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Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that a global leader in optical and photonic technologies has selected its LUMINA+ metal-organic chemical vapor deposition (MOCVD) system to fabricate indium phosphide (InP) lasers for innovative communication solutions in the datacom industry. The firm adds that its LUMINA+ system has now been adopted across all major applications in the arsenide and phosphide (As/P) epitaxial space, including the fast-growing InP laser market...

For its fiscal third-quarter 2026 (ended 3 July), Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has reported revenue of $934.8m, down 1% on $943.7m last quarter and 3.1% on $965m a year ago, but above the mid-point of the $900–950m guidance range...

DigiKey, the global distribution leader of electronic components and automation products, is hosting a webinar with Shawn Hymel: “Train a balance bot with reinforcement learning,” scheduled for Thursday, Aug. 13, 2026, at 10 a.m. CDT. The free 90 minute virtual event will be a hands-on robotics and AI workshop that will teach attendees how to get started in the growing field of reinforcement learning (RL).

Reinforcement learning is a powerful domain within machine learning that teaches agents to make decisions by interacting with an environment and maximizing a reward signal. It can enable robots to learn complex behaviors like balancing, walking and recovering from falls entirely in simulation before ever touching real hardware.

During the workshop, Hymel will guide attendees through training a self-balancing robot using RL and deploying it on real hardware. Attendees will learn to:

• Import a 3D model of the M5Stack Bala-C into the MuJoCo physics simulator
• Train a neural network policy using a multi-phase PPO curriculum
• Deploy the trained actor network to an ESP32 microcontroller using Arduino
• Understand the sim-to-real pipeline, a foundational skill for applying modern AI
  techniques to physical robotics

“Reinforcement learning has quickly become an exciting tool across a wide range of modern applications,” said David Sandys, senior director of technical enablement & engagement for DigiKey. “It’s a complex and growing field, and knowing where to begin can be tricky. That’s why we’re thankful to partner with Shawn Hymel to help bring this educational workshop to our customers and community to share how to get started, and why it’s beneficial to gain this knowledge.”

“Almost every major robotics lab has turned to reinforcement learning to build robust, AI-powered control and decision-making for their robots, from quadrupeds to bipeds,” says Hymel, expert instructor and content creator. “However, RL remains hard to approach. Training a policy can take millions of simulation steps, and getting the reward function right is as much art as science. This webinar will help lower the barrier to entry for anyone who wants to build their own robots with RL.”

Anyone who would like to follow along with the webinar is encouraged to have either the M5Stack Bala-C Balance Bot or the M5Stack Bala2 Fire Self-Balancing Robot. If you can’t attend the live webinar, you’re still encouraged to register, and the recording will be sent to all registrants following the event. Everyone is welcome to register for free.

DigiKey has also debuted the first of a six-part educational YouTube series in partnership with Hymel, designed to help engineers, hobbyists and students get started with robotics and RL. The full series will walk viewers through training a robot using modern RL techniques, from simulation to hardware deployment. By the end of the series, viewers will have a working remote-controlled balance bot that learned its own control policy, entirely through trial and error in simulation. Viewers can also follow the full write-up of the tutorial on DigiKey’s Maker.io site.

This webinar and video series furthers DigiKey’s commitment to providing helpful resources and education for engineers, designers, makers and students. For more information about other resources and educational content, please visit DigiKey.com.

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Montage Technology has introduced the M88MX6852, a CXL 3.2 Memory eXpander Controller (MXC) chip for AI infrastructure and data center applications. The device has entered trial production and has been integrated into next-generation CXL products developed by memory module manufacturers including Samsung and SK hynix.  It is also designed for interoperability with Intel Xeon and AMD EPYC server platforms.

By converting host CXL memory requests into DDR commands in real time, the M88MX6852 manages data exchange between the host processor and DDR5 memory. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, enabling memory expansion, sharing, pooling, and tiering.

