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Qorvo, a leading global provider of connectivity and power solutions, today announces a new family of RF switches that simplifies multi-band radio architectures. Spanning 50 MHz to 10 GHz, the family reduces component count, improves signal integrity, and enables more efficient RF system design across 5G infrastructure, industrial, drone, and test applications.

As 5G radios expand to support wider bandwidths and more frequency bands, including emerging spectrum such as FR3, designers face increasing challenges maintaining isolation and signal integrity without adding size, loss, and complexity. Many current designs rely on cascaded switch architectures or multiple narrowband devices, increasing insertion loss, degrading linearity and signal integrity, and adding board space and design effort.

“Designers no longer have to rely on cascaded switch architectures to achieve high isolation. We’re delivering that performance in a single device across a very wide bandwidth,” said Debbie Gibson, general manager of Qorvo’s infrastructure business. This approach reduces insertion loss, maintains signal linearity, and simplifies design, improving receiver performance in applications such as digital pre-distortion (DPD) feedback.

Qorvo’s new QPC6144 is a SP4T wideband switch that delivers greater than 65 dB isolation in a single device. Complementing this capability, the QPC6122 (SP2T) and QPC6188 (SP4T) provide wideband absorptive switching across 50 MHz to 10 GHz, enabling a single platform approach to RF routing. These devices reduce component count and simplify design while maintaining low insertion loss and strong linearity across wide bandwidths for calibration paths, general signal routing, and multi-band operation.

The new family of devices forms a dual switching platform that supports both high-isolation and general-purpose routing. By consolidating switching functions into fewer components, engineers can reduce BOM complexity, simplify layouts, and accelerate development across multiple applications.

Product	Key Role	Solves	Typical Use
QPC6144	High-isolation switching	Eliminates cascaded switches with >65 dB isolation in a single device	DPD feedback, calibration paths, high-isolation paths in 5G radios, and advanced drone communications
QPC6122	Compact wideband switching	Reduces component count while maintaining low insertion loss and signal linearity across wide bandwidths	Calibration paths, space-constrained RF routing in compact RF modules, and drones
QPC6188	Flexible wideband routing	Simplifies multi-path RF routing while maintaining low loss and signal linearity across multiple bands	Switching networks in infrastructure, industrial, drone, and test system applications

Samples are available through Qorvo. Visit the Qorvo IMS hub for more information.

About Qorvo

Qorvo supplies innovative semiconductor solutions that make a better world possible.  It combines product and technology leadership, systems level expertise, and global manufacturing scale to quickly solve customers’ most complex technical challenges.  Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, and infrastructure. and mobile.  Visit www.qorvo.com to learn how a diverse and innovative team.

The post Qorvo drops Cascaded Switches with New Wideband 5G High-Isolation Family appeared first on ELE Times.

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...

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I added RGB backlighting to my RAM stick to get +20 fps. submitted by /u/mmSTEA [link] [comments]

This is a heart-shaped LED keychain I made. submitted by /u/Federal_Door_9998 [link] [comments]

My attempt at making a really minimal switching LED driver (as lean as possible without "abusing" components), for a flashlight or something. I had a lot of fun optimizing it without abusing strange nonlinear effects in components - I would guess the minimum parts you'd need are a choke, (obviously) an LED, sense resistor, flyback diode and 2 transistors (minimum required to create hysteresis). If you were going to use it with 12 volts of Vdd, the component values would be about 470 uH, 10 ohm shunt, 1k pull up resistor, 10k pot, and a feedback resistor in the tens of kohm, this should yield an LED current of a couple hundred milliamps. Let me know if you can remove any more components, or if you find it useful somewhere! submitted by /u/DmitryE [link] [comments]

This is a laser I’ve made for milled blank double sided boards with mounting holes for alignment. Previously it’s worked for single sided pcb & now I’ve ben working on making a easy system for double sided & still working on a different homing system for easier flipping of the board. The etching fluid I use hydrogen peroxide with hcl. Main board ESP32, gcode sender I use is laser GRBL , where I just insert a screenshot of my traces and resize based on the dimensions of the blank. It’s generally very easy the most challenging part is still aligning, each board takes about 1hr from blank to etched with no drilling & 80% of time is on waiting. Project files: https://grabcad.com/library/pcb-laser-v2-1 I’d appreciate a like if anyone uses GrabCAD, it helps my career :) , any feedback or ideas here are also very appreciated! Still working on V3 with its own firmware for aligning and faster motion, I will likely be done with that in a few months if anyone is interested! I’ll make a update. If anyone decides to make this machine buy a cover for fumes and light protection! submitted by /u/Mediocre-Advisor-728 [link] [comments]

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Відкриття меморіальної дошки Марії Бігун (Леут) KPI4U-1 пт, 05/29/2026 - 23:02

Captured using Fujifilm XH2 and Laowa 65mm F2.8. Quite the beauty. submitted by /u/Nightrach [link] [comments]

Infineon Technologies AG of Munich, Germany, which provides power systems and IoT, has joined NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions will support NVIDIA’s MGX architecture and 800VDC power architecture, an open, modular reference architecture designed for AI factories in the agentic AI era. 800VDC MGX-compatible power racks help existing AI infrastructure to scale AI compute performance and power density, creating an upgrade path for future AI infrastructure...

