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Ayar Labs joins NVIDIA NVLink Fusion ecosystem to bring CPO to rack-scale AI infrastructure
Rohde & Schwarz Secures Critical Certification for Next-Gen eCall Compliance
The hybrid eCall test specification EN 18052 states that a hybrid system must combine different transmission paths and protocols to make sure an eCall reliably reaches its destination. In practice, this means a vehicle uses NG eCall functions (IP/IMS-based voice and data over 4G/5G) but can automatically fall back to available classic CS eCall (2G/3G) transport paths when coverage or service quality degrades. Manufacturers need to validate hybrid implementations to ensure they can trigger calls, transmit the minimum set of data (MSD), maintain GNSS positioning, and deliver intelligible voice quality across multiple network scenarios, including voice over New Radio (VoNR), voice over LTE (VoLTE), and circuit-switched fallback. Tests must demonstrate that a system remains robust during handovers and under degraded radio conditions, while also complying with relevant CEN, ETSI, 3GPP, and national requirements.
“We use the solution for functional tests and protocol conformity tests as well as for the type-approval of In-Vehicle Systems (IVS) that implement hybrid eCall and NG eCall,” says Thomas Reschka, Senior Technical Consultant at cetecom advanced.
Rohde & Schwarz has updated its eCall evaluation solution, CMX-KA09x, to support compliance with EN 18052:2025 and EN 17240:2024+A1:2026. The CMX-KA099 option completed Public Safety Answering Point (PSAP) test scenarios in accordance with EN 18052:2025, while the CMX-KA098 option completed PSAP test scenarios in accordance with EN 17240:2024+A1:2026. This marks an important step toward meeting European requirements for NG eCall test systems. The test environment allows the simulation of the real world mobile network conditions and the emulation of various network scenarios. This is a significant advantage in preparing for certifications or the market launch of new vehicle models.
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XpressConnect PCIe 6.0: Solving AI Data Center Latency
As AI workloads continue to scale, the data center architects show limitations by signal reach and rising latency, leaving valuable memory resources underutilized across large GPU clusters. These challenges boost as interconnect speeds increase. At 64 GT/s (giga transfers per second), signal integrity limitations can restrict system scale and burden server architectures. In response, Microchip Technology releases XpressConnect PCIe 6.0 and CXL 3.1 retimers to enable memory expansion and resource disaggregation in large-scale AI fabrics.
The retimers extend signal reach beyond conventional PCIe Gen 5 and Gen 6 electrical limits, enabling more flexible system designs across complex baseboards, riser cards, and cabled interconnects. The retimers are engineered to help address these challenges by enabling higher-bandwidth connectivity while supporting the stringent thermal requirements of modern AI fabrics that require power budgets. XpressConnect retimers achieve a pin-to-pin latency of less than 12 ns, approximately 80% lower than PCIe 6.0 specifications. This low-latency performance helps improve utilization of AI accelerators and GPUs by reducing data stalls in high-density AI clusters.
“AI data centers are increasingly constrained not by compute, but by the ability to move data efficiently across the system. As PCIe 6.0 pushes speeds to 64 GT/s, signal reach and latency become critical design challenges,” said Brian McCarson, corporate vice president and GM of Microchip’s data center solutions business unit.
Our XpressConnect retimers are designed to act as the high‑performance nerve center of the AI server, helping customers build more scalable, power‑efficient fabrics by reducing latency and improving connectivity across dense GPU clusters. This system‑level approach allows data center architects to reclaim underutilized resources and improve overall platform efficiency at scale.
The XpressConnect retimers round out Microchip’s data center portfolio and are engineered to work alongside the company’s 3-nm Switchtec PCIe Gen 6 switches, Adaptec SmartRAID controllers and Host Bus Adapters (HBAs), and Flashtec NVMe controllers, helping enable a pre-validated, interoperable fabric. Microchip’s XpressConnect PCIe Gen 6 and CXL 3.1 retimers can integrate with PCIe Gen 3, Gen 4, and Gen 5 platforms as required, helping reduce time to market. The retimers also connect into Microchip’s ChipLink diagnostic ecosystem, delivering a unified graphical user interface for real-time 2D eye capture and four-level pulse amplitude modulation (PAM4) telemetry. These capabilities help data center operators monitor link health more effectively and simplify troubleshooting, which can help reduce the total cost of ownership.
