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Команда КПІ пройшла відбір до програми MInT-Ukraine!

Новини - 4 години 57 хв тому
Команда КПІ пройшла відбір до програми MInT-Ukraine!
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kpi пн, 09/28/2026 - 18:40
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🇺🇦🇩🇪 Команда Кафедри технології неорганічних речовин, водоочищення та загальної хімічної технології ХТФ пройшла відбір у межах програми «Micro-Credentials as an Internationalisation Tool for Ukrainian Universities» в межах програмної лінії DAAD.

✍️ Дистанційний режим

Новини - 6 годин 4 хв тому
✍️ Дистанційний режим kpi пн, 09/28/2026 - 17:33
Текст

Опубліковано Розпорядження № RP/202/26 від 28.09.2026 р. "Про заходи щодо організації та проведення освітнього та робочого процесів у вересні – жовтні 2026 року".

Київські політехніки відпрацювали алгоритми дій у надзвичайних ситуаціях

Новини - 6 годин 9 хв тому
Київські політехніки відпрацювали алгоритми дій у надзвичайних ситуаціях
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KPI4U-2 пн, 09/28/2026 - 17:28
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✅ Під час щорічного спеціального об’єктового тренування в КПІ ім. Ігоря Сікорського перевірили готовність університету до різних сценаріїв.

Wolfspeed adds Premium power substrates to 200mm silicon carbide portfolio

Semiconductor today - 6 годин 16 хв тому
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced the commercial availability of its new Premium 200mm n-type silicon carbide substrate, expanding its 200mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability...

Fraunhofer IAF develops broadband distributed amplifier MMIC for data centers, measurement systems and sensors

Semiconductor today - 6 годин 22 хв тому
Fraunhofer Institute for Applied Solid State Physics IAF of Freiburg, Germany has developed a broadband distributed amplifier monolithic microwave integrated circuit (MMIC) chip suitable for use in data centers, measurement systems and sensors. Modern data centers, high-precision measurement systems and high-resolution radar sensors rely on extremely broadband amplifier chips that feature both low noise and high output power...

📣 Engineering Project Sprint 2026

Новини - 6 годин 37 хв тому
📣 Engineering Project Sprint 2026
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kpi пн, 09/28/2026 - 17:00
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EPS 2026 — це формат, у якому учасники проходять повний шлях від отримання технічного завдання до презентації готового рішення або прототипу.

LED PoV Stick: A Portable Display for Live Performances

Open Electronics - 7 годин 38 хв тому

A portable LED stick that turns into a persistence-of-vision (PoV) display. Wren Weichman built it to create visual effects during live performances: you spin it by hand, and a camera with a long exposure captures spectacular images and videos. The result is digitally controlled light painting, with a quality far superior to classic manual tools.

The heart of the project is a strip of addressable RGB LEDs mounted along the stick. The LEDs flash rapidly as the user rotates the instrument. Persistence of vision makes the human eye perceive a solid shape, but to capture the effect you need video recording with a long exposure, about a quarter of a second per frame. This way, each shot collects the complete light trail.

LED control and rotation

A Teensy 4.1 manages the LEDs, maintaining the correct refresh rate. The board is powerful enough to drive hundreds of RGB LEDs without dropping frames. Additionally, an IMU monitors the stick’s rotation speed at all times. Thanks to this data, the Teensy adjusts the timing of color changes and brightness, so the image stays stable even when rotation is not uniform.

The typical rotation speed of a desktop PoV display is about 2,000 RPM. A hand-operated stick never reaches a constant speed, so motion detection is essential. The IMU provides real-time measurements, and the Teensy adapts each frame to the instantaneous speed. This approach eliminates distortions and makes the image readable even with irregular movements.

For communication with a smartphone, the project uses an ESP32. The board lets you set LED animation effects from a dedicated app, without rewiring anything. An ESP32 module with a TFT touch display could make effect selection even more convenient, integrating the control directly on the stick. In any case, the Teensy and ESP32 pair covers both processing and connectivity well.

Power and weight balance

The stick is powered by batteries placed at the ends. This choice is not random: the batteries balance the instrument’s weight, making rotation smoother and less tiring. Moreover, the mass distribution helps maintain a stable trajectory during movement, a crucial factor for the quality of the final image.

The project demonstrates how PoV display principles can be adapted to a portable, hand-operated device. The main challenges are variable speed and motion detection. Wren Weichman overcame them with creative techniques, combining powerful hardware and real-time compensation algorithms.

For those who want to experiment with motion sensors, a 3-axis accelerometer with ADXL345 is an excellent starting point. It offers precise measurements and a simple interface to integrate with microcontrollers. Alternatively, a 3-axis accelerometer in Blebrick format mounts easily on breadboards and rapid prototypes.

The LED PoV stick combines electronics, programming, and performance art. It is not just a gadget: it is a concrete example of how to adapt established technologies to a new context. Speed management via IMU is an excellent educational case, as is the use of a powerful microcontroller like the Teensy 4.1 for LED control.

