, and oxidative environments enables long-term stability in harsh conditions.
- High Hardness and Strength: With superior hardness and impact resistance compared to traditional ceramics, SiC is ideal for wear-resistant and impact-resistant applications.
- Improved Thermal and Electrical Conductivity
- SiC’s high thermal conductivity makes it an excellent choice for heat dissipation in high-power applications, such as radiators and power electronic components.
- Its superior electrical conductivity supports efficient power conversion and high-frequency operation.
- Packaging and Design Considerations
- Optimized Packaging: To maximize SiC’s benefits, specialized packaging with symmetrical layouts is necessary to minimize loop inductance and support high-frequency switching.
- Advanced Gate Drivers: SiC devices require specifically designed gate drivers to handle faster switching speeds, higher frequency operations, and augmented turn-off techniques to reduce current spikes and ringing.
- Suitability for High-Temperature and Corrosive Environments
- SiC is widely used in fields such as petrochemical processing and high-temperature furnaces due to its robust high-temperature performance and strong corrosion resistance.
Limitations
- Cost: SiC devices are more expensive than silicon, but system-level benefits, particularly at voltages of 1,200V and above, offset this cost.
- Lower Short-Circuit Tolerance: SiC requires fast-acting protection mechanisms, which increase design complexity.
- Limited Availability: SiC devices are less available at lower voltage ratings (e.g., 600V/650V), and most offerings are discrete components.
The post Silicon Carbide: Overview, Discovery, Properties, Process & Uses appeared first on ELE Times.
Digital Multimeter Definition, Types, Working, Uses & Advantages
A digital multimeter (DMM) is an electronic measuring instrument that combines multiple functions into one device. It can measure voltage, current, resistance, and often additional parameters like capacitance, frequency, temperature, and continuity. The readings are displayed on a digital screen, providing high accuracy and ease of use.
History of Digital Multimeter
- Analog Origins: Multimeters began as analog devices, using moving needle mechanisms to display measurements.
- First Digital Multimeter: In the 1970s, advancements in digital electronics led to the development of the first digital multimeters. Early models were bulky and expensive but offered better accuracy than analog counterparts.
- Modern Developments: Over the decades, DMMs have become compact, affordable, and feature-rich, with advanced functionalities such as wireless connectivity and data logging. Companies like Fluke, Tektronix, and Keysight have pioneered innovation in this field.
Types of Digital Multimeters
- Handheld Multimeters:
- Portable and commonly used for general-purpose applications.
- Bench Multimeters:
- Larger and more precise; used in laboratories and industrial settings.
- Clamp Multimeters:
- Specialized for measuring current without direct contact with the conductor.
- Autoranging Multimeters:
- Automatically select the appropriate measurement range for the parameter being tested.
- Fluke Digital Multimeters:
- Known for ruggedness and reliability, often used in industrial applications.
Block Diagram of a Digital Multimeter
The operation of a Digital Multimeter (DMM) is based on precise voltage measurement, which serves as the foundation for calculating other parameters like current and resistance using mathematical relationships. Below is an explanation of the working process alongside a conceptual block diagram.
Working Principle
The key process in a digital multimeter involves the measurement and conversion of an analog input voltage into a digital output, which is displayed numerically. The conversion is achieved using a Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC), which is widely employed in DMMs for its speed and accuracy.
- Sample and Hold:
- The first stage of the DMM involves sampling the input voltage.
- The sampled voltage is held steady to ensure accurate processing.
- Operational Amplifier (Op-Amp):
- The sampled input voltage is fed into an operational amplifier.
- The second input of the op-amp receives feedback from a Digital-to-Analog Converter (DAC) that operates in tandem with the SAR ADC.
- Successive Approximation Register (SAR) ADC:
- The SAR ADC determines the digital equivalent of the analog input voltage with high resolution.
- The process begins by setting the Most Significant Bit (MSB) to “1” and others to “0” (e.g., 1000 for a 4-bit system).
- Based on comparisons of the input voltage with the DAC output, subsequent bits are adjusted iteratively.
- Digital Output:
- The SAR ADC provides a stable digital output corresponding to the analog input.
- This result is processed and displayed on the DMM’s digital screen.
Block Diagram
Here’s a high-level description of the components in a DMM:
- Input Section:
- Probes connected to the circuit under test.
- Selector Switch to choose the measurement type (voltage, current, resistance).
- Sample and Hold Circuit:
- Captures and holds the input voltage for processing.
- Operational Amplifier (Op-Amp):
- Amplifies the sampled signal and compares it to feedback from the DAC.
- Digital-to-Analog Converter (DAC):
- Converts the digital output of the SAR ADC back to an analog signal for comparison.
- Successive Approximation Register (SAR) ADC:
- Converts the analog signal into a digital value with high resolution.
- Microcontroller/Processor:
- Processes the digital signal and controls the display output.
- Display Unit:
- Displays the measured value numerically.
Operation Example (4-bit SAR)
For a 4-bit SAR ADC:
- Initially, the output is set to 1000 (MSB = 1).
- If the input voltage is less than half the full-scale range, the comparator output is low, forcing the register to 0100.
- If the voltage exceeds this value, the output progresses to 0110, and so on.
- The process continues until the digital output closely matches the analog input.
This iterative approach ensures precise measurement of the input voltage.
How to Use a Digital Multimeter
- Safety First: Ensure the multimeter is in good condition and the probes are not damaged.
- Set the Mode: Use the rotary dial to select the parameter you want to measure (voltage, current, resistance, etc.).
- Connect the Probes:
- Insert the black probe into the COM port.
- Insert the red probe into the appropriate port based on the measurement.
- Take the Measurement:
- For voltage, connect the probes across the two points.
- For current, break the circuit and connect the probes in series.
- For resistance, connect the probes across the resistor.
- Read the Display: The measurement appears on the screen.
Digital Multimeter Uses
- Testing and troubleshooting electrical circuits.
- Measuring battery voltage and capacity.
- Diagnosing automotive electrical issues.
- Checking continuity in wiring and connections.
- Monitoring industrial equipment and machinery.
- Research and educational experiments.
Advantages of a Digital Multimeter
- High Accuracy: Provides precise measurements with minimal error.
- Ease of Use: Digital readouts are easy to interpret, reducing the chance of misreading.
- Versatility: Combines multiple measurement functions in one device.
- Portability: Compact and lightweight, ideal for fieldwork.
- Safety Features: Built-in protections for high-voltage measurements.
- Advanced Features: Options like autoranging, data logging, and connectivity enhance functionality.
A digital multimeter is an indispensable tool for anyone working in electronics, electrical engineering, or related fields.
The post Digital Multimeter Definition, Types, Working, Uses & Advantages appeared first on ELE Times.
Merry Christmas
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Save, recall, and script oscilloscope settings

Digital oscilloscopes have a great thing going for them: they are digital. Instrument settings, waveforms, and screen images can be saved as digital files either internally or to external devices. Not only can they be saved, but they can be recalled to the oscilloscope or an offline program to review the data and, in some cases, for additional analysis and measurements.