Infineon Technologies AG of Munich, Germany is introducing a new 1300V silicon carbide (SiC) module within the HybridPACK Drive family that is capable of continuous operation at temperatures up to 205°C. Existing designs typically allow up to 175°C. This increase enables automotive OEMs and tier-1 suppliers to deliver higher peak and continuous output power from existing inverter designs or, in new designs, reduce system complexity and overall cost...

For full-year 2025, epiwafer and substrate maker IQE plc of Cardiff, Wales, UK has reported revenue of £97.3m, down 17.6% on 2024’s £118m...

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Asymmetric network technologies such as ASA are becoming more important for transporting the increasing volume of sensor data in vehicles. At the same time, interoperability is harder to secure in a growing multi-vendor ecosystem. Rohde & Schwarz addresses this with a new ASA Motion Link compliance solution for the R&S RTP oscilloscope that focuses on standards-compliant testing, enables efficient device debugging, and ensures compatibility and seamless automotive communication.

The Automotive SerDes Alliance (ASA) was formed in 2019 with the ambition of providing an open standard for a multi-vendor ecosystem for high-speed asymmetric SerDes (Serializer/Deserializer) technology. It is perfectly optimal to carry data from high-resolution cameras, LiDAR, or radar sensors to the ECU or provide continuous data streams from the ECU to ultra-wide, high-definition displays, all the while ensuring that high-speed data transfers do not interfere with other sensitive vehicle electronics. With bandwidth capabilities scaling up to 16 Gbps per lane, it provides the scalable “nervous system” required for level 3 autonomous driving and beyond.

Rohde & Schwarz has been a long-standing member of the Alliance, contributing to the various technical committees to help further the open standard. The new R&S SPLUS-K105 option available on the R&S ScopeSuite+ software offers comprehensive electrical compliance testing for the latest ASA Motion Link standard. The software fully controls and automates the R&S RTP high-performance oscilloscope, allowing test engineers to seek guidance effortlessly through each test case via the step-by-step wizard and the web-based GUI. All relevant test cases for each speed grade (SG1 to SG5) are getting support from the software. In addition, users can also control the R&SZNB3000 and other supported VNAs for performing accurate return loss measurements.

The combination of oscilloscope, VNA, and compliance software provides capabilities for signal integrity analysis. The time domain impedance analysis in repeatable measurements is essential for verifying PHYs, ECUs, cables, and connectors, fostering reliable Automotive communication.

Further information can be found at https://www.rohde-schwarz.com/solutions/automotive-testing/in-vehicle-networks-and-ecu-testing/in-vehicle-networks-and-ecu-testing_231834.html.

The post Rohde & Schwarz strengthens Its In-Vehicle Networks Test Portfolio with the Launch of a New ASA-ML Compliance Solution appeared first on ELE Times.

From a Jena-based spin-off to a globally sought-after test and inspection specialist.

In May 2026, GÖPEL electronics celebrates its 35th anniversary. Founded in 1991 as a spin-off of Carl Zeiss Jena Measurement and Testing Technology, the company continuously evolves and is now one of the world’s leading providers of innovative test and inspection systems, with approximately 240 employees as well as locations and partners in more than 25 countries.

GÖPEL electronic was founded as a family business by Holger Göpel, Thomas Wenzel, and Manfred Schneider. To this day, this family-oriented character shapes the corporate culture. With Alice Göpel, Jörg Schneider, and Ricardo Wenzel, the next generation is now also actively involving in management and leadership roles. With annual revenue exceeding 40 million euros, GÖPEL electronic is now one of Thuringia’s leading medium-size technology companies.

A central component of the corporate strategy is consistent investment in research and development. Approximately one-quarter of annual revenue is invested in new technologies, products, and innovations. In doing so, the company lays the foundation for sustainable growth and long-term competitiveness each year. In addition to innovative inspection systems for electronics manufacturing, GÖPEL electronics’s core competencies include electrical test systems based on embedded JTAG and boundary scan, as well as test solutions specifically for the automotive sector.

As early as 2002, the company’s individual test platforms became the de facto standard in the European automotive industry. Worldwide, the AOI systems of the Basic Line, Vario Line, and Multi Line series ensure the highest quality in electronics manufacturing and production lines. In the field of boundary scan, GÖPEL electronic is also internationally known as a leading provider of complex solutions and their seamless integration into existing test environments.

At the same time, GÖPEL electronics is increasingly expanding into new industries. Test solutions for the medical, avionics, security technology, and industrial manufacturing sectors complement the portfolio for the automotive and electronics industries. In the field of inspection systems, the manufacturer is setting new standards this year with its new Multi Line AXI X-ray system, which is based on the new ASPECT technology, and opens up expanded possibilities for the inspection of electronic assemblies. In the Embedded JTAG sector as well, the focus is on innovative software solutions and new models that enable an unprecedented level of test depth in boundary scan. The systems are complemented by modern AI-supported functions that further simplify operation and analysis processes.