Furthermore, the project opens the door to numerous variations. You can change the number of LEDs, increase resolution, or add synchronized sound effects. The hardware base is solid and modular, so every maker can customize it without rewriting everything from scratch. The project video documents every step in detail.

In summary, this stick proves that persistence of vision works even without motors and fixed supports. Manual skill becomes part of the artwork, and technology compensates for the imperfections of the gesture. A project worth studying, both for the technical skills and for the visual result.

  • Teensy 4.1 for controlling addressable RGB LEDs
  • IMU for monitoring rotation speed
  • ESP32 for smartphone communication
  • Batteries at the ends for power and balance

Source: https://youtu.be/GZVfNMVYYRY?si=8xgRLVamI6LgN70d

The post LED PoV Stick: A Portable Display for Live Performances appeared first on Open Electronics.

TP-Link’s Tapo P115: Smart plug subtracts Apple, adds energy tracking

EDN Network - 8 годин 37 хв тому

Take a baseline device, remove a subsequently added protocol and replace it with a function, and…you end up with a bigger-than-expected revision?

As I alluded to in a blog post a week-and-a-half back, I’m nearing the finish line of my teardown series on TP-Link smart plugs. As I mentioned last month, my basic aspiration with this project is to ascertain to what degree (if any) differences in the company’s various smart plug products’ feature sets, broadly between the Kasa and Tapo product lines as well as between products within a given line, are due to hardware variability versus (or in addition to) software-implemented inconsistency.

As such, today’s entry ended up being a deviation from the to-date norm, therefore a pleasant surprise. But I don’t want to ruin it for all of you via a premature reveal, so I’ll keep my cyber-lip zipped for the moment. Here’s the so-far published dissection list:

Revisiting another last-month comment, again note that hardware changes can be driven not only by evolving feature set requirements but also by phaseout and replacement of building block components inside these devices. To wit, hold that thought.

Unpacking the patient(s)

Today’s dissection victim is TP-Link’s Tapo P115, a two-pack of which set me back $13.77 during a Thanksgiving 2025 Amazon Resale (formerly Warehouse) used-goods promotion.

Like last month’s Tapo P125, it shares a common form factor with the baseline Tapo P105 I took apart in early June.

But as the above “stock” photo highlights, whereas the Tapo P125 had built on the Tapo P105 foundation with added Apple Homekit support, today’s Tapo P115 instead focuses its enhancement energy on energy monitoring and logging specifically. As such, it’s conceptually akin to the prior-gen Kasa EP25, again with energy monitoring, that went “under the knife” back in March.

What, if any, hardware commonality exists between the Kasa EP25 and Tapo P115? As well as, for that matter, between the Tapo P105 and Tapo P115? Let’s find out, as usual starting with some outer box shots, again accompanied by a 0.75′′/19.1 mm diameter U.S. penny for size comparison purposes.

The Amazon Resale-origination identifying sticker added to the bottom panel left unobscured the hardware version, v1.6. TP-Link’s support page indicates that this is the latest-and-greatest revision, with a v1.26 predecessor. Why do I care about such seeming minutia? I’ll remind you of my early-March coverage of the Kasa EP10, wherein I detailed (for the first time, but definitely not the last) version-based functional shortcomings both in an absolute sense and in “smart home”-striving combination with same-name devices containing different-version hardware.

Picking patient

As was the case last month, opening the packaging and perusing the contents revealed evidence of prior-customer access and device removal, leading me to select that same device for analysis (the one on the left, if not already obvious).

Last month’s noted cuteness continues unabated, of course.

And now, finally free from its cardboard captivity, here’s our patient.

Once again, as is the case with the box containing it, the device’s bottom side is the most informative perspective, revealing factoids including the always-helpful FCC ID (2BCGWP110).

Diving inside

Here’s a vendor-supplied conceptual cutaway to whet your appetite for what’s next (regular readers of my teardowns already know how much I love coming across and sharing these).

How closely (or not) does this marketing creation (or abomination?) match what our eyes see when they peruse the actual insides? Let’s find out.

The inside of the back half of the enclosure is, as usual, bland and boring (unless you’re a plastics specialist, I suppose).

The other half, on the other hand…that’s more like it (including an under-penny further peek) for an electrical engineer like you and me.

Much of it is reminiscent of what we’ve seen before. Here’s the top-side view.

Once again, the relay is a Churod A16-V-105DA2F, although in comparison to its Tapo P125 cousin, it’s 90° rotated and downward shifted location-wise on the PCB this time.

Bottom side view next.

Now to the right.

And the left…wait, what’s this?

Silicon and broader software swaps

The Shanghai Belling BL0937 single-phase energy monitoring IC at right is the same as the one previously seen in the Kasa EP25. Below it is yet another five-lead SOT-packaged IC, presumably housing a dual-transistor combo and seen multiple times before, this time labeled as follows:

JWM3J
5G5hG

And in the middle is, once again, a switch alongside an LED. But check out the processor at left! In every other TP-Link smart plug I’ve taken apart so far, it has come from Realtek Semiconductor and is based on an Arm architecture. This time, in contrast, it’s the RISC-V-based Espressif Systems ESP8684.

