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Hareesh Ramana, Chief Experience Officer, Sasken Group & President, Borqs Technologies (a Sasken Group company)

India is making significant strides in electronics manufacturing with the aim of 38% value addition within five years. The device manufacturing ecosystem has grown to a significant scale, but it still depends heavily on designs and reference architectures developed elsewhere.

Building domestic capability in electronic device design, especially IoT/connected device design, is critical to India’s ambition of becoming a major electronics manufacturing hub. India’s ambition to reach 38% value addition in electronics manufacturing will be driven not only by scaling assembly but by strengthening device design and systems engineering, which can contribute as much as 30-35% of the total value creation.

Need for in-house design capabilities:

A growing model in India’s connected-device ecosystem is design-led, end-to-end IoT product development anchored locally, covering silicon integration, embedded software, connectivity stacks, and certification. Companies like Borqs Technologies (now part of the Sasken Group) exemplify this approach, offering full-stack IoT design capabilities from within India.  For OEMs, this can shorten development cycles, improve control over system integration, and reduce dependence on externally sourced IP and engineering capacity, especially in critical connectivity and compliance stages. Expanding these capabilities across the industry can help India move beyond contract manufacturing and toward the higher-value innovation layer where devices connect to data, analytics, and services.

Time to market gap:

Many IoT projects stall because hardware, firmware, cloud platforms, connectivity, and certification are handled by separate vendors with misaligned priorities.

Over the past decade, India’s product development ecosystem has matured to address these challenges, evolving from a cost-centric outsourcing base into a design-led innovation hub. Global OEMs and platform companies increasingly view India as a partner for rapid prototyping and co-innovation, not just low-cost assembly. Several end-to-end product engineering companies in India exemplify this shift by delivering integrated IoT solutions that shorten development cycles and align with global OEM roadmaps.

Integration as a strategic capability

Connected devices are no longer standalone products; they are endpoints of digital services. The differentiator is therefore systems integration across silicon, hardware, software, connectivity, and lifecycle management. A unified, end-to-end engineering model can enable:

• Faster debugging by tightening the feedback loop between hardware and software teams
• Fewer integration issues by reducing handoffs across multiple vendors
• Quicker prototyping and validation through coordinated design and test cycles
• More predictable certification and production ramp by planning compliance and manufacturability early
• A single accountable partner from concept through delivery and lifecycle management

This is particularly vital for industrial-grade devices where reliability, security, and compliance define adoption. Indian engineering firms with cross-layer capabilities are increasingly enabling platform-driven approaches that allow module reuse across verticals like automotive, energy management, and logistics.

AI and advanced technologies and product development:

Advanced technologies like AI, IoT, automation, digital twins, and cloud computing are transforming product development. AI-driven analytics reduce manual testing cycles, while digital twins simulate device behaviour under real-world conditions, enabling faster iteration and higher reliability.

Demand for software-defined vehicles, smart energy infrastructure, automated factories, and connected appliances is accelerating globally. Multinationals are expanding design centres and co-innovation programs in India to build products for both developed and emerging markets.

For India, the opportunity lies in moving beyond contract manufacturing to the high-value layer where devices meet data, analytics, and services. Mastery over sensors, edge intelligence, connectivity stacks, and lifecycle platforms can enable the country to capture a far greater share of the global electronics economy.

The coming decade will reward ecosystems that can bridge the design-to-deployment gap with reliability and speed. India has the talent, digital infrastructure, and entrepreneurial energy to lead this shift. The next step is an integrated approach that unites design, engineering, and manufacturing into a single innovation continuum.

The post Bridging the design-to-deployment gap: How India can lead the next wave of connected device innovation appeared first on ELE Times.

Hi everyone, This is my Healthtracker project. This will be my first real 6-Layer PCB I have designed using EasyEDA. I am using the nrf5340 for this low Power Bluetooth application paired with couple i2c peripherals for activitiy, heartrate, time & temp. So I don't run out of storage, I integrated infineon 8-Mbit FRAM. Power is supplied to various DC/DC Buck/Boost converters found at the top. Charging is possible via USB C. I am planning to programm the SoC using the pinheaders and my DevKit. (pinheaders will be soldered out, after programming and Debugging). Oh, don't be confused with these many throughhole vias; JLCPCB curently doesn't support blind or buried vias.... Have a great day. submitted by /u/Scared_Promise_5234 [link] [comments]

submitted by /u/1Davide [link] [comments]

Thumbwheel switches may evoke early digital design, yet their compact precision and tactile feedback keep them indispensable. From setting circuit-board addresses to configuring embedded parameters, they translate simple rotations into reliable numeric codes.

Whether selecting device IDs, adjusting ranges, or defining system values, thumbwheel switches deliver a straightforward interface that endures across industrial, consumer, and embedded applications.

Thumbwheel switches (often abbreviated as TWS) offer a straightforward, tactile method for setting numerical values in electronic instruments and control systems. Each wheel is marked with digits, allowing users to rotate and lock in precise entries without complex circuitry or software.

Their mechanical reliability, clear visual indication, and ease of use have made them a staple in applications ranging from laboratory test equipment to industrial control panels. By combining compact design with intuitive operation, thumbwheel switches continue to serve as a practical solution where accuracy and simplicity are paramount.