The ability to save setups is one of the great benefits of digital oscilloscopes. It saves lots of time setting up measurements, allowing settings of previous work sessions to be recalled and work resumed in seconds. A series of recalled settings can even be the basis for a comprehensive test procedure.
Digital oscilloscopes preserve the last settings when powered down and restore them when power is restored. That can be a problem if that state is not what you need. For instance, If the previous user set the oscilloscope to trigger on an external signal and you want to trigger on one of the internal channels there will be a problem unless you check first and update the settings. The easiest way to ensure the state of the oscilloscope when first powered on is to recall its default setup. The default setup is a known state defined by the manufacturer. The default state is generally helpful in getting data on the screen. It usually places the instrument in an auto-trigger mode so there will be a trace on the screen. Starting with the default state the instrument can be set to make the desired measurement. When that state is reached simply saving that setup state means that it can be recalled at need.
Setup filesSetup file formats vary between oscilloscope suppliers. Teledyne LeCroy uses Visual Basic for setup files. Most other suppliers use Standard Commands for Programmable Instruments (SCPI) for settings. Both use ASCII text which is easy to read and edit.
Figure 1 shows part of a typical setup file for a mid-range Teledyne LeCroy oscilloscope.
Figure 1 Part of a setup file for a Teledyne LeCroy Windows-based oscilloscope using ASCII text-based Visual Basic script. The command for setting the vertical scale of channel 1 is highlighted. Source: Art Pini
The setup files in this oscilloscope are a complete Visual Basic Script. This script can be thought of as a program that when executed sets up the oscilloscope in the state described. When a setting file is saved, it contains a Visual Basic program to restore the instrument settings upon execution. Visual Basic scripts allow the user to incorporate all the power and flexibility of the Visual Basic programming language, including looping and conditional branching.
The control statements for each function of the oscilloscope are based on a hierarchical structure of oscilloscope functions, which is documented in the automation and remote-control manual as well as in a software application called Maui Browser (formerly XStream Browser), which is included with every Windows oscilloscope. The manual includes detailed instructions on using the Maui Browser. The browser connects to the oscilloscope, either locally or remotely, and exposes the automation components as seen in Figure 2.
Figure 2 A view of the Maui Browser, connected locally to an oscilloscope, showing the control selections for channel C1 under the Acquisition function. The vertical scale setting is highlighted. Source: Art Pini
Each functional category of the oscilloscope’s operation is listed in the left-hand column. Acquisition, one of the high-level functions, has been selected in this example. Under that selection is a range of sub-functions related to the acquisition function, including Channel 1 (C1), which has been selected. The table on the right lists all the controls associated with channel 1. Note that the Vertical Scale (Ver Scale) setting has been selected and highlighted. The current setting of 200 mV per division is shown. To the right is a summary of the range of values available for the vertical scale function. The value can be changed on the connected oscilloscope by highlighting the numeric value and changing it to one of the appropriate values within the range.
An example of a simple command is setting the vertical scale of channel 1 (C1) to 200 mV per division. The command structure for the selected command is at the bottom of the figure. All that has to be added is the parameter value, 0.2 in this case- “app.Acquisition.C1.VerScale=0.2”
The Maui Browser is a tool for looking up the desired setting command without the need for a programming manual. It is also helpful for verifying selected commands and associated parameters. The browser program is updated with the oscilloscope firmware and is always up to date, unlike a paper manual.
ScriptingWith Visual Basic scripts being used internally to program the oscilloscope and automate the settings operations, the logical step is to have Visual Basic scripts control and automate scope operations. This operation happens within the oscilloscope itself; there is no need for an external controller. Visual Basic scripting uses Windows’ built-in text editor (Notepad) and the Visual Basic Script interpreter (VBScript), which is also installed in this family of oscilloscopes.
The Teledyne LeCroy website has many useful scripts for their oscilloscopes posted on the website, they perform tasks like setting up a data logging operation, saving selected measurements to spreadsheet files, or using cursors to set measurement gate limits. These can be used as written, but they can also serve as examples on which to base your script. Consider the following example. Figure 3 shows a settings script that allows a zoom trace to be dynamically centered on the position of the absolute horizontal cursor. As the cursor is moved the zoom tracks the movement.
Figure 3 A Visual Basic script that centers a zoom trace on the current horizontal cursor location. Source: Art Pini
The script is copied to the oscilloscope and either recalled using the recall setup function of the oscilloscope or executed by highlighting the script file in Windows File Explorer and double-clicking on it. The script turns on the cursor and the zoom trace and adjusts the center of the zoom trace to match the current cursor’s horizontal location as seen in Figure 4.
Figure 4 The script centers the zoom trace on the absolute horizontal cursor location and tracks it as it is moved. Source: Art Pini
The script operates dynamically; as the cursor is moved, the zoom trace tracks the movement instantly. The script runs continuously and is stopped by turning off the cursor. The message, “Script running; turn off cursor to stop,” appears in the message field in the lower left corner of the screen.
CustomDSOTeledyne LeCroy oscilloscopes incorporate the advanced customization option, including the CustomDSO feature, which allows user-defined graphical interface elements to be called Visual Basic scripts. The basic mode of CustomDSO creates a simple push-button interface used to run setup scripts. The touch of a single button within the oscilloscope user interface can recall scripts. The recalled setups can include other nested setups. This allows users to create a complex series of setups. CustomDSO Plug-In mode will enable users to create an ActiveX Plug-In designed in an environment like Visual Studio and merge this graphical user interface with the scope user interface.
Figure 5 shows the CustomDSO user interface.
Figure 5 The CustomDSO basic mode setup links a user interface push button to a specific setup script file. Source: Art Pini
In basic mode, CustomDSO links eight user interface push buttons with setup scripts. A checkbox enables showing the CustomDSO menu on powerup when no other menu is being displayed.
Figure 6 shows the CustomDSO user interface with the first pushbutton linked to the script to have the zoom center track the cursor.
Figure 6 The user interface for the basic CustomDSO mode with the leftmost pushbutton linked to the zoom tracking script. Source: Art Pini
The basic user interface has eight push buttons that can be linked with setup scripts. In this example, the leftmost push button, which is highlighted, has been linked to the script “Track Zoom.lss”. The oscilloscope uses the root name of the script as the push button label. This capability allows test designers to allow users with less training to recall all the elements of a test procedure.
Some other oscilloscopes can store several setups and then sequence through them as a macro program. This is similar but lacks any flow control when executing the macro.
The Plugin mode of CustomDSO is an even more powerful feature that allows user-programmed ActiveX controls to create a custom graphical user interface. The plugins are powered by routines written in Visual Basic, Visual C++, or other ActiveX-compatible programming languages. Many interactive devices are available, including buttons, a check box, a radio button, a list box, a picture box, and a common dialogue box. A detailed description of plugin generation is beyond the scope of this article.
Recall instrument setupsThe use of Visual Basic scripts enables these oscilloscopes to recall instrument setups easily and enhances this process with the ability to program a series of setups into a test procedure. It also offers the ability to use custom user graphical interfaces to simplify operations.
Arthur Pini is a technical support specialist and electrical engineer with over 50 years of experience in electronics test and measurement.