The very first page of the datasheet clears up another discrepancy I’d noted; seemingly no discrete flash memory device anywhere on the mini-PCB this time. Instead, the documentation tipped me off that there’s “Optional 2 MB or 4 MB flash in the chip’s package”.

All of which leaves me with no shortage of questions, which do not include the contents of the as-usual difficult-to-access PCB underside (as usual, it’s quite bare, as far as I can tell, and FCC certification photos can fill any nagging knowledge gaps for the curious among you out there).

These questions include (but are not limited) to the following:

  • Previously, in transitioning from the conventional Tapo HS103 to the energy-monitoring Tapo EP25, TP-Link migrated from a single- to dual-core Realtek Arm-based chip. To what degree, if any, was a similar performance-boost need behind this more significant shift?
  • Were, as I alluded to at the beginning, product shortages or more definitive device phaseouts factors in this particular more significant change of supplier and architecture?
  • And to what degree, if any, was a desire to shift to a royalty-free, fully open-source processor architecture behind this design decision, keeping in mind the substantial software porting effort that would be required for TP-Link to actualize its aspiration?

I daresay I’m not likely to get any answers from TP-Link if I inquire, so I doubt I’ll even bother. Or from either Espressif Systems or Realtek, for that matter. But I’m guessing at least a one of you out there has a tangible clue as to what’s going on. Tips, either passed on to me anonymously over email or publicly in the comments, are greatly appreciated!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

The post TP-Link’s Tapo P115: Smart plug subtracts Apple, adds energy tracking appeared first on EDN.

OMRON S8NR: IP67 power supplies with built-in diagnostics on the machine

Open Electronics - 10 годин 38 хв тому

OMRON introduces the new S8NR series of IP67 power supplies, designed for direct installation on the machine, including outside the electrical cabinet. Available from 90 W to 600 W at 24 V DC, the range includes 360 W and 600 W models able to integrate up to six individually protected outputs in a single device, cutting components, wiring and design complexity. Paired with it, the new S8R-BB DC Blocking Box brings the same logic to control circuits as well, making it possible to complete both power and safety wiring outside the cabinet.

Simplified installation on the machine

The solution is designed to make systems easier to install, monitor and maintain. The digital display and the LEDs for each output show voltage, current and alarms in real time, while IO-Link communication makes data and configurations accessible remotely.

Predictive maintenance and IO-Link connectivity

The predictive maintenance function also monitors the remaining life of the internal capacitors, helping to schedule servicing before a potential failure. Thanks to Smartclick connectors and the ability to precisely adjust thresholds and output start-up sequences, the S8NR and S8R-BB support a tidier design and shorter installation times.

Range and key features

The S8NR series is available from 90 W to 600 W at 24 V DC. The 360 W and 600 W models can integrate up to six individually protected outputs, with immediate diagnostics via a dedicated display and LEDs. IO-Link connectivity provides remote access to operating data and configurations, while monitoring the condition of the capacitors helps plan maintenance before any downtime.

OMRON S8R-BB DC Blocking Box for IP67 power supplies with diagnostics on the machineOMRON’s S8R-BB DC Blocking Box, which extends the out-of-cabinet wiring approach already used for power to control circuits.

More information is available on the OMRON website.

The post OMRON S8NR: IP67 power supplies with built-in diagnostics on the machine appeared first on Open Electronics.

Pixels, power, and physics: Unlocking the fundamentals of thermal imaging

EDN Network - 12 годин 9 хв тому

Thermal imaging sits at the intersection of science and engineering, where invisible heat patterns are transformed into visible insights. By harnessing the physics of infrared radiation, converting it into electrical signals, and mapping those signals into pixel-based images, engineers unlock a powerful tool for diagnostics, safety, and innovation.

What makes this field exciting is not just the science—it’s the empowerment it offers: the ability to see beyond the visible spectrum, anticipate problems before they surface, and design solutions that protect, heal, and inspire. When pixels, power, and physics converge, they don’t just reveal heat, they reveal possibilities.

Nature’s blueprint for thermal vision

Nature has long demonstrated the power of thermal perception. Pit vipers detect prey through specialized infrared-sensing organs, beetles locate forest fires by sensing thermal radiation, and certain fish use heat gradients to navigate their environments.

These biological systems remind us that thermal vision is not an artificial invention but an evolutionary advantage. By studying and emulating these natural mechanisms, engineers extend human capability, transforming biology lessons into technology that safeguards industries, advances medicine, and expands the boundaries of exploration.