Rolling vs. clicking: Choosing your digital dial

While both convert a physical turn into a digital signal, the choice between a thumbwheel and a push-wheel switch comes down to how you prefer to drive your data. The rotary thumbwheel is the high-speed option, featuring a serrated edge that you roll with your thumb to flick through numbers in a single, fluid motion—ideal for quick adjustments across a broad range.

In contrast, the push-wheel is the precision specialist; it keeps the wheel protected behind a window and uses dedicated ‘+’ and ‘−’ buttons to advance the value one crisp click at a time. While the thumbwheel offers intuitive speed, the push-wheel provides tactile certainty and protection against accidental bumps, making it the go-to for industrial settings where every digit counts.

Figure 1 Rotary thumbwheel and push-button thumbwheel switches adjust numerical inputs by rotation or precision clicks. Source: Author

Sidenote: Although rotary thumbwheel and push‑button thumbwheel (push-wheel) switches differ in operation—one using a rotating wheel, the other plus/minus buttons—the term thumbwheel is widely applied as an umbrella designation for both types of digital input switches in industry.

Switch communication mechanisms

Beneath the surface, these switches speak a specific digital language through their pin configurations, typically utilizing binary coded decimal (BCD) or hexadecimal (Hex) outputs to communicate with your controller.

A BCD switch is the standard for human-readable interfaces, cycling strictly from 0 to 9; it’s the perfect fit for decimal-based inputs like a kitchen timer or a thermostat setpoint. However, if your project requires more density, a hexadecimal switch utilizes the same four output pins to provide 16 distinct positions (0–9 and A–F).

Figure 2 Example maps TWS positions to BCD code chart using 8421 pin logic. Source: Author

While both rely on the same 8-4-2-1 weighted logic—where internal contacts bridge a common pin to specific data lines to represent a value—BCD keeps things simple for the end-user, whereas hexadecimal is the preferred choice for technical tasks like setting device addresses or selecting complex software modes in a space-saving format.

As a quick aside, the 8-4-2-1 weighted logic is the most common form of BCD representation. Each decimal digit (0–9) is encoded into a 4-bit binary number, where the bit positions carry weights of 8, 4, 2, and 1 from left to right (MSB to LSB).

Thumbwheel switch output code variants

In practice, thumbwheel switches provide designers with multiple output code formats to match diverse digital system needs. The most common is BCD, where each decimal digit is encoded into a 4-bit binary value for straightforward interfacing with counters and microcontrollers.

Some switches offer decimal output, directly representing the digit without binary conversion. More specialized variants include BCD + Complement, which supplies both the normal BCD code and its inverted form for redundancy or error checking, and BCD Complement, which outputs only the inverted binary representation.

Certain models also support BCH hexadecimal coding, enabling representation of values 0–F in compact 4-bit hexadecimal form, useful in applications requiring extended coding beyond decimal digits. These output options give engineers flexibility to align switch signals with the encoding schemes of displays, logic circuits, or embedded systems, ensuring compatibility and efficient signal processing.

Thumbwheel switches: Key practical notes

In practice, each push-wheel/thumbwheel switch forms a single vertical segment, and multiple segments can be combined to build assemblies of varying sizes. The wheel or buttons enable digit selection from 0 through 9.

In a BCD thumbwheel switch, the common terminal (C) lies on one side, followed by weighted contacts for 8, 4, 2, and 1. Applying a small voltage, for instance 5 VDC, to the common allows the output value to be read by summing the weights of the contacts driven HIGH. For example, selecting digit 3 energizes contacts 1 and 2, both appearing at the common voltage.

Notably, diodes are incorporated into thumbwheel switches to isolate each weighted contact and prevent back-feeding between lines. This ensures that only the intended logic states contribute to the BCD output, protecting the switch and downstream logic from false readings or short circuits.

Figure 3 A practical example illustrates a BCD TWS with diodes installed. Source: Author

Equally important, pull-up and pull-down resistors establish defined default states for the contacts. A pull-up resistor ties an inactive line to logic HIGH, while a pull-down resistor ties it to logic LOW. Without these resistors, floating inputs could drift unpredictably, resulting in noisy or unstable outputs. Together, diodes and pull-up/pull-down resistors guarantee that BCD thumbwheel switches deliver clean, reliable, and unambiguous digital signals to the system.

Keep note at this point that datasheets for thumbwheel switches consistently caution against exceeding their specified voltage and current limits. These devices are usually intended for logic interfacing, with ratings of only a few volts and currents in the milliampere range. Operating them beyond these limits can lead to contact wear, unstable outputs, or permanent failure. As emphasized in manufacturer specifications, designers should strictly adhere to the stated ratings and apply recommended best practices to ensure reliable performance.

Also, it’s critical to distinguish between the Switch Rating and the Carry Rating when selecting a thumbwheel switch. The Switch Rating defines the maximum current allowed while the dial is in motion; exceeding this causes electrical arcing that can erode the gold plating on the contacts. In contrast, the Carry Rating is significantly higher because it applies only when the dial is stationary and the contacts are firmly seated, eliminating the risk of arcs.