Related Content
- Customize your oscilloscope to simplify operations
- The scope…from Hell!
- Oscilloscope articles by Arthur Pini
- Basic jitter measurements using an oscilloscope
The post Save, recall, and script oscilloscope settings appeared first on EDN.
Happy Christmas
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Yes I do this often, yes like it, yes the first thing ai is going to do when it gets sentient its gonna beat me to death
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Perceiving the insides of a wireless camera flash receiver

In a recent teardown, I disassembled and documented the insides of a Godox wireless camera flash transmitter that ended up being in much better shape than had been advertised when I’d first acquired it. I was therefore highly motivated to return it to fully functional shape afterwards, albeit not for personal-usage reasons—it supported Fujifilm cameras, which I don’t own—but instead so that I could subsequently donate for another’s use, keeping it out of the landfill in the process.
This time around, the situation’s reversed. Today we’ll be looking at an “as-is” condition wireless camera flash receiver, from the same manufacturer (Godox’ X1R-C). And this time, I do have a personal interest, because it supports Canon cameras (“-C”), several of which I own. But given the rattling I heard inside whenever I picked it up, I was skeptical that it’d work at all, far from deluding myself that I could fix whatever ailed it. That said, it only cost $4.01 pre-15% promo discount, $3.40 after, in March 2024 from KEH Camera on the same order as its X1T-F sibling.
Here’s the sticker on the baggie that it came shipped in:
And here are a few stock photos of it:
Stepping back for a minute before diving into the teardown minutia: why would someone want to buy and use a standalone wireless camera receiver at all? Assuming a photographer wanted to sync up multiple camera flashes (implementing the popular three-point lighting setup or other arrangement, for example), as I’ve written about before, why wouldn’t they just leverage the wireless connectivity built into their camera supplier’s own flash units, such as (in my case) Canon’s EOS flash system?
Part of the answer might be that with Canon’s system, for example, “wireless” only means RF-based for newer units; older implementations were infrared- (also sometimes referred to as “optical”-) based, which requires line-of-sight between a transmitter and each receiver, has limited range, and is also prone to ambient light interference. Part of the reason might be that a given flash unit doesn’t integrate wireless receiver functionality (Godox’s entry-level flashes don’t support the company’s own 2.4 GHz X protocol, for example), or there might be a protocol mismatch between the separate transmitter and the built-in receiver. And part of the reason might be because the strobe illumination source you’re desiring to sync to doesn’t even have a hot shoe; you’ll shortly see how the Godox receiver handles such situations…normally, at least.
Let’s dive in, beginning with some overview shots, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes (per B&H Photo’s website, the Godox X1R-C has dimensions of 2.8 x 2.6 x 1.9″ / 70 x 65 x 47 mm and weighs 2.5 oz / 70.9 g). Back:
Rattling aside, it still powers up and outputs seemingly meaningful display info!
Left (as viewed from the front) side, including the power switch:
Bland front (no need for an infrared optical module with this particular receiver!):
Right side (you’ll see what’s importantly behind, and not behind, that rubberized panel shortly):
Top; you can tell from the extra contacts that this hot shoe’s not only actually “hot” but also Canon control protocol-cognizant:
And bottom; this particular shoe’s “cold”, intended only for mounting purposes:
Underneath that removable panel, unsurprisingly, is the two-AA battery compartment:
Look closely and you’ll see two screw heads inside it at the top corners, along with two more holes at the lower device corners in the photo. You know what comes next, right?
And inside we go:
Disconnect the cable harness mating the topside hot shoe to the PCB, and the separation of the two halves is complete:
Here’s a standalone overview of the inside of the top half, along with a hot shoe closeup:
And now for the (bottom) half we all care more about, because it contains the PCB:
Remember that rubberized flap I earlier mentioned? It got jostled out of position at this point, and eventually fell out completely. Notice anything odd behind it? If not, don’t feel bad; I still hadn’t, either:
Those two screws holding the PCB in place within the chassis are next to depart:
Before continuing, I’ll highlight a few notable (to me, at least) aspects of this side of the PCB. The connector in the lower left corner, again, goes to the cable harness which ends up at the hot shoe. The large IC at center is, perhaps obviously, the system “brains”, but as with other Godox devices I’ve already torn apart, its topside marking has been obliterated, so I unfortunately can’t ID it (I can’t help but wonder, though, if it’s a FPGA?). Above it is Texas Instruments’ CC2500, a “low cost, low-power 2.4 GHz RF transceiver designed for low-power wireless apps in the 2.4 GHz ISM band”: translation, Godox’s X wireless sync protocol. And above that, at the very top of the PCB, is the associated embedded antenna.
Onward. As I began to lift the PCB out of the chassis, the display popped out of position:
And at this point, I was also able to dislodge what had been rattling around underneath the PCB. Do you recognize it?
It’s the 2.5 mm sync connector, which acts as a comparatively “dumb” but still baseline functional alternative to the hot shoe for connecting the receiver to a strobe or other flash unit. It’s normally located next to the USB-C connector you recently saw behind the rubberized flap.
At this point, after all the shaking to get the sync connector out of the chassis, the power switch’s plastic piece also went flying:
I was initially only able to lift the PCB partway out of the chassis before it got “stuck”…that is, until I remembered (as with the earlier Godox transmitter) the two battery tabs connected to the PCB underside and sticking through the chassis to the battery compartment underneath:
Pushing them through the chassis from the battery compartment got to the desired end point:
The 2.5-mm sync connector site in the lower right corner of the PCB, below the USB-C connector, is obvious now that I knew what to look for! Rough handling by the Godox X1R-C’s prior owner had apparently snapped it off the board. I could have stopped at that point, but those screw heads visible atop the smaller PCB for the monochrome LCD were beckoning to me:
Removing them didn’t get me anywhere, until I got the bright idea to look underneath the ribbon cable, where I found one more:
That’s more like it:
The two halves of the display assembly also came apart at this point:
That pink-and-black strip is an elastomeric connector (also known by the ZEBRA trademark). They’re pretty cool, IMHO. Per the Wikipedia summary, they…:
…consist of alternating conductive and insulating regions in a rubber or elastomer matrix to produce overall anisotropic conductive properties. The original version consisted of alternating conductive and insulating layers of silicone rubber, cut crosswise to expose the thin layers. They provide high-density redundant electrical paths for high reliability connections. One of the first applications was connecting thin and fragile glass liquid-crystal displays (LCDs) to circuit boards in electronic devices, as little current was required. Because of their flexibility, they excel in shock and anti-vibration applications. They can create a gasket-like seal for harsh environments.

black conductor center to center distance 180 microns (7 mils)
Numbers on ruler are centimeters
Released to Public Domain by Wikipedia user Caltrop
May 13, 2009
Here’s a standalone view of the backplane (with LEDs and switches alongside it), once again showing the contacts that the elastomeric connector’s conductive layers mate up with:
And here are a few shots of the remainder of the monochrome LCD, sequentially ordered as I disassembled it, and among other things faintly revealing the contacts associated with the other end of the elastomeric connector:
Last, but not least, I decided to try reversing my teardown steps to see if I could reassemble the receiver back to its original seeming-functional (sync connector aside) condition:
Huzzah! The display backlight even still works. I’ll hold onto the sync connector, at least for now:
I might try soldering it back in place, although I don’t anticipate using anything other than the alternative hot shoe going forward. For now, I welcome your thoughts in the comments!