Figure 1 The image visualizes how a pit viper detects prey using its specialized infrared-sensing pit organ, converting heat signatures into directional cues for precise targeting. Source: Author

The physics beyond “heat vision”

To a maker, a thermal imager isn’t magic; it’s a sensor array tuned for long-wave infrared (LWIR) light. The trick lies in the atmospheric window: while Earth’s atmosphere absorbs most infrared radiation, there’s a transparent band between 8 µm and 14 µm where IR passes through cleanly. Thermal imagers exploit this window, giving us a view of heat patterns without interference from the air.

Deeper physics comes from Planck’s Law. Every object emits radiation based on its temperature, and the peak wavelength shifts as that temperature changes. For room-temperature objects, the peak falls right inside the LWIR band—exactly where thermal imagers are most sensitive. That’s why these devices can reveal the invisible glow of everyday objects, translating physics into practical “heat vision”.

Figure 2 Uncooled LWIR OEM thermal camera module with continuous zoom lens delivers a high-performance imaging solution. Source: Teledyne FLIR OEM

Sensor: The microbolometer

At the core of a thermal imager lies the microbolometer. Unlike the CMOS sensor in a visible-light camera, which counts photons through a photovoltaic effect, a microbolometer is built as a grid of tiny resistors. Each resistor changes its electrical resistance when warmed by incoming infrared radiation. By measuring these resistance shifts across the array, the device constructs a thermal image—turning invisible heat into a visible map of temperature differences.

VOx and a-Si represent two different material approaches to building the resistive pixels. Vanadium Oxide (VOx) has become the industry’s benchmark for high-end sensors because it offers higher sensitivity to small temperature changes and better thermal stability over time. Amorphous Silicon (a-Si), while less sensitive, is cheaper to manufacture and often used in cost-conscious designs where performance trade-offs are acceptable.

Another key factor is the thermal time constant—the rate at which each pixel heats up and cools down. Because the sensing elements must physically absorb and release heat, their response is slower than the instantaneous photon counting of a digital camera.

This is why thermal imagers often feel “laggy”: the image refresh is limited by the physics of thermal inertia, not just by electronics. Engineers designing with microbolometers must balance sensitivity, stability, and time constant to match the intended application.

Figure 3 The PICO384S infrared detector utilizes a 384 x 288 pixel microbolometer array to capture high-contrast thermal imagery in zero-light environments for surveillance, industrial monitoring, and predictive maintenance. Source: Lynred USA

The emissivity trap: Radiometer, not thermometer

The “emissivity trap” is the most important gap-learning concept for new users. A thermal camera is not a thermometer; it’s a radiometer, measuring emitted infrared radiation rather than direct temperature.

Emissivity is a material property—ranging from 0 to 1—that describes how efficiently a surface emits IR energy. High-emissivity surfaces like electrical tape (≈ 0.95) give reliable readings, while low-emissivity metals like polished aluminum (≈ 0.05) reflect more than they emit.

The problem: If a maker points a thermal imager at a shiny copper busbar, the sensor may capture a reflection of its own body heat instead of the copper’s true temperature. Without accounting for emissivity, readings can be misleading—sometimes dangerously so. Understanding this distinction is what separates casual “heat vision” from serious engineering measurement.

Key engineering specifications

When engineers compare thermal camera datasheets, three specifications define performance. Noise equivalent temperature difference (NETD) expresses sensitivity—the effective signal‑to‑noise ratio of heat. A camera with an NETD of 50 mK can resolve temperature differences as fine as 0.05 °C, making subtle gradients visible.

Instantaneous field of view (IFOV) sets spatial resolution, describing how much area each pixel covers at a given distance. It’s not just pixel count but pixel footprint that determines whether small features can be distinguished.

Finally, non‑uniformity correction (NUC) explains the audible “click” many users notice: a mechanical shutter briefly closes so the sensor can recalibrate against a uniform reference, correcting pixel drift and maintaining image consistency. Together, these specifications shape how accurately and reliably a thermal imager translates invisible radiation into usable engineering data.

The maker angle: Integrating thermal into projects

For makers, the real challenge is not just capturing thermal data but integrating it into projects through communication protocols and processing pipelines. The FLIR Lepton module offers higher resolution and uses a Video over SPI (VoSPI) interface layered on SPI/I²C, making it powerful but slightly more complex to handle.

In contrast, the Melexis MLX90640 provides lower resolution but communicates directly over I²C, which is simpler to implement on hobbyist microcontrollers—ideal for cost‑sensitive builds.

Figure 4 The radiometric-capable LWIR camera Lepton 3.5 integrates into mobile devices as an IR sensor or thermal imager, capturing calibrated temperature data in every pixel. Source: Teledyne FLIR OEM

It’s worth noting about the FLIR Lepton 3.x series at this point that its two primary variants—the Lepton 3.0 and Lepton 3.5—focus their differences entirely on internal capabilities, remaining completely identical on the outside. Both micro-camera modules share the exact same 160×120 resolution and compact physical form factor, meaning the true differentiator is the Lepton 3.5’s advanced radiometry.