The M88MX6852 integrates a CXL controller, dual DDR5-8000 controllers, two RISC-V processor subsystems, and an on-chip PVT sensor. Its CXL controller complies with the CXL 3.2 specification, including CXL.mem and CXL.io protocols, as well as CXL 1.1 and CXL 2.0. Based on a PCIe 6.2 interface, it achieves data rates up to 64 GT/s over eight lanes.

Montage Technology provides an SDK along with analysis and testing tools to support product development, system validation, and production ramp.

M88MX6852 product page

Montage Technology 

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Innodisk’s DDR5 Multiplexed Rank DIMM (MRDIMM) uses a multiplexed registering clock driver and a multiplexed data buffer to achieve data rates up to 12,800 MT/s. By enabling simultaneous access to two ranks, the memory module increases bandwidth by 60% compared to conventional DDR5-8000 registered DIMMs (RDIMMs). The architecture reduces memory controller load and lowers latency, improving performance for AI model training, LLM inference, cloud computing, and robotic automation.

Designed to fit standard 287-pin DDR5 RDIMM slots, the Innodisk DDR5-12800 MRDIMM simplifies system upgrades. Built-in eFuse and TVS safeguard against power surges, while the integrated multiplexed registering clock driver and data buffer support stable high-speed data transmission. The company says the module’s energy-efficient design minimizes power consumption, supporting the sustainability goals of modern data centers.

The DDR5-12800 MRDIMM will be available in Q4 2026 with capacities ranging from 32 GB to 128 GB.

Innodisk

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Entry-level MCUs in Toshiba’s TXZ+ Series M4L Group integrate dedicated hardware and security functions for single-motor control applications. The devices feature an 80-MHz Arm Cortex-M4 core with an FPU and target home appliances, consumer products, industrial equipment, and factory automation systems.

Integrated motor control hardware includes a vector engine, programmable PWM motor control, and encoder input circuitry for motor position and speed detection. Offloading these functions to dedicated hardware reduces CPU load, allowing the MCUs to execute precise single-motor control more efficiently.

Built-in security functions help protect systems against unauthorized access and program tampering. Integrated chip protection, secure access memory, and non-rewritable flash protection safeguard firmware and system integrity. The MCUs provide 128 KB or 256 KB of code flash, 64 KB of data flash, and 32 KB of SRAM. In the 256-KB devices, the code flash is organized into two 128-KB banks, allowing one bank to execute code while the other is rewritten for firmware updates without interrupting system operation.

The TXZ+ Series M4L Group of MCUs are now in mass production.

TXZ+ M4L product page 

Toshiba Electronic Devices & Storage 

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Renesas announced its third-generation DDR5 Multiplexed Rank DIMM (MRDIMM) chipset, delivering server-class speeds of up to 16,000 MT/s. The memory interface components, including the RRG5013 multiplexed registering clock driver and the RRG5103 multiplexed data buffer, are designed to meet the high memory bandwidth requirements of AI data centers, cloud infrastructure, and accelerated computing workloads.

Renesas says the Gen 3 MRDIMM chipset achieves 25% higher bandwidth than its second-generation devices while preserving standard DIMM form factors and system compatibility within existing DDR5 infrastructure. Gen 3 also introduces Device Equalization Self-Train Mode (DESTM) Quality Indication Status to improve system visibility and robustness. This feature enables users to fine-tune timing and receiver equalization training to maximize signal margins.

Renesas is working with leading CPU and platform partners to enable MRDIMM Gen 3 adoption in future server platforms. The RRG5013 and RRG5103 are sampling to select customers, including all major DRAM suppliers. Production availability is expected in the second half of 2027.

More information about Renesas’ DDR5 memory interface devices is available on the company’s DDR5 Solutions page.

Renesas Electronics 

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Two battery monitoring ICs (BMICs) from Nuvoton, the KA49703A and KA49713A, are designed for battery backup units used in AI servers and energy storage systems. They can monitor up to 16 lithium-ion cells, while daisy-chain communication enables up to 55 BMICs to be connected in series using a single MCU. This configuration minimizes wiring, ensures robust communication, and reduces the need for additional MCUs and isolation components.