Engineered as an industry-standard, drop-in solution, XpressConnect retimers are designed to help reduce the risk of single-vendor dependency for hyperscalers. Additionally, the devices support flexible link bifurcation configurations (1×16, 2×8, and 4×4) and align with widely adopted retimer footprint guidelines, while providing enterprise-class features such as hot-plug support and end-to-end data integrity. Visit the website to learn more about Microchip Technology’s data center solutions for high-performance compute, storage, and connectivity.
Development Tools
Microchip’s ChipLink diagnostic tools offer comprehensive debug, diagnostics, configuration, and analysis through an intuitive graphical user interface (GUI). ChipLink connects via in-band PCIe or sideband signals such as UART, TWI, and EJTAG, enabling flexible, efficient monitoring and troubleshooting throughout design and deployment.
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University of Texas at Dallas and Attolight launch new demo lab for wide-bandgap R&D
BTL Deploys Taiwan’s First CTIA-Compliant OTA Test System with Rohde & Schwarz
Rohde & Schwarz supplies the independent test house BTL Laboratory in Taiwan with a full R&S TS8991 OTA test system that meets CTIA Certification standards. Plus, the company’s experts give hands‑on support throughout the necessary accreditation audits. This collaboration makes BTL the first test house in the region to provide its customers with comprehensive over-the-air testing services, including certification of wireless devices in line with CTIA Certification OTA requirements based on a Rohde & Schwarz test system.
BTL relies on Rohde & Schwarz to install a full CTIA Certification-compliant turnkey OTA test solution in one of its prominent testing and certification laboratories in Taiwan. The project covers the R&STS8991 over-the-air test system, related measurement software, a ready‑to‑use third-party test chamber, and a positioner from a single source. Furthermore, Rohde & Schwarz experts provide guidance and support on-site throughout the process of the two necessary accreditation audits performed by TAF (Taiwan Accreditation Foundation) and CTIA Certification, to guarantee measurement proficiency and accuracy.
Rohde & Schwarz and BTL collaborates closely to make sure the test chamber and its supporting infrastructure provide an interference-free test environment, a requirement for reliable measurements. The single‑source arrangement simplifies procurement for the test house in comparison with solutions that rely on several vendors.
As the first test lab in Taiwan using the R&S TS8991 with CTIA Certification. BTL now offers OTA measurements on wireless devices that use 2G, 3G, 4G, 5G, Wi‑Fi, and Bluetooth technology, especially notebooks and laptops. Furthermore, by keeping it compatible with new wireless standards, A‑GNSS, it upgrades the measurement software of the test system. By bringing in expertise in antenna measurement.
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Ruggedized connectors: Not necessarily big or bulky
Ruggedized connectors are usually associated with military/aerospace, industrial, and some medical applications, but there are consumer ones as well, in special circumstances. Of course, the phrase “ruggedized connector” invokes different requirements in different circumstances.
In brief, it’s the ability of the connector to endure and consistently function to specifications despite extreme mechanical, environmental, and thermal stresses. These stresses differ depending on the operating conditions but often have overlap as well. For example:
- Connectors in land-based military systems must handle severe vibration, dirt accumulation (dust, sand, grit), and cold and heat extremes.
- Seaborne interconnects must withstand prolonged exposure to corrosive saltwater; deep-sea ones must also withstand crushing pressure.
- Aerospace applications must tolerate repeated take-offs, landings, and in-flight vibrations in addition to wide temperature ranges.
- Space applications have more extreme temperature swings, vacuum exposure and outgassing, and intense mechanical stress during launch and re-entry.
- Industrial applications often need to function despite vibration, shock, dirt, grease, abuse, and even neglect.
- Some consumer-facing applications such as vending machines, commercial washers/dryers, arcade games, and elevators/escalators also need ruggedized attributes; it’s a surprisingly long list here.
Meeting these requirements involves an understanding of multiple factors, including:
- Vibration: connectors in military vehicles or fighter jets are tested to resist forces up to 20 g.
- Shock: a high-impact force during rapid acceleration or deceleration is a distinct from vibration. It can be as high as 50 g for standard connectors and 100 g for nano and micro designs.