While the 3.0 acts purely as a thermal imager to visualize relative heat differences up to 120°C, the 3.5 delivers fully calibrated, pixel-by-pixel temperature readings alongside a significantly expanded dynamic range capable of measuring scenes up to 450°C.

Beyond the sensor choice, makers should pay attention to the communication protocols that move thermal frames from sensor to processor. The FLIR Lepton relies on VoSPI, a packetized stream layered on the SPI bus that demands careful timing and buffer management but rewards with higher‑resolution data throughput.

By contrast, the Melexis MLX90640 uses a straightforward I²C register map, where each pixel’s 14‑bit value can be read directly with simple address calls. For hobbyist platforms, I²C feels friendlier—easy to implement on Arduino or ESP32—while VoSPI requires tighter firmware discipline but scales better for real‑time imaging. Choosing between them is less about raw capability and more about how much protocol complexity a maker is willing to embrace.

Once the sensor delivers raw frames, the next step is data processing. Thermal imagers typically output 14‑bit values per pixel, representing temperature intensity. Makers must map these values into a visual palette—common choices include Ironbow, Rainbow, or grayscale—using libraries like OpenCV or lightweight embedded frameworks.

Even microcontrollers such as the ESP32 or Teensy can handle this task, converting raw thermal data into colorized images or live heat maps. This workflow bridges physics and electronics, turning invisible infrared into accessible, project‑ready visuals.

Engineering wins in the real world

Thermal imagers are more than “heat vision”—they are tools of discovery, precision, and problem‑solving. In real‑world debugging, they deliver engineering wins that save time, prevent failures, and inspire innovation. On a PCB, a thermal camera can expose a hidden latch‑up state or a poorly decoupled regulator by revealing the telltale heat bloom.

In mechanical systems, it can uncover stress points, such as friction heating in a misaligned 3D printer lead screw. Even in fluid dynamics, thermal imaging makes the invisible visible, showing the heat dissipation patterns of a custom liquid‑cooling block.

For the electronics fraternity, the challenge is clear: don’t just admire thermal images—use them. Treat every glowing hotspot as a clue, every gradient as a story, and every frame as a chance to engineer smarter, safer, and more resilient systems.

The call to action is to embrace thermal imaging not as a novelty, but as a core debugging instrument. Push beyond “heat vision” and let physics guide your next breakthrough.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

The post Pixels, power, and physics: Unlocking the fundamentals of thermal imaging appeared first on EDN.

Riber’s first-half revenue grows 19% year-on-year to €12.7m

Semiconductor today - 12 годин 14 хв тому
Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has confirmed 19% growth in revenue from €10.7m in first-half 2025 to €12.7m for first-half 2026, driven by strong momentum in Services & Accessories and resilient Systems sales...

Wise Integration’s digital control technology to combine with Navitas’ wide-bandgap technologies

Semiconductor today - 12 годин 36 хв тому
Fabless company Wise Integration SAS of Hyeres, France — which specializes in digital control solutions for wide-bandgap (GaN and SiC)-based power converters — and gallium nitride (GaN) and silicon carbide (SiC) power semiconductor firm Navitas Semiconductor Corp of Torrance, CA, USA have agreed to collaborate on advancing power-computing applications for AI PCs, high-end workstations, desktop computers for gamers, and industrial systems...

Geometric Planter with Local CO₂ Monitor for Home Assistant

Open Electronics - 12 годин 38 хв тому

A CO₂ and air quality monitor for Home Assistant, hidden inside a geometric planter, with a speaker for voice notifications and a colored LED. The project by Murco-design combines desk design with serious home automation functionality, all local, without cloud. At its core is an M5Stack AtomS3 Lite, paired with a Sensirion SCD40 and a MAX98357A amplifier with a 4Ω speaker.

The SCD40 sensor measures CO₂, temperature, and humidity. The RGB LED on the AtomS3 Lite shows the CO₂ level with colors that follow the ASHRAE/REHVA thresholds: green below 420 ppm, orange up to 1500 ppm, red beyond. This way, at a glance, you can tell if the air needs changing. All in an object that doesn’t look like an electronic device.

Voice, LED, and buttons: how the planter interacts

The I2S speaker, managed by the MAX98357A, works as a native media_player in Home Assistant. It can play voice announcements, high CO₂ alerts, or custom ringtones, without needing a separate audio hub. Additionally, a long press of the button provides a complete climate report, with color and optional voice. Four clicks make the IP address blink in colors, useful for initial setup.

The planter also includes a watering indicator for Tillandsia plants: a blue LED pulse warns when it’s time to water. A Wi-Fi watchdog, on the other hand, signals disconnection from the network with a magenta pulse. Finally, the device works as a BLE proxy, extending Home Assistant’s Bluetooth range to other sensors in the environment.