Figure 4 Datasheet snippet highlights the key specifications of a thumbwheel switch. Source: C&K Switches

So, to maximize component life when interfacing with PLC inputs, many engineers employ cold switching. This involves adjusting the thumbwheel only when the circuit is de-energized, allowing the switch to operate within its higher carry capacity rather than its lower switching capacity. This practice eliminates the risk of electrical arcing across the contacts during transitions, thereby preventing signal noise and extending the operational life of the switch.

The click that counts

That marks the end of this quick take on thumbwheel switches. While we have covered a flake of theory and some essential practical pointers, there is always more to explore—from advanced BCD logic to creative modern retrofits. These switches may be a “classic” technology, but their reliability and tactile feedback still offer unique value in a touchscreen world.

What is your take? Are you planning to use thumbwheels in your next project, or do you have a favorite “old-school” component that still outperforms modern alternatives? Leave a comment below and share your experience; I would love to hear how you are putting these switches to work.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

The post Thumbwheel switches: Turning numbers into control appeared first on EDN.

I couldn't for the life of me understand why the multimeter was not reading correctly when using bananas to crocodile cables. Lesson learned: don't cheap out on cables. submitted by /u/love_in_technicolor [link] [comments]

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PONG has always fascinated me. A video game made entirely from logic blocks from the 74xx series. Without a processor, memory or software. After seeing an original PONG console at the Berlin Computer Game Museum, I set myself the goal of recreating one. And now it's finished. I didn't want to use the large arcade cabinet like the original as the ‘housing’, but something smaller that would focus on the circuit board. Because it is the ‘star’ of PONG. Ingeniously designed by Allen Alcorn, who went down in computer gaming history as the designer of PONG. But as I said, it's not a computer. I redesigned the circuit board from photos and templates. Conductor track by conductor track, component by component. The ICs are still relatively easy to obtain (I also recreated an Apple I, which was more difficult, or rather almost impossible nowadays). The control panel also had to be the same as the original, and of course a real coin validator had to be included. submitted by /u/GHelectronic [link] [comments]

This “Mona Lisa” was created as a technical demonstration by a by a Japanese company that provides PCB assembly (PCBA) services. Instead of using PCB traces or silkscreen artwork, this piece is built from about 10,000 1608-metric SMD components. The image is formed through the color variation of resistors, ceramic capacitors and other components, turning electronic parts into a high-resolution mosaic. submitted by /u/NEET_FACT0RY [link] [comments]

This post presents a component-level schematic overview of an ESP32-S3-based vision development board. The shared material focuses strictly on electronic circuit design and interconnection of active components, including the MCU core, power regulation, and peripheral interfaces. Primary active components shown in the schematic: - ESP32-S3-WROOM system-on-chip - DVP camera interface connected directly to the MCU - 6-axis IMU interfaced over I2C - MEMS microphone connected via I2S - SPI-based microSD card interface - Dedicated voltage regulation stages supplying RF, camera, and sensor domains The circuit design integrates vision, motion sensing, and wireless communication on a single ESP32-S3 platform. Power integrity, signal routing density, and pin multiplexing constraints are central factors influencing the schematic structure. The schematic is provided for component-level reference and electronic circuit visibility. Since it's newly created, it doesn't have a GitHub repository yet. submitted by /u/No-Army-950 [link] [comments]

submitted by /u/Vast_Image_4828 [link] [comments]

I love maps, transit, and DIY electronics- here is my recent project combining all three! I had an 8"x10" PCB manufactured with a custom map of Boston silkscreened on the front side. On this map, each station on the Red Line is marked by two LEDs- one for inbound and outbound trains. Data is streamed from the MBTA's API and displayed on the board, showing location, speed, or occupancy information. This version utilizes WS2812B-2020 LEDs and a very simple two-layer PCB. For future projects, I would be interested in using rear-mounted LEDs (such as SK6812-Es) for a more polished look. If you're interested in the project, all of the code, PCB files, and tutorials are open source: https://github.com/tomunderwood99/CharlieBoard submitted by /u/CyclingOctopuses [link] [comments]

Korea Advanced Institute of Science and Technology (KAIST) has demonstrated a high-efficiency, ultra-high-resolution red micro-LED display, paving the way for displays that can deliver visuals even sharper than reality...

MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) has promoted two senior leaders within the organization to the senior vice president level. The promotions further strengthen and expand the management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies...

As AI workloads and hyperscale data centers drive unprecedented power demand, operators face mounting pressure to improve efficiency and reduce grid strain. High-voltage direct current (HVDC) distribution is emerging as a critical solution, and GlobalFoundries is enabling this transition with advanced GaN technology that enables high-density, high-efficiency power conversion. This perspective explores how GF’s semiconductor innovations will power the next generation of sustainable, large-scale data centers.

The rapid adoption of AI across consumer and commercial markets is driving unprecedented investment in high-performance computing and networking. As AI models scale and proliferate across diverse applications, demand for compute power keeps rising. To meet this need, the power consumption of heterogeneous processing units (XPUs) is projected to climb from today’s 1–1.5 kW to more than 5 kW by 2030 [1]. This surge in power requirements is driving demand for denser, more efficient power conversion solutions from the grid to the core. 