- Temperature extremes: ground-based systems may see temperatures ranging from -65°C to +125°C while space systems can go as high as 200°C.
- Sealing and ingress protection: connectors may need to be protected against exposure to moisture, dust, and contaminants to ensure long-term operation using sealing solutions such as O-rings, gaskets, and grommets.
- Corrosion: it’s caused by exposure to moisture and salt spray, leading to oxidation.
Deciding on a ruggedized connector requires attention to two broad design issues: the body or shell, and the electrical contacts.
For the body or shell, vendors and users consider what it’s made of, how it mates, retention and locking, and more. For this reason, rugged connectors are often associated with relatively bulky form factor, locking rings, and similar; but this is not necessarily the case.
For the contacts, ruggedized connectors also have sophisticated, specially designed and fabricated contacts that use suitable base metals and are clad with advanced plating to withstand and maintain contact despite the challenges. The contact pairs are often based on a multipoint design with two or four mating surfaces for redundancy, rather than a single mating point.
Start with a classic
One widely used choice for a ruggedized connection is the classic D-subminiature connector. If you think that the classic 9-pin D-subminiature connector (often called DB-9) and the rest of the broader family of D-subminiature connectors have largely disappeared due to the fading away of the “ancient” RS-232 interface—along with the rise of various versions of USB and Ethernet connectors—that’s not the case at all.
The D-sub form factor has been in use since the 1950s and still offers many advantages. It’s fully shielded against EMI/RFI and provides a sealed or nearly sealed enclosure. And it’s mechanically rugged, and its mating halves can be locked to each other with small jackscrews or other arrangements. This class of connectors is still widely used due to their flexibility, integrity, track record, and wide variety of models and versions. It’s so good that it is widely used in mil/aero and space-related designs.
This connector is offered in six basic standard-size bodies, but that is only part of its versatility. It also offers flexibility in its electrical contact positions and types.
In addition to offering connector shells with the same contact type at all positions, “Combo-D” D-subs such as those from Amphenol Positronic provide a mix of independent signal and power contacts within the connector shell (Figure 1). A single D-sub can support multiple signal contacts, power contacts, and more in a variety of mix-and-match arrangements. There are available contacts for signal, power, shielded, high voltage, thermocouple, and even fiber-optic applications.
Figure 1 The Combo-D subminiature connector style supports many signal- and power-path combinations (upper); these combinations are available in standardized, named shell sizes and contact arrangements (lower). Source: Amphenol Positronic
Among the material options for the shell are:
- Thermoplastic polymers offer excellent mechanical strength, thermal resistance, and chemical stability. These materials effectively absorb vibration and shock in a low-weight structure.
- Composite materials such as fiberglass-reinforced polymers and carbon fiber composites provide excellent strength-to-weight ratios. They can be engineered to maximize specific properties such as tensile strength, impact resistance, or thermal stability.
- Metal enclosures of stainless steel and aluminum alloys are preferred materials for connector housing in the high-shock, high-vibration, and high-EMI environments of aerospace and defense applications.
The virtues of the sub-D shell—or any ruggedized housing—are an important part of the connector story, but they are only half of the ruggedness reality as the electrical contacts and their attributes are also critical. Over the years, there have been many innovations in contact technology with respect to materials, design, and electrical and mechanical performance.
For example, Amphenol Positronic uses its patented PosiBand contact technology (U.S. Patent 7,115,002) in one of its D-sub families. This contact has a unique approach to provide enhanced performance, where its external pressure-element design fully separates the mechanical action from the electrical action of the connection (Figure 2).
Figure 2 The PosiBand uses a patented design to separate the mechanical action and the electrical action of the connection. Source: Amphenol Positronic
The pressure element performs the mechanical action by applying a force pressing the male pin against the inner female cavity, achieving electrical connection along a long line of direct contact. Among its many subtle but important attributes is the spring clip within the PosiBand; it’s a small but critical part of the assembly and a key contributor to its vibration/shock performance (Figure 3).
Figure 3 The PosiBand spring clip provides a normal force across the contact area and so maximizes the electrical mating-surface contact area. Source: Amphenol Positronic
This spring-tempered beryllium copper alloy provides a normal force on the male contact, contributing to a rugged and reliable contact pairing. At the same time, it offers a lower average insertion force while meeting or exceeding performance requirements.