Both devices support battery stack voltages from 12.5 V to 76.8 V. They measure individual cell voltages with a maximum error of ±2.9 mV. The KA49703A and KA49713A provide alarm outputs for overcharge, overdischarge, and abnormal high- or low-temperature conditions. Additionally, the KA49713A includes a dedicated transportation and storage mode that reduces shutdown current to less than 0.1 µA to minimize battery self-discharge.

The BMICs are supplied in 7×7-mm QFP-48 packages. Samples are available now, with mass-production shipments scheduled to begin in September 2026.

KA49703A product page 

KA49713A product page

Nuvoton Technology 

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Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) says that PowiGaN gallium nitride (GaN) technology is now rated at up to 2200V, far exceeding the voltage capabilities of all other commercially available GaN technologies, it is claimed. This positions PowiGaN as the leading technology solution for high-voltage data centers, electric vehicles (EVs), renewable energy and HVDC infrastructure as they leverage higher-voltage bus architectures in search of greater power density, the firm adds...

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has emphasized its continued commitment to providing durable, reliable solar solutions to the space market, and expanded on its entry into the unmanned systems market as global demand rapidly grows. This objective underscores its strategy of expanding the spectrum of commercial opportunities for its thin-film offerings while maintaining its paramount focus on space applications...

Minimal circuit converts input frequency to a precision current source that also accommodates grounded inputs.

I recently had the opportunity to share a design for frequency to current loop conversion using the versatile (if somewhat ancient) LM29x7 series. Taking shameless advantage of the flexibility of these legacy devices, that minimalist design made do with just nine paltry passive parts.  Figure 1 shows its (nearly painful) simplicity (so simple it almost Hz).

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 In this circuit, the LM2917 needs no added actives to make a frequency to 4-20mA current sink converter.

However, it was pointed out in the comments (thanks, RJ!) that its current sink output may not be compatible with some industrial control and monitoring hardware.  So here comes Figure 2 with a frequently friendlier current source output.

Figure 2 Four frugal extra external parts (bringing the total to 13) convert Figure 1 into a flexible current source that’s useful if the load is grounded.

Converting Figure 1’s converter from current sink to current source begins with tying pin 6 to the +24v rail.  This lets the internal voltage shunt reference Z1 float the internal “ground” reference pin 8 at 16.4v instead of at zero.  R5 provides the necessary bias current (just as it does in Figure 1), and C4 gives us some noise-bypassing insurance.  Adding cascode Q1 completes the conversion.

Although U1’s spec’d linearity and temperature coefficient are good, its initial tolerances aren’t so great. Therefore some post-assembly final calibration is unavoidable, which necessitates R1’s (4mA zero) and R2’s (20mA full-scale 5kHz) tweakability.  If you do the adjustments in the right order (first R1, then R2), they won’t interact, and calibration can be completed in s single pass.

An additional helping of flexibility comes from the fact that, if your application doesn’t need or want a 4mA baseline current, just omit R3.  Then adjust R2 normally for a top end of 20mA.  That’ll give 0-20mA with no other mods required.

References

1. https://www.ti.com/lit/an/sboa574/sboa574.pdf

Stephen Woodward‘s relationship with EDN’s DI column goes back quite a long way. Over 200 submissions have been accepted since his first contribution back in 1974.  They have included best Design Idea of the year in 1974 and 2001.

Related Content

• Painlessly convert Hz to 4-20mA current loop
• 4mA-20mA to 0mA-20mA converter’s current mirror drives grounded load
• Transistor and FVCs make linear anemometer

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Vector Photonics Ltd of the West of Scotland Science Park — which was spun off from the University of Glasgow in 2020, and is pioneering the use of photonic crystal surface-emitting lasers (PCSEL) in secure communications — is heading to Taiwan as part of Innovate UK’s Global Business Innovation Programme (GPIB)...