Emerging power distribution architecture

Distribution of 415-480 VAC within data centers causes a patchwork of electrical conversions. AC power needs to be converted to DC power to support battery backup, and back to AC for further distribution.  But as AI systems scale up, this energy loss is too costly to absorb. A key focus area for the industry is high-voltage direct current (HVDC) distribution, which reduces conduction losses and the number of conversion stages in large clusters.

The main proposed solutions are either ±400 V (Mt. Diablo) or 800 V (Kyber) DC power delivery.  The first phase of HVDC solutions will still rely on 415-480 VAC distribution with a sidecar power rack, thereby reducing some power conversion losses.  This step has fewer power conversion stages than existing systems and reduces conduction losses by delivering HVDC to the adjacent compute rack.  However, to further eliminate power conversion stages, data centers will distribute HVDC throughout the cluster.  Additional energy savings will be achieved by implementing the 800V DC-DC conversion within the system trays in compute racks, reducing busbar conduction losses. This deployment will require a significant step up in density and efficiency. The past few months have seen hyperscalers specifying their general needs [2] of higher rack-power capacity, power efficiency, density, and scalability, as well as vendors responding with proposed converter topologies and considerations to meet those needs [3].  

This marks real progress, and it’s already clear that the key performance goals of the solutions are within reach. The benefits of these next-generation power delivery architectures include:

1. High conversion ratio – Conversion from HVDC distribution to very low XPU core voltage with as few stages as possible requires a large step-down ratio (>1000:1).  Solutions based on wide bandgap semiconductors such as gallium nitride (GaN) achieve higher conversion ratios due to higher breakdown voltages and reduced conduction and switching losses compared to silicon-based solutions.
2. Significant density increase compared to current power supply unit (PSU) designs – The increase in XPU power consumption does not come with a corresponding increase in available volume for power electronics. Computer and network architectures impose constraints on physical distance, necessitating more compact power components. Thanks to their excellent switching characteristics, GaN power semiconductors enable higher-frequency operation, allowing smaller energy-storage components such as capacitors, inductors, and transformers.
3. Extremely high efficiency at scale – The extraordinary growth in data center power consumption means that power losses in every stage translate directly to energy costs. Thus, the conversion ratio and high density must be achieved without sacrificing efficiency. GaN devices offer the best figures of merit—including lower specific on-resistance, minimal switching charge, and better high-frequency FOM—which result in the highest efficiency for a given ratio and density.

How GaN is driving data center innovation

The data center market demands not only advanced performance but also exceptional quality and reliability. Increasingly, industry consensus points to Power GaN as the key enabling technology for HVDC solutions in data centers. 

GlobalFoundries is developing GaN platforms to support this transition, including HV (650 V) and MV (200 V and below) devices. These platforms will offer industry-leading figures of merit (FoM) with the reliability and ruggedness that hyperscalers require to deploy AI at scale.

Opportunities for scaling HVDC architectures

Looking ahead to broad solution deployment, there are several major opportunities that remain, each offering room to drive the next wave of innovation on topology selection and device optimization:

• Establishing clear safety and isolation requirements: To date, safety and isolation have been discussed only in broad terms, but HVDC architectures will require isolation. Achieving safety and isolation compliance through spacing (creepage and clearance) can come at a high cost to density, while achieving compliance mechanically via conformal coating or potting can degrade thermal performance—both of which complicate serviceability of systems in the field. Defining the right balance represents a major opportunity for innovation in materials, mechanical structures, and system architecture.
• Defining EMI/EMC requirements for scaling next-generation data centers: With data centers subject to strict electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards, the industry must determine how topologies can meet them. If bulky filter components are required to scale HVDC solutions, this may prevent density targets from being met, potentially forcing alternate topology selection. It is crucial that these requirements scale to multi-GW data centers, allowing clusters to interoperate, otherwise compatibility and performance are at risk.
• Converging on optimal step-down ratios and system-level power conversion strategy: Will the industry converge to a 16x or 64x step-down, or, as the HVDC converter moves into the system tray, will system designers optimize the power conversion stages around different voltage levels?  If solutions are customized based on system-level optimization, this will likely lead to a need for regulated HVDC converters as well as unregulated fixed-ratio converters, with the two types having distinct transient requirements. These tradeoffs will affect overall system design in the future, from rack input to XPU.

Enabling scalable, efficient, and sustainable data centers

As these solutions evolve and mature, GF will collaborate with our customers to optimize device development, integrate driver and sensor functionality with power devices, and heterogeneously integrate power devices with additional components.  

It is encouraging that, along with the activity around converter feasibility, industry participants are also extremely active in pursuing open standards, such as the Open Compute Project’s Power Distribution sub-project, which will provide a roadmap for scalable, interoperable HVDC architectures. 

Adoption of HVDC architectures allows operators and OEMs to convert efficiency gains directly into XPU and network-cluster performance—delivering more usable floating-point operations per second (FLOPs) from the same energy footprint while reducing energy losses, lowering operational costs, improving rack-level density, and advancing sustainability goals through more efficient power delivery. Meeting these stringent demands at a massive scale requires solutions that ensure interoperability and long-term ecosystem value remain top priority.