—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.
Related Content
- Scrutinizing a camera flash transmitter
- The Godox V1 camera flash: Well-“rounded” with multiple-identity panache
- Multi-source vs proprietary: more “illuminating” case studies
- Disclosing the results of a webcam closeup
The post Perceiving the insides of a wireless camera flash receiver appeared first on EDN.
Power Analyzer Definition, Types, Circuit, Working & Applications
A power analyzer is a specialized instrument used to measure electrical power in various systems, including AC and DC circuits. It can provide detailed insights into the power consumption, energy efficiency, and quality of electrical systems. Power analyzers are typically used to monitor and analyze parameters such as voltage, current, frequency, power factor, and harmonics, allowing users to evaluate the performance of electrical devices, circuits, and systems.
Types of Power Analyzers
- Single-Phase Power Analyzers
- Used for measuring power in single-phase systems.
- Commonly employed in homes and smaller industrial settings.
- Three-Phase Power Analyzers
- Designed for measuring power in three-phase systems.
- Used in industrial and commercial power systems where three-phase electrical systems are common.
- Portable Power Analyzers
- Compact, handheld devices that are easy to carry for field testing and maintenance.
- Used in applications where mobility is required.
- Benchtop Power Analyzers
- Larger, more precise instruments for use in laboratory settings or manufacturing environments.
- Offer advanced features for analyzing multiple parameters in high-accuracy settings.
- Digital Power Analyzers
- Use digital processing for high accuracy and fast measurements.
- Offer advanced features like harmonic analysis and power quality measurements.
- Power Quality Analyzers
- Specialized for monitoring power quality parameters such as harmonics, voltage sags, surges, and transients.
- Common in industrial settings to ensure stable operation of sensitive equipment.
A basic power analyzer circuit typically consists of the following components:
- Voltage Sensing Circuit: Measures the voltage across the load.
- Current Sensing Circuit: Measures the current flowing through the load.
- Signal Processing Unit: Converts the analog signals into readable data for display or further analysis.
- Microcontroller/Digital Processor: Manages the data and performs calculations like power, energy, and power factor.
- Display Unit: Shows the results of the power analysis (can be an analog meter or digital screen).
An example of a simplified block diagram could be represented as follows:
Power Source → Voltage Sensing → Current Sensing → Signal Processing → Data Display
Power Analyzer WorkingA power analyzer functions by assessing the electrical parameters of a system, such as voltage, current, and phase. The following provides a comprehensive explanation of its operation:
- Voltage Measurement: The analyzer measures the voltage across the load or circuit under test.
- Current Measurement: It also measures the current flowing through the load using a current transformer or shunt resistor.
- Power Calculation: Based on the voltage and current values, the analyzer calculates various power parameters, including:
- Active Power (P): The actual power utilized by the load to perform useful work.
- Reactive Power (Q): The energy that flows back and forth between the source and load without being converted into useful work.
- Apparent Power (S): The total power supplied to the load.
- Power Factor (PF): The ratio of active power to apparent power, indicating the efficiency of the system.
- Harmonic Analysis: For advanced models, the analyzer also detects harmonics and power quality issues, helping identify inefficiencies and system faults.
- Data Output: The results are displayed on a screen or sent to a computer for further analysis.
- Energy Efficiency Analysis
- Used to analyze and optimize the power consumption of industrial machinery, HVAC systems, and appliances to improve energy efficiency and reduce costs.
- Power Quality Monitoring
- Detects issues like voltage sags, surges, harmonics, and flickers that can affect equipment performance and lifespan.
- R&D and Testing
- In research and development, power analyzers are used to test new electrical devices, ensuring they meet performance and regulatory standards.
- Electric Vehicle (EV) Charging Stations
- Monitors the power used in EV charging infrastructure to optimize performance and ensure compliance with standards.
- Manufacturing
- Used in the testing of production lines, machinery, and equipment to ensure they operate within safe and efficient power limits.
- Renewable Energy Systems
- Analyzes the performance of solar panels, wind turbines, and other renewable sources to assess power output and efficiency.
- Consumer Electronics Testing
- Ensures that consumer electronic devices meet energy consumption standards and helps optimize power usage in devices like laptops, phones, and TVs.
- Grid Monitoring
- Used by utilities to monitor power supply networks, ensuring stability and efficient distribution of electricity across regions.
The post Power Analyzer Definition, Types, Circuit, Working & Applications appeared first on ELE Times.
AC to DC Converter Types, Formula and Examples
AC-DC converters are essential electronic circuits that transform alternating current (AC) into direct current (DC). These devices are integral to powering electronics such as computers, televisions, and smartphones, which rely on DC power for proper operation. The use of AC-DC converters is driven by the fact that AC is the standard power supply provided by utility companies, while many electronic devices are designed to function with DC power. By converting AC into DC, these converters enable electronic systems to run reliably and efficiently.
AC-DC converters are composed of essential components such as step-down transformers, switching devices like diodes and thyristors, passive filters comprising inductors and capacitors, and the load they supply. The choice of a specific AC-DC converter type depends on factors such as the required voltage and current output, as well as the desired efficiency and reliability of the system. Typical AC-DC converters include designs that incorporate transformers, diode-based rectifiers, and voltage regulation circuits.
One of the primary benefits of AC-DC converters is their ability to provide a stable and reliable DC power supply, which is vital for ensuring the consistent performance of electronic devices. By converting AC to DC, these converters deliver power with minimal fluctuations, supporting the smooth operation of the connected equipment. Additionally, AC-DC converters contribute to reduced energy losses and improved efficiency in electronic devices by enabling optimized power delivery.
Types of AC to DC Converters
AC to DC converters, also known as rectifiers, can be classified based on control, components, and application needs. Below is a detailed categorization:
- Uncontrolled Rectifiers
These rectifiers use diodes to convert AC to DC and provide a fixed output without control over the voltage or current.
Types:
- Half-Wave Rectifier
- Uses a single diode.
- Only one-half of the AC cycle is converted to DC.
- Simple and inexpensive but has a high ripple factor.
- Applications: Small, low-power devices.
- Full-Wave Rectifier
- Utilizes two diodes and a center-tapped transformer.
- The entire AC cycle is utilized for conversion.
- Applications: Moderate power supply requirements.
- Bridge Rectifier
- Uses four diodes in a bridge configuration.
- Converts both AC halves without needing a center-tapped transformer.
- Applications: Power supplies for appliances and electronics.
- Controlled Rectifiers
These rectifiers use controllable devices like thyristors or SCRs, allowing regulation of the output.
Types:
- Half-Controlled Rectifier
- Mix of diodes and thyristors.
- Partial control over the output.
- Applications: Medium-performance motor drives.
- Fully Controlled Rectifier
- All diodes are replaced by thyristors.