ASMPT SMT Solutions will exhibit at the first EFX Expo for Electronics Manufacturing in Stuttgart, Germany. From October 6 to 8, 2026, the global technology and market leader for integrated hardware and software solutions for the electronics manufacturing industry will present its latest products and services for intelligent SMT production at Booth 9D52 in Hall 9. The focus will be on innovations around the new SIPLACE V assembly platform, the DEK TQ L stencil printer, and the WORKS Software Suite for connecting and optimizing workflows on the shop floor.

“With its focus on personal interactions and networking, the EFX provides an ideal supplement to the Productronica by creating a new meeting place for electronics manufacturers every two years,” explained Bernhard Fritz, Head of Global Marketing, ASMPT SMT Solutions. “AI applications are currently changing the requirements for electronics manufacturing faster than ever before. The EFX presents an ideal platform for discussing with customers and partners how integrated hardware and software solutions help companies to respond flexibly to these developments and prepare their factories for the future.”

SIPLACE V L: Ready for demanding AI server boards

With the SIPLACE V, ASMPT has developed a new generation of placement machines that enables productivity increases of up to 30 percent under real-life conditions in several key industries while also meeting the rising requirements of modern electronics applications, such as AI server boards. It can handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturized components down to the 016008M size factor reliably, precisely, and efficiently.

At EFX, ASMPT will demonstrate with the SIPLACE V L how maximum productivity and quality can be combined with outstanding flexibility. With a compact footprint of just 1.5 × 2.4 m, the placement platform processes odd-shaped components (OSCs) up to 55 mm in height. Existing SIPLACE X feeders and even changeover tables from the SIPLACE SX can continue to be used, providing electronics manufacturers with a high level of investment protection. An enhanced Smart Pin Support, increased maximum PCB size and a flexibly interchangeable tray changer further expand application versatility and simplify adaptation to changing production requirements.

Top productivity and quality in solder paste printing

With the DEK TQ L, ASMPT will present its stencil printer for mid-size boards that has been designed from the ground up for productivity, precision and automation. It combines maximum precision (up to ±17.0 µm @ 2 cpk wet-print accuracy) with a core cycle time of only 6.5 seconds. Many automation functions increase the machine’s productivity and process reliability. The understencil cleaning system runs for a whole shift without any user assists, the Dual Access Cover makes it possible to switch out paste cartridges without having to stop the machine, and Automated Paste Transfer can transfer the paste to a new stencil completely on its own. A new mechanism cuts the time required to change squeegees by up to 20 percent. And with the DEK TQ GO, even squeegee and stencil changeovers can be fully automated in the future.

With WORKS Automation, ASMPT will show how printing processes can be automatically optimized even further. The software continuously captures and analyzes process data from the printer and the SPI system, recognizes potential improvements, and helps with intelligent and increasingly AI-supported functions to improve print quality, process stability, and productivity.

Intelligent use of data

With the WORKS Software Suite, ASMPT will showcase its integrated software platform for intelligent SMT manufacturing. It connects machines, processes and production data in real time to create total production transparency.  Based on this information, users can optimize specific workflows, deploy resources more efficiently, and make decisions more quickly. The WORKS applications support all workflows on the shop floor in terms of material management, process optimization along the SMT line, and efficient personnel deployment. Thanks to open interfaces according to industry standards IPC-HERMES-9852 and IPC-CFX, users can easily integrate machines, software solutions and autonomous mobile robots (AMRs) from other manufacturers and build a coordinated manufacturing environment.

 

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During a severe sandstorm, a transport aircraft attempts to land at a remote forward operating location. Visibility is nearly zero, forcing the crew to rely on navigation, communications, and landing-assistance systems. If the aircraft were to lose its GNSS signal, local timing sources would drift. Even a few microseconds of drift could cause these systems to lose synchronization.

This can cause communication disruptions, impacts to radar and ranging systems, higher inertial navigation error, and ultimately reduce the accuracy of information displayed to the pilot. Lives and the mission could be at stake. In this scenario, the fallout would not stem from a hardware failure or cyberattack, but from a small timing error.