  • Green LED: CO₂ below 420 ppm
  • Orange LED: CO₂ between 420 and 1500 ppm
  • Red LED: CO₂ above 1500 ppm
  • Blue pulse: Tillandsia watering
  • Magenta pulse: Wi-Fi disconnected
ESPHome firmware and numbers to keep in mind

The ESPHome firmware is completely local, with native encrypted API and integrated web interface. This means data never leaves home, and control works even if the internet goes down. The build guide is designed to be accessible even to children, and the Murco-design repository collects the source code and 3D printing files.

The project numbers are interesting: the total cost is about 35-40 euros, with the SCD40 sensor alone weighing in at about 23 euros. The firmware required 58 compilations to reach version v1.4.5. Measured temperatures have a deviation of 3-6 °C, with an accuracy of 0.5 °C. Power consumption is between 2 and 3 W, powered at 5V.

For those who want to replicate it, GPIO pins 1, 2, 5, 6, 7, 35, and 41 are already mapped in the firmware. The board connects via USB and the first boot exposes a Wi-Fi network at 192.168.4.1. From there you configure your home network and Home Assistant finds it on its own. Furthermore, the project is designed to be extended: the BLE proxy and media_player are already ready to use.

The local CO₂ monitor is an example of how home automation can be useful, beautiful, and privacy-respecting. You don’t need a cloud service to know if the air in the room is good. Just a geometric planter, a 23-euro sensor, and an open source firmware.

Source: https://github.com/Murco-design/murco-planter

The post Geometric Planter with Local CO₂ Monitor for Home Assistant appeared first on Open Electronics.

Toshiba launches 3300V SiC MOSFET module

Semiconductor today - Ндл, 09/27/2026 - 19:14
Toshiba Electronic Devices & Storage Corp (TDSC) of Kawasaki, Japan has launched the IX800FXF2YMS4, a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain–source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I2t limit value in the diode section (an indicator of surge current capability)...

Prototyping a simple keyboard with self-etched PCB and 3D-printed keycaps

Reddit:Electronics - Ндл, 09/27/2026 - 19:05
Prototyping a simple keyboard with self-etched PCB and 3D-printed keycaps

I pre-planned a customizable keyboard matrix into my cyberdeck without actually designing the keyboard itself yet, so I could add one later. This is basically a rough version.

I also thought about splitting it into two halves and putting one left and one right of the display. My fallback is still just a USB dongle with a wireless keyboard, but I wanted to try this out and see how it feels.

The layout is based on the old Nokia E7-00.

I still like old-school self-etching with the photo-positive method for stuff like this. You can make a board, notice something stupid, fix it and do another one the same day.

It’s far from perfect, but that wasn’t really the point. I mainly wanted to see how the spacing feels when actually typing on it. I already have another idea that would make it lower profile and simpler, but I really like the crisp click sound of these switches compared to the lower-profile ones, so I wanted to give them a shot.

The black vertical bars keep the keycaps in place without getting in the way when you press the keys.

Not a single via was required here, and ghosting is prevented with simple diodes. The board also has a basic keyboard-matrix IC (TCA8418) on it. Usually it would be cleaner to expose I2C and put the IC directly on the keyboard imo, but I have some other keys on the main board as well, and the cable mess is still manageable this way.

Won’t win a beauty contest, but it works. Sometimes just building something and actually using it is necessary imo before optimizing anything.

submitted by /u/gitzian
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Modbus RTU on Arduino with the DFRobot_RTU Library

Open Electronics - Ндл, 09/27/2026 - 16:00

The DFRobot_RTU library brings the Modbus RTU protocol to Arduino. With a few commands you can read and write coils, discrete inputs, holding registers, and input registers. The source code is available in the official repository, which includes ready-to-upload examples.

Modbus RTU is a serial protocol widely used in industry. It runs over UART, so on Arduino you only need the TX and RX pins. The library handles the Modbus frame, CRC calculation, and exception codes. This lets the maker focus on the data rather than the protocol details.

Supported commands and registers

The library implements Modbus commands 0x01, 0x02, 0x03, 0x04, 0x05, 0x06, 0x0F, and 0x10. Command 0x01 reads coils, 0x02 reads discrete inputs, 0x03 reads holding registers, and 0x04 reads input registers. Commands 0x05 and 0x06 write a single register, while 0x0F and 0x10 write multiple registers. This covers all the main protocol operations.

Each Modbus device has an address ranging from 0x00 to 0xF7, that is, from 0 to 247. The library uses this address to route requests. It also sets a reception timeout with a default value of 100 ms. If the device does not respond within that time, the library reports the error.

  • 0x01: read coils
  • 0x02: read discrete inputs
  • 0x03: read holding registers
  • 0x04: read input registers
  • 0x05: write single coil
  • 0x06: write single holding register
  • 0x0F: write multiple coils
  • 0x10: write multiple holding registers
Wiring and configuration

Connecting the sensor to the microcontroller is straightforward. Connect VCC to 5V, GND to GND, RX to the TX pin of the UART, and TX to the RX pin of the UART. Mind the crossover: the sensor’s TX goes to Arduino’s RX and vice versa. Then set the device address in the code and choose the command to use.