- The DC output can be precisely controlled by modifying the firing angles of the switching devices.
- Applications: Industrial equipment and variable-speed drives.
- Linear AC to DC Converters
These converters combine rectification with linear voltage regulation.
- Low-efficiency but provide highly stable and low-ripple DC output.
- Applications: Sensitive analog devices, lab equipment.
- Switch-Mode AC to DC Converters (SMPS)
Use high-frequency switching components to achieve efficient and compact designs.
- Buck Converters: Step down voltage.
- Boost Converters: Step up voltage.
- Buck-Boost Converters: Step up or down voltage as required.
- Applications: Computers, telecom systems, industrial automation.
- Special-Purpose Rectifiers
- Phase-Controlled Converters: Used in grid applications for HVDC power systems.
- Multiphase Rectifiers: Employ three-phase input for higher power levels.
- Inverter-Based Systems with Rectifiers: Combine DC-DC stages for renewable energy systems or battery chargers.
- Modern Integrated Converters
- Integrated circuits (ICs) that handle AC-DC conversion with multiple stages of regulation.
- Compact, energy-efficient, and widely used in IoT and portable devices.
AC to DC conversion is achieved through processes such as rectification and filtering. Below are the key formulas used in AC to DC conversion:
- Peak Voltage (VpeakV_{\text{peak}})
- DC Voltage Output
- Ripple Voltage
- Ripple Factor (γ\gamma)
- Efficiency (η\eta)
- Filtered DC Voltage
AC to DC converters are used in various applications, ranging from small household devices to industrial systems. Below are examples of different types of converters based on their applications:
- Consumer Electronics
- Phone Chargers
- Converts AC mains power (110-240V) to low-voltage DC (5-12V) for smartphones and tablets.
- Example: USB wall adapters.
- Laptop Power Supplies
- Converts AC to DC (typically 19V) to power laptops.
- Switch-Mode Power Supplies (SMPS) are commonly used due to their efficient performance and compact form factor.
- Televisions
- Internal AC-DC converters supply regulated DC voltages to various components of the TV.
- Automotive Applications
- Onboard AC-DC Converters
- In electric vehicles (EVs), these converters transform AC from charging stations into DC to charge the vehicle’s battery.
- Car Adapters
- Plug into vehicle cigarette lighter sockets to convert 12V DC (from the car battery) to DC output for devices like phones and GPS units.
- Industrial Systems
- Power Supplies for Control Systems
- Industrial automation systems use AC-DC converters to power programmable logic controllers (PLCs) and sensors.
- Rectifiers in Motor Drives
- Convert AC mains to DC for use in DC motor drives, enabling precise speed and torque control.
- HVDC Power Systems
- High Voltage DC (HVDC) transmission systems use large-scale rectifiers for long-distance power transmission.
- Renewable Energy Systems
- Solar Inverters
- Convert solar panel-generated DC power to AC, and include an AC-DC stage for storage systems.
- Wind Turbine Systems
- Convert AC generated by turbines to DC for battery storage or grid synchronization.
- Household Devices
- LED Lighting
- AC-DC drivers convert mains AC power to regulated DC voltage for LED lights.
- Power Adapters for Appliances
- Devices like routers, set-top boxes, and gaming consoles use AC-DC adapters to operate.
- Medical Equipment
- Imaging Systems
- CT and MRI scanners rely on AC-DC converters to provide a stable and noise-free DC power supply.
- Portable Medical Devices
- AC-DC converters supply regulated power to devices like ventilators and infusion pumps.
- Telecom and IT Infrastructure
- Base Stations and Servers
- Use high-capacity AC-DC converters to power servers and communication equipment with minimal energy losses.
- UPS Systems
- AC-DC converters charge batteries in Uninterruptible Power Supplies (UPS), ensuring backup power during outages.
The post AC to DC Converter Types, Formula and Examples appeared first on ELE Times.
OpenSTLinux, the superpower of the STM32 MPU ecosystem or the making of a great Embedded Linux distro
Author: STMicroelectronics
Why does ST care so much about OpenSTLinux? As microprocessors increasingly become the secret weapons of many integrators, an intuitive and powerful Embedded Linux distribution is like a superpower. Too often, decision-makers forget how critical the operating system is to the success of a project. However, developers know all too well how a spotty kernel, poorly written middleware, and unstable builds can slow efforts to a crawl. That’s why we’ve been expanding OpenSTLinux since its launch in 2019, both in scope and capability. At first glance, there are more packages, new distributions, and myriads of expansions. Let us, therefore, explore the OpenSTLinux ecosystem and why it has been such a strong supporting cast in the STM32 MPU story.

At the heart of OpenSTLinux is its Board Support Package (BSP), which has significantly matured since its initial release. To ensure the integrity and security of the system, the ST BSP uses a boot chain based on Trusted Firmware for Cortex-A and U-Boot. It ensures that OpenSTLinux takes advantage of the protection mechanisms available in Cortex-A cores to guarantee the system’s integrity at its lowest level. OpenSTLinux BSP also includes an open portable trusted execution environment (OP-TEE), which isolates secure code from the rest of the system. As a result, developers immediately benefit from extensive protections that guard the system configuration, resource management, and other critical services.
Avid readers of the ST Blog know that we have multiplied the security initiatives from STM32Trust, which provides documentation and code to help with various security implementations, to updating STM32CubeProgrammer to make secret provisioning more accessible on all our microprocessors. The new STM32MP2 even targets SESIP Level 3 certification to help makers provide concrete security guarantees to users. The OpenSTLinux BSP’s focus on ensuring the system’s integrity is thus a natural manifestation of our efforts to make security more accessible and ubiquitous. It’s also why we continue to mainline all our drivers to the Linux kernel. We want the open-source community to audit our work so we can respond rapidly to their feedback.
A close partnership with the open-source communityIndeed, since the launch of OpenSTLinux, ST has adopted the philosophy that upstreaming is in everyone’s best interest. There are security benefits and long-term support opportunities for companies looking to maintain systems over decades. It can also help developers standardize APIs to promote interoperability. Hence, OpenSTLinux is more than an OS for ST MPUs; it is a desire to lower the barrier to entry to embedded systems by facilitating secure and long-term developments. Put simply, we want to leverage the expansive capabilities of Linux while ensuring compatibility and support for our hardware so developers can release their products to market faster.
It’s also why ST has added support for Buildroot. Initially, we focused our efforts on Yocto, and we still do. It’s often the de facto way to create a Linux-based system for industrial or niche applications. However, over the years, we heard from many in our communities who came from different backgrounds. Hence, we collaborated with Bootlin, a member of the ST Partner Program, to come up with an OpenSTLinux BSP based on OpenWRT. It’s also why we developed new OpenSTLinux-based distributions, such as OpenSTDroid and others based on OpenWRT and OpenBMC. Put simply, as more communities adopt OpenSTLinux and STM32 MPUs, we try to meet developers where they are.