Take, for instance, MicroPNT GDO-1000, a GNSS-disciplined oscillator (GNSS-DO) module from VIAVI, a supplier of test and measurement, optical, and position, navigation and timing (PNT) technologies. The module, built for situations mentioned above, features MEMS-based Endura Epoch or Elite X oscillators to deliver microsecond-class, 24-hour holdover in a tiny package.

The Viavi µPNT GDO-1000 module nears atomic-clock timing holdover precision, but with a low size, weight, power and cost (SWAP-C) profile—in a footprint the size of a postage stamp. The solution provides greater flexibility to keep networks synchronized, sensors aligned, and mission systems operating with confidence across air, land, sea, space, and cyber domains—even in extreme environments.

What is a GNSS-DO?

GNSS signals can be vulnerable to jamming or spoofing. Signals can be interrupted in urban or geographic canyons and subject to outages. A GNSS-DO combines a local precision oscillator with timing from GNSS to provide accurate and resilient timing required by modern defense systems. Typically, GNSS-DOs are comprised of the following:

• GNSS receiver
• High-stability local oscillator (crystal, MEMS TCXO or OCXO, or an atomic clock)
• Disciplining algorithm (servo loop)
• 1 pulse per second (PPS) input and a 1 PPS and 10 MHz output

Under normal operating conditions, the GNSS receiver serves as the primary timing reference for the GNSS-DO, providing output signals, such as 1 PPS and 10 MHz synchronized to the GNSS 1 PPS rising edge. During this phase, GNSS-DO continuously learns and characterizes the drift behavior of the local oscillator relative to the GNSS reference.

If GNSS signals become degraded, jammed or denied, GNSS-DO seamlessly transitions to the local oscillator as the timing source. Leveraging this learned behavior, the system actively compensates its outputs to maintain accurate time alignment.

This unique combination of long-term accuracy and short-term stability makes GNSS-DO a critical enabler for military communications, radar systems, electronic defense platforms, sensor fusion networks, and autonomous systems—where precise timing is essential for mission success and operational continuity.

Choosing an oscillator with the right stuff

Drift can be caused by temperature fluctuations, vibration, mechanical stress, power supply variations, and long-term aging effects. Left unchecked, drift accumulates over time, degrading synchronization accuracy and potentially impacting system performance.

The role of GNSS-DO is to continuously correct these errors when a reference signal is available and minimize their impact when it’s not. The better the oscillator’s inherent stability, the longer and more accurately the system can maintain synchronization during a GNSS outage.

This is how the different types of oscillators compare:

• CSACs

Chip-scale atomic clocks (CSACs) offer great stability and the longest holdover performance, making them the benchmark for resilience in GNSS-denied environments. However, these advantages come with trade-offs in size, weight, cost, and procurement lead times that can limit their practicality for many deployed systems.

• Crystal TCXOs and OCXOs

Traditional crystal-based TCXOs and OCXOs provide lower-cost alternatives and are widely used across communications, aerospace, and defense applications. While they can deliver strong timing performance, quartz is very susceptible to shock, vibration and mechanical stress, causing them to crack, break, or severely degrade performance. This makes them less suitable for increasingly rugged and mobile platforms.

• MEMS TCXOs and OCXOs

Micro-electro-mechanical systems (MEMS)-based TCXOs and OCXOs are emerging as a viable solution. They provide robust resistance to vibration, shock, and environmental stress while significantly reducing size and power consumption. In many cases, MEMS OCXOs offer near atomic-level frequency stability over temperature and occupy 75x less volume. This combination enables system designers to achieve precise timing and extended holdover without the SWAP-C penalties.

Figure 1 MEMS OCXOs can outperform the alternatives for SWaP in critical military defense applications. Source: SiTime

About GDO-1000 module

The µPNT GDO-1000 module features dual-frequency L1/L5 GNSS reception with microsecond-class, 24-hour holdover, enabling highly accurate timing even in degraded or contested conditions. “Its holdover performance approaches what customers expect from atomic-class clocks, in a module that fits on a standard M.2 slot and draws approximately half a watt,” said Doug Russell, senior VP and GM for aerospace and defense at VIAVI.