Consumer connectors get a little more rugged, too
The recent European initiative mandating use of USB-C for many classes of consumer end products is a major factor driving the use of this connector. Due to the wide availability of USB-C connected functions and peripherals, it seems logical that the connector and associated standard would be worth considering for medical, industrial, and other non-consumer appliances.
But there’s a problem with USB-C connectors: they are not rugged or sealed against intrusion, yet that’s where many may be used beyond low-end consumer applications.
Addressing this concern, Same Sky has introduced the UJ family of waterproof USB receptacles with IPX5, IPX6, IPX7, IPX8, IP66, IP67, and IP68 ratings, making them well-suited for applications where moisture and environmental contaminants are a concern (Figure 4). If you are not familiar with Same Sky, it was known as CUI Devices until it changed its name in September 2024.
Figure 4 These USB Type C connectors from Same Sky (formerly CUI Devices) feature water/dust intrusion-resistant O-rings to meet multiple IP ratings. Source: Same Sky
The five models are compatible with reflow soldering due to their UV-glued O-rings. This simplifies the PCB assembly process, as there is no need for a separate wave-soldering step (as is often the case with connectors and other larger components).
The five IP-rated USB Type C receptacles conform to a variety of USB standards, from USB 2.0 up to USB 4.0 Gen 3×2, with data-transfer speeds up to 40 Gbps as well as power delivery up to 240 W at 48 V and 5 A. The family also includes power-only models that remove the data-transfer pins to create a more cost-effective solution for designs where charging or power is the sole needed function.
If you are looking for a ruggedized connector, you have these and many other options. The first challenge is defining what you mean by “ruggedized” in your application beyond number and type of contacts and then pick which available connectors meet those criteria.
Maybe AI can help make the selection?
Bill Schweber is a degreed senior EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features. Prior to becoming an author and editor, he spent his entire hands-on career on the analog side by working on power supplies, sensors, signal conditioning, and wired and wireless communication links. His work experience includes many years at Analog Devices in applications and marketing.
Related Content
- Consumer connectors get ruggedized
- Meeting the ‘Rugged Design’ Challenge
- USB-C and Power Delivery: Too much of a good thing?
The post Ruggedized connectors: Not necessarily big or bulky appeared first on EDN.
EEVblog 1752 - WTF Texas Instruments! BIG NE5532 CHANGES!
Cree LED launches XLamp XE-B LEDs for directional lighting
Sivers and GlobalFoundries to develop silicon photonics for AI infrastructure
Новітнє обладнання для 3D-сканування за підтримки Чеської Республіки
⚙️У КПІ ім. Ігоря Сікорського офіційно відкрили та ввели в експлуатацію новітнє обладнання для 3D-сканування та постобробки деталей, аналогів якому сьогодні немає в Україні.
Останній дзвоник Політехнічного ліцею НТУУ «КПІ» 2026 року
У Центрі культури та мистецтв КПІ ім. Ігоря Сікорського відбувся особливий Останній дзвоник Політехнічного ліцею НТУУ «КПІ» м. Києва, приурочений до 35-річчя закладу.
Свято об’єднало учнів, випускників різних років, педагогів, батьків і друзів ліцею.
😎 Запрошуємо студентів взяти участь у олімпіаді з програмування «KPI-OPEN 2026»
2–5 липня 2026 року в КПІ ім. Ігоря Сікорського відбудеться XVII Міжнародна відкрита студентська олімпіада з програмування ім. С. О. Лебедєва та В. М. Глушкова «KPI-OPEN 2026».
Wise Integration unveiling digital control roadmap for next-gen power conversion at PCIM
Optimizing Vision: High-Performance Testing for Industrial Cameras and Displays
Video Dragon 6222 combines a frame grabber and frame generator in a single device. GÖPEL electronic offers a modular setup using the Video Dragon 6222 for the verification of high-resolution industrial cameras, display systems, and imaging units. As a high-performance solution, this setup is suitable for all camera and display applications where the highest standards of image quality, reliability, and reproducibility are required. The setup combines a frame grabber and frame generator into a single system, enabling the capture, analysis, and output of video data in a seamless workflow—from development through validation to production.