The library includes functions to read and write single or multiple registers. It also handles Modbus exception codes, so you can immediately tell if the device rejected the request. To get started, the project repository contains basic examples with the configuration for each command.

To try the library you can use an Arduino Uno R4 Wi-Fi board. The hardware UART is available on pins 0 and 1, or you can use a SoftwareSerial on other pins. The library works with both modes. Additionally, if you want a module with built-in Wi-Fi, the ESP32-C6-Zero is a good choice for IoT projects that speak Modbus.

Before uploading the sketch, check the baud rate. The sensor and Arduino must use the same baud rate, otherwise communication fails. The library does not set the speed, so you configure it in the code. Modbus devices usually use 9600 or 19200 baud.

Once everything is configured, reading a register takes only a few lines of code. You call the read function, passing the device address, the register address, and the number of registers. The library builds the frame, sends it, and waits for the response. Finally, it returns the read data or an error code.

Source: https://github.com/DFRobot/DFRobot_RTU

The post Modbus RTU on Arduino with the DFRobot_RTU Library appeared first on Open Electronics.

Renesas launches 64-bit RZ/G3L and RZ/G3SE MPUs for HMI and IoT Edge

Open Electronics - Ндл, 09/27/2026 - 13:00

Renesas Electronics Corporation, a leading supplier of advanced semiconductor solutions, has expanded its RZ/G series with new 64-bit general-purpose microprocessors (MPUs) aimed at HMI (Human Machine Interface) systems and IoT Edge applications. The RZ/G3L and RZ/G3SE devices are pin-compatible MPUs that support a wide range of industrial and consumer HMI systems, as well as IoT gateways and home gateways, characterised by high demands for processing power and high-speed network connectivity.

The RZ/G3L integrates a GPU (Graphics Processing Unit) for 3D graphics rendering, together with an H.264 video codec. This combination is ideal for applications such as smart retail terminals and medical devices with an HMI interface, which require advanced graphics and video capabilities. The RZ/G3SE, on the other hand, is designed for IoT devices with simpler display requirements, such as electric vehicle (EV) chargers and industrial gateways that provide status indications and configuration screens. Thanks to the pin-level compatibility between the RZ/G3L and RZ/G3SE, developers can reuse the same PCB design across different product variants, simplifying development and reducing time-to-market.

Renesas RZ/G3L and RZ/G3SE 64-bit MPUs for HMI and IoT Edge applicationsRenesas’ new RZ/G3L and RZ/G3SE microcontrollers, pin-compatible so the same PCB design can be reused across different product variants.
High performance with standby consumption in the order of 1 mW

The new devices deliver high processing performance thanks to a CPU cluster made up of up to four Arm® Cortex®-A55 cores running at up to 1.2 GHz, alongside a Cortex-M33 coprocessor running at 200 MHz. At the same time, the third generation of the RZ/G series adopts a proprietary power management architecture that significantly reduces energy consumption in standby. As a result, the new products can achieve consumption in the order of 1 mW in deep standby mode. The devices can remain in standby while keeping the Linux system in memory and quickly resume operation when needed. These power-saving features are particularly suited to industrial applications and IoT devices that require continuous, always-on connectivity.

High-performance connectivity to expand system functionality

Featuring high-speed interfaces such as PCIe, Gigabit Ethernet with TSN support and USB, the new MPUs allow developers to add application-specific functionality and advanced connectivity options. The PCIe interface supports connection to 5G communication modules, Wi-Fi 6 modules and even external AI accelerators. Gigabit Ethernet with TSN support enables low-latency, highly reliable communication, essential characteristics in industrial networks where real-time performance is a fundamental requirement.

“The growing sophistication of industrial and IoT devices requires solutions able to balance high performance, low power consumption, advanced connectivity and platform scalability,” said Hari Pendurty, Vice President of the EP Edge AI & Application Processors Business Division at Renesas. “RZ/G3L and RZ/G3SE were developed to help customers meet these constantly evolving requirements and to build product families more efficiently, leveraging a common hardware platform for different applications.”

An ecosystem rich in tools and resources to reduce development time

Thanks to an ecosystem made up of ten solutions, which includes GUI development environments, operating systems, software and SoMs, Renesas simplifies and accelerates application development. The company will continue to invest in expanding the ecosystem, offering an ever wider choice of hardware, software and tools that are already validated and ready to use.

For information on other partners you can refer to the following link: Renesas Partner Program.