Figure 2 The VIAVI µPNT GDO-1000 module featuring an advanced MEMS oscillator has dual frequency L1/L5 GNSS reception and microsecond-class 24-hour holdover and draws less than half a watt of power. Source: SiTime

Moreover, it integrates directly into modern compute platforms, time appliance cards, and embedded systems without custom mechanical design.

The module performance is enhanced by patented AI and ML algorithms which model and compensate for oscillator behavior across varying environmental conditions. At its core, MEMS oscillators provide improved thermal stability across the full military temperature range compared with traditional quartz OCXOs, while maintaining phase noise and Allan Deviation performance under vibration and shock.

The system also accepts an external 1 PPS input, allowing discipline from M-Code GPS, alternative navigation sources, or other external references without hardware modification. Despite its miniature size, it supports multiple 1 PPS and low-phase-noise 10 MHz coaxial inputs and outputs, providing flexible integration across complex systems.

Modern precision timing solutions such as the advanced OCXO platform and high-performance Super-TCXO architectures are designed to directly address the combined challenges of SWaP constraints and oscillator drift and loss of reference time in GNSS-degraded environments. By improving intrinsic frequency stability, reducing phase noise, and minimizing long-term aging effects, the devices help maintain more accurate local timekeeping when external references are unavailable.

As defense systems evolve from standalone platforms into interconnected networks of sensors, communications systems, and autonomous assets, timing is becoming as fundamental to system design as power and memory management. Precision timing enables everything from PNT to secure communications, sensor fusion, and synchronized operations across distributed missions.

The future belongs to timing solutions that deliver precision, resilience, and performance while minimizing SWaP and system complexity.

Tyler Hohmann is business development director for aerospace and defense at SiTime, where he leads strategy and execution across prime contractors, startups, and sub-system manufacturers to advance precision timing adoption in mission-critical systems. Prior to SiTime, he was VP of sales and marketing and co-founder of Safran Federal Systems.

Related Content

• MEMS Resonators Drive Advanced Timing Solutions
• MEMS timing disrupts quartz in modern automotive
• The top 6 reasons to use silicon MEMS timing solutions
• How to use MEMS OCXOs to overcome timing challenges
• GNSS Receiver Frequency Reference for Successful Satellite Navigation

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Vishay Intertechnology introduced a new series of infrared (IR) receiver modules for IR remote control applications. Featuring a wide modulation frequency acceptance from 30 kHz to 68 kHz, devices in the Vishay Semiconductors TSOP15300 series are designed to receive and demodulate all major remote control codes on the market, enabling a single-component universal remote control solution.

How Do Vishay’s New IR Receivers Simplify Consumer Electronics Design?

Standard IR receivers are typically tuned to one center frequency, limiting compatibility and requiring multiple devices to cover different code sets. With their wide modulation frequency range, the receivers released today overcome this limitation, reducing component counts to lower system costs and save board space.

Designed for consumer electronics such as televisions, audio systems, gaming consoles, soundbars, set-top boxes (STB), video projectors, and more, TSOP15300 series receivers provide immunity against ripple noise and interference from common sources like IR emissions in CFL lamps and LCD televisions, and RF emissions from onboard Wi-Fi antennas. When paired with a 50 mA emitter, the devices offer reliable transmission distances of up to 18 m.

To simplify designs, each receiver integrates a photodetector, preamplifier circuit, and IR filter within a 4-pin Heimdall package. For decoding, their demodulated output signal can be directly connected to a microprocessor. Optimized for short burst codes, TSOP15300 series devices operate over a wide supply voltage range from 2.0 V to 5.5 V, draw a typical supply current of 0.35 mA, and feature a maximum irradiance of 0.2 mW/m² at 45 kHz. They are RoHS-compliant, halogen-free, and Vishay Green.