Notes:

1. Future AI processors said to consume up to 15,360 watts of power — massive power draw will demand exotic immersion and embedded cooling tech | Tom’s Hardware
2. Asset Share – NVDAM 
3. Swing Aboard the 800-V Bus: NVIDIA’s AI Power Architecture and the Chips to Drive It | Electronic Design

Related Content

• The shift to 800-VDC power architectures in AI factories
• The transition from 54-V to 800-V power in AI data centers
• Solving power challenges in AI data centers
• Data center power meets rising energy demands amid AI boom

The post Powering AI at scale: How HVDC and GaN are transforming hyperscale data centers appeared first on EDN.

❤️ БО БФ "КОЛО" і Центр крові ЗСУ у співпраці із КПІ ім. Ігоря Сікорського запрошують на донацію крові kpi пт, 02/06/2026 - 14:36

The ST Foundation, the non-profit corporate arm of STMicroelectronics, hosted a media briefing late January 2026 to outline its strategic expansion in India and celebrate the recent recognition of its flagship “Digital Unify” program. Dedicated to bridging the global digital divide since 2001. The Foundation’s mission has taken on critical urgency in India, where over 400 million people remain excluded from essential digital services.

Addressing the 400 Million Divide

With global data from the 2025 ITU Connectivity Report indicating that 2.2 billion people lack basic digital access, the ST Foundation has positioned India as a central focus for its “Digital Unify” (DU) initiative. The program uses a “train-the-trainer” model and local partnerships to ensure sustainable, community-owned growth.

Impact in Asia and India

In Asia alone, the foundation has 96 Digital Unify Labs, serving about 26,000 beneficiaries per year at a cost of less than $10 per student trained.

The Foundation in India was officially registered in 2018, having reached more than 180,000 trainees to date and having established over 56 Digital Unify Labs across the country.

Key Program Impact and Expansions:

• Education for Vulnerable Children: Since 2022, the “Basic Coding” program has reached over 2,500 children aged 9–13 in slum areas, providing many with their first-ever exposure to digital devices.
• Rehabilitation for Incarcerated Individuals: In partnership with the India Vision Foundation, the “Introduction to Computer Basics” (ICB) course has trained over 3,300 incarcerated people across Uttar Pradesh and Delhi (including Central Jail Rohini) to aid in their eventual reintegration into society.
• Empowering the Visually Impaired: A specialised ICB4VI pilot recently trained 17 visually impaired girls in digital skills. The Foundation is now preparing to scale this model nationwide.

Digital Unification and Cyber Concerns

The Foundation has not only been providing underprivileged people with digital literacy but has also helped them with understanding the basic risks of cyber-attacks, briefings on cybersecurity and internet safety.

Award-Winning Impact

The briefing also highlighted the Foundation’s recent accolade as the “CSR Project of the Year” at the 7th Indo-French Chamber of Commerce & Industry (IFCCI) CSR Conclave & Awards. This award recognises the program’s effectiveness in turning the digital access gap into tangible opportunities for education and employment.

By: Shreya Bansal, Sub-Editor

The post ST Foundation Continues Expansion of Digital Literacy Initiatives in India; Honours IFCCI ‘CSR Project of the Year’ Recognition appeared first on ELE Times.

Rohde & Schwarz will exhibit its extensive portfolio of next generation of wireless technologies, under the motto, “Enabling Connections, Empowering Innovations”, at the Mobile World Congress 2026 in Barcelona, Fira Gran Via, hall 5, booth 5A80 from March 2 to 5, 2026.

The path from 5G to 6G

For a seamless evolution from 5G to 6G, Rohde & Schwarz offers future-ready test solutions for mobile devices and networks. Among the many innovative solutions, the CMX500 one-box signalling tester stands out throughout multiple demos, addressing today’s and tomorrow’s testing challenges.

• Paving the way for 6G, Rohde & Schwarz showcases carrier aggregation combining FR1 and FR3 frequency ranges with its CMX500 one-box signalling tester. The demonstration validates end-to-end device behaviour across the aggregated spectrum. FR3 (7.125 to 24.25 GHz) has been identified by industry and research as a “sweet spot” for combining wide-area coverage with high capacity. Equipped with the new, upgradeable RFU18 board for the CMX500, the tester covers up to 18 GHz, giving users enough headroom for FR3 evolution and a future-ready path for testing next-generation networks.
• Another setup addresses virtual signalling testing. Based on the CMX500, Rohde & Schwarz demonstrates a new approach of shift-left testing, allowing R&D engineers to find design flaws early in their mobile radio modem chips before costly silicon fabrication. This early SDR-based validation will significantly cut time-to-market for 6G devices.
• Ray tracing simulates real-world signal propagation environments, making it a valuable technique for AI receiver testing for future 6G devices. Rohde & Schwarz will showcase the CMX500 as it creates a digital twin of signal propagation within its test environment by leveraging the VIAVI ray tracing engine. This enables controlled and reproducible validation of complex scenarios with high measurement precision, facilitating site-specific optimisation of radio links and reducing the need for tedious field tests.
• Rohde & Schwarz also advances 5G and emerging 6G testing with its AI-based toolset AI Workplace for the CMX500, massively enhancing testing productivity. TechAssist uses natural language to control the CMX500, enabling rapid test-scenario setup and status/configuration queries, while an upgraded ScriptAssist with a new interface simplifies and accelerates scripting for R&D protocol and application testing as well as instrument automation. Visitors can experience these AI-powered tools in action within various setups at MWC 2026.
• Mobile XR and personal AI devices like smart glasses and wearables are key for 5G-Advanced and 6G-enabled immersive 3D communications. Delivering compelling, low-latency experiences will require rigorous, realistic testing. Rohde & Schwarz will demonstrate an end-to-end testbed centred around the CMX500, addressing AI on RAN and XR testing challenges with its ability to emulate 4G, 5G and Wi-Fi networks, applying both RF and IP impairments to reproduce real-world conditions such as interference and congestion.
• 6G ISAC (Integrated Sensing and Communication), which leverages mobile networks for object detection, is rapidly gaining traction. Rohde & Schwarz will demonstrate new capabilities of its R&S AREG800A, including the emulation of micro-Doppler signatures – in addition to distance, speed and RCS – to support object classification, such as drones.
• For testing base stations and network infrastructure, Rohde & Schwarz showcases the PVT360. It meets the requirements for testing FR1/FR2, small cells and O-RU in a single box. For the verification of frequency converting antennas used in SATCOM, NTN or 5G and 6G applications, visitors can learn about CATR-based over-the-air test chambers, enabling fast OTA-testing of phased antenna arrays.
• With the first off-the-shelf commercial mobile devices now available for 5G broadcast, Rohde & Schwarz lets visitors explore seamless rich data distribution transmission to mobile devices, innovative applications like venue casting, emergency alerts and advanced solutions for terrestrial positioning, navigation and timing.