What makes a great ecosystem? Specific packages for all stages of development
The best introduction to OpenSTLinux is with an evaluation board and a Starter package. It’s a pre-built image with all the drivers and modules necessary to run the OS from an SD Card or the embedded flash. It ensures developers can run the OS on their development board in minutes. Users don’t even need an IDE. They just boot up and start testing the operating system, run scripts, connect to the Internet, and more. Our STM32 MPU Wiki even provides a step-by-step guide to run the Starter Package on an STM32MP25 or an STM32MP15 board.
OpenSTLinux also comes in two other packages: Developer and Distribution. As the name suggests, the Developer Package targets ongoing projects. Programmer can use it to start writing and testing their applications. It, therefore, comes with an SDK, the source code for the MPU’s firmware, and more. It sits on top of the Starter Package and will help hasten developments. Afterwards, when teams approach production, they can download the Distribution package. It’s the most barebones version out of the three and is meant to be the most optimized OpenSTLinux version the system will run in the field. It is also possible to customize the Distribution package to create a unique Developer or Starter kit specific to a project or company.
Moreover, the OpenSTLinux BSP comes with all the services and modules enabling developers to work with STM32Cube Packages meant to run on the Cortex-M co-processor of the STM32MP15 or STM32MP2. Indeed, being able to isolate certain applications or benefit from a real-time operating system alongside the embedded Linux distribution on the Cortex-A meant that developers could transition more easily from their MCU to their MPU, reuse code, and tailor their system to take advantage of both worlds. By integrating STM32Cube Packages into OpenSTLinux BSP, we ensure developers have the tools they need to optimize their workflow, especially if they are already familiar with our ecosystem on our STM32 MCUs.
Numerous expansion packages to facilitate developmentsFinally, ST continues to release new OpenSTLinux expansion packages to accelerate developments further. From X-LINUX-AI, which helps with machine learning applications, to X-LINUX-RT to approximate real-time execution, X-LINUX-PRDMNT for predictive maintenance, X-LINUX-GNSS1 for cellular connections, X-LINUX-AWS to connect to Amazon Web Services, and X-LINUX-NFC6 for contactless systems, there’s a package for a wide range of development needs. And the ecosystem keeps growing. While some competing ecosystems struggle to provide a reliable Linux distribution for their Arm microprocessor, OpenSTLinux is so dependable and extensive that we are now focusing on helping developers with their features outside the OS.
The post OpenSTLinux, the superpower of the STM32 MPU ecosystem or the making of a great Embedded Linux distro appeared first on ELE Times.
Powering Your Drive: A Comprehensive Guide to Trickle Chargers
In the realm of automotive care, there’s a little hero that often goes unnoticed but is crucial for the longevity and reliability of your vehicle’s battery. Yes, you guessed it – we’re talking about the trickle charger. This device may not seem like the most glamorous tool in your garage, but its role is pivotal in ensuring that your vehicle is ready to go when you are.
Understanding the Role of a Trickle Charger
Have you ever planned a delightful road trip, invited friends over, and then discovered that your car wouldn’t start? This frustrating situation often occurs due to a discharged battery – a common issue for vehicles that aren’t used regularly. This is where a trickle charger comes into play.
A trickle charger is a type of battery charger that delivers a small, steady stream of electricity to your battery. Unlike standard chargers that can quickly replenish a battery’s power, trickle chargers are designed to maintain a battery’s charge over extended periods. They do this by compensating for the natural rate of battery discharge, thus ensuring that your vehicle’s battery remains in peak condition, even if you don’t drive it for weeks or months at a time.
Choosing the Right Trickle Charger for Your Needs
Selecting the right trickle charger can be likened to choosing a candle for a serene evening. Just as you would select a candle’s scent and size based on the mood you wish to create and the size of the room, choosing a battery trickle charger requires similar consideration. You need to assess the type and size of your battery, as well as how often and for how long you’ll use the charger.
For most standard vehicles, a simple 12-volt charger with an output of about 1 to 2 amps will suffice. However, for larger vehicles or those with special battery requirements, you may need a charger with different specifications. Always ensure that the charger you choose is compatible with your vehicle’s battery to avoid potential damage.
How to Use a Trickle Charger
Using a trickle charger is not particularly complicated, but it is instructive to know the correct steps to ensure safety and efficiency. First, ensure your vehicle is in a safe, static position – preferably in a garage or a similar sheltered area. Next, connect the charger to your battery; red to positive, black to negative. Most modern trickle chargers come with a monitoring system that prevents overcharging, but it’s wise to periodically check on the progress to ensure everything is functioning as expected.
Remember the story of the novice chef who tried to melt chocolate without a double boiler, leading to a burnt, unsalvageable mess? Similarly, skipping steps or rushing the charging process can lead to battery damage. Just as the chef learned to follow instructions carefully for perfect results, so should you take your time to properly connect and set up your trickle charger.
Maintenance and Safety Tips
Maintaining your trickle charger is not demanding, but it deserves attention. Always keep the charger clean and dry, store it in a safe place, and inspect the cables and clamps regularly for wear and tear. Safety is paramount when dealing with electrical devices and car batteries. Always follow the manufacturer’s instructions carefully, wear protective gear if necessary, and ensure the charging area is well-ventilated.
Why a Trickle Charger is an Essential Tool for Every Garage
Imagine planning a relaxing weekend getaway. Your bags are packed, your itinerary is set, and you’re ready to escape the hustle and bustle of everyday life. The last thing you want is to be held back by a vehicle that won’t start. A trickle charger ensures that your battery is charged and ready, providing peace of mind and reliability.
Just as a candle can transform an ordinary room into a cozy sanctuary, a trickle charger can transform your vehicle maintenance routine from reactive to proactive. By maintaining your battery consistently, you extend its life and performance, reduce waste, and save money in the long run.
So, whether you’re an occasional driver, own a classic car, or simply want to ensure your vehicle is always ready to roll, a trickle charger is not just a tool—it’s an investment in your vehicle’s longevity and reliability. Embrace this indispensable gadget and drive with confidence, knowing that your battery’s health is in good hands.
The post Powering Your Drive: A Comprehensive Guide to Trickle Chargers appeared first on Electronics Lovers ~ Technology We Love.
Zig-zag transformers

Three phase power transformer secondaries that are set up in a delta configuration do not have an earthing or grounding point. By contrast, a wye configuration of windings would provide such a point, but delta windings are frequently the transformer designer’s choice (Figure 1).
Figure 1 Wye versus delta transformer secondaries.
Where the three coils of the wye configuration meet, a ground or earth connection can be established, but the three secondary coils of the delta configuration offer no such point.
In such cases, an earthing point can be established using a zig-zag transformer as in the following sketch in Figure 2.
Figure 2 A zig-zag transformer with an established earthing point.
The origin of the phrase “zig-zag” would seem to be self-evident. The underlying theory of zig-zag transformers and additional discussions of its characteristics have been written up extensively as shown in its Wikipedia page.
Looking at this device feeding just a single load (Figure 3), we can see how earthing can be achieved when power is fed from delta secondaries.
Figure 3 A zig-zag transformer with an earthed load with power fed from delta secondaries.
John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).
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The post Zig-zag transformers appeared first on EDN.