 

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КПІ ім. Ігоря Сікорського став лауреатом 2026 Friend of IEEE MGA Award kpi ср, 08/05/2026 - 13:01

Nuvoton Technology Corporation announced the launch of the NAU83G60YG stereo smart audio amplifier integrating Klippel Controlled Sound (KCS) nonlinear adaptive speaker control technology developed by Klippel GmbH. The NAU83G60YG is designed for conference speakerphones, smart speakers, professional monitoring speakers, and automotive audio systems. By leveraging advanced nonlinear speaker control technology, the amplifier delivers low distortion, high output power, and ultra low latency audio processing, enabling clearer voice communication and enhanced low-frequency performance for next generation audio applications.

Targeting voice communication devices, compact multimedia speakers and studio monitors

The impressive distortion reduction provided by NAU83G60YG with KCS enables unsurpassed clarity of bidirectional voice communication in conferencing speakers and soundbars. This advantage is strengthened even further by the linearized reference signal from NAU83G60YG that provides best learning conditions for Active Echo Cancellation (AEC) algorithms. It leads to faster and more consistent convergence with less artifacts. Compact multimedia speakers as well as studio monitors profit from additional dynamics (bass and SPL) for a more enjoyable and consistent listening experience.

How Does Nuvoton’s New Smart Amplifier Improve Audio Performance?

“We are excited to collaborate with Klippel on this innovative stereo smart amplifier solution. Compared with traditional smart amplifier designs based on linear models, the NAU83G60YG enables smaller speakers to achieve higher sound quality and maximum output performance. It supports precise speaker protection and real-time speaker diagnostics while significantly simplifying speaker tuning processes. In addition, it enhances barge-in AEC performance and enables low-latency Active Noise Cancellation (ANC) applications for next-generation smart audio systems.” said Walter Tseng, Vice President of Microcontroller Business Group at Nuvoton Technology Corporation.

“The release of the NAU83G60YG today is good news for audio designers. It makes KCS technology accessible in the highly relevant power range of up to 30 W. This is a significant milestone for Klippel GmbH in fulfilling the vision of our founder, Dr. Wolfgang Klippel: providing the entire audio industry with innovative tools that push the boundaries of audio performance. We are grateful for our trusted, long-term cooperation with Nuvoton, whose support has helped bring this achievement to life.” said Benjamin Barth, CEO of Klippel GmbH.

Revolutionizing Audio: KCS (Klippel Controlled Sound) Advantage

Loudspeakers are inherently highly nonlinear and time-varying systems. Signal distortion, thermal effects, instabilities, aging, and environmental conditions have traditionally limited maximum sound pressure levels and overall sound quality.

Compared with conventional amplifiers and smart amplifiers based on linear speaker models, the KCS algorithm offers superior performance with more bass, cleaner sound, and inherent operational stability. Its adaptive nonlinear speaker control technology provides active compensation of speaker distortion, balances operational instabilities, offers superior accuracy of mechanical and thermal protection to avoid overload situations, features automatic adaptive system alignment for unrivaled consistency, and adds voice-coil resting position control for maximum coil travel. These capabilities significantly improve loudspeaker performance and sound quality.

Key Advantages of KCS Technology

• Wider voice-coil excursion capability for greater acoustic output with superior overload protection
• Significant reduction of harmonic and intermodulation distortion for improved sound quality
• Enhanced Acoustic Echo Cancellation (AEC) performance by minimizing loudspeaker distortion and improving barge-in AEC operation under linear and time-invariant acoustic conditions
• Improved voice interaction experience through more accurate wake-word detection for AI-enabled
  smart speakers
• Support for ultra-low-latency audio processing, ideal for high-performance Active Noise
  Cancellation (ANC) systems

NAU83G60YG Stereo Smart Amplifier Specifications

The NAU83G60YG adopts a high-performance Class-D amplifier architecture supporting an operating voltage range from 8V to 24V and reliable operation across an industrial temperature range of -40°C to +85°C. The device integrates IV Sense (current and voltage sensing) ADCs and a high-performance DSP engine. It supports multiple digital audio interfaces, including I²S, PCM, and TDM, while integrating multi-band PEQ, DRC, and low-latency audio processing capabilities for optimized voice performance. The device delivers up to 2 × 30 W into 4 Ω loads and 2 × 20 W into 8 Ω loads with a 24 V supply.

