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STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption
STMicroelectronics has announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, has joined the board of directors of the FiRa Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.
ST is actively driving the development the IEEE 802.15.4ab amendment, building upon previous UWB enhancements to further improve system performance and expand UWB’s application scope. The ongoing evolution of UWB standards promises significant improvements, including centimeter-level accuracy, enhanced security, and reduced power consumption. These improvements are critical for enabling a wide range of applications, from automotive access and digital keys to smart home automation and IoT innovations. Integrating IEEE 802.15.4ab into the CCC Digital Key ecosystem would represent a major step forward in addressing implementation challenges and accelerate broader adoption of UWB technology in both consumer and automotive markets.
“STMicroelectronics has long been a valued member of the FiRa Consortium, and we are thrilled to welcome them at the Sponsor level. This upgrade is a reflection of ST’s deepening commitment to the future of Ultra-Wideband technology and to FiRa’s mission. We are especially pleased to have Rias Al-Kadi, General Manager of ST’s Ranging and Connectivity Division, join our Board of Directors. His experience and leadership will be instrumental as we continue to expand UWB’s global impact and shape the future of secure, interoperable solutions,” states SK Yong, FiRa Consortium Board Chairman.
“Joining the FiRa board underlines our commitment to advancing the CCC Digital Key and other UWB-based applications,” said Rias Al-Kadi, General Manager, Ranging and Connectivity Division, STMicroelectronics. “By deeply engaging in standardization and certification across all major UWB groups, we are helping to shape the future of UWB technology to deliver maximum value for consumers and industries alike.”
Rias Al-Kadi’s appointment further strengthens ST’s active participation in key UWB standards bodies and consortia, including the IEEE, Connected Car Consortium (CCC), Connectivity Standards Alliance (CSA), and UWB Alliance. Through strategic participation in these groups, ST supports the continuous evolution of UWB technology aimed at enhancing user experiences and lowering system costs, particularly in consumer and automotive access applications. This aligns with ST’s vision to foster a robust UWB ecosystem that enables seamless, secure, and cost-effective solutions for the growing UWB market.
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NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing
NEPCON ASIA 2025, taking place from October 28 to 30 at the Shenzhen World Exhibition & Convention Center, is set to deliver an unparalleled platform for the global electronics manufacturing community. With over 3500 participating companies across more than 140,000 square meters and 80 high-level forums, the show will highlight the latest advancements in smart manufacturing, AI-driven automation, robotics, and semiconductor technologies.
According to Fortune Business Insights, the global Electronics Manufacturing Services (EMS) market reached USD 609.79 billion in 2024 and is projected to grow to USD 648.1 billion in 2025, eventually surpassing USD 1 trillion by 2032, underscoring the tremendous growth potential of the electronics manufacturing industry.
Connecting Global Manufacturers with Cutting-Edge Innovation
NEPCON ASIA 2025 will host over 600 leading suppliers from sectors including PCB assembly, smart factories, semiconductor packaging and testing, automotive electronics, and touch display solutions. The exhibition provides an immersive opportunity for international visitors to explore innovative products, witness advanced electronic manufacturing processes, and identify emerging technology trends. Through hands-on demonstrations, component dissections, and real-world production line showcases, visitors will gain insight into the industry’s next-generation solutions.
Driving Industry Transformation with AI and Smart Manufacturing
The concurrent S-Factory Expo will feature AI-driven smart factory and automation forums, showcasing how integration of AI, robotics, and digitalized production systems dramatically enhancing operational efficiency, product quality, and flexibility. Leading robotics companies such as FANUC, Elite Robot, Flexiv, and Fudan University will provide in-depth analyses of AI applications, offering actionable insights for businesses seeking to accelerate production line upgrades and embrace intelligent manufacturing transformation.
Vision + AI: Empowering Intelligent Manufacturing
The Vision China Shenzhen exhibition will highlight the convergence of machine vision and AI with a dedicated “Showcase for Machine Vision Innovative Products” Area and the Vision + AI High-Quality Development Innovation Conference. This platform will unveil global product launches and present full-industry-chain intelligent vision solutions for electronics, new energy, industrial automation, life sciences, and packaging industries. Attendees will gain critical insights into quality inspection, smart production, and process optimization, saving time while unlocking new business opportunities.
Innovative Technology Areas
Specialized Areas at NEPCON ASIA 2025 include:
- Embodied Intelligence Robot & Core Component Dissection Area – Featuring robot controllers, sensors, actuators, and power modules from leading brands such as Qiongche Intelligent, RobStride Dynamics, AISpeech and more, providing a window into the next frontier of robotics.
- AI Smart Glasses Disassembly Area – Showcasing 25 new AI smart glasses launched in 2025 by Huawei, Xiaomi, Meta, Lenovo, and others, integrating advanced optics, chips, sensors, and interactive technologies.
- IGBT & SiC Packaging and Testing Demo Line – Demonstrating over 50 semiconductor packaging and testing processes, supporting industry R&D and process optimization.
- Finished Electronic Product Automated Packaging Demonstration Area – Highlighting flexible manufacturing, automated packaging, and intelligent conveyance solutions from leading suppliers such as Fanuc, Elite, Feixi, and Yongchuang, enabling higher efficiency and quality control for electronic production lines.
- Engaging Global Audiences through Conferences and Forums – NEPCON ASIA 2025 will host 40 high-level forums across automotive electronics, semiconductors, AI, embodied intelligence, and smart glasses, bringing together industry experts, scholars, and practitioners to explore current challenges, future trends, and cross-industry collaboration opportunities. The SMTA International Forum will feature global technical leaders, including Charles E. Bauer Ph.D from SMTA, delivering international perspectives on the evolution of electronics manufacturing technology.
- Unlocking Global Business Opportunities – With a focus on international collaboration, NEPCON ASIA will invite buyers from Thailand, Vietnam, Malaysia, and Indonesia for factory tours, country-specific networking events, and business matchmaking. This ensures meaningful engagement between Chinese manufacturers and global electronics stakeholders, fostering partnerships and uncovering new market opportunities.
The post NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing appeared first on ELE Times.
Ever seen a green transistor before? In an old Metz camera flash unit.
| submitted by /u/Successful_Panic_850 [link] [comments] |
12 студентів КПІ ім. Ігоря Сікорського відвідають CES 2026
12 студентів КПІ ім. Ігоря Сікорського відвідають CES 2026 — одну з наймасштабніших технологічних виставок світу, яка відбудеться у Лас-Вегасі 6-9 січня 2026 року.
Understanding Slope Detectors for FM Demodulation
Vintage Siemens Photodiode from an old Metz camera flash
| | I just parts-salvaged a Metz camera flash with a burnt-out charging transformer, and found this vintage beauty on the inside. Tell me what you think! [link] [comments] |
Crime scene
| This bloody LM2576-33 (new) gave out 10V instead of 3,3V. Killed two STM32 before I figured out WTH was going on. I am, of course, going to widlarize it, as it it written in the ancient scrolls. [link] [comments] |
I found the issue with my LCR tester
| After addressing the issue with the shorted Kelvin Leads this instrument a FNIRSI LC2010E, it has so far proven to be a handy tool to have going above and beyond my Fluke DMM. [link] [comments] |
Made my own Lipo charger
| | Today I milled another working pcb (for practice) and its turned out great! In the basic TP4056 chip, only replaced the leds with bigger ones. [link] [comments] |
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