Who will get Altera in 2025?

While the news about Altera being up for grabs isn’t new, there are fresh bytes on its sale to either an FPGA industry player like Lattice Semiconductor or private equity firms such as Francisco Partners, Silver Lake Management, and Bain Capital. Altera’s transition from Intel’s lap to an independent entity is all set, and the only hiccup is money.
Start with Lattice, whose market value is $8 billion. So, to acquire Altera, Lattice will inevitably need a financial partner. On the other hand, proposals from private equity firms value Altera at $9 billion to $12 billion, far below the $17 billion Intel paid to acquire it.
Altera, which once made the FPGA duopoly along with Xilinx, was acquired by then-cash-rich Intel in 2015. This sparked a guessing game in the semiconductor industry regarding why the CPU kingpin had grabbed an FPGA player. Archrival AMD followed suit by snapping Xilinx in 2020.
However, while industry watchers were mulling over the ultimate objectives of CPU makers acquiring the FPGA business and how it could potentially relate to their server and data center roadmaps, trouble started brewing at Intel. Next, we heard about Intel considering to spinning off Alter to deal with its capital crunch. The decision was made by then-CEO Pat Gelsinger.
Figure 1 Sandra Rivera has been named the CEO of Altera. Source: Intel
According to a new Bloomberg report, Intel has shortlisted several buyout firms for the next phase of bids and has set a deadline of the end of January for bidders to formalize their offers. However, while the Santa Clara, California-based chipmaker seems committed to executing Altera’s spin-off, the price tag has become a stumbling block.
Intel’s co-CEO and former CFO David Zinsner has hinted about a way out if Intel doesn’t get a financially viable offer. He mentioned the possibility of a deal like IMS Nanofabrication, an industry leader in multi-beam mask writing tools required to develop extreme ultraviolet lithography (EUV).
In June 2023, Intel sold 20% of its stake in IMS to Bain Capital in a deal that valued IMS at around $4.3 billion. Three months later, Intel sold an additional 10% stake in IMS to TSMC. We’ll see in 2025 which way things go, but it’s worth remembering that Intel doesn’t have an enviable history regarding acquisitions.
Figure 2 Altera continues to launch an array of FPGA hardware, software, and development tools to make its programmable solutions more accessible across a broader range of use cases and markets. Source: Intel
Founded in 1983, Altera is an important company. So, at a time when the AMD-plus-Xilinx combo is doing well, it’s crucial to watch how the future of Altera 2.0 is shaped in 2025. A successful outcome will provide Intel with a much-needed cash boost and offer Altera greater independence to proactively innovate in the FPGA design realm.
Related Content
- Intel to Buy Altera for $16.7B
- Intel, Altera End Acquisition Talks
- Intel to Accelerate Altera, Says CEO
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Digital Twins on the Way to Transform the Future of Smart Factories
In the dynamic realm of Industry 4.0, digital twins have established themselves as a revolutionary technology. They are reshaping how industries design, operate, and maintain their processes and equipment. A digital twin is a digital model of a physical system, process, or product that enables real-time analysis, monitoring, and optimization. In smart factories, digital twins are not just a technological advancement but a strategic enabler of efficiency, agility, and innovation.
What Are Digital Twins?
Digital twins combine data from the physical world with advanced modeling and analytics to create an accurate digital counterpart. Using Internet of Things (IoT) sensors, real-time data is continuously fed into the digital model, ensuring it remains synchronized with its physical counterpart. This real-time feedback loop allows manufacturers to monitor operations, predict outcomes, and make data-driven decisions.
Key components of a digital twin include:
- Physical Entity: The actual machinery, system, or process being modeled.
- Digital Model: A detailed virtual representation of the physical entity.
- Data Interface: Real-time data from IoT sensors, processed through advanced analytics and machine learning algorithms.
Transformative Impact on Smart Factories
Digital twins have revolutionized several aspects of smart manufacturing:
- Enhanced Predictive Maintenance
- Conventional maintenance schedules frequently lead to either excessive upkeep or unforeseen equipment failures. Digital twins, powered by IoT data and AI-driven analytics, enable predictive maintenance by identifying potential issues before they escalate. This minimizes downtime, prolongs equipment lifespan, and enhances resource utilization.
- Improved Production Efficiency
- Digital twins provide real-time insights into manufacturing processes, helping identify bottlenecks and inefficiencies. By simulating various scenarios, manufacturers can optimize workflows, improve quality control, and reduce waste.
- Accelerated Product Development
- Virtual prototyping through digital twins allows engineers to test and refine designs without the need for physical prototypes. This speeds up the development process, lowers costs, and enhances product performance and reliability.
- Dynamic Supply Chain Management
- Digital twins offer end-to-end visibility of the supply chain, enabling real-time tracking of inventory, logistics, and supplier performance. This ensures timely deliveries and minimizes disruptions, enhancing overall supply chain resilience.
- Employee Training and Simulation
- Virtual environments created by digital twins serve as effective training tools for employees. Workers can simulate complex processes and emergency scenarios in a risk-free environment, improving their preparedness and productivity.
Technologies Driving Digital Twins
The implementation of digital twins relies on a convergence of cutting-edge technologies:
- IoT Sensors: Enable continuous data collection from physical assets.
- Cloud Computing: Offers the infrastructure required to manage and process large volumes of data efficiently.
- Artificial Intelligence (AI) and Machine Learning (ML): Analyze data patterns, predict outcomes, and optimize processes.
- Edge Computing: Enables real-time data processing directly at the source, minimizing latency.
- Augmented Reality (AR) and Virtual Reality (VR): Improve visualization and interaction with digital twins.
While the benefits of digital twins are compelling, their adoption is not without challenges:
- Integration Complexity: Combining data from legacy systems, IoT devices, and cloud platforms can be technically challenging.
- Data Security: The reliance on real-time data exchange raises concerns about cybersecurity and data integrity.
- High Initial Costs: The development and implementation of digital twins require substantial investment in technology and infrastructure.
- Skill Gaps: Organizations often need to upskill their workforce to effectively utilize digital twin technologies.
Future Outlook
The capabilities of digital twins will grow as technology continues to advance. Advances in AI, 5G, and edge computing are expected to make digital twins more accessible and efficient. In addition, the integration of digital twins with blockchain technology can enhance data security and traceability, particularly in supply chain management.
By 2030, digital twins are projected to be a cornerstone of Industry 5.0, where human-machine collaboration will redefine manufacturing paradigms. They will play a crucial role in creating sustainable, resilient, and highly adaptive industrial ecosystems.
Conclusion
Digital twins are undeniably a game-changer for smart factories, enabling manufacturers to achieve unprecedented levels of efficiency, innovation, and competitiveness. By bridging the physical and digital worlds, they empower organizations to make informed decisions, reduce risks, and drive continuous improvement. As industries increasingly embrace this technology, digital twins will be instrumental in shaping the future of manufacturing and beyond.
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I designed this ATmega32U4 control board specifically for Pedro, my 3D-printed robotic arm.