The post Nuvoton Launches NAU83G60YG Next-Generation Smart Amplifier With Klippel KCS for Low-Distortion Audio and Special Benefits for AEC/ANC Systems appeared first on ELE Times.

DigiKey, the global distribution leader of electronic components and automation products, expanded its portfolio by more than 27,000 new stocking products available for fast shipment in Q2 2026. In total, over 373,000 new products were added to the DigiKey system, along with 104 new suppliers across its core business, Marketplace and Fulfilled by DigiKey programs.

What Vice President of Global Business Development at DigiKey said?

“DigiKey’s robust inventory pipeline and in-stock product availability continue to power our record-breaking customer count growth,” said Mike Slater, vice president of global business development for DigiKey. “The ongoing investments in our product line card and industry-leading website provide customers fast access to the latest innovative new products they need to accelerate their designs and projects.”

Which New Suppliers Joined DigiKey’s Portfolio in Q2?

DigiKey’s commitment to expanding in-stock inventory for fast shipment allows engineers, designers, makers and procurement professionals to order prototype quantities for rapid shipping, without placing a special order in factory quantities or waiting for lead or transit time.

New supplier additions in Q2 include:

• Neutrik Group, a global manufacturer of professional interconnect solutions including well-known audio/video products which provide access to reliable audio, video, lighting, data and fiber-optic connectivity.
• LumenRadio, which specializes in wireless control technology designed to replace complex cabling in industrial and commercial systems. Its frequency-agile platform ensures stable, low-latency communication in RF-congested environments and supports applications such as lighting control, building systems and industrial equipment.
• Altelix, which provides weatherproof enclosures and accessories, along with in-house design and manufacturing for customized solutions in industrial and commercial environments.
• AMobile, which delivers industrial mobile computers supporting applications such as logistics, transportation, public safety and warehouse management to enable industrial IoT deployments.

What Are DigiKey’s Latest Product Introductions for Q2 2026?

DigiKey’s consistent inventory expansion is an industry differentiator and provides engineers, designers and makers access to the most innovative new product introductions (NPIs) in their industries. Some of the NPIs added in Q2 2026 include:

• Klein Tools’ insulated hand tools are designed for professionals working on or near energized equipment where safety and reliability are critical.
• ABLIC’s CLEAN-Boost battery-less water leak sensor generates electricity from leaking water to transmit water leak signals wirelessly.
• HARTING’s Han S 450 Plus connectors feature compact, flexible, waterproof housings with integrated unlocking protection, delivering secure, high-power connections for modular battery energy storage systems up to 500 A and 2 kV.
• Knowles’ A series ceramic core inductors deliver industry-standard RF performance across broad inductance ranges in compact packages and are well-suited for demanding industrial, telecom and MRI applications.
• Analog Devices’ ADEMA124 and ADEMA127 precision energy measurement ADCs are tailored for polyphase and split-phase energy systems.
• CIT Relay & Switch IN8 series indicators offer wire or quick-connect terminals with lasting performance and multiple LED and finish options.
• The Lantronix xPico 600 Wi-Fi 6 embedded IoT gateway eliminates the need for an external host MCU, simplifying integration, accelerating timetomarket, and reducing overall system cost.
• Built for demanding electronics, the 3M electrically conductive double-sided tape 9793KW/KT series helps deliver strong bonding, reliable EMI shielding and grounding, plus moisture and dust sealing for lasting performance.

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Optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan has announced a strategic investment in DenseLight Photonics — an integrated device manufacturer (IDM) of indium phosphide (InP) optical communication components through its Singapore-based operating subsidiary — with a total transaction value of US$34.3m. LITEON will hold about 21% equity ownership in DenseLight and secure one seat on the board...