From ground to orbit with NTN

As terrestrial and satellite-based networks converge, it becomes increasingly complex to simulate real-world conditions while meeting 3GPP requirements, for instance, when it comes to handovers within orbits, between orbits or from space to ground. As NTN technology matures alongside 5G and towards 6G, overcoming significant technical hurdles is key to realising NTN’s potential.

• Rohde & Schwarz has upgraded its CMX500 one-box signalling tester, supporting NR-NTN, NB-NTN and Direct-to-Cell (D2C/DTC) technologies in a single platform. The tester creates a digital twin of the sky, simulating orbits, bands and impairments like Doppler shifts and fading. Combined with smart features like the Constellation Insights Tool, it allows engineers to visualise satellite constellations, analyse coverage gaps and observe trajectories.
• Rohde & Schwarz also supports NTN conformance and carrier acceptance testing, offering the highest number of validated test cases for NR-NTN according to 3GPP Rel.17. In cooperation with Samsung, validations were conducted across all three test domains: RF, RRM and PCT. At MWC 2026, visitors will not only be able to experience these test cases but also see a demonstration of Viasat’s test plan for NB-NTN, covering protocol, performance and RF test scenarios.

Industry collaborations to accelerate AI-RAN

AI is becoming an integral part of the RAN, enabling performance optimisation, improved energy efficiency and more autonomous operations. As a member of the AI-RAN Alliance, Rohde & Schwarz continues industry collaboration and provides reliable test equipment for navigating interoperability in this evolving landscape.

• Rohde & Schwarz and Nokia Bell Labs have collaborated on an AI/ML-based 6G base station radio receiver employing Digital Post Distortion (DPoD) to recover distorted uplink signals. DPoD improves link budget, preserves coverage and reduces the need for dense site deployments, lowering costs. DPoD also reduces mobile device complexity and power consumption. The testbed at the Rohde & Schwarz booth, comprising the R&S SMW200A vector signal generator and the newly launched FSWX signal and spectrum analyzer will showcase the improved performance of Nokia’s AI receiver for uplink signals with different distortion levels.
• In collaboration with NVIDIA, Rohde & Schwarz will exhibit its latest proof-of-concept, also leveraging digital twin technology and high-fidelity ray tracing. This approach creates a robust framework for testing AI-enhanced base stations for both 5G-Advanced and 6G under realistic propagation conditions. This integration aims to bridge the gap between AI-driven wireless simulations and real-world deployment, facilitating more efficient and accurate testing of next-generation receiver architectures.

Next-generation Wi-Fi experience

Wi-Fi 8 sets new expectations for consistent, ultra-high-reliability and quality connectivity. Designed to handle a growing number of connected devices and demanding applications like XR or industrial IoT, IEEE 802.11bn employs ever more complex MIMO (Multiple-Input, Multiple-Output) scenarios. Rohde & Schwarz enables manufacturers with its solution portfolio, from R&D to production.

• The CMX500 one-box signalling tester is now equipped with comprehensive Wi-Fi 8 capabilities. The tester’s flexibility and embedded IP test capabilities make it a versatile solution for a broad range of Wi-Fi 8-specific tests, such as dRu (distributed resource unit), introducing distributed resource allocation, and UEQM (unequal modulation) where different MIMO layers use different modulation schemes, as well as 320 MHz channel bandwidth.
• To navigate the technical complexities of Wi-Fi 8 throughout the entire device lifecycle – from development to production – Rohde & Schwarz will exhibit the CMP180 radio communication tester, designed for testing in non-signalling mode with advanced capabilities and broad bandwidth support. The CMP180 combines two analysers and generators for efficient testing of 2×2 MIMO Wi-Fi 8 devices.
• For high-end MIMO signal generation and analysis tasks in R&D, Rohde & Schwarz will display the R&S SMW200A vector signal generator and the newly launched FSWX signal and spectrum analyser. With its outstanding standard EVM performance and in combination with its cross-correlation feature, the FSWX discovers details of Wi-Fi 8 signals that have been hidden up to now and offers new margins for optimisation. Its multichannel architecture makes the FSWX well-suited for analysing complex scenarios like multi-user MIMO (MU-MIMO).