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Analog vs Digital Electronics – Difference and Comparison
Analog electronics focuses on the study and manipulation of continuous signals through circuits specifically designed to handle them. These signals can vary smoothly over a range, representing physical quantities like temperature, pressure, sound, or light intensity. Analog circuits use components like resistors, capacitors, inductors, and transistors to amplify, filter, or modulate these signals. Applications include audio amplifiers, radio receivers, and sensors for real-world measurements. Analog systems are valued for their high-resolution processing but are more susceptible to noise and distortion compared to digital systems.
Digital electronics is a branch of electronics that deals with discrete signals represented in binary form (0s and 1s). It uses components like logic gates, flip-flops, microprocessors, and memory to process, store, and transmit digital data. Digital circuits are less susceptible to noise, allow for precise operations, and are widely used in devices like computers, smartphones, digital watches, and IoT systems. They enable fast, efficient, and reliable processing of information.
Analog vs Digital Electronics: Key Differences and Comparison
Feature | Analog Electronics | Digital Electronics |
Signal Type | Processes continuous signals. | Processes discrete signals (binary: 0 and 1). |
Representation | Uses waveforms or continuously varying signals. | Uses binary numbers (0s and 1s). |
Examples of Signals | Audio signals, temperature, pressure. | Computer data, digital audio, and images. |
Accuracy | High resolution with theoretically infinite precision. | Limited by step size; approximations are common. |
Complexity | Relatively simple circuits but prone to noise. | More complex circuits but less affected by noise. |
Components | Resistors, capacitors, inductors, transistors, diodes. | Logic gates, flip-flops, microprocessors, memory chips. |
Applications | Audio amplifiers, radio tuners, temperature sensors. | Computers, digital watches, smartphones, microcontrollers. |
Noise Susceptibility | Highly susceptible to noise and signal degradation. | Less affected due to discrete nature of signals. |
Signal Manipulation | Difficult to process, requiring analog circuitry. | Easier to process with algorithms and digital circuitry. |
Storage | Stored using physical properties (e.g., magnetic tapes). | Stored as binary data in digital storage devices (e.g., SSDs). |
Processing Speed | Limited by signal nature and physical properties. | Fast processing enabled by advanced digital systems. |
Cost | Often less expensive for simple systems. | Typically higher due to complexity but decreasing with scale. |
Power Consumption | Higher due to continuous operation. | Lower due to binary switching. |
Error Correction | Difficult to implement. | Easier with error-detection and correction algorithms. |
Summary of Differences
- Nature of Signals: Analog systems deal with smooth, continuous signals, while digital systems handle binary data, enabling more robust processing and storage.
- Design and Complexity: Analog circuits are simpler but more susceptible to noise, while digital circuits are more complex yet provide higher accuracy and resilience.
- Applications: Analog systems excel in real-world measurements like temperature and sound, whereas digital systems dominate computing, communication, and modern technology.
Use Cases
- Analog Electronics: Audio amplifiers, radio systems, and sensors for temperature or pressure.
- Digital Electronics: Computers, IoT devices, smartphones, and digital communication systems.
Both analog and digital electronics are essential, often complementing each other in hybrid systems like analog-to-digital converters (ADCs) and digital-to-analog converters (DACs).
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Digital Integrated Circuits Definition, Examples & Applications
A digital integrated circuit (IC) is a compact electronic device that integrates several digital electronic components onto a single semiconductor chip. Each IC is typically designed for a specific function, ranging from simple tasks like performing a logical AND operation on three inputs to more complex operations like decoding inputs to activate one of several outputs. Digital ICs can also encompass highly sophisticated components like microprocessors.
Integrated circuits are broadly categorized into two types: digital and analog. Analog ICs process continuous signals, which represent varying quantities like audio, temperature, or pressure, over a continuous range of values (e.g., any number between 0 and 10, including decimals like 1.2 or 3.456). In contrast, digital ICs handle discrete signals, which are limited to binary values of 0 and 1. These signals, often called switching circuits, operate within two defined voltage levels—high and low—representing binary states. A discrete signal moves in steps between values, unlike a continuous signal, which flows smoothly. For instance, a discrete signal could represent whole numbers between 0 and 10, while a continuous signal might include any fractional values within that range. Sampling a continuous signal can generate a discrete signal.
Digital ICs incorporate elements like flip-flops, multiplexers, and logic gates, which facilitate their operation. While the complexity and functionality of these circuits can vary, they are often economical and relatively simple to design. Digital ICs are also found in linear and radio frequency (RF) integrated circuits, further broadening their applications.
Modern digital ICs include diodes, microprocessors, and transistors, each serving specific roles like voltage storage, current control, and memory. With modern circuits containing over a billion transistors, integrated circuits play a crucial role in achieving functionality and efficiency. They are highly reliable and cost-effective, making them indispensable in today’s electronic systems.
Examples of Digital Integrated Circuits
- Logic Gates:
- AND, NOT, OR, NAND, XOR, XNOR, NOR gates.
- Example: 7400 series NAND gate (TTL logic).
- Microprocessors:
- Perform computation and control in computers and embedded systems.
- Example: Intel 8086, ARM Cortex processors.
- Microcontrollers:
- Integrated systems combining a CPU, memory, and peripherals.
- Example: Arduino (based on ATmega328P), ESP32.
- Memory Chips:
- Store digital information in various formats.
- Example: SRAM, DRAM, Flash memory chips.
- Digital Signal Processors (DSPs):
- Optimize mathematical computations for signals.
- Example: Texas Instruments TMS320 series.
- Field-Programmable Gate Arrays (FPGAs):
- Configurable digital ICs for custom logic designs.
- Example: Xilinx Spartan series.
- Application-Specific Integrated Circuits (ASICs):
- Custom ICs for specific applications.
- Example: Bitcoin mining chips.
- Timing and Control ICs:
- Manage the timing of signals.
- Example: 555 Timer in astable or monostable mode.
Applications of Digital Integrated Circuits
- Computing and Consumer Electronics:
- Laptops, desktops, and smartphones.
- Examples: Microprocessors, GPUs, and memory ICs.
- Communication Systems:
- Modems, routers, and mobile networks.
- Examples: DSPs, transceivers.
- Industrial Automation:
- Robotics and control systems.
- Examples: Microcontrollers, ASICs.
- Automotive:
- Advanced driver-assistance systems (ADAS), infotainment, and sensors.
- Examples: FPGAs, microprocessors.
- Aerospace and Defense:
- Navigation systems, signal processing, and avionics.
- Examples: Radiation-hardened ASICs, FPGAs.
- Healthcare:
- Medical imaging, portable diagnostic devices, and wearable health tech.
- Examples: Microcontrollers, ASICs.
- Smart Home and IoT Devices:
- Smart thermostats, light switches, and security systems.
- Examples: Microcontrollers like ESP8266, ASICs for IoT.
- Data Centers and Cloud Computing:
- Server processors, storage controllers, and network interface cards.
- Examples: Memory ICs, high-performance FPGAs.
Digital ICs are crucial in almost all modern technology sectors, driving innovation and enabling advanced functionalities.
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My early teenage soldering from 20 years ago is still going strong. The first PCB I ever soldered was this kit.
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