With increasing resolutions, frame rates, and heterogeneous interfaces, the complexity of testing camera and imaging systems is growing. Video Dragon 6222 addresses this challenge head-on and impresses with a modular hardware design, flexible sideband communication, and intuitive application software. The use of project-specific interface units, such as pin adapters, enables flexible implementation and a precise connection to the respective applications. Developers, test engineers, and production managers thus gain a powerful solution for reliably testing stability during continuous operation, interface compatibility, and timing.
Video Dragon 6222 combines a frame grabber and frame generator in a single device. This allows incoming video streams from high-resolution cameras to be recorded, visualized, and analyzed. It also enables the output of test patterns and videos with freely configurable resolution, color formats, and frame rates. As a “man-in-the-middle,” Video Dragon can integrate into existing systems without affecting their behavior. This flexibility enables rapid debugging of prototypes, objective verification of production products, and long-term and stress testing under realistic conditions. The modular architecture reduces integration effort and ensures investment security, as new interfaces can be added as needed.
The included Dragon Suite software offers a clear, intuitive user interface that provides access to all hardware functions—without any programming effort. The cross-hardware interface G-API is available for integration into custom applications. It maps all hardware functions and enables rapid automation, e.g., in validation environments, production test benches, or HIL systems.
The Video Dragon 6222 product family includes three models that cover all use cases:
- G CAR 6222 (standalone device): Ideal for lab, mobile testing, and flexible setups
- G PCIe 6222 (PCI Express card): Directly in the test PC, high data density, and automation
- G PXIe 6222 (PXI-Express module): Optimized for modular test systems and fully automated production lines
These variants enable end-to-end deployment from the developer’s workstation through validation test benches to production testing.
The post Optimizing Vision: High-Performance Testing for Industrial Cameras and Displays appeared first on ELE Times.
Gartner Forecasts End-User Public Cloud Spending in India to Surpass $17 Billion in 2026
End-user spending on public cloud services in India is forecast to grow 28.1% to a total of $17.5 billion in 2026, up from $13.7 billion in 2025, according to Gartner, Inc, a business and technology insights company.
“Strong enterprise demand for AI-ready cloud infrastructure is redefining cloud investment priorities in India, driving the next phase of public cloud spending growth,” said Ashish Banerjee, Sr Principal Analyst at Gartner. This is further fueled by rising demand for application modernization, digital sovereignty, digital service delivery, and more scalable, consumption-based IT models, as organizations move toward more advanced and strategic cloud use cases.
“Cloud adoption is becoming more tightly aligned with business goals, such as improving productivity, accelerating innovation and go-to-market speed, enhancing customer experience, and strengthening business resilience,” said Banerjee.This sharper focus on business outcomes is sustaining strong momentum in cloud investments across the country.
Gartner analysts are exploring how IT infrastructure and operations (I&O) leaders can advance their cloud strategies and optimize costs at the Gartner IT Infrastructure, Operations & Cloud Strategies Conference in Mumbai this week.
Infrastructure-as-a-service (IaaS) and platform-as-a-service (PaaS) are expected to be the fastest-growing segments in India’s cloud market, with IaaS projected to grow 40% in 2026, followed by PaaS at 25.4% (see Table 1).
Table 1. India Public Cloud Services End-User Spending Forecast (Millions of U.S. Dollars)
| 2025
Spending |
2025
Growth (%) |
2026 Spending | 2026
Growth (%) |
|
| Cloud Application Infrastructure Services (PaaS) | 5,114 | 22.1 | 6,414 | 25.4 |
| Cloud Application Services (SaaS) | 3,901 | 16.7 | 4,637 | 18.9 |
| Cloud Desktop-as-a-Service (DaaS) | 171 | 4.9 | 176 | 2.9 |
| Cloud System Infrastructure Services (IaaS) | 4,470 | 34.9 | 6,259 | 40.0 |
| Total Market | 13,656 | 24.0 | 17,487 | 28.1 |
Source: Gartner (June 2026)
“The rising need for AI-ready infrastructure, including GPUs, high-performance compute, high-speed networking, scalable storage and always-on inference capacity, is amplifying IaaS adoption and driving higher spending in this segment,” said Banerjee. PaaS is the largest spending category for Indian organizations in 2026, and is forecast to reach $6.4 billion, as enterprises rebuild their technology foundations to support AI-driven initiatives.