Automotive connectivity testing 

Vehicle manufacturers are integrating increasing levels of wireless connectivity to enable new user experiences, safety features and higher levels of autonomous driving. Rohde & Schwarz offers precise test solutions that cover all wireless technologies used in the automotive industry, from 5G and ultra-wideband to C-V2X and GNSS.

• With NG eCall becoming mandatory for vehicles sold in Europe starting in 2026, Rohde & Schwarz will demonstrate compliance testing capabilities using the CMX500 one-box signalling tester and R&S SMBV100B vector signal generator. The test solution also supports the upcoming Chinese automotive GNSS test standard, GB/T 45086.1 2024, expected to be mandatory for the Automotive Emergency Call System in 2027, with automated testing.
• Non-terrestrial networks have the potential to provide ubiquitous automotive connectivity and require enhancements to key components such as the chipsets, TCU and antennas. Trade show visitors can discover at MWC 2026 how the company’s comprehensive NTN test solutions can help the automotive industry create the always-connected vehicle.

Solutions for mission-critical communications and spectrum monitoring

Mission-critical communications (MCX) support public safety, first responders and emergency services by providing extremely reliable, low-latency and secure communications even in adverse conditions. Rohde & Schwarz will showcase its integrated solutions for testing devices and mobile networks, facilitating the ongoing migration to 3GPP-compliant broadband mission-critical services.

• The QualiPoc platform will be demonstrated with new capabilities for MCX testing. This smartphone-based solution allows detailed performance assessment of MCX private and group calls, including measurement of 3GPP-defined MCX KPIs. New features include direct MCX app control and the ability to measure quality of service (QoS) and quality of experience (QoE) for public safety communications. The R&S LCM, an autonomous monitoring probe, and the R&S TSMS8, the fastest network scanner, will also be on display, further expanding capabilities for both business and mission-critical networks.
• Rohde & Schwarz will also exhibit a protocol conformance test solution to verify that MCX devices and client software implementations adhere to 3GPP specifications.
• Expanding its spectrum monitoring portfolio, Rohde & Schwarz will launch two new products at MWC Barcelona 2026: These solutions will enable regulatory authorities, network operators and public services in over 100 countries to actively protect the electromagnetic spectrum and address evolving monitoring challenges. The new devices will enhance capabilities in interference hunting and regulatory compliance.

Endpoint security, network visibility and secure network solutions

Robust security solutions deliver seamless and reliable communications experiences. Rohde & Schwarz subsidiaries will also present their innovative solutions supporting the wireless ecosystem.

• The Rohde & Schwarz Networks & Cybersecurity division, comprising the subsidiaries Rohde & Schwarz Cybersecurity and LANCOM Systems, provides endpoint security, secure networks and high-quality cryptography. With products “Engineered in Germany”, they ensure trustworthy, reliable and secure data transfer, specialising in the public, critical infrastructures, defence, health, retail and SME verticals. At MWC 2026, Rohde & Schwarz Cybersecurity will showcase the Layer 2 encryptor R&S SITLine ETH NG and the R&S ComSec solution enabling secure mobile working with sensitive data on iPhones and iPads. LANCOM Systems will present an overview of its Wi-Fi 7 access point portfolio, the latest 5G router models and firewalls.
• As networks become more distributed, encrypted and dynamic, network visibility becomes indispensable. At the Rohde & Schwarz booth, visitors will experience how the ready-to-deploy, DPI-powered R&S Probe Observer delivers deep network visibility, precise real-time traffic analytics and actionable intelligence. Developed by ipoque, a Rohde & Schwarz company, this deep packet inspection (DPI) software probe analyses network traffic at the application level, enabling operators to understand, optimise, and control their networks while supporting faster detection, diagnosis and resolution of network and service issues.

Rohde & Schwarz will showcase its comprehensive portfolio of test and measurement and industry solutions at Mobile World Congress 2026 at Fira Gran Via in Barcelona, in hall 5, booth 5A80. Trade magazine editors and press representatives visiting the event are invited to schedule briefings with their press contact at Rohde & Schwarz.

The post R&S drives connections and innovations at MWC Barcelona 2026 appeared first on ELE Times.

Speaking at the Auto EV Tech Vision Summit 2025, Mohammadsaeed Mombasawala laid bare a reality the EV industry often skirts around—electric vehicles are evolving fast, but the ecosystem supporting them is dangerously lagging.

Opening his address with a provocative question—“Is EV done and dusted?”—Mombasawala was quick to answer it himself:  far from it. Innovation in EVs is accelerating, but the real battleground is no longer the vehicle alone. It is charging infrastructure, grid readiness, and software-defined architectures that will decide the success or failure of the transition.