Technical specifications
  • Main Arm Cortex A55 CPU available in dual-core or quad-core configurations
  • Available in a 400-pin LFBGA package (14 × 14 mm) and a 368-pin LFBGA package (17 × 17 mm)
  • ECC (Error Checking and Correction) protection on both integrated memory and the external DDR interface
  • Advanced security features, including Renesas Secure IP, Secure Boot, Arm TrustZone and tamper detection
  • Wide operating temperature range from -40°C to +125°C
  • Verified Linux Package (VLP) compliant with the Civil Infrastructure Platform (CIP), for Long-Term Support (LTS).
Winning Combinations

Renesas has combined the new MPUs with numerous compatible devices from its product portfolio to offer a wide range of complete solutions. These include the Mode3 AC EV Charger Wallbox solution with high-level PLC communication, based on the RZ/G3L, and the AI-Enabled Smart Home Security Hub based on the RZ/G3SE, which enables advanced monitoring capabilities thanks to integration with cameras, microphones and sensors, as well as cloud connectivity. For further Winning Combinations you can visit the Renesas website: renesas.com/win

Availability

The RZ/G3L and RZ/G3SE devices are available today. An evaluation kit consisting of an SMARC v2.1 module board and a carrier board is also available for both products.

Renesas RZ/G3L and RZ/G3SE device lineup with SMARC v2.1 evaluation kitThe RZ/G3L and RZ/G3SE device lineup, available today together with the evaluation kit made up of an SMARC v2.1 module board and a carrier board.

The post Renesas launches 64-bit RZ/G3L and RZ/G3SE MPUs for HMI and IoT Edge appeared first on Open Electronics.

Electronic door lock with Arduino UNO R4 WiFi and touch sensor

Open Electronics - Ндл, 09/27/2026 - 11:00

This project builds a basic electronic door lock with the Arduino UNO R4 WiFi. A touch sensor detects contact, a relay controls a solenoid lock, and an OLED display shows the system status. The principle is simple: touch the sensor, the door unlocks for 5 seconds, then locks itself again. It is a starting point for customizable smart locking systems.

The central board is the Arduino UNO R4 WiFi, which manages the whole flow. The touch sensor sends a signal to the board, which activates the relay to power the lock. The 128×64 pixel OLED display shows the startup, locked, and unlocked screens. The system uses a relay module to separate the control circuit from the power circuit, so the solenoid lock operates safely.

The circuit and components of the lock

Assembly requires few components: the Arduino board, the touch sensor, the OLED display, the relay module, and a solenoid lock. Everything connects on a breadboard with jumper wires. The relay is essential because the lock runs at 12 VDC, while the Arduino operates at 5 V. Without the relay, the lock’s current would damage the board.

The OLED display connects via I2C, using the SSD1306 and Adafruit_GFX libraries. The 128×64 pixel resolution is enough to show the system status with clear characters. The touch sensor connects to a digital pin: when it detects a touch, it sends a high signal to the Arduino. The response is immediate, and the relay trips right away.

The firmware and unlock time

The code is written in the Arduino IDE and uses the SSD1306, Adafruit_GFX, and Adafruit_SSD1306 libraries. The sketch reads the touch sensor state and, when it detects a touch, activates the relay. The display shows the unlock screen for 5 seconds, then the system locks the door again. The unlock time is fixed at 5 seconds, but it can be changed in the code.

The operation is cyclic: startup, waiting, unlock, relock. The OLED display updates the status in real time, so you always know whether the door is locked or unlocked. The project demonstrates the principle of a basic electronic lock, and the maker’s website collects the details for replicating it. It is a simple but complete system.

For assembly you also need a universal acrylic support to keep the Arduino and breadboard tidy. 15 cm male-to-female jumper wires help connect the modules without soldering. The project can be expanded with a numeric keypad, an RFID reader, or a Wi-Fi module for remote control.

In short, this project is an excellent base for anyone who wants to understand how an electronic lock works. The components are few, the code is essential, and the result is functional. With the Arduino UNO R4 WiFi you also have the option to add connectivity in the future, turning the prototype into a real smart lock.

Source: https://srituhobby.com/how-to-make-a-solenoid-door-lock-system-using-a-touch-sensor/

The post Electronic door lock with Arduino UNO R4 WiFi and touch sensor appeared first on Open Electronics.

My most recent project AIRNODE😅

Reddit:Electronics - Сбт, 09/26/2026 - 20:15
My most recent project AIRNODE😅

This is my project that I’ve been working on for the last two weeks. It’s called Kira04 AIRNODE.
I currently 3D print in my small bedroom, and I have three printers running simultaneously, sometimes almost 24/7. I started getting worried about the VOCs they release, as well as the amount of heat they generate, so I came up with this project.
Kira04 AIRNODE is basically a bundle of sensor modules that connects directly to the ventilation system I installed in my window. It helps me monitor and keep the temperature, humidity, and VOC levels in check while my printers are running.
And yes, I know the wiring and soldering are pretty horrible 😅. There are wires everywhere right now. I actually tried making a custom PCB for it using my CNC mill a few times, but unfortunately both attempts failed pretty tragically 😂. At that point, I just wanted to get the project working, so I decided to finish it quickly with the current wiring.
I’d love to hear any feedback or suggestions you have for improving it.
I’m also trying to decide what to do with the project next: Should I open-source Kira04 AIRNODE, or do you think this could potentially become an actual product?

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