“Organizations are accelerating adoption of AI-driven technologies to unify data, connect systems, speed up development and enable real-time digital interactions, driving PaaS growth beyond cloud migration toward platform-led execution,” said Arunasree Cheparthi, Sr Principal Analyst at Gartner.
SaaS is expected to exhibit more moderate growth in 2026. “This reflects its established adoption base, as enterprises optimize licenses, rationalize usage, and shift incremental spending toward infrastructure and platform capabilities required to scale workloads and operationalize AI at scale,” said Cheparthi.
Cloud Priorities in 2026 and Beyond
Governance of increasingly complex hybrid, multicloud, and AI-enabled environments is emerging as one of the most significant cloud challenges for enterprises in 2026. Gartner predicts that by 2030, over 60% of enterprises will perform intensive AI model activity in one cloud but leverage it with their data in another, up from less than 10% today.
“Over the next 12-18 months, I&O leaders in India need to shift from cloud adoption to disciplined execution,” said Banerjee. “This includes prioritizing AI-ready data and infrastructure, stronger governance, FinOps maturity, security-by-design, and dynamic workload placement across hybrid and multicloud environments.”
“Organizations that can scale AI and digital initiatives while demonstrating business value, maintaining cost and risk discipline, and addressing critical skills gaps without slowing innovation, are expected to outperform their peers.”
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Infineon Brings 800V Power Delivery to Nvidia’s MGX AI Server Racks
Infineon Technologies, a leading provider of power systems and IoT, joins NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions support NVIDIA’s MGX architecture and 800 VDC power architecture, an open, modular reference architecture for AI factories in the agentic AI era. 800 VDC MGX-compatible power racks help existing AI infrastructure scale AI compute performance and power density, creating an upgrade path for future AI infrastructure.
“As a member of NVIDIA’s ecosystem, Infineon is working with NVIDIA to redefine power delivery systems from the grid to the processor core, which is required for this next phase of AI innovation,” says Adam White, Division President, Power & Sensor Systems at Infineon. “As AI models continue to grow in size and complexity, data centers must deliver dramatically more compute performance within the same physical, power, and cooling constraints. Combined with NVIDIA’s modular MGX architecture, Infineon’s power solutions significantly enhance energy-efficient power distribution across the entire data center power flow. We look forward to continuing our work with NVIDIA to bring more MGX-powered innovations to market.”
Infineon’s deep expertise in power conversion from grid to core leverages all relevant semiconductor materials, including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). This comprehensive approach helps accelerate the transition toward full-scale 800 VDC architectures. Using Infineon’s GaN technology at switching frequencies close to 1 MHz enables ultra-compact bus converters at an industry-leading efficiency, while the combination of Infineon’s proprietary SiC JFET technology and dedicated control ICs is the perfect match for protection and hot-swap functionality of native 800 V server boards. Infineon’s power management solutions convert power from 800 V to 50 V, 12 V, or even down to 6 V.
As part of the NVIDIA MGX AI Factory ecosystem, Infineon supports the complete 800 VDC power conversion flow down to an intermediate bus voltage and core voltage in systems based on NVIDIA MGX, helping to reduce conversion stages and deliver DC power closer to the rack. This improves power efficiency, simplifies infrastructure, and supports higher-density AI deployments.
About NVIDIA 800 VDC
NVIDIA’s 800 VDC MGX-compatible power racks help existing AI infrastructure increase compute performance and power density without waiting for full-scale 800V DC AI factories. They provide an upgrade path for higher-density accelerated computing, enabling hybrid power architectures that protect current infrastructure investments while preparing AI factories for future workloads.
About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market.
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One-shot surge protection
This moral of this story: any promises of protection and safety should be double-checked for validity.
Surge (over-voltage) protection is a rather frequent function, but implementing it robustly is not a very simple task. Recently, I stumbled upon a device called an “Extension Lead With Surge Protection“. I already owned several other gadgets from the same manufacturer, and they were by and large OK. “Why not?” was my thought, so the new gadget I also bought.