 Charging Anxiety Will Not Be Solved with AC

According to Mombasawala, EV charging anxiety cannot be addressed with slow, AC charging solutions. The industry is inevitably moving towards high-power DC fast charging, with capacities of  50 kW and above becoming the new norm.

But charging speed alone is not enough. He highlighted the emergence of plug-and-play charging, where vehicles authenticate themselves automatically through preloaded scripts and cloud connectivity—eliminating the need for RFID cards or manual authentication. In this model, the vehicle communicates with the charger via the cloud, pre-authorises itself, and begins charging seamlessly, reflecting the deeper convergence between EVs and software-defined vehicles (SDVs).

Vehicle-to-Grid: Opportunity Born from Crisis

One of the most critical trends Mombasawala pointed to was  Vehicle-to-Grid (V2G) —using EVs not just as consumers of electricity, but as mobile energy sources capable of feeding power back into the grid.

This, he explained, is not just a technological curiosity, but a necessity born from a looming crisis. “I have done the calculation myself,” he noted. If all vehicles in Delhi were replaced with EVs and charged using 50 kW fast chargers, the grid would require 7,000 MW of additional power just to charge vehicles within 5–8 minutes. No grid today is prepared for that kind of load”.

The implication is stark: while EV adoption is racing ahead, grid infrastructure is nowhere close to ready.     

The Grid Is the Real Bottleneck

Mombasawala warned that without serious innovation and investment in electrical infrastructure, a rapid EV transition could destabilise the power system itself.

“If we transition the whole country by 2030 at this pace, the grid will collapse,” he cautioned. The issue is no longer just EV range anxiety—it is national power security. Without infrastructure upgrades, consumers may find themselves unable to charge vehicles and facing power shortages at home.

Electrical engineers, he stressed, have a monumental role ahead—not just in vehicles, but in re-architecting the grid to handle electrified mobility at scale.

Software-Defined Vehicles: Complexity Beneath the Surface

While SDVs are often discussed as sleek, updatable platforms, Mombasawala highlighted the hidden complexity beneath the headlines. Today’s vehicles contain hundreds of ECUs communicating through multiple discrete protocols. The industry urgently needs standardisation, moving towards  Ethernet-based architectures to manage growing data and control demands.

He also pointed to emerging semiconductor trends such as chiplets, where optics and semiconductors are packaged together in a single die—underscoring how vehicle electronics are becoming more sophisticated and tightly integrated.

Why the Cloud Is Non-Negotiable

A recurring theme in his address was the absolute necessity of cloud backends for SDVs. With millions of vehicles requiring continuous updates, feature upgrades, and service enhancements, localised solutions are no longer viable. “There is no red reset button,” he reminded the audience. Without cloud-based services, upgrading and managing vehicle software at scale becomes impossible.

AI, Data Centres and the Limits of In-Vehicle Intelligence

One of the most sobering insights came from Mombasawala’s discussion on  AI in SDVs. Advanced vehicle functions—braking behaviour, acceleration profiles, comfort tuning—will increasingly rely on AI models trained on massive datasets. But these models cannot be trained inside vehicles.

To put scale into perspective, he cited how companies like Meta use around  600,000 GPUs, while Elon Musk’s Grok reportedly uses 800,000 GPUs in a single data centre. Even with such resources, training models can take weeks. Training safety-critical vehicle systems like braking could require  6–8 weeks per iteration, and continuous retraining as new data arrives.

This underscores a key reality: SDVs are as much a data-centre problem as they are an automotive one.

Beyond the Hype

Mombasawala concluded by grounding expectations around SDVs. While the stories sound exciting, real-world vehicle control systems only stabilise through negative feedback loops, making their design and validation far more complex than popular narratives suggest. The EV transition, he implied, will not be won by flashy announcements alone. It will require deep engineering, infrastructure investment, and a sober understanding of system-level constraints.

As the industry pushes ahead, his message was clear: the future of EVs depends not just on better vehicles, but on grids, software, clouds, and engineers rising together.

The post EVs, Software and the Grid: Why the Real EV Challenge Is Infrastructure, Not Vehicles appeared first on ELE Times.

Diodes’ PI2MEQX2505Q MIPI D-PHY ReDriver supports data rates up to 2.5 Gbps, making it well suited for ADAS and automotive camera monitoring systems. It provides one clock lane and four differential data lanes. Each data lane features programmable receiver equalization, output swing, and pre-emphasis, configurable via I²C or pin-strap. This helps optimize performance and reduce intersymbol interference across different physical media.

Compliant with MIPI D-PHY 1.2, the device regenerates D-PHY signals for CSI-2 and DSI interfaces over PCB traces, connectors, and cables. This extends trace lengths while minimizing power consumption and maintaining low latency. Activity-detection circuitry allows the redriver to enter a lower-power mode during Ultra-Low Power State (ULPS) and low-power (LP) states.

The PI2MEQX2505Q is AEC-Q100, Grade 2 qualified and operates from a 1.8 V supply over a temperature range of –40 °C to +105 °C. It comes in a compact 3.5 × 5.5 mm W-QFN3555-28/SWP package, supporting high-density channel routing.

Available now, the PI2MEQX2505Q is priced at $0.88 each in lots of 3500 units.

PI2MEQX2505Q product page 

Diodes

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