“35 years of GÖPEL electronics stand for innovative strength, reliability, and sustainable growth,” explains Alice Göpel, Managing Director of GÖPEL electronics. “We are proud to continue writing the success story of our family business together with our employees, customers, and partners. Many of our current solutions have emerged directly from our customers’ requirements. Together, we develop technologies that solve today’s challenges and help shape the future of electronics manufacturing.”

About GÖPEL electronic

GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies, as well as industrial and automotive electronics systems. GÖPEL electronic has four business units:

•  Automotive Test Solutions
• Embedded JTAG Solutions
• Inspection Solutions AOI-AXI-SPI-IVS
• Industrial Function Test

The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with 240 employees. For further information, visit www.goepel.com/en.

The post 35 Years of Innovation from Jena: GÖPEL electronic Celebrates Its Anniversary appeared first on ELE Times.

Companies to collaborate on R&D to accelerate the introduction of the latest packaging technologies for next-generation AI chips and systems. Partnership will leverage Applied’s global network of innovation centers, including the new EPIC Center in Silicon Valley.

Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today announces that Broadcom Inc. will join Applied’s EPIC platform as an innovation partner to accelerate the development of next-gen chip packaging technologies critical to next-generation AI systems.

The explosive growth of AI has driven a surge in demand for high-performance, energy-efficient compute infrastructure. To address this demand, chipmakers and system designers are increasingly adopting the latest packaging techniques and heterogeneous integration of multiple chips, aiming to boost energy-efficient performance across their systems. To unlock AI’s full potential, the industry is developing a new set of packaging building blocks to dramatically increase the interconnect density and bandwidth of tomorrow’s systems.

“The EPIC platform is designed to drive co-innovation across the ecosystem to change the way semiconductor technologies are developed and commercialized,” said Gary Dickerson, President and CEO of Applied Materials. “This new model gives leading system designers like Broadcom early access to foundational innovations in materials and process equipment, providing an opportunity for deep collaboration to accelerate the introduction of new advanced packaging technologies.”

“Close collaboration with partners throughout the supply chain is critical to delivering the next generation of high-performance AI systems,” said Charlie Kawwas, President of the Semiconductor Solutions Group at Broadcom. “By bringing together Applied’s expertise in materials engineering with Broadcom’s leading capabilities in semiconductor and system design, we can accelerate the time to market for innovations in AI.”

Through the EPIC platform partnership, Broadcom will leverage the R&D work taking place across Applied’s global innovation centers – driving progress in advanced packaging capabilities for connecting multiple chips within a computing system.

“Innovation in advanced packaging is essential to enabling sustainable progress in the AI era,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “We look forward to working side-by-side with Broadcom engineers to explore new technologies for boosting performance-per-watt through advanced chip packaging. With our global innovation platform and the new EPIC Center in Silicon Valley, Applied is uniquely positioned to help chipmakers and system designers accelerate the journey from concept to commercialization.”

“Cross-ecosystem collaboration has never been more important to address the rising complexity of chips for AI systems,” said Dilip Vijay, Vice President and Head of Global Operations for Silicon Products at Broadcom. “System designers must navigate a complex array of solution paths and packaging architectures, while simultaneously driving a faster cadence of product introductions. Collaborating with Applied will provide earlier access to the foundational technologies needed to accelerate progress in advanced packaging.”

Applied’s new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley is the cornerstone of the company’s global EPIC platform. Representing the largest-ever U.S. investment in semiconductor equipment R&D, the center is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. The facility is on track to become operational in 2026.

Forward-Looking Statements

This press release contains forward-looking statements, including those regarding Applied’s investment and growth strategies, the development of new materials and technologies, industry outlook and technology requirements, the plans and expectations for the EPIC platform and Center, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those shown by such statements include, without limitation: the demand for semiconductors and customers’ technology requirements; the ability to develop new and innovative technologies; the ability to obtain and protect intellectual property rights in key technologies; the ability to achieve the objectives of the EPIC platform and Center; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections, and assumptions, and Applied assumes no obligation to update them.

About Applied Materials

Applied Materials, Inc. is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at www.appliedmaterials.com.

The post Applied Materials Announces Broadcom as EPIC Innovation Partner appeared first on ELE Times.

Got around to making an enclosure for this little guy. It's was done a lot more strategically than the first one I made. I went with colorful popsicle sticks this time around. I had the forethought to have the audio sockets stick out from the pcb just enough that when I made the enclosure, they'd go through a side and be flush with the surface so connecting a cable is simple. I tried to photograph as much of the process as I could remember haha Someone asked for a schematic in the previous post. It's seems simple enough, but I'll see if I get around to making one in a follow up if you're interested in making a passive mixer of your own. Be warned that making it like this in this particular form factor had it's frustrations if you're not experienced with tinkering. It took a lot of patience. I've got some additional cleaning up to do for the edges, but it turned out nice enough I think. submitted by /u/Edboy796 [link] [comments]