Wow the engineering world with your unique design: Design Ideas Submission Guide
My initial testing involved connecting the device to AC outlets both with and without ground. The gadget correctly identified both of these configurations, which was good, but I wasn’t yet done.
The gadget also promised protection from surges up to 2000 Volts (the normal AC voltage is 220V here where I live). This protection was its main merit, so of course I had to check this feature as well. I did so with the simple circuit shown in Figure 1.
Figure 1 This simple circuit supports confirmation of valid (or not) surge voltage protection.
The circuit produces a DC voltage of roughly double the input AC amplitude, approximately 600V in this case. The DC output shouldn’t be considered a shortcoming! The values of resistors R1 and R2, and diode Z1 (a 200V Zener diode in this case) need to be recalculated if your AC outlet voltage isn’t 220V.
The circuit also includes a LED which will illuminate only when this doubled voltage really is present on the gadget’s output. The LED should be bright enough for a current of ~ 1mA or less. Should I warn you here to beware of high voltage; to be cautious and not to connect any inappropriate load to the circuit? That said, I’ll continue the story.
I connected an AC/DC voltmeter to the output of the “Extension Lead with Surge Protection”, while its input was connected to the output of the circuit. The voltmeter showed 600+ volts! The gadget was simply translating its input to the output without any high voltage detection, far from protection.
To figure out what had gone wrong, I had to dismantle the gadget, which was not a simple task, as as it turned out. The screws required a very specific bit in order for them to be unscrewed. At this point, I prepared to see something interesting inside, and indeed there was!
The circuit within had several transistors to detect unconnected ground, which I’d already confirmed worked. It also had two varistor/thermal switch pairs, in thermal contact. Unfortunately, these thermal switches were only single-tasked! Being one-shot fuses, they could protect the load only once, leaving it permanently disconnected afterwards. “One-shot Surge Protection” would have been more accurate.
It seems that the designers realized this fault too late, so they instead connected the output of the gadget directly to its input, bypassing and completely disabling any surge protection in the process! My disappointing purchase had transformed into an interesting project, enabling me to re-enable the gadget’s protection again, albeit on a one-time-only basis.
—Peter Demchenko studied math at the University of Vilnius and has worked in software development.
Related Content
- Four key surge protection methods for RF designs
- Top 10 circuit-protection devices
- Gas discharge tubes (GDTs): From sparks to circuit protection
The post One-shot surge protection appeared first on EDN.
Keysight Tackles Semiconductor Talent Gap with Executable RF Design Whiteboard
Keysight Technologies, Inc. announces a new capability within its RF Circuit Simulation Professional software, which enables engineers to capture their design process on an executable whiteboard. It replicates the engineer’s decision process, capturing simulations, optimizations, decision trees, and design parameters built on prior analyses. Each step generates editable Python code that can be saved, shared, and redeployed across Keysight Advanced Design System (ADS), Cadence Virtuoso, and Synopsys Custom Compiler environments.
RF organizations face a looming talent gap. McKinsey projects the semiconductor industry will need 88,000 engineers by 2029. In RF design, the challenge is more acute. Simulation methodologies spanning multiple physics domains can take years to master, and critical expertise is often lost when senior engineers leave.
Design teams face inefficient workflows, simulation bottlenecks, and knowledge barriers. RF Circuit Simulation Professional lets engineers construct their workflow on a visual whiteboard or in auto-generated Python scripts. Each step executes simulations, optimizations, and design decisions in sequence, with support for decision-based loops and parameter settings.
Each workflow becomes a repeatable methodology that can be shared across teams, reused, and driven by AI. Design review and tapeout steps that previously required manual setup for each iteration now run automatically.
Nilesh Kamdar, EDA General Manager, Keysight, said: “RF design expertise is leaving the industry faster than it can be replaced. The simulation knowledge that senior engineers have accrued cannot be transferred through documentation alone. Design teams now have a way to capture that experience as a visual, executable, reusable workflow. The structured data this generates, and the underlying Python APIs, are the first step toward fully automated, AI/ML-driven RF design.”
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EPC supporting NVIDIA MGX-based AI infrastructure with 800V-to-12.5V power conversion
EPC supporting NVIDIA MGX-based AI infrastructure with 800V-to-12.5V power conversion
Сторінки
